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J-STD-001, IPC A-610 F to G Differences Webinar

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BEST presented on the recent updates to IPC-A-610 and IPC J-STD-001. This slide deck was put together by the BEST staff and present as the differences between "F" and "G" webinar series.

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J-STD-001, IPC A-610 F to G Differences Webinar

  1. 1. J-STD-001 Rev F - G Comparison Presented by Norman D. Mier Jr. IPC MIT BEST, Inc © 2018 BEST Inc. - Presented for SMTA 1-29-18
  2. 2. 1.1 Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection.© 2018 BEST Inc. - Presented for SMTA 1-29-18
  3. 3. 1.2 Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection. This standard prescribes material requirements, process requirements, and acceptability requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. Standards may be updated at any time, including with the use of amendments. The use of an amendment or newer revision is not automatically required. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  4. 4. 1.4 Measurement Units and Applications All dimensions and tolerances, as well as other forms of measurement (temperature, weight, etc.) in this standard are expressed in SI (System International) units (with Imperial English equivalent dimensions provided in brackets). Dimensions and tolerances use millimeters as the main form of dimensional expression; micrometers are used when the precision required makes millimeters too cumbersome. Celsius is used to express temperature. Weight is expressed in grams. This Standard uses International System of Units (SI) units per ASTM SI10-10, IEEE/ASTM SI 10 Practice (Section 3) [Imperial English equivalent units are in brackets for convenience]. The SI units used in this Standard are millimeters (mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g) [oz] for weight, lux (lx) [footcandles] for illuminance. Note: This Standard uses other SI prefixes (ASTM SI10-10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm becomes 1.2 μm) or as alternative to powers-of-ten (3.6 × 10³ mm becomes 3.6 m). © 2018 BEST Inc. - Presented for SMTA 1-29-18
  5. 5. 1.4.1 Verification of Dimensions Actual measurement of specific part mounting and solder fillet dimensions and determination of percentages are not required except for referee purposes. For the purposes of determining conformance to this specification, all specified limits in this standard are absolute limits as defined in ASTM E29.For determining conformance to the specifications in this Standard, round all observed or calculated values “to the nearest unit” in the last right-hand digit used in expressing the specification limit, in accordance with the rounding method of ASTM Practice E29. For example, specifications of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round the measured value to the nearest 0.1 mm, 0.01 mm, or 0.001 mm, respectively, and then compare to the specification number cited. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  6. 6. 1.5 Definition of Requirements When the International Space Station symbol appears next to a paragraph it indicates that J-STD-001GS Space Applications Electronic Hardware Addendum to J-STD-001G contains some different requirements to this document. The criteria in J-STD-001GS are not applicable unless the addendum is specifically required by procurement documentation. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  7. 7. 1.7.1 Conflict The user has the responsibility to specify acceptance criteria. If no criteria is specified, requirements, or cited, then best manufacturing practices applies © 2018 BEST Inc. - Presented for SMTA 1-29-18
  8. 8. 1.8.1 Diameter 1.8.1.1 Conductor Diameter The conductor diameter is the outside diameter of wire, either stranded or solid, without the insulation. 1.8.1.2 Wire Diameter The wire diameter is the outside diameter of wire, either stranded or solid, including insulation if present. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  9. 9. 1.8.7 Objective Evidence Such documentation may include, but is not limited to: a. Work instructions. b. Procedures and records required by the quality management system. c. Chemical and physical test data. d. Reliability calculations based on recognized industry reliability standards. e. Manufacturer data sheets/reports, known acceptable record of performance by selected suppliers. f. External and/or internal audit reports. g. Test/inspection reports including actual measured values. h. Training records. i. Soldering temperature versus time profiles. j. Technical basis for changes in materials and/or processes (as an example, see Appendix C). k. Historical data. l. Competency Matrix (skills checklist). © 2018 BEST Inc. - Presented for SMTA 1-29-18
  10. 10. 2.6 International Electrotechnical Commission IEC 61340-5-1 Protection of Electronic Devices from Electrostatic Phenomena – General Requirements 2.7 SAE International7 GEIA-STD-0005-1 Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free Solder GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems 2.8 Military Standards MIL-STD-1686 Electrostatic Discharge Control Program For Protection Of Electrical And Electronic Parts, Assemblies And Equipment (Excluding Electrically Initiated Explosive Devices) © 2018 BEST Inc. - Presented for SMTA 1-29-18
  11. 11. 3.1 Materials Manufacturers, when specified, shall [N1N2D3] have a lead-free control plan (LFCP), which shall [N1N2D3] be agreed upon by the Manufacturer and the User. Note: GEIA-STD-0005-1 and GEIA-STD-0005-2 constitute examples for the implementation of LFCPs/tin whisker mitigation for Aerospace and other High Performance Electronic Systems. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  12. 12. 3.2.2.1 Solder Pot Purity and Maintenance Dross shall [N1D2D3] be removed from the solder surface in a manner that assures the dross does not contact the items being tinned. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  13. 13. 4.1 Electrostatic Discharge (ESD) If there are any assemblies that contain components or parts sensitive to ESD, the Manufacturer shall [D1D2D3] implement a documented ESD control program in accordance with ANSI/ESD S20.20, IEC 61340-5-1, MIL-STD- 1686, or as agreed between User and Supplier. Documentation necessary for an effective program shall [D1D2D3] be available for review. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  14. 14. 4.2 Facilities Cleanliness and ambient environments in all work areas shall [D1D2D3] be maintained at levels that prevent contamination or deterioration of tools, materials, and surfaces to be soldered or conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of tobacco products shall [D1D2D3] be prohibited in the work area. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  15. 15. 4.6 Thermal Protection Multilayer Ceramic Chip Capacitors (MLCCs) and ‘‘stacked’’ capacitors containing these parts shall [N1D2D3] be handled as thermal shock sensitive. Heat up and cool down rates should be controlled within the component manufacturer's recommendations. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  16. 16. 4.9 General Part Mounting Requirements Uninsulated parts mounted over exposed circuitry shall [N1N2D3] have their leads formed to provide a minimum of 0.25 mm [0.01 in] between the bottom of the component body and the exposed circuitry. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  17. 17. 4.17 Reflow Soldering IPC-7530 provides guidance on developing an appropriate profile for wave and reflow soldering. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  18. 18. 4.18 Solder Connection The primary difference between the solder connections created with processes using tin-lead alloys and processes using lead free alloys is related to the visual appearance of the solder. All other solder fillet criteria are the same. Lead-free and tin-lead connections may exhibit similar appearances but lead free alloys are more likely to have surface roughness (grainy or dull) or different wetting contact angles. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  19. 19. Figure 5-1 1. 100% insulation thickness 2. 20% insulation thickness reduction 5.1.1 Insulation Damage © 2018 BEST Inc. - Presented for SMTA 1-29-18
  20. 20. 5.1.2 Strand Damage The number of damaged (nicked or broken) strands in a wire shall not [D1D2D3] exceed the limits given in Table 5-1. There shall not [N1P2P3] be any number of severed or damaged strands less than the quantity allowed in Table 5-1. There shall [A1P2D3] be no strand separation (birdcaging) greater than one strand diameter. There shall [A1D2D3] be no strand separation (birdcaging) beyond the outside diameter of the insulation. Recommendations and requirements on wires used in high voltage applications are provided in 1.13.2.3. • Wire strands shall not [A1D2D3] be altered or cut to fit terminals. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  21. 21. 5.1.3.2 Tinning of Stranded Wire – Coverage The solder shall [N1D2D3] wet the tinned portion of the wire and should penetrate to the inner strands of the wire. Pinholes, voids, dewetting/nonwetting shall not [A1P2D3] exceed 5% of the area required to be tinned. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  22. 22. 5.4.1.2 Service Loops When service loops are required at initial attachment, wires shall [D1D2D3] have sufficient length as shown in Figure 5-6, 7 to allow at least one field re-termination. Note: When Service Loop(s) are required, that requirement should be included on the assembly drawing(s)/documentation. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  23. 23. 5.4.1.4 Orientation of Lead or Wire Wrap Attachments to terminals that require a wrap may be wrapped clockwise or counterclockwise (consistent with the direction of potential stress application). The lead or wire shall [A1P2D3] continue the curvature of the dress of the lead/wire. Wrapped conductors shall not [A1D2D3] cross over or overlap themselves or each other on the terminal. and shall not [A1D2D3] interfere with the wrapping of other leads or wires on the terminal or overlap itself. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  24. 24. 5.4.1.5 Continuous Runs A continuous solid bus wire may be run from terminal to terminal to three or more bifurcated, turret, or pierced terminals are to be connected. A curvature shall [D1D2D3] be included in the unwrapped wire portion of the jumper to provide relief of tension from environmental loading. The connections to the first and last terminals shall [D1D2D3] meet the required wrap for individual terminals. The following additional requirements shall [A1P2D3] be met: a. For each intermediate turret terminal, the wire is wrapped 3600 around or interweaves each terminal. b. For each intermediate bifurcated terminal, the wire passes through the slot and is in contact with the base of the terminal or a previously installed wire. c. For each intermediate pierced or perforated terminal, the wire is in contact with at least two nonadjacent contact surfaces of each intermediate terminal. d. For each intermediate hook terminal, the wire is wrapped 360° around each terminal. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  25. 25. 5.4.3.1 Side Route Connection Table 5-6 provides the staking criteria for side route connections that do not meet minimum wrap criteria, see Figure 5-10. As an alternative to the wrap criteria provided in Table 5-5, wire(s) and/or component lead(s) may be routed straight through the terminal when the assembly drawing/documentation incorporates bonding/staking for the wire(s)/lead(s) to the requirements of Table 5-6. If straight through routing is utilized, wire(s) or lead(s) shall [A1P2D3] extend beyond the post of the terminal and be in contact with the base of the terminal or the previously installed wire (see Figure 5-11). Additionally, wires/leads shall [D1D2D3] meet the staking requirements of Table 5-6. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  26. 26. 7.5.5 Cylindrical End Cap Terminations Note 5: The maximum fillet may overhang the land or extend onto the top metallization but of the component termination; however, the solder does not touch the top of extend further onto the component body. Solder may touch the bottom half of the component body. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  27. 27. 9.1.12 Crazing Crazing shall not [N1D2D3] exceed 50% of the physical spacing between noncommon conductors. Crazing at the edge of the board shall not N1D2D3] reduce the spacing minimum defined distance between the board edge and any conductive pattern to below the minimum lateral conductor spacing specified in the drawing(s)/documentation. If the minimum distance is not specified, crazing shall not [N1D2D3] reduce the distance between the board edge and conductive pattern by not more than 50% or 2.5 mm [0.1 in], whichever is less. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  28. 28. 10 COATING, ENCAPSULATION AND STAKING (ADHESIVE) All assemblies shall [N1N2D3] be clean before processing. After cleaning, prior to processing, assemblies shall [N1N2D3] be handled to prevent contamination. The material specification/data sheet or other documented procedure shall [D1D2D3] be followed for mixing and curing. The material shall [D1D2D3] be used within the time period specified (both shelf life and pot life) or used within the time period indicated by a documented system to control age-dated material. When processing varies from supplier recommended instructions, the variations shall [D1D2D3] be documented and available for review. Items exposed to uncured silicone material shall not [D1D2D3] be used for processing other material. An authorized exception is allowed only in cases where equipment is used for co-curing processes and the manufacturer has demonstrated through system tests that non- silicone material properties have not changed and design requirements are met. Objective evidence shall [D1D2D3] be maintained and available for review. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  29. 29. 10.5.1.2 Staking – Application - SMT The following criteria apply to surface mount components only. a. Components whose longest dimension is their height - The staking material shall [N1D2D3] be applied to a minimum height of 25% of each individual component’s body height. Slight flow of staking material under the component body is acceptable provided it does not violate 10.5.1. i. For closely spaced arrays consisting of up to four components fillet height requirements for the two outer end-faces shall [N1D2D3] be the same as for an individual component. In addition, the top inner surfaces shall [N1D2D3] be bonded to each other for 50% of the components’ width. ii. For closely spaced arrays consisting of greater than four components staking shall [N1D2D3] be applied in the same manner as arrays up to four components, with the additional requirement that every other internal component shall [N1D2D3] have their sides staked to the board surface. b. Components whose longest dimension is their diameter or length (e.g., QFPs) Rectangular components shall [N1D2D3] be staked with a bead of staking material placed at each corner of the component. For each bead, the staking material shall [N1D2D3] contact a minimum 25% of the height of the component body. Slight flow of staking material under the component body is acceptable provided it does not violate © 2018 BEST Inc. - Presented for SMTA 1-29-18
  30. 30. 12.1.2 Visual Inspection The assembly shall [N1D2D3] be evaluated either by sample based inspection in accordance with the established a documented process control plan system, see 12.2, or by 100% visual inspection, see 1.11. Inspection of soldering and post solder cleanliness may be performed in the same operation using Tables 12-1, 12-2, and 12-3 conformal coating, staking or encapsulation shall [N1D2D3] be performed after and not combined with, soldering and cleaning process inspections. Inspection of soldering and cleanliness shall [N1D2D3] be performed prior to conformal coating, staking or encapsulation. Inspection for damage may be combined with solder and/or cleanliness inspections. Inspection for damage should be performed prior to conformal coating and as part of the final inspection process. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  31. 31. IPC-A-610 Rev F - G Comparison Presented by Norman D. Mier Jr. IPC MIT BEST, Inc © 2018 BEST Inc. - Presented for SMTA 1-29-18
  32. 32. 1.2 Purpose Standards may be updated at any time, including with the use of amendments. The use of an amendment or newer revision is not automatically required. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  33. 33. 1.4 Measurement Units and Applications This Standard uses International System of Units (SI) units per ASTM SI10-10, IEEE/ASTM SI 10 American National Standard for Metric Practice (Section 3) [Imperial English equivalent units are in brackets forconvenience]. The SI units used in this Standard are millimeters (mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g) [oz] for weight, lux (lx) [footcandles] for illuminance. Note: This Standard uses other SI prefixes (ASTM SI10-10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm becomes 1.2 μm) or as alternative to powers- of-ten (3.6 × 10³ mm becomes 3.6 m). 1.4.1 Verification of Dimensions Actual MeasurementsFor determining conformance to the specifications in this Standard, round all observed or calculated values “to the nearest unit” in the last right-hand digit used in expressing the specification limit, in accordance with the • J-STD-001G Draft Document for Industry Consensus Ballot Only January 2017 • 2 | P a g e • rounding method of ASTM Practice E29, Using Significant Digits in Test Data to Determine Conformance with Specification. For • example, specifications of 2.5 mm max, 2.50 mm max, or 2.500 mm max, round the measured value to the nearest 0.1 mm, 0.01 mm, • or 0.001 mm, respectively, and then compare to the specification number cited. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  34. 34. 1.7.5 (Examples and Illustrations) Definitions of Requirements Many of the examples (illustrations) shown are grossly exaggerated in order to depict the reasons for this classification. It is necessary that users of this standard pay particular attention to the subject of each section to avoid misinterpretation. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  35. 35. 1.5.1.3 Defect Condition A defect is a condition that may be insufficient to ensure the form, fit or function of the assembly in its end use environment. Defect conditions shall be dispositioned by the manufacturer based on design, service, and customer requirements. Disposition may be to rework, repair, scrap, or use as is. Repair or "use as is" may require customer concurrence. It is the responsibility of the User to define unique defect categories applicable to the product. A defect for Class 1 automatically implies a defect for Class 2 and 3. A defect for Class 2 implies a defect for Class 3. (Note this would not be the case where criteria for a particular class have not been established). © 2018 BEST Inc. - Presented for SMTA 1-29-18
  36. 36. 1.8.3 Diameter Conductor The conductor diameter is the outside diameter of wire, either stranded or solid, without the insulation. Wire Wire diameter is the outside diameter of wire, either stranded or solid, including insulation if present. 1.8.8 Locking Mechanism A method of securing a mated assembly, e.g., fastener, connector, either by use of a device integral to the assembly’s components / parts, e.g., polymer insert, design feature, e.g., spring clip, latch, twist detent, push-pull, or by additive device, material, or process, e.g., thread adhesive, safety wire that when engaged prevents loosening or disconnection of the mated assembly. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  37. 37. 1.8.13 *Stress Relief Slack in a component lead or wire that is formed in such a way as to minimize mechanical stresses. 1.6.11 Wire Diameter In this document, wire diameter (D) is the outside overall diameter of conductor wire, either stranded or solid, including insulation if present. Unless otherwise specified, criteria in this standard are applicable for solid wire/component leads or stranded wire. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  38. 38. 1.8.12 Inspection Methodology Accept and/or reject decisions shall be based on applicable documentation such as contract, drawings, specifications and referenced documents. The use of any non-visual inspection methods, other than those already detailed in Sections 8.3.12 and 8.3.13 are not specifically covered by this Standard and shall be used as agreed between User and Manufacturer. The inspector does not select the class for the assembly under inspection, see 1.3. Documentation that specifies the applicable class for the assembly under inspection shall be provided to the inspector. Automated Inspection, e.g., AOI, AXI, Technology (AIT) is a viable alternative to visual inspection and complements automated test equipment. Many of the characteristics in this document can be inspected with an AIT automated system. IPCAI-641 "User's Guidelines for Automated Solder Joint Inspection Systems" and IPC-AI-642 "User's Guidelines for Automated Inspection of Artwork, Inner-layers, and Unpopulated PCBs" provide more information on automated inspection technologies. If the customer desires the use of industry standard requirements for frequency of inspection and acceptance, J-STD-001 is recommended for further soldering requirement details. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  39. 39. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  40. 40. 4.1.5 Hardware Installation - Threaded Fasteners and Other Threaded Hardware Acceptable - Class 1 Defect – Class 2,3 Less than one and one-half threads extend beyond the threaded hardware, (e.g., nut) unless otherwise specified by engineering drawing. thread extension would interfere with other component. Thread extension more than 3 mm [0.1 in] plus one and one-half threads for bolts or screws up to 25 mm [1 in]. Thread extension more than 6.3 mm [0.25 in] plus one and one-half threads for bolts or screws over 25 mm [1 in]. Bolts or screws without locking mechanisms extend less than one and one half threads beyond the threaded hardware. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  41. 41. 4.1.5.1 Hardware Installation - Threaded Fasteners and Other Threaded Hardware –Torque Acceptable - Class 1,2,3 Fasteners are tight and split-ring lock washers, when used, are fully compressed. Fastener torque value, if specified, is within limits. No evidence of damage resulting from overtightening of the threaded item. Torque stripe on fasteners (witness/anti-tampering stripe), when required, see Figure 4-21: Is continuous between the fastener and the substrate. Extends from the top of the fastener onto the adjacent substrate (at minimum). Is aligned with the center line of the fastener. Is undisturbed (indicating no movement of the fastener and stripe after torqueing). © 2018 BEST Inc. - Presented for SMTA 1-29-18
  42. 42. 4.1.5.1 Hardware Installation - Threaded Fasteners and Other Threaded Hardware –Torque Defect - Class 1,2,3 Threaded items are not tight and split ring lock washer, Split ring lock washer, if used, is not compressed, see Figure 4-212. Fastener torque value, if specified, is not within limits. Hardware is loose, see Figure 4-22. Evidence of damage resulting from overtightening of the threaded item to the parts being fastened / tightened. Required torque stripe is not continuous between the fastener and the substrate. Required torque stripe does not extend from the top of the fastener onto the adjacent substrate (at minimum). Required torque stripe is not aligned with the center line of the fastener. Required torque stripe is disturbed (indicating movement of the fastener and stripe after torqueing © 2018 BEST Inc. - Presented for SMTA 1-29-18
  43. 43. 4.2 Jackpost Mounting This section covers the height relationship of the face of the jackpost to the associated connector face. This is critical to obtain maximum connector pin contact. Hardware stack-up for mounted connectors may be varied in order to locate the face of the jackpost flush to 0.75 mm [0.030in] below the face of the connector. Acceptable - Class 1,2,3 Jackpost face is flush to 0.75 mm [0.030 in] below the face of the connector. The jackposts can be above or below the face of the connector, depending on the design, providing the connector and jackposts mate correctly. Height is obtained by adding or removing washers (supplied with jackpost) in accordance with manufacturer’s instructions. Defect - Class 1,2,3 Jackpost face extends above the connector face, see Figure 4-28 The jackposts are above or below the face of the connector, depending on the design, and the connector and jackposts do not mate correctly. (No figure showing the defect condition.). Face of jackpost is greater than 0.75 mm [0.030 in] below the connector face, see Figure 4-29. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  44. 44. 5.2.1 Soldering Anomalies - Exposed Basis Metal Component leads, sides of land patterns, conductors, and use of liquid photo imageable solder mask can have exposed basis metal per original designs. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  45. 45. 5.2.14 Partially Visible or Hidden Solder Connections A partially visible or hidden solder connection shall have the visible portion inspected, if any, of the connection on either side of the PTH solder connection (or the visible portion of an SMT connection), and shall be compliant with the criteria stated herein for that type of connection. The non-visible portion of the connection should be maintained in accordance with Clause 1.5.1.4.1. NOTE: Nondestructive evaluation (NDE) may be used or AABUS to verify the specified dimensions that are not visible through normal visual means. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  46. 46. 6.2.1.2 Insulation – Damage – Post-Solder Defect - Class 1,2,3 Insulation charred. Solder connection contaminated by burnt or melted insulation. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  47. 47. 6.2.3.1 Insulation - Flexible Sleeve – Placement Acceptable – Class 2,3 • Sleeving/tubing is tight on terminal and wire/cable. • Multiple pieces of sleeving overlap each other by at least 3 wire/cable diameters, or 13 mm [0.5in], whichever is larger. Defect – Class 2,3 • Sleeving/tubing is not tight on terminal and wire/cable. • Multiple pieces of sleeving overlap is less than 3 • wire/cable diameters or 13 mm [0.5 inch],whichever is less. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  48. 48. 6.3.2.1 Conductor – Damage – Stranded Wire Target – Class 1,2,3 Wire conductor ends are cut perpendicular to the wire longitudinal axis. All of the strands of the strand group are the same length. Wire strands are not scraped, nicked, cut, flattened, scored, or otherwise damaged. Defect - Class 1,2,3 The number of Damaged (scraped, nicked or severed) strands exceed the limits specified in a single wire exceeds the limits in Table 6-2. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  49. 49. 6.4 Service Loops Acceptable - Class 1,2,3 When a service loop is required, wire has at initial attachment there is sufficient length to allow one field re-termination to be made. Defect - Class 1,2,3 When a service loop is required, wire does not have sufficient at initial attachment the length is to short to allow at least one field re- termination to be made. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  50. 50. 6.5.1 Stress Relief – Bundle Acceptable – Class 1 Process Indicator – Class 2 Defect - Class 3 Does not meet bend radius requirements. See Table 4-1, see Figure 6-58. There is insufficient stress relief, see Figure 6- 58. The wire is under stress at the wrap, see Figure 6-59. Defect – Class 1,2,3 Does not meet bend radius requirements. See Table 4-1, see Figure 6-59. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  51. 51. 6.6 Lead/Wire Placement – General Requirements The terminal wire wrap summarized in Table 6- 3 apply equally to wires and component leads. The criteria associated with each terminal type or connection are in clauses 6.8 through 6.15 apply only to that connection. Unless otherwise specified the wire or lead should be in contact with base of the terminal or a previously installed wire. The lead and wire ends should not extend beyond the terminal greater than one (1) lead diameter. Removed Table 6-3 © 2018 BEST Inc. - Presented for SMTA 1-29-18
  52. 52. 6.6 Lead/Wire Placement – General Requirements Target - Class 1, 2, 3 Wires placed in ascending order with the largest on the bottom. Wraps to a terminal are parallel with the terminal base and each other. Wires are mounted as close to the terminal base as allowed by the insulation. Acceptable - Class 1,2,3 Wraps to a terminal are parallel with the terminal base and each other. Wires are mounted as close to the terminal base as allowed by the insulation. Wrapped conductors do not cross over or overlap each other on terminal. Strand separation (birdcaging) meets the requirements of 6.3.3 and 6.3.4. Calibration parts may be mounted to the tops of hollow terminals, see Figure 6-69. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  53. 53. 6.6 Lead/Wire Placement – General Requirements Acceptable – Class 1 Defect – Class 2,3 • Terminal altered to accept oversized wire or wire group. • Wrapped conductors cross over or overlap each • other on terminal, see Figure 6-67B. • Strand separation (birdcaging) does not meet the requirements of 6.3.3 and 6.3.4. • The lead or wire interferes with the wrapping of other leads or wires on the terminal. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  54. 54. 6.8.1 Turrets and Straight Pins - Lead/Wire Placement Acceptable - Class 1 Process Indicator - Class 2 Defect - Class 3 • On straight pins, the top wire on terminal is less than one wire diameter below the top of the terminal. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  55. 55. 6.9.1 Bifurcated - Lead/Wire Placement - Side Route Attachments Acceptable - Class 1 Process Indicator - Class 2 Defect - Class 3 • Any portion of the wrap extends beyond the top of • terminal post. • Wire does not have positive contact with at least one corner of the post. • Wire/lead less than 0.75 mm [0.03 in] in diameter is wrapped around a post less than 90º. Defect - Class 1,2,3 • Wire does not pass through slot. • Wire end violates minimum electrical clearance, see Figure 6-82. • Wire/lead less than 0.75 mm [0.03 in] in diameter is wrapped around a post less than 90º and is not staked, see 6.9.2. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  56. 56. 6.9.4 Bifurcated – Solder Acceptable – Class 1 Process Indicator – Class 2,3 • Wire/lead not discernible in solder connection. Defect – Class 1,2 • Depression of solder between the post and the wire is greater than 50% of wire radius. Defect – Class 3 • Depression of solder between the post and the wire is greater than 25% of wire radius. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  57. 57. 6.13.2 Solder Cups – Solder Acceptable - Class 1,2,3 • Thin film of solder on the outside of the cup. • Solder fills the inside of the cup. • Solder fill 75% or more of visible portion above the cup lip. • Solder buildup on the outside of the cup, as long as it does not affect form, fit or function. • Solder visible in or slightly protrudes from the inspection hole (if one is provided). Defect - Class 1,2,3 • Solder does not fill the inside of the cup. • Vertical fill of solder in the visible portion of the cup is less than 75%. • Solder vertical fill less than 75%. • Solder buildup on outside of the cup negatively affects form, fit or function. • Solder not visible in the inspection hole (if one is provided). © 2018 BEST Inc. - Presented for SMTA 1-29-18
  58. 58. 7.3.5.1 Supported Holes – Solder - Vertical fill (A) Acceptable - Class 2 • Minimum vertical fill of 50% or 1.2 mm [0.05in], whichever is less, for components with 14 (not shown). • Component lead is discernible in the solder source side of the solder connection. • Minimum vertical fill of hole is more than 50% or 1.2 mm [0.05 in], whichever is less, for components with less than 14 leads and having an internal thermal plane providing the solder fillet of Side B of Figure 7-87 has wetted 360o of the PTH barrel wall and 360o of the lead and the surrounding PTHs meet requirements of Table 7-4. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  59. 59. 7.3.5.1 Supported Holes – Solder - Vertical fill (A) Acceptable - Class 1,2,3 • Minimum 75% fill. A maximum of 25% total depression, including both solder source and solder destination side is permitted. Note: For Class 2, this criteria is specific to components with less than 14 leads and not having an internal thermal plane. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  60. 60. Defect - Class 2 • Vertical fill of hole is less than 75% for component less than 14 leads and not having an internal thermal plane. • Vertical fill of hole is less than 75% and greater than 50% or 1.2 mm [0.05 in], whichever is less, for components with less than 14 leads and having an internal thermal plane and the solder fillet on Side B of Figure 7-867 has wetted less than 360° of the PTH barrel wall and less than 360° of the lead. • Vertical fill of hole is less than 50% or 1.2 mm[0.05 in], whichever is less, for component with greater than or equal to 14 leads or more. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  61. 61. 7.5 Jumper Wires The requirements relative to wire type, wire routing, staking and soldering requirements are the same for both haywires and jumper wires. For the sake of simplicity only the more common term, jumper wires, is used in this section; however these requirements would apply to both haywires and jumper wires. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  62. 62. 8.3.2.9 Rectangular or Square End Chip Components - 1, 2, 3 or 5 Side Terminations - Termination Variations © 2018 BEST Inc. - Presented for SMTA 1-29-18
  63. 63. 8.3.5 Flat Gull Wing Leads Note 6. (C) is measured at the narrowest point of the solder fillet. Note 7. If Side Overhang (A) is present, then the Side Joint Length (D) on the overhanging portion of the lead is not inspectable © 2018 BEST Inc. - Presented for SMTA 1-29-18
  64. 64. 8.3.6 Round or Flattened (Coined) Gull Wing Leads Note 6. Side fillet (and corresponding Dimensions (D) & (Q)) would not form and therefore is not required on a side where acceptable side overhang (A) is present. Note 7. (C) is measured at the narrowest point of the solder fillet. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  65. 65. 8.3.12.5 Surface Mount Area Array – Underfill/Staking Target - Class 1, 2, 3 • Underfill or staking material does not contact adjacent components. Acceptable – Class 1,2,3 • When specified required, underfill or staking material is present. • Excess underfill or staking material does not interfere with form, fit, or function of the assembly. • Underfill or staking material completely cured. Defect – Class 1,2,3 • When specified, underfill or staking material is not present. • Excess underfill or staking material interferes with form, fit or function of the assembly. • Missing or incomplete underfill or staking material when required. • Underfill or staking material not fully cured. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  66. 66. 8.3.16.2 P-Style Connections – Maximum Toe Overhang (B) Acceptable – Class 1,2,3 • No portion of the Lead Length (L) extends beyond the Land Length (S).Does not violate minimum electrical clearance. • Defect – Class 1,2,3 • Any portion of the Lead Length (L) extends beyond the Land Length (S).Violates minimum electrical clearance. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  67. 67. 10.2.2 Laminate Conditions - Blistering and Delamination Defect – Class 2,3 • Blister/delamination exceeds 25% of the distance between plated-through holes or internal conductors. Defect - Class 1,2,3 • Blister/delamination exceeds 25% of the distance between plated-through holes or internal conductors. • Blistering/delamination reduce the space between conductive patterns below the minimum electrical clearance © 2018 BEST Inc. - Presented for SMTA 1-29-18
  68. 68. 10.2.4 Laminate Conditions – Haloing Acceptable - Class 1,2,3 • The distance between the haloing penetration and the nearest conductive feature is not less than the minimum lateral conductor spacing, or 0.1 mm [0.004 in] when the minimum lateral conductor spacing is not specified. • Defect - Class 1,2,3 • The distance of between the haloing penetration and the nearest conductive feature is less than the minimum lateral conductor spacing, or less than 0.1 mm [0.004 in] when the minimum lateral conductor spacing is not specified. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  69. 69. 10.4.2.2 Flexible and Rigid-Flex Printed Circuitry –Delamination/Blister – Flex to Stiffener Not Established – Class 1 Acceptable – Class 2,3 • The distance from stiffener board edge in the straight section of flex circuit which is intended to remain straight is 0.5mm [0.02 in] or less. • The distance from stiffener board edge in the bend section of the flex circuit which is intended to bend is 0.3mm [0.01 in] or less. • The area of blister or delamination between flex circuitry and a stiffener board exceeds 20% of the joined area provided the thickness of the blister does not exceed the thickness limit of the entire board. • Delamination (separation) or bubbles in the coverlayers of the flexible circuitry does not span more than 25% of the distance between adjacent conductive patterns. • Not Established – Class 1 • Defect – Class 2,3 • The distance from stiffener board edge in the straight section of flex circuit which is intended to remain straight exceeds 0.5mm [0.02 in]. • The distance from stiffener board edge in the bend section exceeds 0.3mm [0.01 in]. • The area of blister or delamination between flex circuitry and a stiffener board exceeds 20% of the joined area. • Delamination (separation) or bubbles in the coverlayers of the flexible circuitry span more than 25% of the distance between adjacent conductive patterns. © 2018 BEST Inc. - Presented for SMTA 1-29-18
  70. 70. 10.5.5.3 Marking - Labels - Adhesion and Damage Acceptable – Class 1,2,3 • Label lifted 10% or less of the label area. • Physical damage is 10% or less of the label area and does not affect form, fit or function. • Damage does not affect legibility or the barcode readability Defect - Class 1,2,3 • More than 10% of the label area is peeling. • Missing labels • Label wrinkle affects readability. • Physical damage is greater than 10% of the label area or affects form, fit or function. • Damage affects legibility or the barcode readability. © 2018 BEST Inc. - Presented for SMTA 1-29-18

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