3D Glass & Silicon InterposersReport Details:Published:September 2012No. of Pages: 360Price: Single User License – US$5390Why and how 2.5D integration will impact more than 15% of the IC substrate business by20172.5D AND 3D INTEGRATION IS SET TO BE A LONG-LASTING TREND IN THESEMICONDUCTOR INDUSTRYAfter meeting with swift commercial success on a few initial applications, including MEMS, sensorsand power amplifiers, 3D integration has been on everyone’s mind for the past five years.However, once the initial euphoria faded, and despite technical developments which assured mostobservers that mass adoption of 3D was not out of reach, some unanticipated technical andsupply chain hurdles were revealed that were higher than anticipated. It was then that 2.5Dintegration by means of 3D glass or silicon interposers was revealed by experts as a necessarystepping-stone to full 3D integration. Our first report on 3D interposers and 2.5D integration was in2010; at that time, we listed the various applications of this technology trend and its drivers, andwe showed that glass and silicon interposers were expected to become high-volume necessities,rather than just high-performance solutions for a few niche applications.In this 2012 edition of that report, we provide more evidence of our findings from two years ago:after refining the applications and drivers of 3D interposers and 2.5D integration with the use ofdetailed forecasts, Yole Développement estimates that far from being a stepping-stone technologyto full 3D integration, 3D interposers and 2.5D integration is emerging as a mass volume, long-lasting trend in the semiconductor industry.THE BUSINESS GENERATED BY THE 2.5D INTERPOSER SUBSTRATE WILL GROWRAPIDLY, TO AN EXPECTED TOTAL VALUE OF $1.6B IN 2017Glass & silicon 2.5D interposers are already a commercial reality in MEMS, Analog, RF & LEDapplications on 150mm / 200mm, supported by the relatively ‘exotic’ infrastructures of MEMSplayers such as IMT-MEMS, Silex Microsystems, DNP, and DALSA / Teledyne, and structuredglass substrate suppliers like HOYA, PlanOptik, NEC / Schott, and tecnisco. On 300mm, the
infrastructure and market for 2.5D/3D interposers has hardly emerged as of 2012, butnevertheless we expect that in 2017, over 2 million 300mm wafers will be produced in that yearalone. We also expect that the silicon or glass type of 2.5D interposer substrate will impact morethan 16% of the traditionally ‘organic-made’ IC package substrate business by 2017, with almost$1.6B revenues generated by then.STRONG DIGITAL DRIVERS WILL SHIFT TECHNOLOGY AND SUPPLY CHAIN PARADIGMSAs technology developments progress, the industry will discover clear advantages to using 2.5Dinterposers for new applications and supply chain possibilities. Throughout this 2012 report, wedetail these new lead applications, as well as the relevant needs and challenges.Also, we show evidence that this emerging infrastructure, which was initially focused on MEMSand sensors, is shifting paradigms to logic modules driven by stringent electrical and thermalperformance requirements. As a result, the demand for interposers is shifting to fine-pitch 300mmdiameter silicon wafers and high-accuracy flip chip micro-bumping and assembly.Graphical Processor Units for gaming and computing and high-performance ASICs and FPGAsare paving the way, with high volumes first expected in 2013. As these drivers increasingly appearas must-haves to serve the ever-increasing need for larger electrical bandwidths imposed bygraphical sophistication, cloud computing and many more end uses, leading companies are busycreating the appropriate infrastructure.The semiconductor supply chain is adapting to these significant in substrate technologies.Wafer foundries appear to be the most able entities to offer manufacturing solutions on the openmarket, both technically and in terms of capex investment capabilities. But their ambition extendsfar beyond the manufacturing of wafers, and into assembly and test services as well.Concurrently, some of the major IDMs are preparing to exploit their wide capabilities and to enterthe open foundry and assembly services side for 2.5D and 3D integration based on such new typeof IC package substrate technologies.IS COST REALLY AN ISSUE IN THE LONG TERM?Significant investments began in 2012, with more than $150M capex expected and driven by bothwafer foundries (TSMC, Global Foundries) and OSATs (Amkor, ASE). No one, especially inTaiwan, wants to be left behind in this high-growth story, as it clearly appears to be a central pieceof the increasing middle-end business and infrastructure, halfway between the front-end siliconfoundries and the back-end assembly & test facilities.The question now is: “can anyone build a profitable business case to support the growth of
2.5D/3D interposers”? In other words, how long will it take for investing companies to be paidback, while offering affordable prices to their customers? Yole expects the expansion model of thisnew technology trend to follow a traditional path: first, high-value modules are expected to use thetechnology to offer unprecedented high performance, followed by higher volume applications.The nice thing about 2.5D interposers is that they do not only allow for unprecedentedperformance: they can do so for a much lower cost than any competing technology. Through a fewcost cases in this report, we demonstrate that cost can be a strong adoption driver too. No, siliconand glass interposers are not “additional dead pieces of hardware in the package” -- on thecontrary, they are among the top five key elements of the semiconductor roadmap for the decade2010-2020.KEY FEATURES OF THE REPORT•Detailed view, by product and device type, of the key applications driving the commercialization of 2.5D interposer substrates•Detailed 2011 – 2017 market forecast in both unit and wafer shipments, including a revenues analysis of Middle-end to Back-end assembly & test-related activities•Overview of the positioning of different key players, and an understanding of supply chain challenges happening between the different business models in place•Technology trends & roadmaps, including the topic of glass interposers and the possible move to large PANEL area processing, leveraging LCD or PCB infrastructures•Detailed cost structure of several different 2.5D interposer packages: system-level evaluation of several different case scenarios, analyzing the expected cost decrease trend over five years•Analysis of the required investment in terms of capex between 2011 - 2017COMPANIES CITED IN THIS REPORTAltera, Amkor, Allvia, Apple, Asahi Glass Corporation (AGC), ASE, Bosch, Avago Technologies,CEA-Leti, Cisco, Dai Nippon Print (DNP), Dalsa, EPWorks, eSilicon, Flip Chip International (FCI),Fraunhofer Institüt, Fujikura, Fujitsu, GlobalFoundries, GlobalUniChip (GUC), Hoya,Huawei,Ibiden, IBM, IME, IMEC, Intel, ipdia, LG Innotek, LSI Logic, Mediatek, Micron, Murata, Nepes,Nokia, Oracle, PlanOptik, Qualcomm, Samsung, Sematech, Semtech, Sensonor, Shinko, Sibdi,Silex, Sony, SPIL, StatsChipPac, STMicroelectronics, Suss Microtec, TDK-Epcos, Tecnisco,Teledyne, Texas Instruments, Tezzaron, tMt, Toshiba, TSMC, UMC, Unisem, Viagan, VisEra, VTITechnologies, Xilinx and more…Get your copy of this report @http://www.reportsnreports.com/reports/195557-3d-glass-silicon-interposers.htmlMajor points covered in Table of Contents of this report include Report Scope , Definitions and Background p.3 Executive Summary p.15 Supply Chain Analysis p.42
Market Forecasts p.54 2010-2017 wafer forecasts p.57 2010-2017 unit forecasts p.76 2010-2017 revenue (M$) forecasts P.90 2011 interposer wafer capacity p.96 Applications and Drivers p.102 System partitioning interposers p.107 MEMS & sensors 3D capping interposers p.138 Interposers for CMOS image sensors p.158 3D silicon substrates for High-Power LEDs p.167 3D integrated passive devices p.196 Misc. Glass/silicon package substrates p.207 Technologies and Roadmaps p.215 Technologies and design rules for interposers, by applications p.216 Interposer manufacturing process flow p.233 Assembly and test p.236 Reliability p.250 Design and modeling p.252 Focus on Glass interposers p.256 Focus on PANEL interposers p.263 Roadmaps p.282 Technology Alternatives p.292 Organic interposers strike back ! 2.5D integration with fan-out WLP (eWLB) 3D Interposers and 2.5D ModulesCost Case Studies p.302 Cost model and cost down roadmap of a large 2.5D FPGA structure p.304 Cost model of a 2.5D APE for tablets p.325 Capex Investment Forecasts p.330 Conclusions p.337 APPENDIX p.344Contact: firstname.lastname@example.org for more information.