Icmses 2010

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Icmses 2010

  1. 1. ICMSES 2010 Shenzhen, China, December 11-12,2010International Committee 2010 International Conference on Materials Science and Engineering ScienceHonorary Conference ChairsChin-Chen Chang, IEEE Fellow, Feng Chia Call For PaperUniversity, TaiwanJun Wang , The Chinese University of Hong Kong, Materials Science and Engineering Science (ICMSES 2010),December 11-12,Shenzhen,Hong Kong China. The objective of ICMSES 2010 is to provide a forum for researchers, educators,Chris Price, Aberystwyth University, UnitedKingdom engineers, and government officials involved in the general areas of Materials Science and Engineering Science to disseminate their latest research results and exchange views on theOrganizing Chairs future research directions of these fields.Honghua Tan, Wuhan Institute of Technology, ChinaZiheng Liu, Huazhong Normal University, China All Accepted Papers will be published by Advanced Materials Research ISSN: 1022-6680, ISSN/ISO: Adv. Mater. Res. All published papers will be iindexedProgram Chairs by EI Compendex and ISTP.Xu Gang, Shenzhen Univerisity, ChinaWang Yuanzhi, International Communication ScienceAssociation, China 2010 由 将文论用 录有 所。开 召圳深 国中在日 月 于将 议会际国 学 科程工 与学科料材年 12 11-12 。文 英为须 必稿投。 索检 和 被 将,版出 Advanced Materials Research Ei ISTPPublication ChairDarry Zhu, South China Normal University, China Important Date Paper Submission Deadline: July 30, 2010International Committees Acceptance Notification: August 15, 2010Ying Zhang, Wuhan Uniersity, China Camera Ready Due: August 30, 2010Xueming Zhang, Beijing Normal University, China Conference: December 11-12, 2010Peide Liu, ShangDong Economic University, ChinaDariusz Krol, Wroclaw University of Technology,Poland The secretary of ICMSES 2010Jason J. Jung,Yeungnam University, Republic of Email: icmses2010reg@sina.cnKorea.Paul Davidsson, Blekinge Institute of Technology, Tel: Mr. Wang+86 13866037886 or Miss Jia +86-27+62114455Sweden For more detailed information on ICMSES 2010, please visit the conference website:Cao Longbing,University of Technology Sydney,AustraliaHuaifeng Zhang, University of Technology Sydney,AustraliaQian Yin, Beijing Normal University, China Co-sponored by

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