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Datasheet

  1. 1. Silan Semiconductors TX-2B/RX-2B REMOTE CONTROLLER WITH FIVE FUNCTIONS DESCRIPTION The TX-2B/RX-2B is a pair of CMOS LSIs designed for remote DIP-14 controlled car applications. The TX-2B/RX-2B has five control keys TX-2B for controlling the motions (i.e. forward, backward, rightward, leftward and the turbo function ) of the remote controlled car. FEATURES * Wide operating voltage range (VCC=1.5~5.0V) RX-2B DIP-16 * Low stand-by current * Auto-power-off function for TX-2B * Few external components are needed ORDERING INFORMATION Part No. Package TX-2B DIP-14-300-2.54 RX-2B DIP-16-300-2.54 BLOCK DIAGRAM FOSC TEST B 13 2 OSCI 12 Oscillator Timing Generator OSCO 11 9 VDD RIGHT 1 LEFT 14 10 PC Latch Encoding TURBO 6 Logic 8 SO Circuit Circuit 7 SC FORWARD 5 BACKWARD 4 3 GND TRANSMITTER TX-2B Block Diagram HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 1
  2. 2. Silan Semiconductors TX-2B/RX-2B BLOCK DIAGRAM OSCI 4 Timing Oscillator Generator 13 VDD OSCO 5 Decoding Computer SI 3 AMP Circuit VO1 15 PLA VI1 14 LDB 9 Control 6 RIGHT Logic RDB 8 7 LEFT Latch 12 TURBO Circuit VI2 16 10 BACKWARD VO2 1 11 FORWARD 2 GND RECEIVER RX-2B Block Diagram PIN CONFIGURATION RIGHT 1 14 LEFT VO2 1 16 VI2 TEST 2 13 GND 2 15 FOSC VO1 GND 3 12 SI 3 14 VI1 OSCI TX-2B RX-2B ACKWARD 4 11 OSCO OSCI 4 13 VDD FORWARD 5 10 OSCO 5 12 TURBO PC TURBO 6 9 RIGHT 6 11 FORWARD VDD SC 7 8 SO LEFT 7 10 BACKWARD ROB 8 9 LDB HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 2
  3. 3. Silan Semiconductors TX-2B/RX-2B ABSOLUTE MAXIMUM RATINGS Characteristic Symbol Value Unit Supply Voltage VDD 0.3~5.0 V Input / Output Voltage VIN, VOUT GND-0.3~VDD+0.3 V Operating Temperature TOPR -10~65 °C Storage Temperature Tstg -25~125 °C ELECTRICAL CHARACTERISTICS 1. TX-2B (VDD=4.0V, Fosc=128KHz, Tamb =25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Operating Voltage VDD 1.5 4.0 5.0 V Operating Current IDD -- -- 2.0 mA Stand-By Current ISTB -- -- 10 µA DC O/P Driving Current Idrive 5 -- -- mA AC O/P Driving Current Idrive 5 -- -- mA AC O/P Frequency Faudio 0.5 -- 1.0 kHz 2. RX-2B (VDD=4.0V,Fosc=128KHz, Tamb=25°C, unless otherwise specified.) characteristic Symbol Min Typ Max Unit Operating Voltage VDD 1.5 4.0 5.0 V Operating Current IDD -- -- 3.0 mA O/P Driving Current Idrive 1 -- -- mA O/P Sinking Current Isink 1 -- -- mA Effect Decoding Frequency Variation Ftolerance -20 -- 20 % PIN DESCRIPTION 1. TX-2B Pin No. Symbol Description 1 RIGHT The rightward function will be selected, if this pin is connected to GND 2 TEST This pin is used for testing mode 3 GND Negative power supply 4 BACKWARD The backward function will be selected, if this pin is connected to GND 5 FORWARD The forward function will be selected, if this pin is connected to GND (To be continued) HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 3
  4. 4. Silan Semiconductors TX-2B/RX-2B (Continued) Pin No. Symbol Description 6 TURBO The turbo function will be selected if this pin is connected to GND 7 SC Output pin of the encoding signal with carrier frequency 8 SO Output pin of the encoding signal without carrier frequency 9 VDD Positive power supply 10 PC Power control output pin 11 OSCO Oscillator output pin 12 OSCI Oscillator input pin 13 FOSC This pin is used for testing mode 14 LEFT The leftward function will be selected, if this pin is connected to GND 2. RX-2B Pin No. Symbol Description 1 VO2 Inverter 2 output pin for power amplify 2 GND Negative power supply 3 SI Input pin of the encoding signal 4 OSCI Oscillator input pin 5 OSCO Oscillator output pin 6 RIGHT Rightward output pin 7 LEFT Leftward output pin 8 ROB Rightward function disable, if this pin is connected to GND 9 LDB Leftward function disable, if this pin is connected to GND 10 BACKWARD Backward output pin 11 FORWARD Forward output pin 12 TURBO TURBO output pin 13 VDD Positive power supply 14 VI1 Inverter 1 input pin for power amplify 15 VO1 Inverter 1 output pin for power amplify 16 VI2 Inverter 2 input pin for power amplify HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 4
  5. 5. Silan Semiconductors TX-2B/RX-2B CODE FORMAT 1. ENCODE RULE (A).Bit Format (W1 is used for function codes,W2 for start codes) 1KHz W1 1KHz 50% Duty cycle W2 500Hz 75% Duty cycle (B).Date Format W2 W2 W2 W2 (n) X W1 W2 W2 W2 W2 (n) X W1 W2 W2 W2 W2 W2 W2 W2 W2 1 2 3 4 W2 W2 W2 W2 1 2 3 4 W1 W1 W1 W1 W1 W1 n-th start code n x W1 function code 1 word Number Of Function Code (N) W1 Function Key Decode Result 4 End Code 10 Forward Forward 16 Forward & Turbo Forward 22 Turbo Turbo 28 Turbo & Forward & Left Forward & Left 34 Turbo & Forward & Right Forward & Right 40 Backward Backward 46 Backward & Right Backward & Right 52 Backward & Left Backward & Left 58 Left Left 64 Right Right HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 5
  6. 6. Silan Semiconductors TX-2B/RX-2B 2. ENCODE/DECODE TIMING Any function key Encode output 1st word 2nd word 3rd word 1 2 3 4 5 6 7 8 end code Decode output 9ms 9ms SI 8ms (n) W1 8ms 1ms Decode output T T=17ms+(nW1)x1ms TESTING CIRCUIT (The oscillator frequency of TX-2B, RX-2B is 128KHz, the oscillator resistor is 160KΩ and 250KΩ respectively) forward backward fosc=128kHz turbo VCC=3V 14 13 12 11 10 9 8 16 15 14 13 12 11 10 9 F ­ TX-2B RX-2B 100 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 backward forward turbo right right left left fosc=128kHz HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 6
  7. 7. Silan Semiconductors TX-2B/RX-2B TYPICAL APPLICATION CIRCUIT TRANSMITTER VCC Rosc=500k ¡ R.F. SI CIRCUIT 14 13 12 11 10 9 8 TX-2B 1 2 3 4 5 6 7 backward forward turbo right left RECEIVER power switch 16 15 14 13 12 11 10 9 100 ­ F 4.3V RX-2B VCC 1 2 3 4 5 6 7 8 R.F. CIRCUIT 500k ¡ GND HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 7
  8. 8. Silan Semiconductors TX-2B/RX-2B INFRARED APPLICATION CIRCUIT TRANSMITTER DC:3V F ­ 100 fosc=114kHz ¡ 1~4.7 14 13 12 11 10 9 8 Photo Diode TX-2B 1 2 3 4 5 6 7 Frontwar Backw Turbo C8050 Right ard Left d RECEIVER 16 15 14 13 12 11 10 9 DC:5V 100K ¡ RX-2B F VDD ­ 100 OUT IR 1 2 3 4 5 6 7 8 Receiver 1815 fosc=114KHz GND HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 8
  9. 9. Silan Semiconductors TX-2B/RX-2B RECOMMENDED APPLICATION CIRCUIT R L VDD=9V 1 14 LED 2 13 1.5k ¡ 3 12 Rosc=160K ¡ ¡ 203P 220k 390 L1 L2 L4 B XTAL 2.2 H ­ 2.2 H­ 6.8 H­ 4 TX-2B 11 27MHz 47P 151P L3 F 7T 0.3mm ( ) ¶ 5 10 x 5mm(Core) 68P Q1 TURBO C945 Q2 C945 6 9 ¡ 151P 103P ¡ ¡ 68P F 100 203P 203P 3.0V 33K 100 ­ 47 7 8 C2 47P Q1: C9018,C1815,C380,C382 4P Q2,Q3,Q4: 5610,C8550,B772 Q5,Q6: C8050,5609,D882 1.1 F 7T 0.3mm ( ) ¶ C3 18P ­ VDD1=12V,R=330 ¡ Q7,Q8: B564,C8550,B772 L1 Q1 x 5mm(Core) L2 VDD1=9V,R=220 ¡ Q9,Q10: D471,C8050,D882 VDD1 180k ¡ 3.3k ¡ 3.0V 1N4148 C1 102P C4 203P F 104P ¡ ¡ R2 ­ 100 F­ 820 220 F ­ 470 F ­ 104P 3.3k 4.7 Q3 /16V /16V /16V VDD2 3.9MO 103P 1k ¡ R1 203P 330 ¡ C945 Q2 Q4 R2 1 16 ¡ 1k ¡ M 3.3k 390 ¡ C945 C945 2 15 ¡ Q5 Q6 501P 473P 3.9M 222P 3 14 1kO 4 13 Rosc=250K R1,R2,R3,R4=80~150 ,are ¡ RX-2B changeable with the VDD1 and VDD2. turbo 5 12 right forward 6 11 left backward 7 10 R3 8 9 Q7 Q8 R4 1k ¡ 1k¡ C945 M C945 Q9 Q10 473P HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 9
  10. 10. Silan Semiconductors TX-2B/RX-2B PACKAGE OUTLINE DIP-14-300-2.54 UNIT: mm 2.54 0.05 B 0.25 0.25 7.62 B 6.35 1.52 19.55 B0.3 15 degree 4.36MAX 0.5MIN 3.00MIN 0.46B 0.08 2.40MAX DIP-16-300-2.54 UNIT: mm 2.54 0.05 0.25 B 0.25 7.62 B 6.35 19.55 0.3B 1.52 15 degree 4.36MAX 0.5MIN 3.00MIN 1.27MAX 0.99 B 0.3 0.46 B 0.08 HANGZHOU SILAN MICROELECTRONICS JOINT-STOCK CO.,LTD Rev: 1.0 2002.03.29 10

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