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AP-WBF 2008 Programme (by MMU 22 Jan 2008)


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Agenda for Asia Pacific Wireless Broadband Forum 2008 @ Nikko Hotel, Kuala Lumpur (25jan08).

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AP-WBF 2008 Programme (by MMU 22 Jan 2008)

  1. 1. As of Jan 22 Asia-Pacific Wireless Broadband Forum 2008 (AP-WBF ‘08) Objective: To promote the sharing and dissemination of the most up-to-date wireless communication technology, service, market and business information and trend among various stakeholders and industry. Theme: Broadband Communications: The Enabler of Knowledge Society Friday, 25 January 2008 Junior Ball Room, Level 2, Nikko Hotel, Kuala Lumpur, Malaysia Programme Morning Registration 8.00am – 9.00am Keynote Session Session Chair: Dr. Ewe Hong Tat (MMU) 9.00am – Keynote address 1 “quot;Moving a Major Broadband Agenda 9.25am - Implementing High Speed Broadband and Broadband to the General Population” Mr. Zamani bin Zakariah Senior Director, MyICMS886, Technology and Standards Division, Malaysian Communications and Multimedia Commission 9.25am – Keynote address 2 “Current Status of Mobile Communications in Japan” 9.50am Mr. KATAGIRI Koichi, Director for Promotion of ITS Land Mobile Communications Division Radio Department, Telecommunications Bureau Ministry of Internal Affairs and Communications Opening Ceremony Opening – Broadband Communications: The Enabler of Knowledge Society Time Events Speakers 9.50am – Opening ceremony Welcome speech by Prof. Dr. Zaharin Yusoff, 10.50am President of MMU Dr. Hiroyo Ogawa, Executive Director New Generation Wireless Communications Research Center, National Institute of Information and Communications Technology (NICT), Japan Officiating speech by Minister of Energy, Water and Communications, Malaysia. 10.50am – Tea break & Press Conference
  2. 2. As of Jan 22 11.20am Session 1 Session Chair: Dr. TOKUDA Kiyohito, Oki Electric Industry, Japan Time Events Speakers 11.20am – Invited Speech (Session 1 – 1) “Monetizing WiMAX in Malaysia” 11.40pm Mr. Michael Lai CEO of Packet One Networks (M) Sdn Bhd (Subsidary of GreenPacket) Green Packet, Malaysia 11.40pm – Invited Speech (Session 1 – 2) “ARIB’s Activities on Systems beyond IMT-2000 and 12.00pm Broadband Wireless Access (BWA) Systems” Mr. WACHI Yasuhiko Director, Land Mobile Communications Group, Research & Development Headquarters for Association of Radio Industries and Businesses (ARIB), Japan 12.00pm – Invited speech (Session 1 – 3) “Research and Standardization Activity for 12.20pm IEEE802.15.3c mmW WPAN” Dr. KOJIMA Fumihide National Institute of Information and Communications Technology (NICT), Japan 12.20pm – Invited speech (Session 1 – 4) “Current Mobile and Wireless R&D Activities in KDDI 12.40pm R&D Laboratories” Dr. SHINONAGA Hideyuki Executive Director, Strategic Planning Division KDDI R&D Laboratories Inc., Japan 12.40pm – Lunch Break 2.30pm Afternoon Session 2 Session Chair: Dr. SHINONAGA Hideyuki, KDDI R&D Laboratories Inc., Japan Time Events Speakers 2.30pm – Invited Speech (Session 2 – 1) quot;Next Generation Mobile Access Network - Super 3G 2.50pm and beyond -quot; Dr. MURASE Atsushi Managing Director, Research Laboratories NTT DoCoMo Inc., Japan 2.50pm – Invited Speech (Session 2 – 2) “Emerging Wireless Technologies : What is the 3.10pm horizon?” Ms. Y. Fern Ko, Technical Insights, Frost and Sullivan, Malaysia. 3.10pm – Invited Speech (Session 2 – 3) “Broadband Wireless Access Technologies” 3.30pm Mr. NIIMI Kenji Chief Manager, Mobile Network Solutions Division NEC Corporation, Japan 3.30pm – Refreshment 3.50pm
  3. 3. As of Jan 22 Session 3 Session Chair: Dr. Lee Sze Wei (MMU) 3.50pm – Invited Speech (Session 3 – 1) “Next Generation PHS with Micro-cell Technology” 4.10pm Mr. KAMIMURA Osamu Project Manager / Senior Coordinator Spectrum Planning Dept. WILLCOM, Inc./ PHS-MOU Group, Japan 4.10pm – Invited Speech (Session 3 – 2) “3G and its Evolution Trend” 4.30pm Mr. Yeow Ooh Sheng Huawei Technologies Co., Ltd., Malaysia 4.30pm – Invited Speech (Session 3 – 3) “Safety Driving Support System with DSRC” 4.50pm Dr. TOKUDA Kiyohito General Manager, Wireless Technology R&D Division Oki Electric Industry Co., Ltd., Japan