RFCONNEXT\’s HIGH SPEED INTERCONNECT TECHNOLOGIES AND APPLICATIONS

1. RFCONNEXT, Inc. A Technology Overview Advancing the High Speed Interconnect Ecosystem…™ Jamal S. Izadian, Ph.D. jsi@rfconnext.com 408-981-3700 March 1, 2010 www.rfconnext.com

2. Mission • Squeeze More Performance Out of Copper Interconnects • Diminish the Cost of Copper Bandwidth • Advance the High Speed Interconnect Ecosystem™… Improve Signal and Power Integrity with Higher Speed Connectivity, Across the Spectrum Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 2 Contains Patents Pending Materials

3. Business Model • Innovate, Validate, Critical Elements of – High Speed Interconnect Ecosystem • Provide – Interconnect products with Improved Bandwidth – Engineering Support, Services and Solutions – Embedded IP Development Kits/Licensing • Make it Greener Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 3 Contains Patents Pending Materials

4. Evolution of Advanced Transmission Lines Microstrip Stripline PMTL™/VMTL™/SMTL™ Transmission lines currently used in Advanced Transmission CMOS, Packaging, and PCB industry Lines Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 4 Contains Patents Pending Materials

5. 3D High Speed Interconnect Solutions • Disruptive Patent Pending technologies – PMTL™ , Periodic Micro Transmission Lines – VMTL™ , Via Micro Transmission Lines – SMTL™ , Shaped Membrane Transmission Lines • Enabling the High Speed Interconnect Ecosystem Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 5 Contains Patents Pending Materials

6. What are PMTL™, VMTL™, and SMTL™? • A family of fundamental printable coaxial-like transmission lines technologies that – Significantly improve • Speed, Bandwidth, Edge Rate – Significantly Reduces • EMI, Crosstalk, Noise, Delay, Dispersion – Provides Excellent • SE and Diff Impedance – Supports existing Materials and Fab. Processes Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 6 Contains Patents Pending Materials

7. PMTL™ - Periodic Micro Transmission Lines™ • Connects any points on the same layers with full bandwidth • Uses existing design, layout, and fabrication methods • Provides at least 30% improved electrical performance, on FR4, more on Premium Materials Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 7 Contains Patents Pending Materials

8. VMTL™ - Vertical Micro Transmission Lines™ • Connects any two or multiple stacked layers with full bandwidth • Replaces problematic via stacks to connect vertical Layers – At high speed – No parasitic • Is compatible with PMTL™ and MS,SL,CPW Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 8 Contains Patents Pending Materials

9. SMTL™ - Shaped Membrane Transmission Lines™ • Stackable membrane interconnects – Embedded Transmission Lines • Full bandwidth PMTL/VMT • Traditional MS, SL, CPW etc… • Full 3D Interconnect, Over The Top – Replaces Wire bonds in packaging – Allows die stacking – Allows Package Stacking – Allows PCB stacking • Provides “More than Moore”….Gate/Function Density Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 9 Contains Patents Pending Materials

10. 3D Interconnect Attributes • Wide band TEM DC-220GHz and beyond, no dispersion • Can be Printed on, Rigid, Flex, PCB, even on Wafer • Flexes, twists, turns, bends, maintains excellent phase, amplitude, delay, skew, and impedance • Lower Power Loss, Lowest Cross Talk, Low ISI • Provide Thermal management and Power Integrity • It is stackable, array able, in 2D and 3D • Material/Process Independent Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 10 Contains Patents Pending Materials

11. Advanced Interconnects Embedded in Products/Markets • Cables and Connectors • PCB’s Backplanes Motherboard and Daughterboard • Electronic Packaging, Wafer Level Interconnects • Test and Measurement /Instrumentation • Mobile Handsets, Wireless, Microwave/RF/MMW Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 11 Contains Patents Pending Materials

12. Cables and Connectors • Coaxial Cabling and Flex – High Performance, Assemblies – Generic Cabling, Cable Bundles • Connectors – Coaxial, Single, and Ganges, SMA, SSMB, K, V – PCB Connectors, Sockets, Interfaces, PCIe, • High Speed Twisted Pairs Cabling – HDMI, Ethernet/Cat 5,6,7 – USB/DVI/FireWire etc… Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 12 Contains Patents Pending Materials

13. PCB Multilayer Boards • Servers – Mother Board – Daughter Board • Connectors/Sockets • Routers – Backplanes, Plug-in • Memory Boards/ DDR3/4 DIMM • Communication Networks/Switches Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 13 Contains Patents Pending Materials

14. Packaging ,Wafer and Chip Level • SMTL, mm Wave Packaging – PMTL/VMTL coaxial –like interconnect – Replace Wire Bonding • Chip Level Packaging (CLP) Wafer Level Packaging(WLP) – SxS (Side by Side) flip chips – Die Stacking ,uSD, SD, USB, DDR – SiP (System in Package), PoP, Pup, MCM – PCB Stacks, OTT High Speed Lanes Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 14 Contains Patents Pending Materials

15. Test and Measurements (TAM) • ATE Interfaces – ATE internal Fan-out – Spatial Transformers – Load Boards/Load Cards – Standardization of Device Interface • Universal Test Sockets – BGA, LGA, QFN, TOP etc… • Personal Desktop Probe Stations – Probes/Fixtures/Handy probes/ RF Clips Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 15 Contains Patents Pending Materials

16. RF/Microwaves mm Waves • Mobile Handset Boards/Packages Miniaturization • Antennas and Antenna Interconnects • Wide band low loss Optical Power Combiners • Low Loss Beam Forming Networks(BFN) • Low Cost Transmitter - receivers Modules Integration on FR4 Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 16 Contains Patents Pending Materials

17. Some High Speed Digital Applications • Wide Band Lanes (XAUI, DVI, USB, SGBe, FC, 10GBase-T, SATA, InfiniBand, PCIe, …) • SerDes’(ization) Printed active Cabling, – With embedded Active, Chips, Serdes, E-Passives • Higher Speed Routers/ Servers/PC’s but less crowded routing, shrinking in size • Could Replace Some Fiber links with Copper on PCB’s Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 17 Contains Patents Pending Materials

18. TECHNOLOGY VALIDATION Measured Performance of PMTL™ on Flex compared to Similar Coaxial transmission lines Following Insertion Loss Measurements Courtesy Of Samtec, Inc. Signal Integrity Group Following Measured TDR and Eye Diagrams Courtesy Of Spectrum Integrity, Inc.

19. Prototypes The following results were taken from the first prototypes developed. These prototypes were handled extensively and as such these results lessons learned will improve the future prototypes. Material: Pyralux- Connectors: Samtec – Length 6” Designed for 20GHz Material: Pyralux - Connectors: Southwest Microwave – Length 6” Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 19 Contains Patents Pending Materials

20. Measured Insertion Loss of PMTL™ uFlex vs. Other Transmission Lines over DC-50GHz(All for 6” length) Insertion Loss Comparison 0 -2 uCoax_Teflon_Calculated -4 -6 Insertion Loss (dB) Equivalent -8 microstrip Line -10 RF Flex PMTL 082008 -12 0.141" Reshapable Coax 0.020" Semi-rigid Coax -14 1AL PMTL 031508 1BL PMTL 031108 2AL PMTL 031508 PMTL can Beat -16 3AL PMTL 031508 equivalent Coaxial Line IIIL PMTL 031508 uCoax_Teflon_Calc uCoax_Kapton_Calculated -18 uCoax_Kapton_Calc -20 0 5 10 15 20 25 30 35 40 45 50 Frequency (GHz) Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 20 Contains Patents Pending Materials

21. Pyralux, 3 Layer Results Results from Pyralux material and connectors designed for 20 GHz testing 10 GHz 28GHz 32GHz 40GHz Time in P2P Rise/Fall P2P Rise/Fall P2P Rise/Fall P2P Rise/Fall ps Jitte Time Jitte Time Jitter Time Jitter Time r r Control 2.2 9.3 / 8.4 2 8.8 / 7.7 3 8.7 / 6.7 4.8 9.7 / 8.0 Flex 4.4 20.4 / 5.1 16.6 / 8.3 17.5 / 16.0 20.4 / 19.7 18.2 15.3 15.5 Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 21 Contains Patents Pending Materials

22. Pyralux 4 Layer Results Results from Pyralux sample 10 GHz 28GHz 32GHz Time P2P Rise/Fall P2P Rise/Fall P2P Rise/Fall in ps Jitte Time Jitte Time Jitter Time r r Contro 2.2 9.3 / 8.4 2.0 8.8 / 7.7 3.0 8.7 / 6.7 l Flex 4.8 26.6 / 23.5 6.6 29.1 / 25.3 4.4 20.4 / 18.2 Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 22 Contains Patents Pending Materials

23. TDR, Impedance Profile 6”, 3 Layer PMTL, designed for 20GHz, Kapton, SMA Connectors, Sample S1 6”, 4 Layer PMTL, designed for 50GHz, Kapton, 2.92mm Conn., Samples 1A and 3A Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 23 Contains Patents Pending Materials

24. Way Forward • Insert RFC technologies to improve performance/cost ratio • Provide Products and Engineering Services – Test/ Measurement /Evaluation…. – SMTL™ enabled mmWave High Speed Packaging – mmWave Interface with Optical Component • Provide new wideband cabling/connectors • Flat connectors to replace SMA, SSMP, K, and V Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 24 Contains Patents Pending Materials

25. Additional Information Links • Watch The Stability and No Dispersion of PMTL™ uFlex Under Live TDR • Comparing Fields inside a typical Package with Gold Wire Bonds vs. SMTL™, Shaped Membrane Transmission Lines • Comparing The Hard Disk Drive (HDD) Signal Integrity and EMI Shielding Using Traditional Flex and the New PMTL™ uFlex • Advancing Test and Measurement Instrumentation using PMTL™, VMTL™, and SMTL™ Technologies ATE, Test Sockets, Load Boards, Device Interface • RFCONNEXT TEST and Measurement Catalogue 2009 and 2010 • Application of PMTL™/VMTL™ for Improving DDR Signal Integrity, Skew and Jitter • Eric Bogatin, of BeTheSignal.com Interviews Jamal Izadian at DesignCon2010 about PMTL™ • Download More Info at http://www.rfconnext.com/WHITE%20PAPERS.html Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 25 Contains Patents Pending Materials

26. APPENDIX More Measured Eye Diagram Data

29. 10GBps, and 14GBps ~10” FR4 MS Trace Ref. TP1 Ref. TP1 Instrument, Instrument, 10Gbps 14Gbps 10” FR4 10” FR4 Sample , Sample , 10Gbps 14Gbps Copyright 2008-2010 RFCONNEXT, Inc., 6/7/2008 29 Contains Patents Pending Materials

32. Demonstrating More Applications of PMTL™/VMTL™