An introduction to S3IP

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Learn more about Binghamton University\'s New York State Center of Excellence, S3IP.

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An introduction to S3IP

  1. 1. August 2010<br />
  2. 2. S3IP’s vision<br />The center will create and enable new electronics applications and devices that improve the way people live and interact with their surroundings. <br />Flexible Solar <br />
  3. 3. S3IP’s mission<br />The center, in partnership with industry, addresses challenges in small scale systems research and development, including:<br />Systems Integration<br />Electronics Packaging<br />Electronics Manufacturing<br />New Materials for Electronic Systems<br />The center also develops global partnerships with academic institutions, federal and state governments, national labs and industry to promote high-technology growth opportunities in small scale systems.<br />S3IP has generated more than $700 million in economic impact for New York State alone since 1996.<br />
  4. 4. New York State Centers of Excellence<br />Small Scale Systems Integration and Packaging, Binghamton<br />Bioinformatics and Life Sciences, Buffalo<br />Environmental and Energy Systems, Syracuse<br />Photonics and Microsystems, Rochester<br />Nanoelectronics, Albany<br />Wireless and Information Technologies, Stony Brook<br />
  5. 5. Binghamton University<br />One of the nation's top 50 public universities, according to U.S. News & World Report, and the “premier public university in the Northeast,” according to Fiske’s Guide to Colleges.<br />Benefits include:<br />Strategic location in the technology corridor of the Northeast United States, easily accessible to partners.<br />Track record of industry collaboration and technology commercialization.<br />New York State economic support.<br />More than 15,000 exceptionallyqualified university students.<br />
  6. 6. Research infrastructure at Binghamton<br />Binghamton University is a leader in microelectronics R&D in collaboration with government and industry. New buildings will provide unique commercialization opportunities:<br />$66 million science and engineering building<br />$30 million Center of Excellence building<br />
  7. 7. E3S<br />Energy Efficient Electronic Systems<br />CAMM<br />Flexible Electronics <br />CASP<br />Autonomous Solar<br />IEEC<br />Electronics Packaging<br />Advanced Diagnostics and Analytical Infrastructure<br />
  8. 8. S3IP builds multidisciplinary collaborations<br />The Center of Excellence collaborates with researchers from the Center for Advanced Sensors and Environmental Systems, the Institute for Materials Research and the Watson Institute for Systems Excellence, all of which are part of Binghamton University.<br />
  9. 9. Integrated Electronics Engineering Center (IEEC)<br />A New York State Center for Advanced Technology (NYSTAR)<br />Electronics packaging can enable or limit new systems and applications in fields such as computers, telecommunications, life sciences, security and defense. <br />The market push for greater functional power in smaller and smaller spaces can only be met through advances in packaging.<br />The IEEC performs leading-edge research in electronics packaging and transfers those results to the packaging industry in New York State and beyond.<br />
  10. 10. IEEC research thrusts<br />Current research thrusts at the IEEC that solve problems for industry include:<br />Electrical analysis<br />Mechanical analysis and testing<br />Solder analysis <br />Thermal science<br />Underfill science<br />Micromechanics<br />Photomechanics <br />Failure mechanisms<br />
  11. 11. IEEC emerging research thrusts<br /><ul><li>Packaging for medical applications
  12. 12. Packaging for energy applications
  13. 13. Packaging of flexible electronics
  14. 14. New materials for electronic systems
  15. 15. Chip stacks with Through Silicon Vias (TSV)
  16. 16. New analytical and experimental tools to analyze electronic systems </li></li></ul><li>Center for Advanced Microelectronics Manufacturing (CAMM)<br />The Center for Advanced Microelectronics Manufacturing was established as an R&D center with an award from the Flex Tech Alliance to a team from Binghamton University, Endicott Interconnect and Cornell University.<br />The CAMM:<br />Demonstrates the feasibility of roll-to-roll (R2R) electronics manufacturing by acquiring prototype tools and establishing processes to produce low-volume, test bed products in partnership with industry.<br />Addresses R2R fundamental enabling technologies and sciences.<br />Develops flexible components for medical applications, military and homeland security, displays, electronics, energy and telecommunications.<br />
  17. 17. CAMM facilities<br />The CAMM’s unique $17 million facilities, hosted by Endicott Interconnect Technologies, are an example of successful university-industry collaboration.<br />The Panel Microfabrication Laboratory:<br />Offers large area photolithography and sputtering<br />Is suitable for prototyping and early development<br />The R2R Laboratory:<br />Clean room project <br />Azores Photolithography <br />ECD Defect Inspection<br />Bobst/GV High Vacuum Deposition <br />CHA High Vacuum Deposition<br />
  18. 18. CAMM research<br />Why pursue roll-to-roll manufacturing? <br />R2R can be less expensive and can enable new applications:<br />Inexpensive displays<br />Large area displays<br />Low-cost RFID<br />Remote sensors<br />“Smart” fabrics<br />Large-area lighting <br />
  19. 19. Center for Autonomous Solar Power (CASP)<br />The Center for Autonomous Solar Power aims to capitalize on the sun’s energy as a flexible, large-area and low-cost power source.<br />CASP, which has received millions of dollars in federal funding:<br />Develops flexible, low-cost solar cells.<br />Creates integrated energy-storage and low-cost installation solutions.<br />Fosters university-industry relationships.<br />Provides leading-edge technology for the defense, aerospace, consumer and industrial markets.<br />
  20. 20. CASP research<br />CASP’s approach to solar energy technology:<br />Relies on sustainable materials.<br />Depends on the least energy-intensive solution.<br />Calls for “green” process technology.<br />Includes integrated storage.<br />Will be produced on a flexible platform.<br />Involves large-throughput roll-to-roll manufacturing.<br />Will provide a module cost of roughly10 cents per kilowatt hour.<br />
  21. 21. Center for Energy Efficient Electronic Systems (E3S)<br />The Center for Energy Efficient Electronic Systems is a collaboration of S3IP, Emerson Network Power and industry partners. <br />E3S works with government, academia and industry to develop new energy optimization and thermal management designs, enabling electronic data systems to operate more efficiently and securely.<br />
  22. 22. E3S facilities<br />E3S has developed plans for a data center laboratory, one that will be a world-class showcase for industry partners’ best-of-class technologies and most sophisticated R&D initiatives. The 7,800-square-foot facility will include three zones for member-defined research, an equipment gallery and an uninterruptible power supply (UPS) substation.<br />
  23. 23. E3S research thrusts <br /><ul><li>Server over-provisioning is a common practice
  24. 24. Situation becoming worse with smaller form factors</li></ul>Performance is not proportional to power<br />Poor energy efficiency (performance per Watt) on average<br />100%<br />Power<br />Energy<br />Efficiency<br />Typical Operating Region<br />Individual Server Utilization<br />0%<br />100%<br />
  25. 25. Analytical and Diagnostics Laboratory (ADL)<br />The Analytical and Diagnostics Laboratory promotes high-tech commercialization of microelectronic technologies by providinginstrument and technical support in areas such as electronics systems integration and packaging, materials research and flexible electronics. The lab also supports life sciences research applications in medical areas, security systems for detection of pathogens and additional industrial and consumer applications. <br />The ADL is staffed by PhD-level research scientists and engineers who provide equipment training, consultative assistance, operator services and research collaboration to industry and academic partners.<br />
  26. 26. ADL facilities<br />The ADL, an 8,000-square-foot lab funded by a $21 million award from New York State, includes state-of-the-art instrumentation for: <br />Electron microscopy. <br />Optical microscopy.<br />Thermal analysis.<br />Non-destructive analysis.<br />Spectroscopy.<br />X-ray analysis.<br />Mechanical and electrical testing.<br />Surface and interface analysis.<br />Thin-film fabrication and analysis.<br />Mesoscale machining systems.<br />Sample preparation tools and a microfabrication facility.<br />
  27. 27. Academia, industry and government in collaboration<br />
  28. 28. S3IP: Education and outreach <br />Education and outreach are at the core of many S3IP initiatives: <br />Middle school Go Green Institute<br />Electronics packaging and flexible electronics symposia<br />Electronics packaging certificate<br />Electronics packaging and flexible electronics courses <br />NSF Integrative Graduate Education and Research Traineeship Program<br />
  29. 29. Contact us<br />Bahgat Sammakia<br />Director<br />The Small Scale Systems Integration and Packaging Center<br />Binghamton University<br />PO Box 6000<br />Binghamton, NY 13902-6000<br /> <br />bahgat@binghamton.edu<br /> <br />http://s3ip.binghamton.edu<br />

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