FD SOI The Tipping Point for SOI Which May Lead to Material Constraints

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Purchasing and Supply Chain Organizations at Foundries and Device Manufacturers that need SOI wafers need to closely monitor the supply chain as demand resulting from FD-SOI applications may be the tipping point for capacity issues.

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FD SOI The Tipping Point for SOI Which May Lead to Material Constraints

  1. 1. Bulk vs. SOI Finfet The “Killer Ap” to get SOI Over the Top • Application demands have continued to drive additional requirements for SOI silicon. • Besides all things mobile companies like Google and Facebook have disruptive applications and purchasing criteria that bode well for SOI • The increased adoption of FD-SOI will be a tipping point for SOI Suppliers that Purchasing and Supply Chain groups at Device Companies and Foundries need to watch carefully Bill Kohnen Notes For Semiconductor Technical Purchasing Conference November 2013
  2. 2. Leakage FinFets Everywhere Power Channel Leakage Bulk Planar Transistors In Silicon Low High FinFet Intel TSMC Gate Control Created as a ‘Fin” High Low FinFets really are great. But the manufacturing process seems complex certainly more lithography and related process steps. How about high supply voltage? Also I am not sure we even have a plan at the 14nm mode even if it were ready Bill Kohnen Notes For Semiconductor Technical Purchasing Conference November 2013
  3. 3. FD-SOI is an Alternative SOI Industry Consortium, ST, Freescale, IBM, Global Foundries, Samsung and UMC, Channel FD SOI • • • • Gate Control Leakage Build Channel above silicon on thin insulation layer High Low Production similar to a regular bulk CMOS transistor Less variability due to the lack of implant Lower Supply Voltage for memories means big power savings Available now at 28nm node with path down to 14nm Hold on though – SOI wafers are all ready expensive how can you control an ultrathin top layer within a few Angstroms and make this cost effective? Bill Kohnen Notes For Semiconductor Technical Purchasing Conference November 2013
  4. 4. Total Cost for FD-SOI • • • • Lower cap Ex Lower Opex Higher Throuput Leverage existing CMOS process for faster time to market • At this point cost neutral if not lower total cost for production plus additional value creation to drive higher ASP Bill Kohnen Notes For Semiconductor Technical Purchasing Conference November 2013
  5. 5. So any concerns? Yes Supply of SOI Starting Material • Capacity of supply – Not just sheer capability which is a concern – Ability to provide consistently to requirements • This is a challenge because material planners will want to created safety stock: – Initial sticker shock – Potential to create industry wide supply “Bullwhip Effect” resulting in large osciallation of demand. Industry Consortiums should help to keep this in check Bill Kohnen Notes For Semiconductor Technical Purchasing Conference November 2013

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