Advances in M2M Development

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Advances in M2M Development

  1. 1. Advances in M2M Development Sam Lucero Sr. Analyst, M2M Connectivity ABI Research
  2. 2. Presentation Outline <ul><li>Vendor Framework for Technology Evaluation </li></ul><ul><li>FOTA </li></ul><ul><li>Embedded SIMs </li></ul><ul><li>Module Form Factors </li></ul><ul><li>Reference Designs </li></ul><ul><li>Embedded Application Processing </li></ul><ul><li>Module Technology Integration </li></ul><ul><li>Application Development Platforms </li></ul><ul><li>Roaming </li></ul>
  3. 3. Vendor Frameworks Customers Suppliers Vendors Application Development M2M Module Costs Connectivity Costs
  4. 4. FOTA <ul><li>FOTA: Remote updates for firmware, software components, and device management </li></ul><ul><li>Another handset technology that applies to M2M </li></ul><ul><ul><li>For handsets, the benefit is customer convenience </li></ul></ul><ul><ul><li>For M2M, the benefits are operational efficiency and cost </li></ul></ul><ul><li>FOTA implementation in the M2M market </li></ul><ul><ul><li>Wavecom: self-developed as part of RDM Services </li></ul></ul><ul><ul><li>Red Bend: third-party supplier to Telit, Sierra Wireless, and Motorola </li></ul></ul><ul><li>FOTA increasingly important, largely outsourced </li></ul>
  5. 5. Embedded SIMs <ul><li>Traditional external plastic GSM SIMs enable subscriber service portability, but… </li></ul><ul><ul><li>Lack robustness for M2M relating to temperature, vibration, and humidity </li></ul></ul><ul><ul><li>SIMs can be (and frequently are) stolen </li></ul></ul><ul><ul><li>Necessitates more complex supply-chain </li></ul></ul><ul><li>Embedded SIMs </li></ul><ul><ul><li>NOT “Soft SIMs” – operators won’t allow software-only SIMs due to security concerns </li></ul></ul><ul><ul><li>Hardware SIM embedded into module package </li></ul></ul><ul><ul><li>Resolve challenges noted above </li></ul></ul><ul><ul><li>Standards process ongoing in ETSI; standard by early 2009? </li></ul></ul><ul><ul><li>Wavecom, Telit, Gemalto </li></ul></ul>
  6. 6. Module Form Factors <ul><li>Decreasing size / increasing functionality </li></ul><ul><ul><li>Wavecom WISMO 1 (1996) = 23.5 square centimeters </li></ul></ul><ul><ul><li>Wavecom Quik 26XX (2005) = 5 square centimeters </li></ul></ul><ul><li>Connectorized versus BGA </li></ul><ul><ul><li>Connectorized: flexibility, lower initial cost </li></ul></ul><ul><ul><li>BGA: size (!), robustness (!), manufacturability, lower production costs, increased I/O </li></ul></ul><ul><li>MiniCard </li></ul><ul><ul><li>An offering from the PC connectivity world </li></ul></ul><ul><li>Bus interface trends </li></ul><ul><ul><li>Mostly serial, some SPI, IIC, I2C, PCI Express, USB </li></ul></ul>
  7. 7. Reference Designs <ul><li>From modem to DOB (Direct-On-Board) </li></ul><ul><li>Two levels of “reference design” </li></ul><ul><ul><li>End application design services </li></ul></ul><ul><ul><li>Radio functionality (module) design </li></ul></ul><ul><li>Who offers module reference design, and why? </li></ul><ul><ul><li>Module vendor </li></ul></ul><ul><ul><li>Silicon vendor </li></ul></ul><ul><li>Module reference designs versus DOB </li></ul><ul><ul><li>DOB Pros: reduced BOM cost, reduced size, increased robustness </li></ul></ul><ul><ul><li>DOB Cons: higher initial costs, required expertise </li></ul></ul><ul><ul><li>Telematics is the “canary in the coal mine” </li></ul></ul>
  8. 8. Qualcomm inGeo Reference Design
  9. 9. Module Technology Integration <ul><li>Key technologies under consideration </li></ul><ul><ul><li>SRW (ZigBee, Wi-Fi), GPS, Satellite </li></ul></ul><ul><li>Integration rationale </li></ul><ul><ul><li>Reduce BOM costs, design complexity, and supply-chain complexity for customer while increasing module differentiation and value </li></ul></ul><ul><li>Integration challenges </li></ul><ul><ul><li>Desire for “best-of-breed,” differing pace of technological innovation, which technologies to integrate?, customer lock-in </li></ul></ul><ul><li>Module vendor responses </li></ul><ul><ul><li>Integrate </li></ul></ul><ul><ul><li>Offer standalone </li></ul></ul><ul><ul><li>Optimize for third-party </li></ul></ul>
  10. 10. Onboard Application Processing <ul><li>From bit-pipe to application processing board </li></ul><ul><ul><li>Increase application processing power and memory </li></ul></ul><ul><ul><li>Integrate a second application processor </li></ul></ul><ul><li>Application integration benefits and hurdles </li></ul><ul><ul><li>Customer benefits: reduced solution costs, tighter integration </li></ul></ul><ul><ul><li>Module vendor benefits: increased differentiation and value </li></ul></ul><ul><ul><li>Customer hurdles: sunk costs, fear of vendor lock-in </li></ul></ul><ul><ul><li>Module vendor hurdles: cost-competitiveness </li></ul></ul><ul><li>OS trends: </li></ul><ul><ul><li>JAVA, Python, BREW, “Proprietary C/C++”, Linux </li></ul></ul><ul><ul><li>Embedded OS/RTOS – NOT Windows CE/Mobile, Symbian, Android, LiMo, ALEOS </li></ul></ul>
  11. 11. Application Platforms <ul><li>Overcoming the application development challenge: Most M2M applications are complex, custom efforts </li></ul><ul><li>Differing vendor strategies </li></ul><ul><ul><li>Cinterion Wireless Modules (M2M One) </li></ul></ul><ul><ul><li>Wavecom (Anyware/IDS) </li></ul></ul><ul><ul><li>SensorLogic (XpressIQ Service Suite) </li></ul></ul><ul><li>Challenge to help customers without infringing on customers’ core competencies </li></ul>
  12. 12. Roaming <ul><li>Roaming is a challenge in the M2M world </li></ul><ul><ul><li>M2M: remote batch deployments with high chance for roaming </li></ul></ul><ul><ul><li>Handsets: user-controlled devices mainly used locally </li></ul></ul><ul><ul><li>M2M challenges: roaming rates and SIM management </li></ul></ul><ul><li>Recent European Union actions not a solution </li></ul><ul><ul><li>Voice, not data – and still a premium </li></ul></ul><ul><ul><li>Regional rather than global in scope </li></ul></ul><ul><li>Different approaches to a workable solution </li></ul><ul><ul><li>Wyless: SIM management </li></ul></ul><ul><ul><li>Jasper Wireless: working with one service provider </li></ul></ul><ul><ul><li>BlueSlice / Wireless Maingate: enabling many service providers </li></ul></ul>
  13. 13. Thank you: Questions?

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