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Skr Consulting Abstract


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Skr Consulting Abstract

  1. 1. <ul><li>Offering: </li></ul><ul><ul><li>Design & analysis </li></ul></ul><ul><ul><ul><li>Components & sub-systems </li></ul></ul></ul><ul><ul><ul><li>Board and IC level </li></ul></ul></ul><ul><ul><ul><li>Packaging and interconnects </li></ul></ul></ul><ul><ul><li>Problem solving & troubleshooting </li></ul></ul><ul><ul><ul><li>Data and test methods analysis </li></ul></ul></ul><ul><ul><ul><li>Can work with engineers and technicians in lab environment </li></ul></ul></ul><ul><ul><li>Training </li></ul></ul><ul><ul><ul><li>On wafer and network analyzer calibration & de-embedding </li></ul></ul></ul><ul><ul><ul><li>Devices and passives modeling </li></ul></ul></ul><ul><ul><ul><li>Design processes and risk analysis </li></ul></ul></ul>RF / Microwave Design Expertise in High Frequency (1-100 GHz) Electronics
  2. 2. Reasons Companies Hire Consultants <ul><li>For expertise in areas not resident in the company, either one-time or for training purposes </li></ul><ul><li>For a special short term or one time project </li></ul><ul><li>To get a fresh viewpoint or new ideas about old problems </li></ul><ul><li>To solve a problem when permanent resources are needed for other on-going critical work </li></ul><ul><li>Need for an independent resource to review, evaluate, or assess internal performance </li></ul><ul><li>Cost effective ... expense ends when the job is done </li></ul>
  3. 3. Measurement & Device Modeling Expertise <ul><li>20+ years of practical lab experience </li></ul><ul><li>Vector Network Analyzers (S-Parameters) </li></ul><ul><ul><li>Skilled in network analyzers and de-embedding techniques </li></ul></ul><ul><li>Load Pull </li></ul><ul><li>ICCAP </li></ul><ul><li>Small-signal transistor and passives modeling </li></ul><ul><ul><li>GaAs MESFET/HEMT </li></ul></ul><ul><ul><li>PassiveS in/on silicon </li></ul></ul>
  4. 4. Passives & Packaging Designer Integrated LCP on FR4 Marchand Balun Asymmetric Rat Race Coupler (Sonnet) <ul><li>Custom PCBs </li></ul><ul><ul><li>“ Duroid”, Ceramic, LCP, LTCC, Foam </li></ul></ul><ul><ul><li>Multi-layer, metal backed, cavities, and covers </li></ul></ul><ul><li>ICs </li></ul><ul><ul><li>GaAs </li></ul></ul><ul><ul><li>Silicon (muli-conductor layer) </li></ul></ul><ul><li>Components </li></ul><ul><ul><li>MIM, Spiral Inductors, Couplers </li></ul></ul><ul><li>Interconnects </li></ul><ul><ul><li>Wire bond </li></ul></ul><ul><ul><li>Flip chip </li></ul></ul><ul><ul><li>EM coupled </li></ul></ul>
  5. 5. MMIC Design – Experienced PA and LNA Designer <ul><li>30 GHz LNA Design on UMS PH25 (.25um) PHEMT </li></ul><ul><li>8 Watt 3.5 GHz PA Design on Freescale High Voltage PHEMT </li></ul><ul><li>Foundry Experience </li></ul><ul><ul><li>Triquint, UMS, WIN, Jazz, Raytheon </li></ul></ul><ul><li>60 GHz MIIM Detector </li></ul><ul><li>ADS / Sonnet / HFSS Experience </li></ul>
  6. 6. Gigabit mm-Wave Radio Systems Development <ul><li>Long range for backhaul & networks </li></ul><ul><li>Short range for consumer & portable </li></ul><ul><li>Link budgets, design & analysis, link availability, prototyping </li></ul><ul><li>RF Front Ends </li></ul><ul><li>FCC, standards compliance </li></ul><ul><li>BER testing, waveform analysis </li></ul>
  7. 7. <ul><li>RF / Microwave / mm-Wave Design Expertise </li></ul><ul><ul><li>mm-Wave design & applications (1 thru 100 GHz) </li></ul></ul><ul><ul><li>Gigabit mm-Wave radio front end design & integration </li></ul></ul><ul><ul><li>Actives & Passives characterization & modeling (on-wafer specialist) </li></ul></ul><ul><ul><li>III-V MMIC design </li></ul></ul><ul><ul><li>EM design tools </li></ul></ul><ul><li>20+ years Experience </li></ul><ul><ul><li>Defense / Aerospace / Space / Commercial </li></ul></ul><ul><ul><li>Telecommunications / Semiconductor </li></ul></ul><ul><ul><li>Transistor > IC > Component > Front End > Sub-System > System </li></ul></ul><ul><li>Excellence in Multiple Roles: </li></ul><ul><ul><li>Independent Contributor </li></ul></ul><ul><ul><li>Team Leader / Project Leader </li></ul></ul><ul><ul><li>Engineering Manager / Program Manager </li></ul></ul>Steve K. Rockwell - Resume
  8. 8. Experience & Education <ul><li>Experience </li></ul><ul><ul><li>Motorola Labs, mm-Wave & microwave design and applied research , 9 years </li></ul></ul><ul><ul><li>Motorola Government Business, space payloads, MMIC packaging and test, 4 years </li></ul></ul><ul><ul><li>Texas Instrument Defense and Electronics Division, GaAs MMIC, modeling, characterization, and components, 8 years </li></ul></ul><ul><li>Academics </li></ul><ul><ul><li>BSEE from Arizona State University, 1986 </li></ul></ul><ul><ul><li>Graduate courses at Southern Methodist University and University of Texas at Dallas, 1988-89 </li></ul></ul>
  9. 9. Publications <ul><li>GaAs MESFETs fabricated on Si substrates using a SrTiO/sub 3/ buffer layer Eisenbeiser, K.; Emrick, R.; Droopad, R.; Yu, Z.; Finder, J.; Rockwell, S.; Holmes, J.; Overgaard, C.; Ooms, W. IEEE Electron Device Letters , Volume: 23 Issue: 6 , June 2002 Page(s): 300 –302 </li></ul><ul><li>An 8-Watt 3.5 GHz Power Amplifier with Tunable Matching </li></ul><ul><ul><li>Rockwell, Emrick, R.; Bosco, B.;Franson, S.; Miller, M.; Johnson, E.;Crowder, J. </li></ul></ul><ul><ul><li>GaAs IC Symposium, 2002, October 20-23 </li></ul></ul><ul><li>Performance of GaAs on silicon power amplifier for wireless handset applications Escalera, N.; Emrick, R.; Franson, S.; Farber, B.; Garrison, G.; Holmes, J.; Rockwell, S.; Bosco, B. Microwave Symposium Digest, 2002 IEEE MTT-S International , 2002 Page(s): 1031 -1034 vol.2 </li></ul><ul><li>RF Devices Implemented on GaAs on Si Substrates Using a SrTiO 3 Buffer Layer Eisenbeiser, K.; Emrick, R.; Droopad, R.; Yu, Z.; Finder, J.; Rockwell, S.; Holmes, J.; Overgaard, C.; Ooms, W.;Ramdani, J.;Yu, Z.; Hilt, L.;Talin, A.;Edwards Jr, J.; Curless, J.; O’Steen, M. GaAs IC Symposium, 2001, October 21-24 Page(s): 300 –302 </li></ul><ul><li>MMIC Power Amplifier Output Combiner Network Considerations for S-Band Applications Bosco, B.;Emrick, R.; Franson, S.; Rockwell, S. European Microwave Conference, 2001, September 24-28, London </li></ul><ul><li>A 60 GHz Transceiver with Multi-Gigabit Data Rate Capability Bosco, B.;Emrick, R.; Franson, S.; Rockwell, S.; Holmes, J Radio and Wireless Conference, 2004 IEEE </li></ul><ul><li>On-Wafer Characterization De-embedding and Transmission Line Optimization on Silicon for Millimeter-wave Applications Bosco, B.; Rockwell, S. Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE </li></ul><ul><li>Characterization and Modeling of Metal/Double-Insulator/Metal Diodes for Millimeter Wave Wireless Receiver Applications </li></ul><ul><ul><li>Stephen Rockwell, Derrick Lim, Bruce A. Bosco, Jeffrey H. Baker, Blake Eliasson, Keith Forsyth, Michael Cromar </li></ul></ul><ul><ul><li>Radio Frequency integrated Circuits (RFIC) Symposium, 2007. Digest of Papers. 2007 IEEE </li></ul></ul><ul><li>Gigabit Wireless Personal Area Networks: Motivation, Challenges and Implementation </li></ul><ul><ul><li>Stephen Rockwell, Bruce A. Bosco, Robert Lempkowski, Rudy Emrick, John Holmes </li></ul></ul><ul><ul><li>Radio and Wireless Conference 2009 </li></ul></ul>
  10. 10. Patents <ul><li>GRANTED: </li></ul><ul><li>Structure for fabricating high electron mobility transistors utilizing the formation of compliant substrates </li></ul><ul><li>Patent number : 6646293 Issue date : Nov 11, 2003 Inventors : Rudy M. Emrick, Stephen Kent Rockwell, John E. Holmes Assignee : Motorola, Inc. </li></ul><ul><li>Structure and method for fabricating configurable transistor devices </li></ul><ul><li>Patent number : 6855992 Issue date : Feb 15, 2005 Inventors : Rudy M. Emrick, Bruce Allen Bosco, John E. Holmes, Steven James Franson, Stephen Kent Rockwell Assignee : Motorola Inc. </li></ul><ul><li>Graded liquid crystal polymer package </li></ul><ul><li>Patent number : 7,282,797 Issue date : Oct 16, 2007 Inventors : Rudy M. Emrick, Bruce Allen Bosco, Stephen Kent Rockwell Assignee : Motorola Inc. </li></ul><ul><li>Hermetic cavity package </li></ul><ul><li>Patent number : 7,245,009 Issue date : July 17, 2007 Inventors : Rudy M. Emrick, Bruce Allen Bosco, John E. Holmes, Steven James Franson, Stephen Kent Rockwell Assignee : Motorola Inc. </li></ul><ul><li>FILED: </li></ul><ul><li>Variable Responsivity Adaptive Detector System </li></ul><ul><li>Inventors : Derrick Lim, John E. Holmes, Stephen Kent Rockwell Assignee : Motorola Inc. </li></ul><ul><li>Integrated Bi-directional JEDI (Junction Engineered Dielectric Insulator) Based Transceiver </li></ul><ul><li>Inventors: Steven Franson, Stephen Kent Rockwell Assignee: Motorola, Inc. </li></ul>