Tjm presentation1

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Tjm presentation1

  1. 1. Manufacturing / Advanced Electronics Packaging
  2. 2. In-Circuit ResistanceOpens / Shorts Test on Net ListIn-Circuit CapacitanceIn-Circuit InductanceDiodes and Transistor testDelta ScanFrame Scan
  3. 3. QFN Devices ASIC BGAPress Fit Connector(custom tooling Rq’d)Package on FPGA 1156 BallPackage (POP)devices CSP (Chip Scale Packages) Image Processor Board  ‐ Super Hi Density  ‐ Fine Line – Mix Technologies Ceramic, metal, Plastic components – Populated  both sides. Assembly includes embedded flip chips under Xilinx PLD
  4. 4. • Re‐balling of high cost or long lead time ASIC / FPGA.  • Convert  Pb Free device to Tin/Lead.
  5. 5. TJM works closely with CAM department to assure that paste layer is optimized for proper paste deposition for leadless devices. This is key to successful surface mount assembly of advanced packages.
  6. 6. IPC 7722 / 7721 Certified Repair
  7. 7. Automated Dispense

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