Effective Low Cost Alternative To Liquid Cooling

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The document describes a paradigm shift in alternative lower cost, high performance, light weight, high density electronics cooling.

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Effective Low Cost Alternative To Liquid Cooling

  1. 1. HTE Associates, Inc. PUMPED REFRIGERENT AS AN ALTERNATIVE TO LIQUID COOLING High Density Cooling for Electronic Package Martin Pitasi 12/23/2008 1
  2. 2. INTRODUCTION POSITION STATEMENT Over the last 10 years HTE, Inc. has developed pumped liquid refrigeration cooling (PLRC) technology that has the potential of replacing conventional water based designs. Briefly, for the same cooling specifications, the advantages of a PLRC over a similar water based system are: (1) smaller package envelop, (2) lower overall weight, (3) reduced parasitic power requirements, (4) less hardware, (5) simpler assembly, (6) no glycol or deionization water treatment required, (7) lower costs, and (8) higher returns on your investment. VALUE STATEMENT PLRC COP values range from ~17 to ~70 for air cooled and water cooled condensers, respectively. These values will establish higher benchmarks for future global GREEN markets. Our goal is to jump start PLRC technology by targeting key industries in market segments that find this technology is a value added proposition that will improve their bottom line and provide a competitive advantage. PROPOSAL STATEMENT HTE proposes an equitable agreement that includes, but is not limited to, the following:  Partnership  Exclusive consulting and licensing  Licensing only  Ownership 2
  3. 3. HTE PUMPED LIQUID REFRIGERENT COOLING (PLRC) SYSTEMS are: • Patent and trade secret protected from direct easy competition. • Environmentally GREEN:  Operate with 80/90% power savings over pumped water or water/glycol systems.  Save 40/50% on system weight, size, and assembly over pumped water or water/glycol systems. • Applicable to most products that currently use liquids or wish to use liquids for cooling purposes  Large server farms  Semiconductor lasers  Plasma welding & cutting  High power LED’s  Motor controllers  Large power supplies  Phased array radars  Submarine electronics  High density routers  High power computers  High power IGBTs  Microwave  Electro-optics  Precision alignment and control • A very competitive replacement for existing liquid cooling systems that currently use chillers and liquid sensible heat cooling technology. 3
  4. 4. HTE IS SEEKING A PARTNER TO TAKE ADVANTAGE OF THE MARKET OPPORTUNITIES THAT THESE MARKETS PRESENT • This partner should have a compatible manufacturing and production control facility to produce systems in both small and large sized lots. [that is to say, take piping systems and components and put them into a workable system, test, package, and ship.] • This partner should have a compatible marketing, sales, and distribution network to present and service PLRC systems without a major disruption/training period for this new approach to cooling industrial systems. • As a PLRC partner, a company will have an investment with the potential of eliminate competition in many product sectors. Also, by integrating the PLRC technology into its strategic plans a company will avoid playing the costly competitive catch-up game and provide sales and marketing with a new and different strategy. • The trend today in all types of electrical/electronic packaging is to shrink the envelope and increase the dissipated power. This trend is the driving force that will make liquid cooling more and more acceptable as the only viable approach available. 4
  5. 5. HTE CAN PROVIDE PROSPECTIVE PARTNERS WITH EVERYTHING THAT IS NECESSARY TO BE SUCCESSFUL IMMEDIATELY WITH THIS NEW PLRC LINE OFFERING • The patent protection developed over eight years of design and experimentation can be provided to the partner. • The details of the trade secrets developed over eight years work in the area of component selection and cold plate designs utilizing micro-channels can be provided to the partner to assure competitive designs for the future. • Up to full time engineering development and liaison support is available from HTE Laboratory which currently produces all of the required ‘proof of concept’ equipment to support the current field support effort. • Complete availability of all data, test reports, curves, charts on application work already completed that would assist in the preparation of marketing and sales sheets. • HTE can support any field work reasonable away from their base of operations in Newbury, MA, with OOP expenses paid. • HTE has available a sales demo and can provide electronic copies of many typical application data sheets, • HTE can provide a reasonably up-to-date status on the competitive picture in the marketplace. • The fee for this program is a paid in full license for all markets of interest ……. -Or- An option paid in monthly installments, again related to the anticipated market coverage needed and certain other features. HTE expects to be able to support this agreement for up to five years or so. [Further details will require the execution of an NDA] 5
  6. 6. SELECTED APPLICATION WHERE PLRC’S ADVANTAGES ARE DEMONSTRATED  Large commercial and military systems such as phased array radar (page 7), data, and telecommunication centers, computer farms, motor controls for smelting and mine ventilation, etc.  Electro-optics, high power lasers and laser diodes (page 8), LEDs, etc.  Stand alone computer and telecommunication cabinets, desktop computers and workstations, and computers on a chip (page 9), etc.  High performance cold plates (pages 10 & 11) and evaporators for cooling high power electronic components and systems, including IGBTs, microprocessors, plasma cutting torch nozzles, etc. 6
  7. 7. COOLING COMARISON BETWEEN EGW AND PLRC PHASED ARRAY RADAR 4 Reference Items Design Constraints System Design % Change H.T.E. System Performance Single Phase EGW2 Cooling Media Two Phase R-134a Quality (%) NA 50 NA Heat Load (kw) 54.4 54.4 NA Flow Rate (gpm) 50.0 8.2 -84 Coolant Temperature ( C ) 30.0 30.0 0 Max. Pressure (psig) 125.0 112.3 -10 Pressure Drops (psid) 105.0 9.4 -91 EDA Manifold Load (kw) 6.8 6.8 NA Coolant Temp ( C ) 30 in / 35 out 32 in / 32 out NA Flow Rate (gpm) 6.3 1.0 -84 Critical Temperatures ( C ) 38.0 34.0 NA Pressure Drops (psid) 100.0 8.9 -91 3 Heat Exchanger Type EGW Vapor NA Size (Tons) 15.5 15.5 NA Flow Rate (gpm) 50.0 50.0 NA Supply Pressure (psig) 20.0 20.0 NA Supply Temperature ( C ) 15.0 15.0 NA Pump (centrifugal) HP 10.0 0.2 -98 Wt (Lb) 300.0 25.0 -92 Envelope (in) TBD 26quot; x 16quot; x 10quot; TBD System Impact Leakage1 Contamination Potenial None NA Hardware Reliability (khrs) No Data 50 TBD Size 60quot;L x 30quot;W x 60quot;H 25quot;L x 15quot;W x 45quot;H -84 Weight (Lb) 874.0 150.0 -83 Power (kw) 7.5 0.1 -98 Hardware $11,340.00 ~ $6500.00 -43 1. Impact on leakage on electrical circuits 2. Single Phase EGW (55/45 by Vol) 3. Water Cooled Heat Exchanger 4. Enviornmental demonsteration Array 978-463-9495 (O) / 978-270-1407 (M) HTE Associates Inc. HTEA1@comcast.net 7
  8. 8. CURAMIC PLRC LASER COOLER TEST RESULTS LASER COOLER THERMAL RESISTENCE TEST RESULTS 1.00 Notes: Red Laser Cooler / R-134a 1. Coolant………………… R-134a (sub-cooled) 0.90 Blue Laser Cooler / R-134a 2. Tv…………………………..35 C Published Data / Water 3. Tw…………………………..35 C 0.80 4. Q/A………………………. 1030 W/cm2 Thermal Resistance (deg C/W) 5. HTA………………………2mm x 10mm 0.70 6. Date…………………. …..12/19/2005 0.60 0.50 0.40 LASER COOLER TEST SET-UP 0.30 0.20 0.10 Retainer 0.00 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 Compression Block/Insulator Liquid Flow (gal/min) Compression Pad (2) Surface Thermocouple Load Stack Compression Pad (1) 2mm x 10mm Load Interface *Laser Cooler (1.5mm x 10mm x 27mm) Interface Thermocouple Gasket LASER COOLER FLOW LOSSES TEST RESULTS Test Head 100 Notes: Blue Laser Cooler / R-134a 1. Coolant………………… R-143a (sub-cooled) Red Laser Cooler / R-134a 2. Tv…………………………..35 C Published Data / Water 3. Tw…………………………..35 C 4. Q/A………………………. 1030 W/cm 2 5. HTA………………………2mm x 10mm Pressure Drop (psid) 6. Date…………………. ..12/19/2005 … Vapor Vapor Liquid 10 * Curamik laser diode cooler 1 0.01 0.1 1 Liquid Flow (gal/min) 978-463-9495 (O) / 978-270-1407 (M) HTE Associates Inc. HTEA1@comcast.net 8
  9. 9. SUN’S QUICKSILVER CPU MODULE TEST RESULTS ROCK PLUS AIR FLOW LOSS 0.50 0.45 High Density Electronics OP 0.40 ~100w/cm2 Notes: 0.35 1. Ambient………………20 °C 2. Altitude……………….0 kft Loss (in wc) 0.30 0.25 0.20 0.15 QUICKSILVER PLRC CPU COOLING MODULE 0.10 0.05 0.00 Liquid Reservoir Vapor 0 20 40 60 80 100 120 140 < 4 gph X< 50% Flow Rate (cfm) 120 CFM @ 20°C Condenser & 0.45 in wc Condenser Condenser Pump ROCK PLUS SYSYEM THERMAL PERFORMANCE 0.060 Springs (4) Cold Plate 37 °C 0.050 375w 375w OP 0.045 Overall Resistance (deg C/w) Envelop 9” x 5” x 8” 0.040 Notes: 1. Ambient………………20 °C 0.030 2. Altitude……………….0 kft 3. Coolant…………. ……R-134 a (Sub-Cooled) 4. Flow Rate……….… 120 SCFM 0.020 0.010 0.000 375 0.0 50.0 100.0 150.0 200.0 250.0 300.0 350.0 400.0 450.0 Load (w) 978-463-9495 (O) / 978-270-1407 (M) HTE Associates Inc. HTEA1@comcast.net 9
  10. 10. COLD PLATE PERFORMANCE DATA COLD PLATE POWER RESISTANCE RESULTS Notes: 0.030 1. Psat……………….. 150 psig 2. Coolant…………....... R-134a (sub-cooled) 0.025 3. Load………………… As Noted Thermal Resistanve (deg C/ w) 4. Source Size……...... 2.2 cm x 2.2 cm 0.020 5. PN………………...... 725073-x1 6. Cold Plate Mat’l…… OFC 0.015 7. FPI…………………. 70 8. Mat’l Thk’s………… 0.006” 0.010 Note: 0.005 Flow Rate………………4.7gph 0.000 0 50 100 150 200 250 300 350 400 450 Power / w COLD PLATE FLOW LOSS COLD PLATE THERMAL RESISTEANCE COLD PLATE FLOW RESISTANCE RESULTS 10 0.040 0.035 0.030 Thermal Resistance (deg C/w) Flow Resistance (psid) 0.025 0.020 0.015 0.010 Note: Note: Load…………..450w Load……450w 0.005 0.000 1 0.0 1.0 2.0 3.0 4.0 5.0 6.0 1 10 Flow (gph) Flow ( gph) 10
  11. 11. COLD PLATE PLRC (EVAPORATOR) PERFORMANCE Thermal Resistance 0.06 Notes: 1. Coolant………..R-134a (sub-cooled) 0.05 2.Psat…………….185 psia 3. ColdPlate……..S48/2 Rsv (deg C/W) 4. Source Size….2.0 cm x 2.0 cm 0.04 0.03 0.02 0.01 0 1:48:00 PM 1:55:12 PM 2:02:24 PM 2:09:36 PM 2:16:48 PM 2:24:00 PM 2:31:12 PM 2:38:24 PM 2:45:36 PM R-134a Flow 7 6 5 Flow (GPH) 4 3 Notes: 1. Coolant………..R-134a (sub-cooled) 2 2.Psat…………….185 ps ia 3. ColdPlate……..S48/2 1 4. Source Size….2.0 cm x 2.0 cm 0 1:48:00 PM 1:55:12 PM 2:02:24 PM 2:09:36 PM 2:16:48 PM 2:24:00 PM 2:31:12 PM 2:38:24 PM 2:45:36 PM Load 900 Notes: 800 1. Coolant………..R-134a (sub-cooled) 2.Ps at…………….185 psia 700 3. ColdPlate……..S48/2 600 Power (W) 4. Source Size….2.0 cm x 2.0 cm 500 400 300 200 100 0 1:48:00 PM 1:55:12 PM 2:02:24 PM 2:09:36 PM 2:16:48 PM 2:24:00 PM 2:31:12 PM 2:38:24 PM 2:45:36 PM 978-463-9495 (O) / 978-270-1407 (M) HTE Associates Inc. HTEA1@comcast.net 11

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