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SPONSORSHIP OPPORTUNITIES: For more information, contact Mike Hendrickson at mikeh@oreilly.com or 617.499.7463
Software/Hardware/Everywhere San Francisco, CA | May 21 – 22, 2014
We placed big bets on Web 2.0 and Big Data,
and now, with our new conference, Solid,
we’re betting on the opportunities we see
coalescing around software-enhanced,
networked hardware.
We invite you to join us.
©2014 O’Reilly Media, Inc. The O’Reilly logo is a registered trademark of O’Reilly Media, Inc. 14228
2
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
THE BIG IDEA
The physical world is about to experience the disruption of the Internet. Software and
hardware are blurring together and new ways of manufacturing are emerging. Now you
can create products never before imagined, exploit new efficiencies, and build entirely
new business models.
SIGNALS THAT IT’S CATCHING ON
Searches for the common terms that describe this space—Internet of Things, Internet
of Everything, Industrial Internet, the Programmable World, Intelligent Things, M2M,
Maker-Pro, Generative Things, and Machine-Data—are increasing dramatically, pointing
to growing interest in this emerging market.
HOW BIG IS THE MARKET? HUGE
Opinions on how fast the industry will grow (and even how the industry is defined) vary.
Rob Lloyd, Cisco’s president of development and sales, predicts the Internet of Things
will be a $14.4 trillion industry within the next decade; IDC predicts a $7.3 trillion market
by 2017; and Gartner predicts a $1.9 trillion dollar market by 2020. But all signs point
towards phenomenal growth.
“The O’Reilly
conferences are
the gold standard
for drawing together
a critical mass of
thought leaders.”
STEVE GILLMOR
CRN
3
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
The O’Reilly Solid Conference is where engineers, software programmers, researchers,
product managers, roboticists, designers, venture capitalists, innovators, and business
leaders will gather to explore how the worlds of programming and engineering are
colliding—and what opportunities this perfect storm of intelligent things will bring.
CORE THEMES & TRACKS
The collision of software and hardware is fueling the creation of a software-enhanced,
networked physical world. The impact of this phenomenon goes far beyond the
development of intelligent new consumer products, exploiting new efficiencies, and
creating entirely new business models. Some of the themes that we see as essential:
■■ Manufacturing made frictionless
■■ APIs for the physical world
■■ Software intelligence above the level of a single machine
■■ Every company is a software company
■■ Data-driven things as a service
■■ Designing for the post-screen world
Solid will be tackling the full depth and breadth of the disruption. Sessions are organized
into 5 main tracks:
■■ Solid Companies: Funding, product development, marketing—everything you
need for success, whether your organization is a nimble start-up or a long-established
business.
■■ Solid Machines: Design, prototyping, manufacturing, implementation—the entire
process of making things real, from idea to manufacturing and shipping.
■■ Solid Society: Cities, health, developing world, economics—how to build products
and services which improve our cities, personal health, and the world economy.
■■ Solid Foundations: Materials, synthetic biology, fundamental technologies—all the
underlying technologies that compose and power our connected world.
■■ Solid Tools: The protocols, technologies, and techniques necessary to make ideas
become reality.
“Hardware startups
are looking like the
software startups
of the previous
digital age.”
JOI ITO
DIRECTOR, MIT MEDIA LAB,
AND SOLID CONFERENCE CO-CHAIR
4
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
WHAT IS SOLID?
A new market is emerging at the intersection of hardware and software. Solid is telling the story and
convening the players.
The Solid Program Committee, led by Program Chairs Joi Ito of MIT Media Lab and Jon Bruner of O’Reilly
Radar, have lined up a stellar lineup of the movers, shakers, experts, designers, innovators,
investors, and visionaries in this nascent space to provide a clear vision of what the future holds.
But Solid will also showcase how to use these technologies today to create new products,
go from idea to prototype to market in weeks rather than years; to optimize their operations;
to instrument inexpensively; and to bring their products into new markets.
This industry requires something more than a typical butts-in-seats, heads-on-stage conference.
That’s why Solid isn’t being held at some cookie-cutter conference center. It’s being held on the San
Francisco waterfront at Fort Mason. Expect an Expo Hall with some jaw-dropping demos and a crowd
of thought leaders, decision makers, and influencers from fields as diverse as manufacturing, supply
chain, wearables, robotics, environmental sensing, health monitoring, and 3D printing, who are all
looking for the chance to get up close with the tools and technologies they’ll need to chart their future.
So it’s also not a cookie-cutter conference exhibiting opportunity. Solid is a great opportunity
to break out of your booth and use your imagination. Want to make a really big splash? Solid is the
place to do it.
WHY O’REILLY?
From Web 2.0 to web performance to big data, we have a knack for knowing what’s important now
and what will be important next. That’s why the company is followed by venture capitalists, business
analysts, news pundits, tech journalists, and thought leaders who don’t want to miss out on the next
big thing.
In the US, Europe, and Asia, O’Reilly’s Conferences and Summits have forged new ties between
industry leaders, raised awareness of technology issues we think are important, and crystallized
the critical issues around emerging technologies.
We don’t say this to brag. We say it to make a point: we’re not easily hypnotized by hype. We’ve seen
the bubbles build and burst. We’ve been tapping into a deep network of alpha geeks and thought
leaders to recognize the truly disruptive technologies amidst the fluff for over three decades. So
when we invest in a conference, we’re not just following the hype, we’re committed to creating a
community around an issue we believe is transformative.
We believe the programmable world—by whatever name you want to call it—is hugely
transformative. That’s why we‘ve created Solid.
“The barriers
between software
and the physical
world are falling.”
JON BRUNER
SOLID CONFERENCE CO-CHAIR
5
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
WHO WILL ATTEND SOLID?
■■ Business Leaders who want to harness the upcoming disruptive innovation, stay
competitive, and understand uncharted business models where things are also
services.
■■ Investors who want to stay ahead of this disruptive innovation—and prosper from it.
■■ Innovators and Start-ups in the new digital industrial economy actively seeking
the latest solutions to optimize efficiencies, increase productivity, attract funding,
and grow.
■■ Software Developers who create intelligent, cost-effective, and beautifully
designed things that join the digital world to the physical world.
■■ Hardware Engineers who want their elegantly engineered things to be well
designed, connected, intelligent, and adaptive.
■■ Product Managers and Marketing Execs looking for new ways to connect with
customers in an era of screen fatigue and fragmented attention.
■■ Academics carrying out the basic research in engineering and the sciences that
will enable the connected, sensor-enabled world.
■■ Government Policy Makers and Engineers who define and build connected
infrastructures like intelligent transportation, pollutant sensor-networks, and better
social-services delivery.
“We should be
looking at it as a
way to address
our needs as
human beings…
to connect people
to the Internet
more elegantly,
not just as a source
for more toys.”
KELSEY BRESEMAN
ENTREPRENEUR AT TECHNICAL MACHINE
AND SOLID CONFERENCE PRESENTER
6
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
“Rather than
seeing industrial
device owners as
barriers to progress,
we should be
looking for ways
to help industrial
devices become
as connected as
appropriate.”
VARUN NAGARAJ
SVP OF INTERNET OF THINGS,
ECHELON
REGISTERED TITLES
5%
CTO
14%
DIRECTOR
9%
PRINCIPAL
4%
MANAGING DIRECTOR
4%
SOFTWARE ENGINEER
3%
SENIOR EDITOR
3%
CREATIVE DIRECTOR
3%
ENGINEER
4%
CO-FOUNDER
9%
VP
9%
SENIOR
MANAGER
2%
GRADUATE STUDENT
OWNER
PRODUCT MANAGER
STUDENT
SVP
14%
CEO
10%
FOUNDER
7
	 VP, Product IoT	 Accenture
	 VP, Platform Engineering	 Aeris Communications
	 Product Manager	 Aerofex
	 Director of Marketing	 Alaska Airlines
	 UX Designer	 Alaska Airlines
	 Mechanical Engineer 	 ARM
	 Senior Technical PM	 Ars Electronica Futurelab
	 Senior User Experience Designer	 Autodesk
	 Enterprise Architect	 Cascade Engineering
	CEO	Cinco Capital GmbH
	 Product Manager	 Cisco
	 Senior Business Analyst	 Comcast Cable
	 Principal Engineer	 Comcast Silicon Valley Innovation Center
	 Director, Strategic Innovation	 Danaher Corporation
	 Head of Strategy	 Deloitte–Center for the Edge
	 Director of Research	 Eli Lilly and Company
	 Principal Systems Engineer	 Enphase Energy
	 Manager Innovation	 FedEx
	 VP, Business Innovation	 Fujitsu Labs of America
	 Senior Software Engineer	 General Dynamics
	 Technology Analyst	 General Motors
	 Innovation Design Director	 Google Creative Lab
	 Head of Technology Acquisition	 Hasbro
	 Principal Scientist	 HP
	 Principal Standards and 	 iControl Networks
	 Ecosystem Evangelist	
	 Interaction Designer	 IDEO
	 VP, Strategy	 Interana
	 VP, Engineering	 Interana
	CEO	Lellan LLC
	 Director, Software Engineering	 Marvel Semiconductor
	 Diretcor of Technology	 Maxus Global
	 Founder & President	 MINIMAL
	 Product Manager	 Moxa
	 Lead Software Engineer	 NAVTEQ
	 VP, Business Development	 Neo Innovation, Inc.
	 Chief Strategy Officer	 NGRAIN
	 VP, Advanced Engineering	 Nokia
	 Principal Designer	 Nokia/Here
	 Director Research & Development	 NTT Data
	 Technical Director	 Nurun
	 Reseach & Development	
	 Technology Analyst	 Orange
	 Agile SoftwareEngineer	 Pivotal Labs
	 Senior Mechanical Engineer	 Purdue University
	 Senior Manager, Engineering	 Raven Standard LLC.
	 Director of Engineering	 Re/code
	CEO	ReZolt
	 Information Security Senior Analyst	 Samsung Mobile
	 UX Director	 Samsung Research
	 Diretor, Marketing Research	 SapientNitro
	 & Analytics	
	 Manager, Corporate	 Shasta Ventures
	 Business Development	
	 Systems Test Business Development	 ShopLocket
	 Wireless Business Devlopment	 Silicon Valley Robotics
	 VP, Corporate Development	 SK Planet
	 VP, and Chief Architect	 Smart Design
	 Chief Software Architecture	 SNUPI Technologies
	CEO	SNUPI Technologies
	 Design Technologist	 Sociometric Solutions
	 Senior Technical Director	 Spacehack.org
	 Creative Technology Consultant	 Stamen Design
	 Executive Vice President	 Stanford
	 Executive Vice President	 Superhuman Limited
	 Executive Vice President	 Symantec
	 Executive Vice President	 Synthetos
	President	T4G Limited
	 Senior Product Manager	 Telenav
	 Director, Wireless Business	 Teradyne
	Development	
	 Head of Corporate Development	 Teradyne
	 VP, Marketing and 	 The Center for Bits and Atoms at MIT
	 Ecosystem Development	
	 Agilist and Tinker	 The Kippworks
	 Art Director	 The Register
	 Head of Technology	 ThoughtWorks
	 Senior Software Developmer	 ThoughtWorks
	 Advisor to the CEO & CTO	 Tindie
	 VP, Corporate Strategy	 TinyPipes
	 Senior Director, Experience Design	 Twitter
	Co-Founder	Twitter
	 Technical Director	 USC Annenberg Innovation Lab
	 VP, Product Strategy	 VeriSign
	 Product Strategy	 Version One Ventures
	 UX Designer	 Watershed
	 SVP, Innovation	 West Cary Group
SAMPLE SNAPSHOT OF PRE-REGISTERED ATTENDEES
8
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
Exclusive sponsorship of one of four main areas in the Solid Expo Hall, built for showcasing
demos of innovation and immersive experience:
■■ Solid Companies: Funding, product development, marketing; managing innovation
inside companies large and small; building sustainable businesses
■■ Solid Machines: Design, prototyping, manufacturing, implementation
■■ Solid Society: Cities, health, developing world, economics; finding ways to drive
democratization with technology
■■ Solid Foundations: Materials, synthetic biology, fundamental technologies;
new technologies from universities and research organizations
THOUGHT LEADERSHIP
■■ (2) Article sponsorships on a Solid-related topic*
■■ (3) Guest blogs posted on our sites (consultation and approval from an O’Reilly
editor required)*
■■ (1) 5-minute video, depicting your company’s innovative story (curated and produced
by O’Reilly), shown during Solid and distributed in all O’Reilly channels after the event
ACCESS
■■ (10) 2-day conference passes plus up to (6) booth staff passes
■■ Additional 2-day passes at a 25% discount
EXPOSURE
■■ Company logo, link, and description on event website and mobile app
■■ Opportunity to host a private event at Solid (F&B charges not included)
■■ Top-tier sponsorship designation on event website and in the Solid event app
■■ Main Stage branding: sponsor message shown in housekeeping slides
■■ Onsite signage: double-sided meter board placed in a high-traffic location
■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house)
■■ Access to press list and press kit distribution
PRESENCE
■■ 20' x 20' exhibit space or turn-key demo area for one of the four main
showcasing areas
* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the
year of the conference
SPONSORSHIP LEVELS
CARBON FIBER
SPONSORSHIP
$100,000 (LIMIT 4)
9
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
THOUGHT LEADERSHIP
■■ (1) Article sponsorship on a Solid-related topic*
■■ (2) Guest blogs posted on our sites (consultation and approval from an O’Reilly
editor required)*
■■ Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo,
and link)*
ACCESS
■■ (6) 2-day conference passes plus up to (4) booth staff passes
■■ Additional 2-day passes at a 25% discount
EXPOSURE
■■ Company logo, link, and description on event website and mobile app
■■ Main Stage branding: sponsor message shown in housekeeping slides
■■ Content alignment sponsorship: Exclusive sponsorship of one Solid program track.
Includes signage onsite and three handouts of sponsor literature outside of related
sessions of sponsor’s choice
■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house)
■■ Access to press list and press kit distribution
PRESENCE
■■ 10' x 20' space for demo at Solid
* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the
year of the conference
SPONSORSHIP LEVELS
THERMOPLASTIC
SPONSORSHIP
$50,000 (LIMIT 3)
Premier Area and Demo Space.
Deploy demo of innovation
and immersive experience to
showcase your system, tools,
equipment, lab, etc. Multiple
opportunities available per area.
10
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
THOUGHT LEADERSHIP
n (1) Guest blog posted on our sites (consultation and approval from an O’Reilly
editor required)*
n  Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo,
and link)*
ACCESS
n  (1) 2-day conference pass plus up to (4) booth staff passes
n  Additional 2-day passes at a 25% discount
EXPOSURE
n  Company logo, link, and description on event website and mobile app
n  Access to press list and press kit distribution
PRESENCE
n  10' x 10' space for demo at Solid
* Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the
year of the conference
ACCESS
n  (1) 2-day conference pass plus up to (4) booth staff passes
n  Additional 2-day passes at a 25% discount
EXPOSURE
n  Company logo, link, and description on event website and mobile app
n  Access to press list and press kit distribution
PRESENCE
n  6' table-top space for demo, including electrical and internet
SPONSORSHIP LEVELS
ALUMINUM SPONSORSHIP
$25,000
Premier Area and Demo Space.
Showcase your company’s
innovations in the Solid space.
Multiple opportunities available.
EMERGENT INNOVATOR
$5,500
Unique Sponsor Demo. Provide
attendees with a state-of-the-art
demo showcasing your company’s
innovations in the Solid space.
11
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
EXPECTED PRESS COVERAGE
“Very much a work
in progress, the
stack for IoT will
require rethinking
every layer of the
protocol stack.”
MATTHEW GAST
AEROHIVE NETWORKS
12
SOLID CONFERENCE
MAY 21 – 22, 2014
SAN FRANCISCO, CA
FOR MORE INFORMATION
CONTACT MIKE HENDRICKSON
MIKEH@OREILLY.COM
617.499.7463
SOLIDCONF.COM
PROGRAM COMMITTEE
Marko Ahtisaari
Chris Anderson, 3D Robotics
Paola Antonelli, Museum of Modern Art
Ayah Bdeir, littleBits
Matt Biddulph, Product Club
Mike Bove, MIT Media Lab
Kipp Bradford, Kippworks
Rodney Brooks, Rethink Robotics
Liam Casey, PCH International
Tom Coates, Product Club
Rob Coneybeer, Shasta Ventures
David Cranor, MIT Media Lab
Kenneth Cukier, The Economist
Michael Dewar, New York Times
Renee DiResta, O’Reilly AlphaTech Ventures
Ian Ferguson, Formlabs
Brady Forrest, Highway1
Limor Fried, Adafruit
José Gómez-Márquez, MIT Little Devices Lab
Horst Hoertner, Ars Electronica Futurelab
Henry Holtzman, MIT Media Lab
Rachel Kalmar, Misfit Wearables
Michael Korpi, Baylor University Film & Digital Media
Coco Krumme, MIT
Natan Linder, MIT Media Lab
Pranav Mistry, Samsung Think Tank Team
Joe Paradiso, MIT Media Lab
Amanda Parkes, Columbia University
Arthur Petron, MIT Media Lab
Amanda Peyton, Grand St.
Ivan Poupyrev, Walt Disney Research
Venkatesh Prasad, Ford Motor
Colin Raney, IDEO
Antonio Rodriguez, Matrix Partners
Andy Rubin, Google
Peter Semmelhack, Bug Labs
Yodit Stanton, opensensors.io
Gerfried Stocker, Ars Electronica Center
Linda Stone, Generalist
Phil Torrone, Adafruit
Bruce Upbin, Forbes
Trae Vassallo, Kleiner Perkins Caulfield & Byers
Ben Waber, Sociometric Solutions
Jenn Webb, O’Reilly Media
“The imbrication of
digital and analog
environments is
bringing us to
a revolutionary
information
crossroads.”
ANDY FITZGERALD
DELOITTE DIGITAL
13
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Agreed: Sponsor/Exhibitor is bound to this Sponsor and Exhibitor Application and Contract (“Agreement”) for Sollid (“Conference” and/or “Event”). I have read and agree to all the terms and conditions of the
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Upon receipt of this signed contract and full payment, O’Reilly will countersign and return a copy to the contact listed on page one of the contract.
O’REILLY MEDIA, INC. 		 DATE
ASSIGNMENT OF SPACE: O’Reilly shall assign the booth, display and/or tabletop space as agreed to
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14228 solid14 prospectus_rev6-1

  • 1. SPONSORSHIP OPPORTUNITIES: For more information, contact Mike Hendrickson at mikeh@oreilly.com or 617.499.7463 Software/Hardware/Everywhere San Francisco, CA | May 21 – 22, 2014 We placed big bets on Web 2.0 and Big Data, and now, with our new conference, Solid, we’re betting on the opportunities we see coalescing around software-enhanced, networked hardware. We invite you to join us. ©2014 O’Reilly Media, Inc. The O’Reilly logo is a registered trademark of O’Reilly Media, Inc. 14228
  • 2. 2 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM THE BIG IDEA The physical world is about to experience the disruption of the Internet. Software and hardware are blurring together and new ways of manufacturing are emerging. Now you can create products never before imagined, exploit new efficiencies, and build entirely new business models. SIGNALS THAT IT’S CATCHING ON Searches for the common terms that describe this space—Internet of Things, Internet of Everything, Industrial Internet, the Programmable World, Intelligent Things, M2M, Maker-Pro, Generative Things, and Machine-Data—are increasing dramatically, pointing to growing interest in this emerging market. HOW BIG IS THE MARKET? HUGE Opinions on how fast the industry will grow (and even how the industry is defined) vary. Rob Lloyd, Cisco’s president of development and sales, predicts the Internet of Things will be a $14.4 trillion industry within the next decade; IDC predicts a $7.3 trillion market by 2017; and Gartner predicts a $1.9 trillion dollar market by 2020. But all signs point towards phenomenal growth. “The O’Reilly conferences are the gold standard for drawing together a critical mass of thought leaders.” STEVE GILLMOR CRN
  • 3. 3 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM The O’Reilly Solid Conference is where engineers, software programmers, researchers, product managers, roboticists, designers, venture capitalists, innovators, and business leaders will gather to explore how the worlds of programming and engineering are colliding—and what opportunities this perfect storm of intelligent things will bring. CORE THEMES & TRACKS The collision of software and hardware is fueling the creation of a software-enhanced, networked physical world. The impact of this phenomenon goes far beyond the development of intelligent new consumer products, exploiting new efficiencies, and creating entirely new business models. Some of the themes that we see as essential: ■■ Manufacturing made frictionless ■■ APIs for the physical world ■■ Software intelligence above the level of a single machine ■■ Every company is a software company ■■ Data-driven things as a service ■■ Designing for the post-screen world Solid will be tackling the full depth and breadth of the disruption. Sessions are organized into 5 main tracks: ■■ Solid Companies: Funding, product development, marketing—everything you need for success, whether your organization is a nimble start-up or a long-established business. ■■ Solid Machines: Design, prototyping, manufacturing, implementation—the entire process of making things real, from idea to manufacturing and shipping. ■■ Solid Society: Cities, health, developing world, economics—how to build products and services which improve our cities, personal health, and the world economy. ■■ Solid Foundations: Materials, synthetic biology, fundamental technologies—all the underlying technologies that compose and power our connected world. ■■ Solid Tools: The protocols, technologies, and techniques necessary to make ideas become reality. “Hardware startups are looking like the software startups of the previous digital age.” JOI ITO DIRECTOR, MIT MEDIA LAB, AND SOLID CONFERENCE CO-CHAIR
  • 4. 4 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM WHAT IS SOLID? A new market is emerging at the intersection of hardware and software. Solid is telling the story and convening the players. The Solid Program Committee, led by Program Chairs Joi Ito of MIT Media Lab and Jon Bruner of O’Reilly Radar, have lined up a stellar lineup of the movers, shakers, experts, designers, innovators, investors, and visionaries in this nascent space to provide a clear vision of what the future holds. But Solid will also showcase how to use these technologies today to create new products, go from idea to prototype to market in weeks rather than years; to optimize their operations; to instrument inexpensively; and to bring their products into new markets. This industry requires something more than a typical butts-in-seats, heads-on-stage conference. That’s why Solid isn’t being held at some cookie-cutter conference center. It’s being held on the San Francisco waterfront at Fort Mason. Expect an Expo Hall with some jaw-dropping demos and a crowd of thought leaders, decision makers, and influencers from fields as diverse as manufacturing, supply chain, wearables, robotics, environmental sensing, health monitoring, and 3D printing, who are all looking for the chance to get up close with the tools and technologies they’ll need to chart their future. So it’s also not a cookie-cutter conference exhibiting opportunity. Solid is a great opportunity to break out of your booth and use your imagination. Want to make a really big splash? Solid is the place to do it. WHY O’REILLY? From Web 2.0 to web performance to big data, we have a knack for knowing what’s important now and what will be important next. That’s why the company is followed by venture capitalists, business analysts, news pundits, tech journalists, and thought leaders who don’t want to miss out on the next big thing. In the US, Europe, and Asia, O’Reilly’s Conferences and Summits have forged new ties between industry leaders, raised awareness of technology issues we think are important, and crystallized the critical issues around emerging technologies. We don’t say this to brag. We say it to make a point: we’re not easily hypnotized by hype. We’ve seen the bubbles build and burst. We’ve been tapping into a deep network of alpha geeks and thought leaders to recognize the truly disruptive technologies amidst the fluff for over three decades. So when we invest in a conference, we’re not just following the hype, we’re committed to creating a community around an issue we believe is transformative. We believe the programmable world—by whatever name you want to call it—is hugely transformative. That’s why we‘ve created Solid. “The barriers between software and the physical world are falling.” JON BRUNER SOLID CONFERENCE CO-CHAIR
  • 5. 5 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM WHO WILL ATTEND SOLID? ■■ Business Leaders who want to harness the upcoming disruptive innovation, stay competitive, and understand uncharted business models where things are also services. ■■ Investors who want to stay ahead of this disruptive innovation—and prosper from it. ■■ Innovators and Start-ups in the new digital industrial economy actively seeking the latest solutions to optimize efficiencies, increase productivity, attract funding, and grow. ■■ Software Developers who create intelligent, cost-effective, and beautifully designed things that join the digital world to the physical world. ■■ Hardware Engineers who want their elegantly engineered things to be well designed, connected, intelligent, and adaptive. ■■ Product Managers and Marketing Execs looking for new ways to connect with customers in an era of screen fatigue and fragmented attention. ■■ Academics carrying out the basic research in engineering and the sciences that will enable the connected, sensor-enabled world. ■■ Government Policy Makers and Engineers who define and build connected infrastructures like intelligent transportation, pollutant sensor-networks, and better social-services delivery. “We should be looking at it as a way to address our needs as human beings… to connect people to the Internet more elegantly, not just as a source for more toys.” KELSEY BRESEMAN ENTREPRENEUR AT TECHNICAL MACHINE AND SOLID CONFERENCE PRESENTER
  • 6. 6 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM “Rather than seeing industrial device owners as barriers to progress, we should be looking for ways to help industrial devices become as connected as appropriate.” VARUN NAGARAJ SVP OF INTERNET OF THINGS, ECHELON REGISTERED TITLES 5% CTO 14% DIRECTOR 9% PRINCIPAL 4% MANAGING DIRECTOR 4% SOFTWARE ENGINEER 3% SENIOR EDITOR 3% CREATIVE DIRECTOR 3% ENGINEER 4% CO-FOUNDER 9% VP 9% SENIOR MANAGER 2% GRADUATE STUDENT OWNER PRODUCT MANAGER STUDENT SVP 14% CEO 10% FOUNDER
  • 7. 7 VP, Product IoT Accenture VP, Platform Engineering Aeris Communications Product Manager Aerofex Director of Marketing Alaska Airlines UX Designer Alaska Airlines Mechanical Engineer ARM Senior Technical PM Ars Electronica Futurelab Senior User Experience Designer Autodesk Enterprise Architect Cascade Engineering CEO Cinco Capital GmbH Product Manager Cisco Senior Business Analyst Comcast Cable Principal Engineer Comcast Silicon Valley Innovation Center Director, Strategic Innovation Danaher Corporation Head of Strategy Deloitte–Center for the Edge Director of Research Eli Lilly and Company Principal Systems Engineer Enphase Energy Manager Innovation FedEx VP, Business Innovation Fujitsu Labs of America Senior Software Engineer General Dynamics Technology Analyst General Motors Innovation Design Director Google Creative Lab Head of Technology Acquisition Hasbro Principal Scientist HP Principal Standards and iControl Networks Ecosystem Evangelist Interaction Designer IDEO VP, Strategy Interana VP, Engineering Interana CEO Lellan LLC Director, Software Engineering Marvel Semiconductor Diretcor of Technology Maxus Global Founder & President MINIMAL Product Manager Moxa Lead Software Engineer NAVTEQ VP, Business Development Neo Innovation, Inc. Chief Strategy Officer NGRAIN VP, Advanced Engineering Nokia Principal Designer Nokia/Here Director Research & Development NTT Data Technical Director Nurun Reseach & Development Technology Analyst Orange Agile SoftwareEngineer Pivotal Labs Senior Mechanical Engineer Purdue University Senior Manager, Engineering Raven Standard LLC. Director of Engineering Re/code CEO ReZolt Information Security Senior Analyst Samsung Mobile UX Director Samsung Research Diretor, Marketing Research SapientNitro & Analytics Manager, Corporate Shasta Ventures Business Development Systems Test Business Development ShopLocket Wireless Business Devlopment Silicon Valley Robotics VP, Corporate Development SK Planet VP, and Chief Architect Smart Design Chief Software Architecture SNUPI Technologies CEO SNUPI Technologies Design Technologist Sociometric Solutions Senior Technical Director Spacehack.org Creative Technology Consultant Stamen Design Executive Vice President Stanford Executive Vice President Superhuman Limited Executive Vice President Symantec Executive Vice President Synthetos President T4G Limited Senior Product Manager Telenav Director, Wireless Business Teradyne Development Head of Corporate Development Teradyne VP, Marketing and The Center for Bits and Atoms at MIT Ecosystem Development Agilist and Tinker The Kippworks Art Director The Register Head of Technology ThoughtWorks Senior Software Developmer ThoughtWorks Advisor to the CEO & CTO Tindie VP, Corporate Strategy TinyPipes Senior Director, Experience Design Twitter Co-Founder Twitter Technical Director USC Annenberg Innovation Lab VP, Product Strategy VeriSign Product Strategy Version One Ventures UX Designer Watershed SVP, Innovation West Cary Group SAMPLE SNAPSHOT OF PRE-REGISTERED ATTENDEES
  • 8. 8 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM Exclusive sponsorship of one of four main areas in the Solid Expo Hall, built for showcasing demos of innovation and immersive experience: ■■ Solid Companies: Funding, product development, marketing; managing innovation inside companies large and small; building sustainable businesses ■■ Solid Machines: Design, prototyping, manufacturing, implementation ■■ Solid Society: Cities, health, developing world, economics; finding ways to drive democratization with technology ■■ Solid Foundations: Materials, synthetic biology, fundamental technologies; new technologies from universities and research organizations THOUGHT LEADERSHIP ■■ (2) Article sponsorships on a Solid-related topic* ■■ (3) Guest blogs posted on our sites (consultation and approval from an O’Reilly editor required)* ■■ (1) 5-minute video, depicting your company’s innovative story (curated and produced by O’Reilly), shown during Solid and distributed in all O’Reilly channels after the event ACCESS ■■ (10) 2-day conference passes plus up to (6) booth staff passes ■■ Additional 2-day passes at a 25% discount EXPOSURE ■■ Company logo, link, and description on event website and mobile app ■■ Opportunity to host a private event at Solid (F&B charges not included) ■■ Top-tier sponsorship designation on event website and in the Solid event app ■■ Main Stage branding: sponsor message shown in housekeeping slides ■■ Onsite signage: double-sided meter board placed in a high-traffic location ■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house) ■■ Access to press list and press kit distribution PRESENCE ■■ 20' x 20' exhibit space or turn-key demo area for one of the four main showcasing areas * Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the year of the conference SPONSORSHIP LEVELS CARBON FIBER SPONSORSHIP $100,000 (LIMIT 4)
  • 9. 9 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM THOUGHT LEADERSHIP ■■ (1) Article sponsorship on a Solid-related topic* ■■ (2) Guest blogs posted on our sites (consultation and approval from an O’Reilly editor required)* ■■ Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo, and link)* ACCESS ■■ (6) 2-day conference passes plus up to (4) booth staff passes ■■ Additional 2-day passes at a 25% discount EXPOSURE ■■ Company logo, link, and description on event website and mobile app ■■ Main Stage branding: sponsor message shown in housekeeping slides ■■ Content alignment sponsorship: Exclusive sponsorship of one Solid program track. Includes signage onsite and three handouts of sponsor literature outside of related sessions of sponsor’s choice ■■ (2) Emails to the Solid opt-in attendee list (via third-party mail house) ■■ Access to press list and press kit distribution PRESENCE ■■ 10' x 20' space for demo at Solid * Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the year of the conference SPONSORSHIP LEVELS THERMOPLASTIC SPONSORSHIP $50,000 (LIMIT 3) Premier Area and Demo Space. Deploy demo of innovation and immersive experience to showcase your system, tools, equipment, lab, etc. Multiple opportunities available per area.
  • 10. 10 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM THOUGHT LEADERSHIP n (1) Guest blog posted on our sites (consultation and approval from an O’Reilly editor required)* n Exclusive sponsorship of (1) Solid newsletter (includes sponsor message, logo, and link)* ACCESS n (1) 2-day conference pass plus up to (4) booth staff passes n Additional 2-day passes at a 25% discount EXPOSURE n Company logo, link, and description on event website and mobile app n Access to press list and press kit distribution PRESENCE n 10' x 10' space for demo at Solid * Benefit is part of the sponsorship’s continual engagement, which can be delivered anytime during the year of the conference ACCESS n (1) 2-day conference pass plus up to (4) booth staff passes n Additional 2-day passes at a 25% discount EXPOSURE n Company logo, link, and description on event website and mobile app n Access to press list and press kit distribution PRESENCE n 6' table-top space for demo, including electrical and internet SPONSORSHIP LEVELS ALUMINUM SPONSORSHIP $25,000 Premier Area and Demo Space. Showcase your company’s innovations in the Solid space. Multiple opportunities available. EMERGENT INNOVATOR $5,500 Unique Sponsor Demo. Provide attendees with a state-of-the-art demo showcasing your company’s innovations in the Solid space.
  • 11. 11 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM EXPECTED PRESS COVERAGE “Very much a work in progress, the stack for IoT will require rethinking every layer of the protocol stack.” MATTHEW GAST AEROHIVE NETWORKS
  • 12. 12 SOLID CONFERENCE MAY 21 – 22, 2014 SAN FRANCISCO, CA FOR MORE INFORMATION CONTACT MIKE HENDRICKSON MIKEH@OREILLY.COM 617.499.7463 SOLIDCONF.COM PROGRAM COMMITTEE Marko Ahtisaari Chris Anderson, 3D Robotics Paola Antonelli, Museum of Modern Art Ayah Bdeir, littleBits Matt Biddulph, Product Club Mike Bove, MIT Media Lab Kipp Bradford, Kippworks Rodney Brooks, Rethink Robotics Liam Casey, PCH International Tom Coates, Product Club Rob Coneybeer, Shasta Ventures David Cranor, MIT Media Lab Kenneth Cukier, The Economist Michael Dewar, New York Times Renee DiResta, O’Reilly AlphaTech Ventures Ian Ferguson, Formlabs Brady Forrest, Highway1 Limor Fried, Adafruit José Gómez-Márquez, MIT Little Devices Lab Horst Hoertner, Ars Electronica Futurelab Henry Holtzman, MIT Media Lab Rachel Kalmar, Misfit Wearables Michael Korpi, Baylor University Film & Digital Media Coco Krumme, MIT Natan Linder, MIT Media Lab Pranav Mistry, Samsung Think Tank Team Joe Paradiso, MIT Media Lab Amanda Parkes, Columbia University Arthur Petron, MIT Media Lab Amanda Peyton, Grand St. Ivan Poupyrev, Walt Disney Research Venkatesh Prasad, Ford Motor Colin Raney, IDEO Antonio Rodriguez, Matrix Partners Andy Rubin, Google Peter Semmelhack, Bug Labs Yodit Stanton, opensensors.io Gerfried Stocker, Ars Electronica Center Linda Stone, Generalist Phil Torrone, Adafruit Bruce Upbin, Forbes Trae Vassallo, Kleiner Perkins Caulfield & Byers Ben Waber, Sociometric Solutions Jenn Webb, O’Reilly Media “The imbrication of digital and analog environments is bringing us to a revolutionary information crossroads.” ANDY FITZGERALD DELOITTE DIGITAL
  • 13. 13 Please print Company name exactly as it should appear in all event marketing and promotional materials: Product to be displayed in booth space (if any): PRIMARY CONTACT INFORMATION NAME EMAIL COMPANY PHONE FAX MAILING ADDRESS CITY STATE ZIP CODE BILLING INFORMATION (If different from above) NAME EMAIL PHONE FAX MAILING ADDRESS CITY STATE ZIP CODE SPONSOR & EXHIBITOR SELECTIONS SPONSOR PACKAGES CONFERENCE SPONSOR LEVEL PRICE $ EXHIBIT BOOTHS SQUARE FEET @ $ ______________________ PER SQUARE FOOT EXHIBIT FEE $ TOTAL AMOUNT DUE: $ ADDITIONAL MARKETING OPPORTUNITIES ADVERTISEMENTS PAGES ______________________ PRICE $ ______________________ BAG INSERTS NUMBER OF PIECES ______________________ PRICE $ ______________________ PAYMENT INFORMATION Full payment is due upon execution of this Application and Contract. All fees are deemed fully earned and are non-refundable. Cancellation by Sponsor/Exhibitor does not relieve Sponsor/Exhibitor of liability for full payment of fees, notwithstanding the loss of Sponsor/Exhibitor package benefits. PAYMENT TYPE n COMPANY CHECK (PLEASE MAKE CHECK PAYABLE TO O’REILLY MEDIA, INC.) n VISA n MASTERCARD n AMERICAN EXPRESS ACCOUNT NUMBER EXPIRATION DATE PRINT CARDHOLDER’S NAME CARDHOLDER’S SIGNATURE n PURCHASE ORDER P.O. NUMBER (REQUIRED IF PAYMENT IS NOT SUBMITTED WITH APPLICATION): TOTAL AMOUNT DUE: $ __________________
  • 14. 14 COMPANY LOGO AND INFORMATION Please submit a company logo and company/product description. Sponsors, see sponsorship details for length of description. Exhibitors submit a 50-word description. O’Reilly Media, Inc. (“O’Reilly”) is authorized to make use of this information for the conference program, related marketing material, and website. Company description and logo should be submitted via email to sponsorships@oreilly.com and should comply with the following specs: 1. Vector file with fonts converted to outlines (this is very important: O’Reilly is not responsible for providing fonts for printing sponsor-submitted logos.) or 2. 300 ppi TIFF, EPS, JPEG or PDF of your non-animated logo. The web logo will appear on a white background. CONTRACT SIGNATURES Agreed: Sponsor/Exhibitor is bound to this Sponsor and Exhibitor Application and Contract (“Agreement”) for Sollid (“Conference” and/or “Event”). I have read and agree to all the terms and conditions of the Agreement. I warrant that I am authorized to sign on behalf of the Sponsor/Exhibitor listed above and that all information I have provided is complete and accurate. SPONSOR TITLE DATE Upon receipt of this signed contract and full payment, O’Reilly will countersign and return a copy to the contact listed on page one of the contract. O’REILLY MEDIA, INC. DATE ASSIGNMENT OF SPACE: O’Reilly shall assign the booth, display and/or tabletop space as agreed to under this Agreement for the period of the display and such assignment will generally be made no later than four weeks before the Event. Location assignments will be on a first-come, first-served basis, may be modified by O’Reilly due to changes in Event layout, venue or other factors, and will be made solely at the discretion of O’Reilly. USE OF SPACE: Company is allowed to distribute literature, run demonstrations, and sell products, limited to items other than books, within the boundaries of the Company’s assigned space. Company’s product demonstration, placement or handing out of literature, signage, all booth furnishings and lighting must be well within the confines of the assigned space at all times and may in no way interfere with adjacent space. Demonstrations using audio must use headsets to demonstrate audio capabilities. All booth furnishings, equipment and displays are the responsibility of the Company, must be constructed safely, and must be installed, occupied and dismantled in accordance with O’Reilly’s schedule. O’Reilly may refuse permission to exhibit any products or services O’Reilly deems objectionable or unsuitable for the Event. Company shall not assign to a third party its space or any portion of that space without the prior written consent of O’Reilly, which O’Reilly may grant or withhold at its sole discretion. If such permission is given, the Company assumes full responsibility for the conduct of the assignee and all its representatives. COMPANY EVENTS: Company shall not schedule or sponsor any event in connection with the Conference, including without limitation evening events, during a time that overlaps or conflicts with any Conference event published in O’Reilly’s Conference schedule. INDEMNITY AND LIMITATION OF LIABILITY: Neither O’Reilly, any co-sponsor, venue provider nor any of their respective officers, agents, employees, contractors, facilities, representatives or assigns shall be liable for, and Company hereby releases them from, any claims for damage, loss, expense, harm, or injury or death to the person, property or business of the Company and/or any of its visitors, officers, agents, employees, contractors, or other representatives, resulting from theft, fire, earthquake, water, unavailability of the facility, uncontrollable events, third parties, accident or any other reason in connection with the display at the Conference. The Company hereby indemnifies, and shall defend, and protect O’Reilly and hold O’Reilly, any co-sponsor and venue provider harmless from any and all claims, demands, suits, liability, damages, losses, costs, attorney’s fees, and expenses which might result or arise from Company’s participation in the Conference or any actions of Company’s officers, agents, employees, contractors, or other representatives. Under no circumstance will O’Reilly, any co-sponsor, or the venue provider be liable for lost profits or other incidental or consequential damages for any of their acts or omissions whatsoever whether or not appraised of the possibility or likelihood of such damages or lost profits. In no event shall O’Reilly’s liability, under any circumstance, exceed the amount actually paid to it by the Company. O’Reilly makes no representations or warranties regarding the number or identity of persons who will attend the Conference. OBSERVANCE OF LAWS: Company shall abide by and observe all laws, rules and regulations, and ordinances in connection with Company’s promotion of, and participation in the Conference and this Agreement, including without limitation federal CAN-SPAM laws and all applicable privacy and data protection laws and regulations in regard to the transmission of email. To the extent that O’Reilly provides Company with Conference-related materials for use in connection with Company’s promotional activities under this Agreement, Company understands and agrees that such materials are provided without any warranties, express or implied. CANCELLATION OR TERMINATION BY O’REILLY: If for any reason beyond its reasonable control, including without limitation fire, strike, earthquake, damage, construction or renovation to the display site, government regulation, public catastrophe, or act of God (“Force Majeure”), O’Reilly shall determine that the Conference or any part will not be held, O’Reilly may cancel the Conference or any part thereof. In that event, the liability of O’Reilly is limited to the amount of fees paid, and O’Reilly shall determine and refund to the Company its proportionate share of the balance of the fees received which remains after deducting all expenses incurred by O’Reilly. In the event, however, that O’Reilly cancels the Conference for any reason other than Force Majeure, O’Reilly shall refund to Company the full amount of the fees paid by Company. CANCELLATION BY COMPANY: All payments made to O’Reilly or agreed to under this Agreement shall be deemed fully earned and non-refundable in consideration for expenses incurred by O’Reilly and O’Reilly’s lost or deferred opportunity to provide space and/or sponsorship opportunities to others. Cancellation notices must be in writing and sent to sponsorships@oreilly.com. COMPANY CONDUCT: Company and all of its representatives shall conduct themselves at all times in accordance with highest standards of decorum and good taste (including, without limitation, dressing in suitable business attire), and shall comply with the O’Reilly Conferences Code of Conduct, a current version of which is available at: http://conferences.oreillynet.com/code-of-conduct.csp. O’Reilly reserves the right to eject from the Conference Company or any Company representative(s) violating these standards or O’Reilly Conferences Code of Conduct. AGREEMENT TO TERMS, CONDITIONS AND RULES: Company agrees to observe and abide by the foregoing terms and conditions and by such additional terms, conditions, and rules made by O’Reilly from time to time for the efficient and safe operation of the Conference. This Agreement represents the final, complete and exclusive agreement between the Company and O’Reilly concerning the subject matter of this Agreement. O’Reilly does not make any warranties or other agreements except as set forth above. Any amendment to this contract must be in writing signed by O’Reilly. No business forms (including without limitation any Company purchase order terms and conditions) shall modify, interpret, supplement or alter in any manner the express terms of this Agreement. The rights of O’Reilly under this Agreement shall not be deemed waived except as specifically stated in writing and signed by an officer of O’Reilly. 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