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Assembly Sequence for Intrusive Reflow Soldering for OFP® Receptacles

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Mill-Max Organic Fibre Plug® (OFP®) receptacles and sockets are interconnect sockets for through-hole soldering into printed circuit boards. These open bottom interconnects are fitted with paper plugs to prevent solder, paste or flux from contaminating the internal contact during the placing and soldering process. When the device/mating lead is plugged into the receptacle the OFP® is knocked out allowing the mating lead to pass through the fingers of the internal contact and make a reliable electrical connection.

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Assembly Sequence for Intrusive Reflow Soldering for OFP® Receptacles

  1. 1. APPLICATION NOTE Assembly Sequence for Intrusive Reflow Soldering for OFP® receptacles
  2. 2. What are Organic Fibre Plug® Receptacles? • Designed for hand, wave or reflow soldering. The organic fibre plug® prevents solder, paste or flux from contaminating the spring contact. • After soldering, the organic fibre plug® is pushed out of the receptacle when the component is plugged in. • Supplied as discrete receptacles or on carrier tape per EIA-481 for industry standard pick and place machines. • All Mill-Max receptacles use a precision- machined brass housing with a press-fit beryllium copper “multi-finger” contact (heat-treated BeCu is the best electrical spring contact material.)
  3. 3. What is Intrusive Reflow? Intrusive reflow (also called “pin-in-paste”) is a technique of using conventional through-hole components in a reflow soldering process. The receptacles are placed into plated-through-holes in the circuit board (solder paste has previously been screen printed on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-through-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked up inside the contact during pick’n place assembly. “Overprinting paste on the solder mask can be used to adjust the volume of paste required to fill each hole. Source: http://www.ami.ac.uk/courses/topics/0226_pip/
  4. 4. Assembly Sequence for Intrusive Reflow Soldering 1. Start with a printed circuit board having plated- through-holes .005” larger than the receptacles. 2. Screen solder paste onto the pads adjacent to the holes.
  5. 5. 3. Vacuum pick receptacle from EIA-481 standard carrier tape. Assembly Sequence for Intrusive Reflow Soldering
  6. 6. 4. Place receptacles into circuit board. Assembly Sequence for Intrusive Reflow Soldering
  7. 7. 5. Reflow completely assembled circuit board in a SMT conveyor oven. Assembly Sequence for Intrusive Reflow Soldering
  8. 8. 6. Install leaded component into receptacles. Assembly Sequence for Intrusive Reflow Soldering
  9. 9. 7. The component leads will push out the organic fibre plugs. Assembly Sequence for Intrusive Reflow Soldering
  10. 10. mill-max.com MAXIMUM EVERYTHING. (516)922-6000 MILL-MAX MFG. CORP. - 190 PINE HOLLOW ROAD, OYSTER BAY, NY 11771 Click the button below for more information and to browse our selection of OFP® receptacles More Info

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