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Company Presentation
May 5, 2015
Infineon and International Rectifier:
A Powerful Combination
*non-audited figures
 As of January 2015, International Rectifier is an Infineon Technologies
company
 Combined pro-forma revenue of ~€5,150m* (~6,950m USD) in
Infineon 2014 fiscal year
 About 35,000 employees worldwide* (as of March 2015)
 Strong technology portfolio with more than 22,800 patents and
patent applications (as of September 2014)
 33 R&D locations; 20 manufacturing locations
Page 2May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Table of Contents
 Market and Business Development Second Quarter FY 2015
 Business Focus
 Segments, Products and Technology
 General Company Information
 Integration of International Rectifier
Page 3May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Table of Contents
 Market and Business Development Second Quarter FY 2015
 Business Focus
 Segments, Products and Technology
 General Company Information
 Integration of International Rectifier
Page 4May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Revenue Split by Segment
Q2 FY 2015 Revenue: € 1,483m
Page 5May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*Other Operating Segments; Corporate & Eliminations.
Chip Card
& Security
Automotive
PMM
IPC
ATV
€ 598m
CCS
€ 132m
OOS+C&E*
€ -2m
IPC
€ 241m
PMM
€ 464m
137
126
149
204
139 141
166
213
227
248 256 249
226
298 300 292
306
336
349 353
1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016
Positive Growth Outlook
for Global Semiconductor Market
Source: WSTS for historical data. Forecast:  of WSTS, IHS, Gartner, IC Insights; last update April 27, 2015
Global Semiconductor Market
in Billion US-Dollar
Forecast revenue rangeMarket size (revenue)
359
391
Page 6May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Infineon Holds Top Positions in All Major
Product Categories
Page 7May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Discrete power semiconductors and
power modules.
Source: IHS Inc., September 2014
Microcontroller-based smart
card ICs.
Source: IHS Inc., July 2014
Automotive semiconductors incl.
semiconductor sensors.
Source: Strategy Analytics,
April 2015
Automotive
semiconductors
total market in 2014:
$27.5bn
6.8%
7.5%
7.8%
10.5%
12.0%
NXP
Freescale
STMicro
Infineon
(incl. IRF)
Renesas
Power
semiconductors
total market in 2013:
$15.4bn
Smart card ICs
total market in 2013:
$2.48bn
6.4%
16.5%
17.9%
21.7%
32.3%
SHHIC
Samsung
STMicro
Infineon
NXP
5.5%
5.8%
6.0%
7.2%
17.8%
Fairchild
STMicro
Toshiba
Mitsubishi
Infineon
(incl. IRF)
Infineon Group
Results for FY 2013* and FY 2014*
Segment Result (SR) 377 620
[€ Million] 2013 2014
Net Income 272 535
SR Margin 9.8% 14.4%
Investments 378 668
Free Cash Flow 235 317
Market capitalization**~7,995 ~9,240
Net Cash 1,983 2,232
Revenues Net
Income
FY13 FY14 FY13 FY14
535
3,843
272
4,320
Revenues 3,843 4,320
**share price as of September 30th, 2013: 7.395 Euro; share price as of September 30th, 2014: 8.193 Euro
+12%
Page 8May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
Infineon Group
Results for Q1 FY15* and Q2 FY15
Segment Result (SR) 169 198
[€ Million] Q1 15* Q2 15
Net Income 136 69
SR Margin 15.0% 13.4%
Gross Cash Position 2,107 1,656
Free Cash Flow (171) (1,880)**
Net Cash 1,917 (176)**
Revenues 1,128 1,483
69
1,128
136
+31%
Q1 FY15 Q2 FY15
1,483
Revenues Net
Income
Page 9May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
**includes transactions related to the acquisition of
International Rectifier
Infineon Group
Results for Q2 FY14* and Q2 FY15
Segment Result (SR) 146 198
[€ Million] Q2 14* Q2 15
Net Income 124 69
SR Margin 13.9% 13.4%
Gross Cash Position 2,198 1,656
Free Cash Flow 51 (1,880)**
Net Cash 2,010 (176)**
Revenues 1,051 1,483
69
1,051
124
+41%
1,483
Revenues Net
Income
Q2 FY14 Q2 FY15
Page 10May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
**includes transactions related to the acquisition of
International Rectifier
Segment Revenue, Result and Margin
484
510 518 518
598
185 200
219
190
241 252
271
300
280
464
121 123
142 132
182
66 70 69 72 64 33 40 44 28 20
37 46 60 48 82 8 10 20 18 32
Q2
FY14
Q3 Q4 Q1
FY15
Q2* Q2
FY14
Q3 Q4 Q1
FY15
Q2* Q2
FY14
Q3 Q4 Q1
FY15
Q2* Q2
FY14
Q3 Q4 Q1
FY15
Q2
Revenue Segment Result Segment Result Margin
+30%
[EUR m]
+84%
11%14% 14% 13% 14%
20%
15%
20%18%
8%
7%
18%
17%
+24%
ATV IPC CCSPMM
[EUR m] [EUR m] [EUR m]
+50%
14%
20% 18%15% 17%
8% 14%
* Including International Rectifier from 13 January to 31 March 2015.
Page 11May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Revenue Split by Regions
FY 2013* and FY 2014*
Americas
13% 11%
Europe, Middle East,
Africa (EMEA)
41% 39%
Asia / Pacific
40%
43%
Japan
6% 7%
21% 20%therein:
Germany
18% 20%therein:
China
Page 12May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
therein:
Germany
16%
therein:
Germany
16%
therein:
China 22%
FY 2013 FY 2014
*w/o International Rectifier
Table of Contents
 Market and Business Development Second Quarter FY 2015
 Business Focus
 Segments, Products and Technology
 General Company Information
 Integration of International Rectifier
Page 13May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
A Powerful Combination:
Benefits of the Integration
Broader product portfolio Economies of scale
Greater technology expertise Stronger presence in the regions
 Better regional presence in the
U.S. and the Asia-Pacific region
 Expansion of market access via
the distribution channel
 Broader GaN product and IP
portfolio
 Faster roadmaps
 Expansion of the product
portfolio
 Broader and deeper under-
standing of applications (“From
Product to System” strategy)
 Better cost structure thanks to
broader sales base
 Faster ramp-up of production on
300 mm thin wafers
Page 14May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Table of Contents
 Market and Business Development Second Quarter FY 2015
 Business Focus
 Segments, Products and Technology
 General Company Information
 Integration of International Rectifier
Page 15May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
We Focus on Our Target Markets
Core Competencies
 Analog/Mixed Signal
 Power
 Embedded Control
 Manufacturing Competence
Focus Areas
 Energy Efficiency
 Mobility
 Security
Our Target Markets
 Automotive Electronics
 Industrial Electronics
 Information and Communications
Technology
 Security
Page 16May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
We Focus on Three Central Needs
of Modern Society
Energy Efficiency Mobility Security
Industrial Power Control
Automotive
Power Management & Multimarket
Chip Card & Security
Page 17May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Key Trends
 Soaring total energy demand across the
globe amid dwindling fossil energy
resources
 Strong CO2 policies to achieve
climate goals
 Tapping renewable energies as
sustainable energy sources
 Electrification of the drivetrain of
commercial and passenger vehicles
 Infineon delivers semiconductor innovations playing a valuable role in minimizing power
loss and maximizing power savings along the entire energy supply chain, extending from
generation through distribution to actual consumption.
 Our products are the basis for intelligent and optimal use of energy resources in
industrial, computing and consumer applications, and in cars.
Our Contribution
Energy Efficiency
Page 18May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Key Trends
 Rigid CO2 regulations and rising oil price
 Increasing rules on safety, focusing on
preventive measures
 Rising new requirements in cars for
emerging markets
 Urbanization, globalization and
demographic change
 Strong investments in local and long
distance public transportation systems
 Leading semiconductor solutions contributing to a more sustainable mobility in terms of
reduced fuel consumption/emissions, improved safety and affordability.
 As an innovation driver and supplier of key components for electric and hybrid vehicles,
Infineon will actively help to shape the paradigm shift towards electro mobility on the
road.
 Innovative public transportation solutions for traction and electronic tickets.
Our Contribution
Mobility
Page 19May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Key Trends
 Secure communication everywhere
utilizing mobile phone and internet
 Move to electronic identification of
documents and products
 Contactless cards for payment and
electronic tickets
 Increased intercommunication in cars,
calling for secure data handling
 Introduction of smart grids calling for
advanced data security
 Tailored security according to system requirements, enabling the implementation of
transparent security in everyday systems.
 Leverage our worldwide leadership in security know-how for smart cards in automotive
and industrial applications increasingly demanding security.
 Combining both hardware security and cryptography, our products build the basis for
privacy and security while maintaining personal freedom and facilitating extended
communication capabilities.
Our Contribution
Security
Page 20May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Table of Contents
 Market and Business Development Second Quarter FY 2015
 Business Focus
 Segments, Products and Technology
 General Company Information
 Integration of International Rectifier
Page 21May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Tight Customer Relationships are Based on
System Know-how and App Understanding
Page 22May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Distribution partnersEMS partners
ATV IPC CCSPMM
Market-Oriented Business Structure*
Customers
ApplicationsSegments
Chip Card &
Security
Automotive
Industrial
Power Control
Chassis and comfort electronics; Electric and hybrid
vehicles; Powertrain; Safety; Security
Charger station for electric vehicles; Energy transmission
and conversion; Home appliances; Industrial drives;
Industrial vehicles; Renewable energy generation;
Traction; Uninterruptable power supplies
Authentication; Government Identification; healthcare
cards; Mobile communication; Near Field Communication
(NFC); Payment systems; Ticketing, access control;
Trusted computing
Power
Management
& Multimarket
Cellular network infrastructure; Light management and
LED lighting systems; Micro inverters for photovoltaic
rooftop systems; Mobile devices; Power supplies
*w/o International Rectifier
Page 23May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Product Range*
Industrial Power
Control (IPC)
 IGBT module
solutions incl. IGBT
stacks
 IGBT modules (high-
power, medium-
power and low-
power)
 Discrete IGBTs
 Bare die business
 Driver ICs
Power Management
& Multimarket
(PMM)
 Discrete high- and
low-voltage power
transistors
 Driver ICs
 Control ICs
 RF power transistors
 Small-signal
components
 CMOS RF switches
for antenna modules
 Antenna tuning ICs
 MEMS and ASICs for
silicon microphones
 Customized chips
(ASICs)
Chip Card & Security
(CCS)
 Contact-based
security controller
 Contactless security
controller
 Dual-interface
security controller
(contact-based and
contactless)
Automotive
(ATV)
 Microcontrollers
(8-bit, 16-bit, 32-bit)
for automotive and
industrial applications
 Software development
platform DAVETM
 Discrete power
semiconductors
 IGBT modules
 Voltage regulators
 Power ICs
 Bus interface devices
(CAN, LIN, FlexRay)
 Magnetic and pressure
sensors
 Wireless transmit and
receive ICs (RF, radar)
*w/o International Rectifier
Page 24May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
New Era:
Driving Demand for Power Semiconductors
 Shift towards renewable energies
requires significantly more high-power
semiconductors per MW of power
generated.
'90 – '10
 Electrification in cars with Internal
Combustion Engine as well as the trend
towards emobility drives the demand for
power semiconductors.
 Higher efficiency in power conversion
reduces CO2 emission and total cost of
ownership.
 Stronger demand for goods containing
power semiconductors due to increasing
standard of living in BRIC countries.
'10 – '30 Changes
Courtesy: Facebook
Courtesy: BMW Group
Page 25May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Automotive
Overview
Product Range
 Sensors: pressure, magnetic, radar
 Microcontrollers: 32-bit for Powertrain, Safety and
ADAS
 Power: MOSFETs, IGBTs, smart power ICs: voltage
regulators, bridges, driver ICs, CAN / LIN / FlexRay™
transceiver**, DC-DC converters, power system ICs,
system-on chip, embedded power ICs
 Hybrid & Electric Vehicle: IGBT HybridPACK™,
HybridPACK™ Double Sided Cooling (DSC) modules,
gate driver ICs
Core Competencies/
Value Proposition
 Automotive commitment: More than 40 years of
automotive system and application expertise
 Complete automotive system provider
 Hybrid and Electro mobility: industry leading
expertise and product portfolio
 Functional Safety (ISO26262) and Security
enabling car solutions
 Worldwide development, production and support
sites for automotive semiconductors
 Next Level of Zero Defect: most comprehensive
quality program of the industry
Market Positions*
 No. 2 in Automotive semiconductors worldwide
 No. 1 Europe
 No. 3 North America
 No. 1 APAC & RoW
 No. 1 Korea
 No. 3 China
 No. 4 Japan
 No. 1 in automotive power semiconductors
(24.8%) Source: Strategy Analytics (April 2015)
**FlexRay is a trademark licensed by FlexRay Consortium GbR
*incl. International Rectifier
Page 26May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Market Trends
■ Dwindling energy resources
■ Urbanization
■ Stricter CO2 emission legislations
■ Growing environmental awareness
Infineon's Opportunities
 Infineon components are key enabler for
car manufacturers to meet challenging
targets for CO2 emission reduction, e.g. in
the EU 95g CO2/km in 2021
 We offer Hybrid and electric drivetrain
products (HybridPACK™/HybridPACK™
DSC)
 No electric vehicle without semiconductors:
electric drive and control, battery
management, on-board battery charging
and power grid communication
We Focus on Future Trends
Making Cars Clean
Page 27May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Power module
BMW and Infineon: Working Together to
Shape the Future of Electro Mobility
 75 semiconductors ensure a highly efficient electric drive in the
BMW i3, e.g. Microcontroller AUDO Future, IGBT Power Module
HybridPACK™ 2, EiceDRIVER™ Products, CoolMOS™ High
voltage MOSFETs
 Further components: airbag control, LED light modules,
steering locks, windshield wipers and seatbelt retractors
Page 28May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Infineon's Opportunities
Infineon components covers the overall needs
of the autonomous vehicle:
 AURIXTM microcontroller family enables
dependable and secure processing
 Sensing technologies (e.g. Radar, Hall, 3D
Imager) increase performance of ADAS
systems
 Safe actuation solution (e.g. 3 phase
Bridge Driver IC) and safe power supply
enable dependable vehicle dynamics and
control
We Focus on Future Trends
Making Cars Safe
Key system requirementsMarket trends
ReliabilityAccident avoidance
Autonomous driving
Cyber-networked car
High Availability
Functional Safety (ISO26262)
Cybersecurity
Courtesy: Bosch
Page 29May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
3D-Vision based Driver Monitoring:
Increased Safety and enhanced Comfort
Active and passive Interaction
New ways of interaction due to autonomous driving and
increased HMI (human machine interface) functionality:
■ Occupant detection (position, size, weight,..) allows
adaptive airbag activation
■ Driver awareness monitoring to adjust intervention from
ADAS systems
■ Safety systems consider driver status, especially for
autonomous driving
■ Touchless gesture control allows intuitive, fast and less
distractive interaction
Infineon's 3D Image Sensors
■ 3D cameras based on the Time-of-Flight (TOF) principle with active
infrared illumination provide optimum performance
■ Simplified object segmentation (less calculation effort and independent
from object colors, patterns and textures)
■ Very small form factor of TOF-cameras due to monocular design
Courtesy: KOSTAL
Page 30May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Industrial Power Control
Overview
Product Range
 IGBT Modules: Standard IGBT Modules, Power
Integrated Modules (PIM) and Converter Inverter
Brake (CIB) Modules
 IPM Modules: molded Intelligent Power Module (IPM)
 Discrete IGBTs
 Driver ICs: standalone driver IC products for
combination with IGBT modules and discretes
 Power Stacks: Power module assemblies including
heat sink, Driver IC and protective sensors/functions,
etc.
Core Competencies/
Value Proposition
 High quality products and services
 Leading edge technology and IP portfolio
 System expertise with broad application
competence
 Strong worldwide presence with local sales and
application support
 Dedicated account teams and distributors
Market Positions*
 No.1 in Discrete IGBTs with 24.7% market share
 No.2 in IGBT modules with 20.5% market share
 No.2 in IGBT semiconductor products (module &
discretes) worldwide
 No.1 in Europe
 No.1 in China
*Source: IHS Research, September 2014,
without International Rectifier
Page 31May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Power Components for Drive Control of
Train Systems
Infineon Parts
Metro TrainsHigh-Speed Trains
 Power: 5 to 10MW per train
 80 to 120 IGBT modules
per train
 Semiconductor content:
~ € 100,000 per train
 Power: 0.5 to 1MW per train
 25 to 50 IGBT modules
per train
 Semiconductor content:
~ € 10,000 per train
Page 32May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Power Components for Wind Converters
and HVDC connection of Offshore Parks
HVDC connection of Offshore ParkOnshore/Offshore Wind
Infineon Parts
 Power: 1MW to 6MW per
turbine
 12 to 48 IGBT modules or
6 to 12 Power Stacks per
turbine
 Semiconductor content:
~ € 5,000 per MW
 Power depends on amount of
connected offshore parks
 4,000 to 16,000 modules per
connection
 Semiconductor content:
~ € 5,300 per MW
HVDC: High Voltage Direct Current
Page 33May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Product Range
Market Positions*
 AC/DC and DC/DC Digital Control and Driver ICs
 High, Medium and Low Voltage Power Discretes
 RF Switches, Low Noise Amplifier, TVS Diodes, GPS Modules,
RF Power
 Silicon Microphone, Dig. ASICs, Pressure Sensors, Radar IC
 ASIC design solutions for authentication and battery
management
 GaN Class D Audio Amplifier
 HiRel Discretes & Modules
 Technology Leadership in Power & RF:
 Energy Efficiency
 Power Density, system size and weight reduction
 Connectivity and reliable, clean Data Transmission for
50bn devices in 2020
 Revolutionary Innovation made "easy to use"
 Application centric Innovation
 Integration competence: Power/RF, Digital Power,
Modules/MMIC/Discretes, chip embedding
 System understanding drives more efficient power
management
Core Competencies/Value Proposition
 No. 1 Power Semiconductors 18% market share
(IHS: The World Market for Power Semiconductor Discretes
& Modules – Sep. 2014)
 No. 1 in Discrete Standard MOSFETS 25.6% market
share
(IHS: The World Market for Power Semiconductor Discretes
& Modules – Sep. 2014)
 No. 2 in Chips for Silicon Microphones with 30%
market share (IHS: MEMS Microphones Report– April 2014)
 No. 3 in RF Power Devices with 15 % market share
(ABI Research: RF Power Amplifiers – March 2014)
Power Management & Multimarket
Overview
*with International Rectifier
Page 34May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
DC/DC Single- & Multi-Phase IC
Dig. Power Controllers
Power Stages
Driver ICs
Synchr. Rec IC
Integrated PoL
Class D Audio
PMM Product Overview
Silicon Carbide
SiC Schottky Diodes
GaN
PMM
Power Systems,
HiRel
Connectivity
& Sensing
High Voltage MOSFET
CoolMOS™
AC/DC IC
Dig. Power Controllers
Driver IC
Lighting IC
Low & Medium Voltage MOSFET
OptiMOS™, DirectFET™,
StrongIRFET ™
Sensors
Silicon Microphone
Dig. ASICs
Pressure Sensors
Radar IC
Radio Frequency
RF Switches
GPS Module
LNAs
RF Power
HiRel
Power Discretes
DC/DC Converters
Power Modules
Page 35May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
 Efficiency values of 95% and higher
 Technology leadership in silicon and silicon carbide products
 Highest power density enabling best cost-performance
ratios
 Unique system solutions with MOSFETs, power ICs and
driver products
Computing Mobile Devices Cellular InfrastructureChargerLighting
Power Management Mobile Communications
 Silicon Microphone sensor
element with leading
edge acoustic, electrical
and quality performance
 Excellent performance in
ESD protection
 Best-in Class Noise Figure
in Low Noise Amplifier
 Applicable for all standard
frequencies of 2G, 3G, 4G
(450 MHz to 2.7 GHz)
 Industry leading power
efficiency for LTE
 Wide range of devices with
power levels from 4–700 W
 Best-in-Class thermal
performance
Portfolio: MOSFETs, Power ICs, RF Switches, LNAs, Si-Mics, TVS Diodes, RF Power
Power Components for Servers and RF Devices
Cellular Communication and Infrastructure
Page 36May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Social Networks and Cloud Computing Driving
Demand for Highest Efficient Power Supplies
 Globally, we see one new data
center per week with up to 100
MW of power consumption
 Efficiency of power supply (AC/DC,
DC/DC) of utmost importance.
 DPM best solution for flexible load
dynamics
 Change in value chain: servers no
longer from the shelf but designed
by ODMs according to specification
of data center operator
Digital Power Management (DPM) Gaining Traction in Server Market
 DPM opens the door for bundling
with other products
 Recent design win: Infineon offers
DPM controllers along with driver ICs
and MOSFETs to Taiwanese ODM
CoolMOS™ OptiMOS™
Controller &
Driver IC
Page 37May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Power Semiconductors: Solutions for
Efficient Energy Use
Page 38May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Chip Card & Security
Overview
Product range
 Contactless and contact-based security
products for Communication, Payment, Mobile
Security, Internet of Things (IoT) Security,
Government Identification, Transport, Access,
Object Identification, and Entertainment
 Innovative solutions from basic security RFID
and memories to high-end security controllers
(including the award winning SLE 78 family)
 Extensive packaging and service portfolio
Market positions
 No. 2 in Microcontroller Smart Card ICs with
21,7%1 market share in CY2013* by revenue
 No. 1 in TPM; leading positions in
Authentication ICs and Mobile Security ICs
(secure elements in devices and on SIM cards)
 No. 2 in SIM card IC with 19%2 market share
in CY2013 in terms of volume
 No. 2 in Payment with 28%3 market share in
CY2013
 No. 2 in Government Identification with 32%4
market share in CY2013
Core competencies & value proposition
 Tailored security
Right level of security at the best cost-
performance ratio
 Contactless excellence
Focus on interoperability and dual interface
 Embedded control
Right trade-off between computing power,
power consumption, level
of security and cost
Source: 1,4IHS, July 2014; 2ABI, August 2014; 3May, Sep2014 IHS; IFX internal *Calendar year
Page 39Copyright © Infineon Technologies AG 2014. All rights reserved.May 5, 2015
Infineon supplies embedded secure element
chips to Samsung’s Galaxy S6 and S6 edge
Page 40
 Infineon supplies the embedded Secure
Element (eSE) chip for Samsung’s new
premium smartphones Galaxy S6 and
S6 edge
 Samsung’s flagship Galaxy’s S6 and S6
edge mobile devices use the Infineon
SLE 97 eSE
 Infineon’s SLE 97 is a SOLID FLASH™-
based eSE chip which can safeguard the
functionalities of the mobile device
as well as transactions where users’
sensitive data such as payment
credentials are concerned
Infineon Embedded Secure Element Chip for Samsung Galaxy S6 and S6 edge
May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Infineon supplies security controllers to
Microsoft’s Surface Pro 3 tablets
 Infineon’s OPTIGA™ TPM (Trusted
Platform Module) security controller is
used in Microsoft’s Surface Pro 3
 Microsoft’s Surface Pro 3, widely
recognized for its excellent performance
both as a tablet and a laptop
replacement, utilizes the higher security
and improved system management
features of the latest TPM 2.0 standard
 The Infineon OPTIGA TPM SLB 9665
series is used in Surface Pro 3 -
supporting a wide range of security needs
ranging from strong authentication to
platform integrity checks
Infineon Trusted Mobile Platform (TPM 2.0) for Microsoft Surface Pro 3
Page 41May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Semiconductor Technology Portfolio
Technology portfolio fits needs of logic and power applications
Digital CMOS: 800nm – 65nmTechnology Nodes (Platform <180nm incl. RF, AMS)
Analog/Mixed Signal: 500nm – 180nm Technology Nodes (CxNA)
eNVM: EEPROM: IMEMR, C9FL, OTP: C5OP (Automotive)
eFlash/EEPROM: 250nm – 65nm CxFL (Chip Card), CxFLA, CxFLN (Automotive)
HV-CMOS: 130nm, C11HV
RF BiCMOS: 25GHz – 100GHz: B6HFC, B9COPT, B10C
Bipolar IC: 2GHz...200GHz RF-Bipolar: BxHF SiGe: B7HFM, B7HF_SLC, B7HF200
HiPAC: Al/Cu Integrated Passives RF Switches: C7NP, C11NP
P7Mxx, P7Dxx, P8Mxx
Bipolar/Discretes/MMIC:
RF-Transistors NF-TR; BxHF(D/M), SiGe: B7HFD/M, B7HF_SD
Power Amplifier: LDMOS, LDxM, LDxIC, LD9AB RFMOS: HFM
Diodes: NF-DI, Tuner: DxT, Schottky: DxS PIN: DxP
Analog Bipolar: DOPL, Ax, BIPEP, B4CD
Analog BiCMOS: B6CA, B6CA-CT, B7CA, SPT170
HV-CMOS-SOI, Levelshift(SOI,JI)
Smart Power: 1200-130nm BIP/CMOS/DMOS
SPTx (Automotive, EDP) (BCD)
Smart: CMOS/DMOS, SMARTx, MSMARTx,
SSMARTx, Opto-TRIAC, SPS
Magnetic: BxCAS, C9FLRN_GMR
Opto: OP-DI, OP-TR, OP-C9N, µ-modules
C11TOF
DMOS: 12-500V Planar and Trench
MOSFET (OptiMOS™,HEXFET™)
HV-DMOS: Superjunction MOSFET
(CoolMOS™)
IGBT: Planar & Trench 500-6500V,
rev. cond., fast recov. diodes
SiC/GaN: Diode, JFET / power switches
Pressure: BxCSP, TIREPx
Silicon-Microphones: DSOUND
adopted for automotive, industrial and for high reliability requirements
MEMS/Sensors
CMOS
RF/Bipolar
Power/Analog
incl. Green Robust
Page 42May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Package Technology Portfolio
1) for specialities only 2) phase-out
Through
Hole
 TO, DIP
SMD
 TO
 DSO
 SSOP
Leadless
 ThinPAK
 TDSON
 TSDSON
 DirectFETTM
 TISON
 WISON
 IQFN
 HSOF
Power
Modules
High Power
 Easy
 34mm
 62mm
 Econo
 Econo-
PACK™+
 Prime-
PACK™
 IHM
 IHV
 Hybrid-
PACK™
Intelligent
Power
Modules
 IRAM
CIPOS™
µIPM™
SMD leaded
 SOT
 SOD
 TSOP
 TSSOP
Flat lead
 TSFP
 SC
Leadless
 TSLP
 TSSLP
 TSNP
Wafer level
 WLP
 WLL
Discretes
Power
Sensors
Through
Hole
 PSSO
SMD
Leaded
 DSOSP
Open
cavity
 DSOF
Mold on LF
 P-MCCx
Mold
 P-Mx.x
Chip on
Flex
 FTM
UV Globe
top
 T-Mx.x
PRELAM
 PPxx
Flip Chip
 S-MFCx.x
 S-COMx.x
Wafer
 Bumped
 Diced
Chip Card
Leadframe
based
Packages
Wafer Level
Packages,
Bare Die
Surface
Mount
Technology
(SMD)
Wafer Level
w/o
redistribution
 WLP (fan-in)
w/redistribution
 WLB (fan-in)
 eWLB
(fan-out)
 Blade
Bare Die
Wirebond
Flip chip
Through
Hole
 DIP 2)
SMD
 PLCC 2)
 TSSOP
 TQFP
 LQFP
 MQFP
Leadless
 VQFN
 WQFN
 O-LQFN 1)
 XSON
 USON
PowerIC
Laminate
based
Packages
SMD
 OCCN 1,2)
 BGA
 LBGA
 xFBGA,
xFSGA
Page 43May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Table of Contents
 Market and Business Development Second Quarter FY 2015
 Business Focus
 Segments, Products and Technology
 General Company Information
 Integration of International Rectifier
Page 44May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Decisive Competitive Advantage:
Quality at Infineon
Our
aspiration
Our path
Our
standards
 Preferred partner for our customers
 Smooth production and delivery
 We focus on stability and the
100 percent fulfillment of our
commitments
 Integrated approach along the entire
value chain
 Proactive Quality Management for
products and processes
 International Standards, e.g.
TS16949, ISO 9001, IEC 17025
 Specific customer requirements
Page 45May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Our global R&D network
Malakka
Kulim
Peking
Morgan Hill
Seoul
Schanghai
Bangalore
Torrance
Singapur
Warstein
Duisburg
Bristol
Augsburg
Neubiberg Padua
Villach
Graz
Regensburg
Dresden
Bukarest
Linz
Warwick
Irvine
Tewksbury
Provence
Reigate
Pavia
Skovlunde
Chandler
Page 46May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
El Segundo
San José
Leominster
Newport
Worldwide Manufacturing Sites
Frontend and Backend
Page 47May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Dresden Beijing
Wuxi
BatamWarstein Cegléd Malacca
KulimLeominsterSan JoseMorgan Hill
Mesa
Tijuana
Temecula
Singapore
Newport
Korea (LSPS)
St. Paul
Regensburg Villach
Frontend Backend
Our global Sales network
São Paulo
Kokomo
Livonia
Bangalore
Seoul
Singapore
Libanon Beijing
Milpitas
Melbourne,
Blackburn
Osaka
Shenzhen
Taipei
Tokyo
Nagoya
Hong Kong
Shanghai
Rotterdam
MilanMarseille
Stuttgart,
Ditzingen
Paris (Saint
Denis)
Toulouse
Madrid
Dublin
Bristol
Stockholm,
Kista
Espoo
Moscow
Vienna
Erlangen
Zürich
Munich,
Neubiberg
Hanover
Neu Isenburg
Xi‘an
El Segundo
Reigate
IstanbulBarcelona
Page 48May 5, 2015
Copyright © Infineon Technologies AG 2014. All rights reserved.
Duisburg
Leominster
Hayward
New Delhi
Chennai
Corporate Social Responsibility*
Our Commitment
United Nations Global Compact
10 Principles
Human Rights
Principle 1: support and respect the protection of internationally proclaimed
human rights
Principle 2: make sure they are not complicit in human rights abuses
Labor
Principle 3: uphold the freedom of association and the effective recognition of
the right to collective bargaining
Principle 4: uphold the elimination of all forms of forced and compulsory labor
Principle 5: uphold the effective abolition of child labor
Principle 6: uphold the elimination of discrimination in respect of employment
and occupation
Environment
Principle 7: support a precautionary approach to environmental challenges
Principle 8: undertake initiatives to promote greater environmental responsibility
Principle 9: encourage the development and diffusion of environmentally friendly
technologies
Anti-Corruption
Principle 10: work against corruption in all its forms, including extortion and
bribery
Page 49May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
Corporate Social Responsibility*
Our Understanding
CSR at Infineon comprises our voluntary commitment and
contributions in the areas:
Page 50May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
Continuous
Approach
Corporate Social Responsibility*
Successful CSR Approach
UN
Global
Compact
Infineon
IMPRES *)
since
2004
since
2005
Company Foundation
Worldwide certified environmental
management system according to
ISO 14001
Dow Jones
Sustainability
Index
since
2010
since
2011
oekom
classification
as „Prime“
since
2012
 According to RobecoSAM, Infineon is
among the top 15% most sustainable
companies worldwide and therefore listed
in the Sustainability Yearbook
 RobecoSAM „Runners-up“ Award (2013)
Energy
Management
System,
integrated in
IMPRES *)
Sustainability
Yearbook
2013
„
STOXX®
Global ESG
Leaders
Indices
2014
Page 51May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
Corporate Social Responsibility
We apply certified Management Systems
Our integrated management system for
environmental protection, energy,
occupational safety and health is third party
certified.
Environmental sustainability is not only our business –
it is our commitment
* ISO 50001 in EU sites
The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.
Page 52May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
About 20% less water
consumed per square centimeter
produced wafer than the global
average
About 32% less electricity
consumed per square centimeter
produced wafer than the global
average
About 47% less waste
generated per square centimeter
produced wafer than the global
average
Basis for the calculations are the square centimeters processed wafer area in the front-end production and consumptions according to WSC definition.
At Infineon, less is more
Corporate Social Responsibility
We are excellent in Resources Efficiency
We use resources much more efficient in our production processes
than the global average of the semiconductor industry.
Electricity
-32%
Water
-20%
Waste
-47%
The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies.
Page 53May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
Our CO2 Footprint: Emissions Reduction
Enabled by Our Products and Solutions*
CO2 savings2)
More than
14.4
million
tons
CO2 burden1)
1.4
million
tons
Ratio
1:10
Net ecological benefit*:
round 13 million tons of CO2 emission reduction
1) This figure considers manufacturing, transportation, function cars, flights, materials, chemicals, waste/waste water, direct emissions, energy consumption, waste, etc. and is based on
internally collected data and externally available conversion factors. All data relates to the 2014 fiscal year.*
2) This figure is based on internally established criteria, which are explained in the explanatory notes. The figure relates to the calendar year 2013 and considers the following fields of
application: automotive; lamp ballast control; PC power supply; renewable energy (wind, photovoltaic); and rives. CO₂ savings are calculated on the basis of potential savings of
technologies in which semiconductors are used. The CO₂ savings are allocated on the basis of Infineon's market share, semiconductor content and lifetime of the technologies concerned,
based on internal and external experts' estimations. Despite CO₂ footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear.*
Page 54May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
Business Continuity
ISO 27001 ISO 22301
ISO 14001 OHSAS 18001
ISO 50001
Business Continuity
Integrated Management*
Loss & Fraud
Investigations
Real Estate
& Facility
Management
Business &
Operations
Support
Environmental
Affairs,
Sustainability &
Energy
Management
Information
Security &
IT Security
Management
Corporate
Social
Responsibility
Export
Compliance
Business
Continuity
Planning
Security &
Crisis
Management
Asset
Protection
Page 55May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
*w/o International Rectifier
May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. Page 56

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Infineon Company Presentation Q1 2015

  • 2. Infineon and International Rectifier: A Powerful Combination *non-audited figures  As of January 2015, International Rectifier is an Infineon Technologies company  Combined pro-forma revenue of ~€5,150m* (~6,950m USD) in Infineon 2014 fiscal year  About 35,000 employees worldwide* (as of March 2015)  Strong technology portfolio with more than 22,800 patents and patent applications (as of September 2014)  33 R&D locations; 20 manufacturing locations Page 2May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 3. Table of Contents  Market and Business Development Second Quarter FY 2015  Business Focus  Segments, Products and Technology  General Company Information  Integration of International Rectifier Page 3May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 4. Table of Contents  Market and Business Development Second Quarter FY 2015  Business Focus  Segments, Products and Technology  General Company Information  Integration of International Rectifier Page 4May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 5. Revenue Split by Segment Q2 FY 2015 Revenue: € 1,483m Page 5May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *Other Operating Segments; Corporate & Eliminations. Chip Card & Security Automotive PMM IPC ATV € 598m CCS € 132m OOS+C&E* € -2m IPC € 241m PMM € 464m
  • 6. 137 126 149 204 139 141 166 213 227 248 256 249 226 298 300 292 306 336 349 353 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 Positive Growth Outlook for Global Semiconductor Market Source: WSTS for historical data. Forecast:  of WSTS, IHS, Gartner, IC Insights; last update April 27, 2015 Global Semiconductor Market in Billion US-Dollar Forecast revenue rangeMarket size (revenue) 359 391 Page 6May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 7. Infineon Holds Top Positions in All Major Product Categories Page 7May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. Discrete power semiconductors and power modules. Source: IHS Inc., September 2014 Microcontroller-based smart card ICs. Source: IHS Inc., July 2014 Automotive semiconductors incl. semiconductor sensors. Source: Strategy Analytics, April 2015 Automotive semiconductors total market in 2014: $27.5bn 6.8% 7.5% 7.8% 10.5% 12.0% NXP Freescale STMicro Infineon (incl. IRF) Renesas Power semiconductors total market in 2013: $15.4bn Smart card ICs total market in 2013: $2.48bn 6.4% 16.5% 17.9% 21.7% 32.3% SHHIC Samsung STMicro Infineon NXP 5.5% 5.8% 6.0% 7.2% 17.8% Fairchild STMicro Toshiba Mitsubishi Infineon (incl. IRF)
  • 8. Infineon Group Results for FY 2013* and FY 2014* Segment Result (SR) 377 620 [€ Million] 2013 2014 Net Income 272 535 SR Margin 9.8% 14.4% Investments 378 668 Free Cash Flow 235 317 Market capitalization**~7,995 ~9,240 Net Cash 1,983 2,232 Revenues Net Income FY13 FY14 FY13 FY14 535 3,843 272 4,320 Revenues 3,843 4,320 **share price as of September 30th, 2013: 7.395 Euro; share price as of September 30th, 2014: 8.193 Euro +12% Page 8May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier
  • 9. Infineon Group Results for Q1 FY15* and Q2 FY15 Segment Result (SR) 169 198 [€ Million] Q1 15* Q2 15 Net Income 136 69 SR Margin 15.0% 13.4% Gross Cash Position 2,107 1,656 Free Cash Flow (171) (1,880)** Net Cash 1,917 (176)** Revenues 1,128 1,483 69 1,128 136 +31% Q1 FY15 Q2 FY15 1,483 Revenues Net Income Page 9May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier **includes transactions related to the acquisition of International Rectifier
  • 10. Infineon Group Results for Q2 FY14* and Q2 FY15 Segment Result (SR) 146 198 [€ Million] Q2 14* Q2 15 Net Income 124 69 SR Margin 13.9% 13.4% Gross Cash Position 2,198 1,656 Free Cash Flow 51 (1,880)** Net Cash 2,010 (176)** Revenues 1,051 1,483 69 1,051 124 +41% 1,483 Revenues Net Income Q2 FY14 Q2 FY15 Page 10May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier **includes transactions related to the acquisition of International Rectifier
  • 11. Segment Revenue, Result and Margin 484 510 518 518 598 185 200 219 190 241 252 271 300 280 464 121 123 142 132 182 66 70 69 72 64 33 40 44 28 20 37 46 60 48 82 8 10 20 18 32 Q2 FY14 Q3 Q4 Q1 FY15 Q2* Q2 FY14 Q3 Q4 Q1 FY15 Q2* Q2 FY14 Q3 Q4 Q1 FY15 Q2* Q2 FY14 Q3 Q4 Q1 FY15 Q2 Revenue Segment Result Segment Result Margin +30% [EUR m] +84% 11%14% 14% 13% 14% 20% 15% 20%18% 8% 7% 18% 17% +24% ATV IPC CCSPMM [EUR m] [EUR m] [EUR m] +50% 14% 20% 18%15% 17% 8% 14% * Including International Rectifier from 13 January to 31 March 2015. Page 11May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 12. Revenue Split by Regions FY 2013* and FY 2014* Americas 13% 11% Europe, Middle East, Africa (EMEA) 41% 39% Asia / Pacific 40% 43% Japan 6% 7% 21% 20%therein: Germany 18% 20%therein: China Page 12May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. therein: Germany 16% therein: Germany 16% therein: China 22% FY 2013 FY 2014 *w/o International Rectifier
  • 13. Table of Contents  Market and Business Development Second Quarter FY 2015  Business Focus  Segments, Products and Technology  General Company Information  Integration of International Rectifier Page 13May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 14. A Powerful Combination: Benefits of the Integration Broader product portfolio Economies of scale Greater technology expertise Stronger presence in the regions  Better regional presence in the U.S. and the Asia-Pacific region  Expansion of market access via the distribution channel  Broader GaN product and IP portfolio  Faster roadmaps  Expansion of the product portfolio  Broader and deeper under- standing of applications (“From Product to System” strategy)  Better cost structure thanks to broader sales base  Faster ramp-up of production on 300 mm thin wafers Page 14May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 15. Table of Contents  Market and Business Development Second Quarter FY 2015  Business Focus  Segments, Products and Technology  General Company Information  Integration of International Rectifier Page 15May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 16. We Focus on Our Target Markets Core Competencies  Analog/Mixed Signal  Power  Embedded Control  Manufacturing Competence Focus Areas  Energy Efficiency  Mobility  Security Our Target Markets  Automotive Electronics  Industrial Electronics  Information and Communications Technology  Security Page 16May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 17. We Focus on Three Central Needs of Modern Society Energy Efficiency Mobility Security Industrial Power Control Automotive Power Management & Multimarket Chip Card & Security Page 17May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 18. Key Trends  Soaring total energy demand across the globe amid dwindling fossil energy resources  Strong CO2 policies to achieve climate goals  Tapping renewable energies as sustainable energy sources  Electrification of the drivetrain of commercial and passenger vehicles  Infineon delivers semiconductor innovations playing a valuable role in minimizing power loss and maximizing power savings along the entire energy supply chain, extending from generation through distribution to actual consumption.  Our products are the basis for intelligent and optimal use of energy resources in industrial, computing and consumer applications, and in cars. Our Contribution Energy Efficiency Page 18May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 19. Key Trends  Rigid CO2 regulations and rising oil price  Increasing rules on safety, focusing on preventive measures  Rising new requirements in cars for emerging markets  Urbanization, globalization and demographic change  Strong investments in local and long distance public transportation systems  Leading semiconductor solutions contributing to a more sustainable mobility in terms of reduced fuel consumption/emissions, improved safety and affordability.  As an innovation driver and supplier of key components for electric and hybrid vehicles, Infineon will actively help to shape the paradigm shift towards electro mobility on the road.  Innovative public transportation solutions for traction and electronic tickets. Our Contribution Mobility Page 19May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 20. Key Trends  Secure communication everywhere utilizing mobile phone and internet  Move to electronic identification of documents and products  Contactless cards for payment and electronic tickets  Increased intercommunication in cars, calling for secure data handling  Introduction of smart grids calling for advanced data security  Tailored security according to system requirements, enabling the implementation of transparent security in everyday systems.  Leverage our worldwide leadership in security know-how for smart cards in automotive and industrial applications increasingly demanding security.  Combining both hardware security and cryptography, our products build the basis for privacy and security while maintaining personal freedom and facilitating extended communication capabilities. Our Contribution Security Page 20May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 21. Table of Contents  Market and Business Development Second Quarter FY 2015  Business Focus  Segments, Products and Technology  General Company Information  Integration of International Rectifier Page 21May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 22. Tight Customer Relationships are Based on System Know-how and App Understanding Page 22May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. Distribution partnersEMS partners ATV IPC CCSPMM
  • 23. Market-Oriented Business Structure* Customers ApplicationsSegments Chip Card & Security Automotive Industrial Power Control Chassis and comfort electronics; Electric and hybrid vehicles; Powertrain; Safety; Security Charger station for electric vehicles; Energy transmission and conversion; Home appliances; Industrial drives; Industrial vehicles; Renewable energy generation; Traction; Uninterruptable power supplies Authentication; Government Identification; healthcare cards; Mobile communication; Near Field Communication (NFC); Payment systems; Ticketing, access control; Trusted computing Power Management & Multimarket Cellular network infrastructure; Light management and LED lighting systems; Micro inverters for photovoltaic rooftop systems; Mobile devices; Power supplies *w/o International Rectifier Page 23May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 24. Product Range* Industrial Power Control (IPC)  IGBT module solutions incl. IGBT stacks  IGBT modules (high- power, medium- power and low- power)  Discrete IGBTs  Bare die business  Driver ICs Power Management & Multimarket (PMM)  Discrete high- and low-voltage power transistors  Driver ICs  Control ICs  RF power transistors  Small-signal components  CMOS RF switches for antenna modules  Antenna tuning ICs  MEMS and ASICs for silicon microphones  Customized chips (ASICs) Chip Card & Security (CCS)  Contact-based security controller  Contactless security controller  Dual-interface security controller (contact-based and contactless) Automotive (ATV)  Microcontrollers (8-bit, 16-bit, 32-bit) for automotive and industrial applications  Software development platform DAVETM  Discrete power semiconductors  IGBT modules  Voltage regulators  Power ICs  Bus interface devices (CAN, LIN, FlexRay)  Magnetic and pressure sensors  Wireless transmit and receive ICs (RF, radar) *w/o International Rectifier Page 24May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 25. New Era: Driving Demand for Power Semiconductors  Shift towards renewable energies requires significantly more high-power semiconductors per MW of power generated. '90 – '10  Electrification in cars with Internal Combustion Engine as well as the trend towards emobility drives the demand for power semiconductors.  Higher efficiency in power conversion reduces CO2 emission and total cost of ownership.  Stronger demand for goods containing power semiconductors due to increasing standard of living in BRIC countries. '10 – '30 Changes Courtesy: Facebook Courtesy: BMW Group Page 25May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 26. Automotive Overview Product Range  Sensors: pressure, magnetic, radar  Microcontrollers: 32-bit for Powertrain, Safety and ADAS  Power: MOSFETs, IGBTs, smart power ICs: voltage regulators, bridges, driver ICs, CAN / LIN / FlexRay™ transceiver**, DC-DC converters, power system ICs, system-on chip, embedded power ICs  Hybrid & Electric Vehicle: IGBT HybridPACK™, HybridPACK™ Double Sided Cooling (DSC) modules, gate driver ICs Core Competencies/ Value Proposition  Automotive commitment: More than 40 years of automotive system and application expertise  Complete automotive system provider  Hybrid and Electro mobility: industry leading expertise and product portfolio  Functional Safety (ISO26262) and Security enabling car solutions  Worldwide development, production and support sites for automotive semiconductors  Next Level of Zero Defect: most comprehensive quality program of the industry Market Positions*  No. 2 in Automotive semiconductors worldwide  No. 1 Europe  No. 3 North America  No. 1 APAC & RoW  No. 1 Korea  No. 3 China  No. 4 Japan  No. 1 in automotive power semiconductors (24.8%) Source: Strategy Analytics (April 2015) **FlexRay is a trademark licensed by FlexRay Consortium GbR *incl. International Rectifier Page 26May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 27. Market Trends ■ Dwindling energy resources ■ Urbanization ■ Stricter CO2 emission legislations ■ Growing environmental awareness Infineon's Opportunities  Infineon components are key enabler for car manufacturers to meet challenging targets for CO2 emission reduction, e.g. in the EU 95g CO2/km in 2021  We offer Hybrid and electric drivetrain products (HybridPACK™/HybridPACK™ DSC)  No electric vehicle without semiconductors: electric drive and control, battery management, on-board battery charging and power grid communication We Focus on Future Trends Making Cars Clean Page 27May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 28. Power module BMW and Infineon: Working Together to Shape the Future of Electro Mobility  75 semiconductors ensure a highly efficient electric drive in the BMW i3, e.g. Microcontroller AUDO Future, IGBT Power Module HybridPACK™ 2, EiceDRIVER™ Products, CoolMOS™ High voltage MOSFETs  Further components: airbag control, LED light modules, steering locks, windshield wipers and seatbelt retractors Page 28May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 29. Infineon's Opportunities Infineon components covers the overall needs of the autonomous vehicle:  AURIXTM microcontroller family enables dependable and secure processing  Sensing technologies (e.g. Radar, Hall, 3D Imager) increase performance of ADAS systems  Safe actuation solution (e.g. 3 phase Bridge Driver IC) and safe power supply enable dependable vehicle dynamics and control We Focus on Future Trends Making Cars Safe Key system requirementsMarket trends ReliabilityAccident avoidance Autonomous driving Cyber-networked car High Availability Functional Safety (ISO26262) Cybersecurity Courtesy: Bosch Page 29May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 30. 3D-Vision based Driver Monitoring: Increased Safety and enhanced Comfort Active and passive Interaction New ways of interaction due to autonomous driving and increased HMI (human machine interface) functionality: ■ Occupant detection (position, size, weight,..) allows adaptive airbag activation ■ Driver awareness monitoring to adjust intervention from ADAS systems ■ Safety systems consider driver status, especially for autonomous driving ■ Touchless gesture control allows intuitive, fast and less distractive interaction Infineon's 3D Image Sensors ■ 3D cameras based on the Time-of-Flight (TOF) principle with active infrared illumination provide optimum performance ■ Simplified object segmentation (less calculation effort and independent from object colors, patterns and textures) ■ Very small form factor of TOF-cameras due to monocular design Courtesy: KOSTAL Page 30May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 31. Industrial Power Control Overview Product Range  IGBT Modules: Standard IGBT Modules, Power Integrated Modules (PIM) and Converter Inverter Brake (CIB) Modules  IPM Modules: molded Intelligent Power Module (IPM)  Discrete IGBTs  Driver ICs: standalone driver IC products for combination with IGBT modules and discretes  Power Stacks: Power module assemblies including heat sink, Driver IC and protective sensors/functions, etc. Core Competencies/ Value Proposition  High quality products and services  Leading edge technology and IP portfolio  System expertise with broad application competence  Strong worldwide presence with local sales and application support  Dedicated account teams and distributors Market Positions*  No.1 in Discrete IGBTs with 24.7% market share  No.2 in IGBT modules with 20.5% market share  No.2 in IGBT semiconductor products (module & discretes) worldwide  No.1 in Europe  No.1 in China *Source: IHS Research, September 2014, without International Rectifier Page 31May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 32. Power Components for Drive Control of Train Systems Infineon Parts Metro TrainsHigh-Speed Trains  Power: 5 to 10MW per train  80 to 120 IGBT modules per train  Semiconductor content: ~ € 100,000 per train  Power: 0.5 to 1MW per train  25 to 50 IGBT modules per train  Semiconductor content: ~ € 10,000 per train Page 32May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 33. Power Components for Wind Converters and HVDC connection of Offshore Parks HVDC connection of Offshore ParkOnshore/Offshore Wind Infineon Parts  Power: 1MW to 6MW per turbine  12 to 48 IGBT modules or 6 to 12 Power Stacks per turbine  Semiconductor content: ~ € 5,000 per MW  Power depends on amount of connected offshore parks  4,000 to 16,000 modules per connection  Semiconductor content: ~ € 5,300 per MW HVDC: High Voltage Direct Current Page 33May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 34. Product Range Market Positions*  AC/DC and DC/DC Digital Control and Driver ICs  High, Medium and Low Voltage Power Discretes  RF Switches, Low Noise Amplifier, TVS Diodes, GPS Modules, RF Power  Silicon Microphone, Dig. ASICs, Pressure Sensors, Radar IC  ASIC design solutions for authentication and battery management  GaN Class D Audio Amplifier  HiRel Discretes & Modules  Technology Leadership in Power & RF:  Energy Efficiency  Power Density, system size and weight reduction  Connectivity and reliable, clean Data Transmission for 50bn devices in 2020  Revolutionary Innovation made "easy to use"  Application centric Innovation  Integration competence: Power/RF, Digital Power, Modules/MMIC/Discretes, chip embedding  System understanding drives more efficient power management Core Competencies/Value Proposition  No. 1 Power Semiconductors 18% market share (IHS: The World Market for Power Semiconductor Discretes & Modules – Sep. 2014)  No. 1 in Discrete Standard MOSFETS 25.6% market share (IHS: The World Market for Power Semiconductor Discretes & Modules – Sep. 2014)  No. 2 in Chips for Silicon Microphones with 30% market share (IHS: MEMS Microphones Report– April 2014)  No. 3 in RF Power Devices with 15 % market share (ABI Research: RF Power Amplifiers – March 2014) Power Management & Multimarket Overview *with International Rectifier Page 34May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 35. DC/DC Single- & Multi-Phase IC Dig. Power Controllers Power Stages Driver ICs Synchr. Rec IC Integrated PoL Class D Audio PMM Product Overview Silicon Carbide SiC Schottky Diodes GaN PMM Power Systems, HiRel Connectivity & Sensing High Voltage MOSFET CoolMOS™ AC/DC IC Dig. Power Controllers Driver IC Lighting IC Low & Medium Voltage MOSFET OptiMOS™, DirectFET™, StrongIRFET ™ Sensors Silicon Microphone Dig. ASICs Pressure Sensors Radar IC Radio Frequency RF Switches GPS Module LNAs RF Power HiRel Power Discretes DC/DC Converters Power Modules Page 35May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 36.  Efficiency values of 95% and higher  Technology leadership in silicon and silicon carbide products  Highest power density enabling best cost-performance ratios  Unique system solutions with MOSFETs, power ICs and driver products Computing Mobile Devices Cellular InfrastructureChargerLighting Power Management Mobile Communications  Silicon Microphone sensor element with leading edge acoustic, electrical and quality performance  Excellent performance in ESD protection  Best-in Class Noise Figure in Low Noise Amplifier  Applicable for all standard frequencies of 2G, 3G, 4G (450 MHz to 2.7 GHz)  Industry leading power efficiency for LTE  Wide range of devices with power levels from 4–700 W  Best-in-Class thermal performance Portfolio: MOSFETs, Power ICs, RF Switches, LNAs, Si-Mics, TVS Diodes, RF Power Power Components for Servers and RF Devices Cellular Communication and Infrastructure Page 36May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 37. Social Networks and Cloud Computing Driving Demand for Highest Efficient Power Supplies  Globally, we see one new data center per week with up to 100 MW of power consumption  Efficiency of power supply (AC/DC, DC/DC) of utmost importance.  DPM best solution for flexible load dynamics  Change in value chain: servers no longer from the shelf but designed by ODMs according to specification of data center operator Digital Power Management (DPM) Gaining Traction in Server Market  DPM opens the door for bundling with other products  Recent design win: Infineon offers DPM controllers along with driver ICs and MOSFETs to Taiwanese ODM CoolMOS™ OptiMOS™ Controller & Driver IC Page 37May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 38. Power Semiconductors: Solutions for Efficient Energy Use Page 38May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 39. Chip Card & Security Overview Product range  Contactless and contact-based security products for Communication, Payment, Mobile Security, Internet of Things (IoT) Security, Government Identification, Transport, Access, Object Identification, and Entertainment  Innovative solutions from basic security RFID and memories to high-end security controllers (including the award winning SLE 78 family)  Extensive packaging and service portfolio Market positions  No. 2 in Microcontroller Smart Card ICs with 21,7%1 market share in CY2013* by revenue  No. 1 in TPM; leading positions in Authentication ICs and Mobile Security ICs (secure elements in devices and on SIM cards)  No. 2 in SIM card IC with 19%2 market share in CY2013 in terms of volume  No. 2 in Payment with 28%3 market share in CY2013  No. 2 in Government Identification with 32%4 market share in CY2013 Core competencies & value proposition  Tailored security Right level of security at the best cost- performance ratio  Contactless excellence Focus on interoperability and dual interface  Embedded control Right trade-off between computing power, power consumption, level of security and cost Source: 1,4IHS, July 2014; 2ABI, August 2014; 3May, Sep2014 IHS; IFX internal *Calendar year Page 39Copyright © Infineon Technologies AG 2014. All rights reserved.May 5, 2015
  • 40. Infineon supplies embedded secure element chips to Samsung’s Galaxy S6 and S6 edge Page 40  Infineon supplies the embedded Secure Element (eSE) chip for Samsung’s new premium smartphones Galaxy S6 and S6 edge  Samsung’s flagship Galaxy’s S6 and S6 edge mobile devices use the Infineon SLE 97 eSE  Infineon’s SLE 97 is a SOLID FLASH™- based eSE chip which can safeguard the functionalities of the mobile device as well as transactions where users’ sensitive data such as payment credentials are concerned Infineon Embedded Secure Element Chip for Samsung Galaxy S6 and S6 edge May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 41. Infineon supplies security controllers to Microsoft’s Surface Pro 3 tablets  Infineon’s OPTIGA™ TPM (Trusted Platform Module) security controller is used in Microsoft’s Surface Pro 3  Microsoft’s Surface Pro 3, widely recognized for its excellent performance both as a tablet and a laptop replacement, utilizes the higher security and improved system management features of the latest TPM 2.0 standard  The Infineon OPTIGA TPM SLB 9665 series is used in Surface Pro 3 - supporting a wide range of security needs ranging from strong authentication to platform integrity checks Infineon Trusted Mobile Platform (TPM 2.0) for Microsoft Surface Pro 3 Page 41May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 42. Semiconductor Technology Portfolio Technology portfolio fits needs of logic and power applications Digital CMOS: 800nm – 65nmTechnology Nodes (Platform <180nm incl. RF, AMS) Analog/Mixed Signal: 500nm – 180nm Technology Nodes (CxNA) eNVM: EEPROM: IMEMR, C9FL, OTP: C5OP (Automotive) eFlash/EEPROM: 250nm – 65nm CxFL (Chip Card), CxFLA, CxFLN (Automotive) HV-CMOS: 130nm, C11HV RF BiCMOS: 25GHz – 100GHz: B6HFC, B9COPT, B10C Bipolar IC: 2GHz...200GHz RF-Bipolar: BxHF SiGe: B7HFM, B7HF_SLC, B7HF200 HiPAC: Al/Cu Integrated Passives RF Switches: C7NP, C11NP P7Mxx, P7Dxx, P8Mxx Bipolar/Discretes/MMIC: RF-Transistors NF-TR; BxHF(D/M), SiGe: B7HFD/M, B7HF_SD Power Amplifier: LDMOS, LDxM, LDxIC, LD9AB RFMOS: HFM Diodes: NF-DI, Tuner: DxT, Schottky: DxS PIN: DxP Analog Bipolar: DOPL, Ax, BIPEP, B4CD Analog BiCMOS: B6CA, B6CA-CT, B7CA, SPT170 HV-CMOS-SOI, Levelshift(SOI,JI) Smart Power: 1200-130nm BIP/CMOS/DMOS SPTx (Automotive, EDP) (BCD) Smart: CMOS/DMOS, SMARTx, MSMARTx, SSMARTx, Opto-TRIAC, SPS Magnetic: BxCAS, C9FLRN_GMR Opto: OP-DI, OP-TR, OP-C9N, µ-modules C11TOF DMOS: 12-500V Planar and Trench MOSFET (OptiMOS™,HEXFET™) HV-DMOS: Superjunction MOSFET (CoolMOS™) IGBT: Planar & Trench 500-6500V, rev. cond., fast recov. diodes SiC/GaN: Diode, JFET / power switches Pressure: BxCSP, TIREPx Silicon-Microphones: DSOUND adopted for automotive, industrial and for high reliability requirements MEMS/Sensors CMOS RF/Bipolar Power/Analog incl. Green Robust Page 42May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 43. Package Technology Portfolio 1) for specialities only 2) phase-out Through Hole  TO, DIP SMD  TO  DSO  SSOP Leadless  ThinPAK  TDSON  TSDSON  DirectFETTM  TISON  WISON  IQFN  HSOF Power Modules High Power  Easy  34mm  62mm  Econo  Econo- PACK™+  Prime- PACK™  IHM  IHV  Hybrid- PACK™ Intelligent Power Modules  IRAM CIPOS™ µIPM™ SMD leaded  SOT  SOD  TSOP  TSSOP Flat lead  TSFP  SC Leadless  TSLP  TSSLP  TSNP Wafer level  WLP  WLL Discretes Power Sensors Through Hole  PSSO SMD Leaded  DSOSP Open cavity  DSOF Mold on LF  P-MCCx Mold  P-Mx.x Chip on Flex  FTM UV Globe top  T-Mx.x PRELAM  PPxx Flip Chip  S-MFCx.x  S-COMx.x Wafer  Bumped  Diced Chip Card Leadframe based Packages Wafer Level Packages, Bare Die Surface Mount Technology (SMD) Wafer Level w/o redistribution  WLP (fan-in) w/redistribution  WLB (fan-in)  eWLB (fan-out)  Blade Bare Die Wirebond Flip chip Through Hole  DIP 2) SMD  PLCC 2)  TSSOP  TQFP  LQFP  MQFP Leadless  VQFN  WQFN  O-LQFN 1)  XSON  USON PowerIC Laminate based Packages SMD  OCCN 1,2)  BGA  LBGA  xFBGA, xFSGA Page 43May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 44. Table of Contents  Market and Business Development Second Quarter FY 2015  Business Focus  Segments, Products and Technology  General Company Information  Integration of International Rectifier Page 44May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 45. Decisive Competitive Advantage: Quality at Infineon Our aspiration Our path Our standards  Preferred partner for our customers  Smooth production and delivery  We focus on stability and the 100 percent fulfillment of our commitments  Integrated approach along the entire value chain  Proactive Quality Management for products and processes  International Standards, e.g. TS16949, ISO 9001, IEC 17025  Specific customer requirements Page 45May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 46. Our global R&D network Malakka Kulim Peking Morgan Hill Seoul Schanghai Bangalore Torrance Singapur Warstein Duisburg Bristol Augsburg Neubiberg Padua Villach Graz Regensburg Dresden Bukarest Linz Warwick Irvine Tewksbury Provence Reigate Pavia Skovlunde Chandler Page 46May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. El Segundo San José Leominster Newport
  • 47. Worldwide Manufacturing Sites Frontend and Backend Page 47May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. Dresden Beijing Wuxi BatamWarstein Cegléd Malacca KulimLeominsterSan JoseMorgan Hill Mesa Tijuana Temecula Singapore Newport Korea (LSPS) St. Paul Regensburg Villach Frontend Backend
  • 48. Our global Sales network São Paulo Kokomo Livonia Bangalore Seoul Singapore Libanon Beijing Milpitas Melbourne, Blackburn Osaka Shenzhen Taipei Tokyo Nagoya Hong Kong Shanghai Rotterdam MilanMarseille Stuttgart, Ditzingen Paris (Saint Denis) Toulouse Madrid Dublin Bristol Stockholm, Kista Espoo Moscow Vienna Erlangen Zürich Munich, Neubiberg Hanover Neu Isenburg Xi‘an El Segundo Reigate IstanbulBarcelona Page 48May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. Duisburg Leominster Hayward New Delhi Chennai
  • 49. Corporate Social Responsibility* Our Commitment United Nations Global Compact 10 Principles Human Rights Principle 1: support and respect the protection of internationally proclaimed human rights Principle 2: make sure they are not complicit in human rights abuses Labor Principle 3: uphold the freedom of association and the effective recognition of the right to collective bargaining Principle 4: uphold the elimination of all forms of forced and compulsory labor Principle 5: uphold the effective abolition of child labor Principle 6: uphold the elimination of discrimination in respect of employment and occupation Environment Principle 7: support a precautionary approach to environmental challenges Principle 8: undertake initiatives to promote greater environmental responsibility Principle 9: encourage the development and diffusion of environmentally friendly technologies Anti-Corruption Principle 10: work against corruption in all its forms, including extortion and bribery Page 49May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier
  • 50. Corporate Social Responsibility* Our Understanding CSR at Infineon comprises our voluntary commitment and contributions in the areas: Page 50May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier
  • 51. Continuous Approach Corporate Social Responsibility* Successful CSR Approach UN Global Compact Infineon IMPRES *) since 2004 since 2005 Company Foundation Worldwide certified environmental management system according to ISO 14001 Dow Jones Sustainability Index since 2010 since 2011 oekom classification as „Prime“ since 2012  According to RobecoSAM, Infineon is among the top 15% most sustainable companies worldwide and therefore listed in the Sustainability Yearbook  RobecoSAM „Runners-up“ Award (2013) Energy Management System, integrated in IMPRES *) Sustainability Yearbook 2013 „ STOXX® Global ESG Leaders Indices 2014 Page 51May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier
  • 52. Corporate Social Responsibility We apply certified Management Systems Our integrated management system for environmental protection, energy, occupational safety and health is third party certified. Environmental sustainability is not only our business – it is our commitment * ISO 50001 in EU sites The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies. Page 52May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 53. About 20% less water consumed per square centimeter produced wafer than the global average About 32% less electricity consumed per square centimeter produced wafer than the global average About 47% less waste generated per square centimeter produced wafer than the global average Basis for the calculations are the square centimeters processed wafer area in the front-end production and consumptions according to WSC definition. At Infineon, less is more Corporate Social Responsibility We are excellent in Resources Efficiency We use resources much more efficient in our production processes than the global average of the semiconductor industry. Electricity -32% Water -20% Waste -47% The information and data given in this document apply to the Infineon Technologies group, except for International Rectifier companies. Page 53May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.
  • 54. Our CO2 Footprint: Emissions Reduction Enabled by Our Products and Solutions* CO2 savings2) More than 14.4 million tons CO2 burden1) 1.4 million tons Ratio 1:10 Net ecological benefit*: round 13 million tons of CO2 emission reduction 1) This figure considers manufacturing, transportation, function cars, flights, materials, chemicals, waste/waste water, direct emissions, energy consumption, waste, etc. and is based on internally collected data and externally available conversion factors. All data relates to the 2014 fiscal year.* 2) This figure is based on internally established criteria, which are explained in the explanatory notes. The figure relates to the calendar year 2013 and considers the following fields of application: automotive; lamp ballast control; PC power supply; renewable energy (wind, photovoltaic); and rives. CO₂ savings are calculated on the basis of potential savings of technologies in which semiconductors are used. The CO₂ savings are allocated on the basis of Infineon's market share, semiconductor content and lifetime of the technologies concerned, based on internal and external experts' estimations. Despite CO₂ footprint calculations are subject to imprecision due to the complex issues involved, the results are nevertheless clear.* Page 54May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier
  • 55. Business Continuity ISO 27001 ISO 22301 ISO 14001 OHSAS 18001 ISO 50001 Business Continuity Integrated Management* Loss & Fraud Investigations Real Estate & Facility Management Business & Operations Support Environmental Affairs, Sustainability & Energy Management Information Security & IT Security Management Corporate Social Responsibility Export Compliance Business Continuity Planning Security & Crisis Management Asset Protection Page 55May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. *w/o International Rectifier
  • 56. May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved. Page 56