Research on Global and China Wafer Foundry Industry, 2012
Research on Global and China Wafer Foundry Industry, 2012Report Details:Published:December 2012No. of Pages: 80Price: Single User License – US$2400Since 2011, the world’s major wafer foundries are accelerating the expansion of advancedprocess capacity scale. With the flourish of smart phone and tablet PC market, the demand foradvance process which owns low cost and high efficiency increased rapidly, therefore, the waferfoundries including TSMC, UMC, Global Foundries and Samsung have expanded productioncapacity actively.In 2011, the annual output value of global semiconductor foundries was nearly $ 30 billion, andTSMC occupies more than 40% of the market share. With the flourish of UMC, Samsung, Intel andGlobalFoundries, in order to maintain the leading position, TSMC invested $ 5.9 billion to expand12-inch plant and improve the production capacities of 65/55 nm and 40 nm, and the capitalexpenditure amounted to $ 7.8 billion in 2011, mainly invested in Wafer Fifteenth Factory. In 2012,the capital expenditure is expected to reach $8-8.5 billion.In 2011, UMC gained 35.7% stock equity of HeJian Technology (Suzhou) Co., Ltd and became itslargest shareholder. In the future, UMC will continue to negotiate the acquisition of stock equitywith other shareholders so as to accelerate the production capacity expansion, and also toimprove the competitiveness by virtue of capacity advantage complement between ChinaMainland and Taiwan; at the same time, UMC began 28 nm pilot production since the first quarterof 2012, it is estimated that by the end of 2012, the revenue of 28 nm will occupy 5% of the totalrevenue, and the capital expenditure plan is $ 2 billion in 2012.The global market share of China mainland’s wafer foundries reached 13.3% in 2006. However,this proportion decreased year by year, and the global market share dropped to 10% and less than9% in 2010 and 2011 respectively.Get your copy of this report @http://www.reportsnreports.com/reports/210539-research-on-global-and-china-wafer-foundry-industry-2012.htmlMajor points covered in Table of Contents of this report includeTable Of Contents1. Profile of Semiconductor Industry1.1 Definition1.2 Classification and Production Process1.3 Development History1.3.1 Journey of Integrated Circuit Industry
1.3.2 Reform and Opening Gained Vitality for China’s IC Industry1.3.3 Policy Guarantee and Market Orientation Promoted the Rapid Development of China’s ICIndustry1.3.4 Increasing External Pressure and Industrial Competition Increase the Development Pressureof Local Enterprises1.3.5 Poor Connection of Industrial Chain Restricts the Overall Industrial Development2. Global Semiconductor Industry2.1 Overview of Global Semiconductor Industry2.2 Status Quo and Future Development of Global Wafer Foundry2.3 Horizontal Comparison of Global Wafer Foundries2.3.1 Operation Revenue of Global Wafer Foundries in 20122.3.2 Market Scale of Global Wafer Foundries in 20123. China’s Semiconductor Market and Industry3.1 Status of China’s Semiconductor Industry3.1.1 Industrial Scale Expands Continuously3.1.2 IC Industrial Structure becomes More Balance and Reasonable3.1.3 China has become the World’s Largest Semiconductor Market3.1.4 International Trade Expands Rapidly3.1.5 Technical Level of All Links of the Industrial Chain Improved Largely3.2 Comparison between China’s Semiconductor Industry and International SemiconductorIndustry3.2.1 Industrial Foreign Dependence Degree is Extremely High3.2.2 Industrial Value Chain is Still Disjointed3.2.3 Blockade on Foreign High-end Advanced Technology Still Exist, Self-development isExtremely Urgent3.2.4 Industrial Investment Attraction Decreased3.3 China’s Wafer Foundry and IC Design Industry3.3.1 Status Quo of China’s Wafer Foundry Industry3.3.2 Status Quo of China’s IC Design Industry4. Analysis of Wafer Foundries4.1 TSMC4.1.1 Company Profile4.1.2 Business Performance4.1.3 Future R&D Plan4.1.4 Development Prospect4.2 Global Foundries4.2.1 Global Foundries4.2.2 Future Processing Craft4.2.3 Wafer Supply Agreement between AMD and GF4.2.4 Operating Revenue4.2.5 Future Investment Direction4.3 UMC
4.3.1 Company Profile4.3.2 Wafer Technology4.3.3 Production and Manufacturing4.3.4 Operating Revenue4.4 Samsung Electronics4.4.1 Company Profile4.4.2 Operation Status in 20114.4.3 Capacity Utilization in 20124.4.4 Development Strategy4.5 SMIC4.5.1 Company Profile4.5.2 Operation Status in 20114.5.3 Company Management and Capacity Utilization in the Third Quarter of 20124.5.4 Development Strategy4.6 TowerJazz4.6.1 Company Profile4.6.2 Operation Status4.6.3 Development of Main Business4.6.4 Development Strategy4.7 HHNEC4.7.1 Company Profile4.7.2 Business Status4.7.3 Client Distribution and Product Application4.7.4 Operation Status4.8 Vanguard International Semiconductor Corp4.8.1 Company Profile4.8.2 Pecuniary Condition4.8.3 Technological Development Situation4.8.4 Market Share4.8.5 Main Clients4.8.6 Advantages and Disadvantages of Future Development and the Coping Strategy4.9 Dongbu HiTek4.9.1 Company Profile4.9.2 Advantages4.9.3 Main Business and Clients4.9.4 Operation Situation4.10 MagnaChip4.10.1 Company Profile4.10.2 Business Performance4.10.3 Competitive Advantages4.10.4 Development Prospect4.11 Grace Semiconductor
4.11.1 Company Profile4.11.2 Business Performance4.11.3 Competitive Advantages4.11.4 Operation Principle4.12 X-FAB4.12.1 Company Profile4.12.2 Technical Overview4.12.3 X-FAB takeover MFI, Expand MEMS Wafer Foundry Business Continuously4.13 China Resources Microelectronics4.13.1 Company Profile4.13.2 Development History4.13.3 Main Business and Strength4.13.4 Operation Status4.13.5 Development Plan4.14 ASMC4.14.1 Company Profile4.14.2 Operation Status in 20114.14.3 Company Management and Capacity Utilization in the Third Quarter of 20124.14.4 Development StrategyContact: email@example.com for more information.