1.
ALPHA® OM-350Lead-Free Solder Paste What choices are you making between throughput and defects?Pass Fail Have you ever experienced any of these operational issues in your assembly process?OM-350 Competitor • Cold solder joints with BGA components? Deposit Volume mil3OM-350 Type 4 Competitive Paste • Variations in print 500 volume over a 400 range of print 300 200 Min Vol. speeds? Avg Vol. 100 Max Vol. 0 25mm/sec 100mm/sec • Paste unable to withstand highSoak 150-190°C; 100 sec. air reflow soak reflow alpha profiles? • Paste dripping when used in paste-in-through-hole applications?

2.
ALPHA® OM-350 Lead-Free Solder Paste What choices are you making between throughput and defects? 100 Tombstone defect (%) 90 OM-350 80 Traditional 70 60 • Passive component 50 40 Tombstones? 30 20 10 High Soak Components with MCSB (%) 0 x axis y axis x axis y axis 0.2mm shift 0.3mm shift • Mid-chip solder balls? 25 1005 1608 2012 20 0402 0603 0805 15 ALPHA® OM-350 lead-free solder paste delivers high 10 throughput, while minimizing defects. In today’s competitive 5 electronic assembly marketplace, it’s good to know that 0 0.0mm 0.1mm 0.0mm 0.1mm ALPHA’s technical expertise is there to help you make the Competitor OM-350 best decision for your SMT application. Contact your local ALPHA representative for more information. Performance Summary PROCESS ALPHA OM-350 PERFORMANCE CAPABILITY STEP ATTRIBUTES Fine Feature Print Excellent print definition and consistent volumetric performance to 0.3mm (12 mil) Definition circles and 0.4mm (16 mil) pitch rectangular QFP pads PRINTING Stencil Life Excellent Print Volume Repeatability after 4 hours at 33% RH and 66% RH Print Consistency Repeatable volume deposition and low volume variability (Cp > 2.0) on 12 mil circles 25mm/second to 100mm./second (1 inch/second to 4 inches/second down to Fine Print Speed Range PRINT CYCLE 0.3mm (12 mil) circles across 0.10mm to 0.15mm (4 mil to 6 mil) thick stencils TIME Wet Bridging Up to 5 prints per wipe at 0.4mm (16 mil) pitch with 0.125 mm (5 mil) thick stencil Resistance >20 prints/wipe at 0.5mm (20 mil) pitch with 0.125mm (5 mil) thick stencil Vertical Wetting Wetting force stability coefficient > 0.95 Resistance to Defects Resists tombstones and mid-chip solderballs with 0.2 and 0.3mm print/placement shifts Post Reflow Tackiness Passes JIS Z 3197 Talc Test Flux Residue Cosmetics No Observed Flux Burn on OSP Copper Finish REFLOW YIELD Solder Spread Full coverage of OSP coated pads after exposure to 2 previous reflow cycles Reduced BGA Pillows after multiple reflow cycles Random Solderballs Passes IPC TM650 extended test from 4 hours to 24 hours Resistance to Voids Exceeds requirements of IPC 7095 Class III for low voiding Slump Resistance Exceeds requirements of IPC J-STD-005 and JIS Z 3284 for hot and cold slump IPC SIR Pass (7 days 85°C / 85% RH) Bellcore SIR Pass (96 hours @ 35°C / 85% RH) ELECTRICAL Bellcore Electromigration Pass (500 hours @ 65°C / 85% RH) RELIABILITY JIS Electromigration Pass (1000 hours @ 85°C / 85% RH) HP Electromigration PassWorldwide Headquarters • 600 Route 440 • Jersey City, NJ 07304 • USA • +1-800-367-5460 • www.alphametals.comEuropean Headquarters • Forsyth Road • Sheerwater • Woking GU215RZ • United Kingdom • +44-1483-758-400Asia-Pacific Headquarters • 1/F, Block A • 21 Tung Yuen Street • Yau Tong Bay • Kowloon, Hong Kong • +852-3190-3100SM904© 2006 Cookson Electronics