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Flexible Electronics

Flexible Electronics

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Flexible Electronics

  1. 1. Presented By: Roshan Mani 11ECTEC047 B.Tech. VIII Sem E.C.E. Deptt. GCET Bikaner 7-May-15 1Roshan Mani
  2. 2. OUTLINE  Introduction  Basic OLED Structure  Materials for flexible electronics  Technologies involved in processing  Technologies for Flexible Displays  Degree of flexibility  Applications  Advantages and Limitations  Conclusion 7-May-15 2Roshan Mani
  3. 3. INTRODUCTION Ever evolving advances in thin-film materials and devices have fueled many of the developments in the field of flexible electronics. 7-May-15 3Roshan Mani
  4. 4. Basic OLED structure 7-May-15 4Roshan Mani
  5. 5. Materials for Flexible Electronics A generic large-area electronic structure is composed of : Substrate Back-plane Front-plane Encapsulation 7-May-15 5Roshan Mani
  6. 6. Substrates Flexible substrates that are to serve as drop-in replacements for plate glass substrates must meet many requirements: Optical properties Surface roughness  Thermal and thermo-mechanical properties Chemical properties Mechanical properties Electrical and magnetic properties 7-May-15 6Roshan Mani
  7. 7. Backplane electronics Backplanes provide or collect power and signal to or from front-planes. Backplanes may be passive or active. Silicon Thin-Film Transistors Organic Thin-Film Transistors Materials for Interconnects and Contacts 7-May-15 7Roshan Mani
  8. 8. Backplane Electronics 7-May-15 8Roshan Mani
  9. 9. Front plane technologies Front plane carry the specific optoelectronic application. Liquid Crystal Displays  Electro-phoretic Displays Organic Light-Emitting Displays Sensors 7-May-15 9Roshan Mani
  10. 10. TECHNOLOGIES AND INTEGRATION PROCESSES Any manufacturable device has four essential characteristics:  Superior and pre-specified performance, with reproducibility, uniformity, and reliability  High yield to acceptable tolerance  Simulations exist for both reverse engineering during development and right-first-time design Proven adequate in-service lifetime. 7-May-15 10Roshan Mani
  11. 11. 7-May-15 11Roshan Mani
  12. 12. FABRICATION TECHNOLOGY FOR FLEXIBLE ELECTRONICS  Fabrication on sheets by Batch Processing..  On a rigid carrier, facing up and loose;  In a tensioning frame, facing up or down;  In a frame, facing down and loose  Fabrication On Web by roll-to-roll Processing  Additive Printing 7-May-15 12Roshan Mani
  13. 13. Batch and roll to roll fabrication 7-May-15 13Roshan Mani
  14. 14. 7-May-15 14Roshan Mani
  15. 15. Degree of flexibility Flexibility can mean many different properties to manufacturers and users. Degree of flexibility is given by ε = d/2r. Bendable or rollable Permanently shaped Elastically stretchable 7-May-15 15Roshan Mani
  16. 16. Examples… 7-May-15 16Roshan Mani
  17. 17. APPLICATIONS Holistic system design 7-May-15 17Roshan Mani
  18. 18. Health Care 7-May-15 18Roshan Mani
  19. 19. Other applications Automotive Industries Displays and Human- machine interaction Energy management and mobile devices Wireless systems Electronics Embedded in the living environment Electronics for hostile environment etc.., 7-May-15 19Roshan Mani
  20. 20. 7-May-15 20Roshan Mani
  21. 21. ADVANTAGES AND LIMITATIONS Advantages:  Size and weight  Self luminous  Low cost & easy fabrication  Increased circuitry density  Bounadaries of design and packaging  Shape or to flex during its use  Wide Viewing Angle Limitations:  Lifetime  Manufacturing  Water  Battery 7-May-15 21Roshan Mani
  22. 22. CONCLUSION Based on the current socio-economic trends, we outlined some of the most likely technological future needs and discussed the potential exploits of thin-film flexible electronics in various market sectors. 7-May-15 22Roshan Mani
  23. 23. 7-May-15 23Roshan Mani

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