Thermal Management And Sd0802 C Presentation


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3D Stacked Device assembly materials

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Thermal Management And Sd0802 C Presentation

  1. 1. McKinney, Texas McKinney, Texas, Cheshire, CT, Morrisville, NC USA http://www.m-coat.comMicroCoat Technologies
  2. 2. 3D-IC stacking is a promising technique for miniaturization and performance enhancement of electronic systemsThe adoption of advanced packaging technologies could changethe industry food chain of the semiconductor. •Today wire bonding is limited in density and performances andFlip Chip cannot be used for chip stacking.3D Stacked Die with Thermal Interconnects technology seemsto be unavoidable in the future for miniaturization first, andincreased performance and cost later. MicroCoat Technologies
  3. 3. MicroCoat Technologies
  4. 4. Thermal Interposers *Photo Courtesy of Vertical Circuits, Inc.MicroCoat Technologies
  5. 5. Replaces ----- Thousands of Wire Bonds ! ! !MicroCoat Technologies
  6. 6. Semiconductor packaging houses gain from more device complexityIncreased I/O density on chips, power/performance requirements, yield/costrequirements and form factor constraints (mobile) are coming to pushincreased use of 3D technology. This trend benefits the packagingsubcontractors in the semiconductor industry.Larger packaging subcontractors, like Amkor (AMKR), ASE, and SPIL, willtake market share from smaller sub-contractors. Large packaging houses likeAmkor have invested in 3D packaging technologies, such as through siliconvia (TSV) fabrication, silicon interposers, etc. They are also well-positionedfor an industry shift occurring from wire bonding to 3D. MicroCoat Technologies
  7. 7. Why Conductive Adhesive Edge Attach Interconnection? These novel interconnect systems interconnects provide solutions to many limitations of current SiP and Chip Stacking methods. Wire Bonding; Long Connections Low Density RC Delays High Impedance High Power consumption Poor Heat Dissipation Large Area Challenging Interposers I/O Pitch limitations Conductive Interposer; Short Connections Very High Density No RC Delays Low Impedance Low Power Consumption Excellent Heat Dissipation Small Connecting Area No Real I/O LimitationsMicroCoat Technologies
  8. 8. MicroCoat Technologies High Thermally Conductive and Non- Conductive Adhesives Meet the Challenge for 3D Stacking for;Cell Phones, Smart Phones, PDAs, Digital Cameras,Wireless Networking, Game Boxes, Multimedia, etc.MicroCoat Technologies
  9. 9. Thermal Management of 3D Stacked Die Using Conductive Adhesive for Heat DissipationThe conductive paths provide an ground-breaking method for helping tocool the device(s) with the high thermal conductivity of the epoxyacting as cooling fins. It is shown that a 32MB 3D stacked DRAM cachecan reduce the cycles per memory access of a twothreaded RMSbenchmark on average by 13% and as much as 55% while increasingthe peak temperature by a negligible 0.08ºC. Off-die BW and power arealso reduced by 66% on average. It is also shown that a 3D floorplan ofa high performance microprocessor can simultaneously reduce power15% and increase performance 15% with a small 14ºC increase in peaktemperature. Voltage scaling can reach neutral thermals with asimultaneous 34% power reduction and 8% performance improvement.Bryan Black, et al, Intel Corporation.MicroCoat Technologies
  10. 10. MCT SD0802C TC = >12.0 W/mKMCT 3417AdhesiveTC= >3.0 MicroCoat Technologies
  11. 11. 3D Thermal ManagementUsing just “any” conductive adhesive will reduceyour opportunity for success.3-dimensional integrated circuits (3D IC’s) technology places circuitblocks in the vertical dimension in addition to the conventional horizontalplane. Compared to conventional planar ICs, 3D ICs have shorterlatencies as well as lower power consumption, due to shorter wires. Thebenefits of 3D ICs increase as we stack more die, due to successivereductions in wire lengths. However, as we stack more die, the powerdensity increases due to increasing proximity of active (heat generating)devices, thus causing the temperatures to increase. Also, the topmost dieon the 3D stack are located further from the heat sink and experience alonger heat dissipation path. Kiran Puttaswamy Georgia Institute of Technology School ofElectrical and Computer Engineering Atlanta, GA & Gabriel H. Loh Georgia Institute of TechnologyCollege of Computing Atlanta, GAMicroCoat Technologies
  12. 12. Advantages of SD0802C Over Other 3D Dispensable Adhesives Copper Bearing Standard Ag SD0802HTCREAL Interfacial Thermal Conductivity W/mK 4-7 2.5 – 4.2 12.0Weight Loss on Cure TGA 4% 2.75 – 3.1% .07 - 1.1%Work Life (Hours) 12 12-48 144 !! MicroCoat Technologies
  13. 13. Advantages of SD0802C Over Other 3D Dispensable AdhesivesCopper material shrinks more on cure that is why it cracks!!User will have long term failures trying to adhere to either aluminum orgold IC pads User will be able to use full 10cc syringes (40 grams) using SD0802 onJetSpray or Standard Dispense EquipmentIf a company is depositing a 200um line and it shrinks 4% that is 8um ofshrinkage. The actual contact resistance between the dispensed coppermaterial and the pad on the die will be very high and the adhesion willget progressively worse with temperature cyclingSD0802 has a Cure Temperature Window of 80oC to >150oC MicroCoat Technologies
  14. 14. ** Thermal Conductivity vs. thermal impedance in adhesive bondlines. . Although some adhesive manufacturers may claim to have bulk thermal conductivity values higher than 30 W/m°K, device manufacturers need to appreciate that the bulk value is only an indicator of potential for heat transfer through the adhesive bondline. The material with the lowest thermal impedance should actually be the goal, as it is with this that the best heat transfer can actually be obtained. The factors that affect thermal impedance include: adhesion at the interface, surface wetting, thin adhesive bondlines, low shrinkage, and void-free bondlines. If the interfacial adhesion is weak or impacted by filler alignment or solvent removal, then the thermal resistance across the interface will be so great that the bulk resistivity becomes meaningless. If the bondline can be kept thin, for example by using a solventless adhesive, then heat transfer will be very efficient regardless of the difference in the bulk thermal conductivity.MicroCoat Technologies