Peter Curnow-Ford - Viatec Associates - Frequencies Up to 100g-hz - Technology
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Peter Curnow-Ford, Chair Cluster 2 + CEO Viatec Associates
UK SPF Cluster 1 – Frequencies up to 100GHz, and above – Mar 16th, ‘17
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mmWave Technology background
Historically
• Old SDH, ATM, E1 and STM equipment
• Very reliable
• Cost effective equipment
• Expensive license fees
• Mainly PtP
• Plumbing
• 7GHz, 13GHz, 15GHz, 23/24GHz, 28GHz, 32GHz, 38GHz, 40GHz
• Many bands now at capacity
• In-efficient Class 2 Antenna, need Class 3 and 4 upgrade
• Many at end of life
• Large percentage non-IP
• Mostly narrow band
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Future – Access, Backhaul and Fixed Wireless
Access (60GHz)
• WiGig , indoor, large BW, <5Gbps, 10m range
• CEPT notes a lack of interest above 66GHz for 5G
Backhaul (eg 60GHz and 70/80GHz, poss 143GHz)
• Macro cell – 2Gbps/site, <5km, <1ms, PtP LoS, auto alignment
• Small cell – 1Gbps/site, <500m, <1ms, PtP/PmP/LoS/NLoS, auto alignment
Fronthaul (90GHz and 143GHz)
• Macro cell – 20 to 60Gbps/site, <100uS, auto alignment
• Small cell – 2 to 10Gbps, <100uS, auto alignment
Fixed Wireless Access (60GHz, 5G, >90GHz)
• 60GHz, WttH (1-10Gbps, <300m), WttC (10-40Gbps, 1 to 3km), urban,
suburban, clustered rural, PtP/PmP, LoS/NLoS
• 90GHz, Fixed Wireless, Enterprise and WttC
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Antenna Developments
Antenna developments
• Auto alignment – to reduce cost of installation and setup
• Dynamic alignment – to maintain high order modulation, redundancy
• Pt to pt and pt to mpt
Technology
• Electronically steered – higher losses, costs, medium efficient
• Mechanically steered – efficient, low loss, low cost unless high gain
• Elect/mech steered – compromise to offset above
• MIMO, Massive MIMO, phased arrays
• Gain >30dBi to create small beams, less interference, range < 400m
• WiGig 60GHz – integrated antenna arrays – size constrained by IC – range
<10m yet low cost, high volume
• ETSI ISG mWT #9 - beamsteering
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Silicon, SiGe, CMOS, etc
Chips!
• Silicon
• SiGe
• Proven but expensive, 7+ years of m/f
• SiGe BiCMOS
• Good integration, low cost, up to 175GHz
• RF-CMOS
• Low cost, >5 years, integration, low power, high volume needed
• GaAs
• Expensive, low-med volumes, linear, power efficiency, up to 160GHz
• FD SOI
• High integration, low power, high wafer cost
• GaN
• High power, high frequency
• InP
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Future Challenges
Challenges
• >50GHz need new construction techniques
• No connectors, PCBs or just chips, compact, design tools
• Power amplifiers, Beamformers, packaging, heat
• 60GHz and above – interference in dense urban backhaul deployment,
between outdoor WiGig and backhaul
• 60GHz regulations, US FCC +ve, EU CEPT/ETSI –ve, 10:1 cost advantage
on links with FCC rules with no fixed gain limits
• Costs
• mmWave is not low cost
• How to get to volume – new packaging
• Energy
• High data rates = power
• Chips
• 10Gbps modem needs 2 TeraOP/s processing for baseband, support 1m+
packets/s for 5Gbps today