Globalfoundries, DAC 2011 Update


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Globalfoundries and Magma presented an update at the DAC 2011 show, talking about 28nm production, IP libraries and tool flows.

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Globalfoundries, DAC 2011 Update

  1. 1. GLOBALFOUNDRIES Leading Edge Technology<br />6-9th June 2011<br />DAC 2011 Update<br />
  2. 2. Only Pure-Play Foundry in HKMG Production32nm “Llano” Yields Climb as Production Ramps<br />- Lot Yield Averages<br /> Do = 0.13 <br />Prime Die Yield<br />See “Llano” Demos in our Booth #1517<br />“Llano” is the first HKMG Product in the Foundry Industry <br />See “Llano”-powered Laptops in Stores this Month!<br />Q4 2010 - Q1 2011 <br />2<br />
  3. 3. Leading the Foundry Ramp in HKMG<br />Ramping HKMG in volume ahead of others*<br />Other leading foundries<br />* Data based on customers’ and GLOBALFOUNDRIES projections. Comparison done for pure play foundries only. <br />3<br />
  4. 4. Forget the FUD - Here are the FACTS<br />* Based on GLOBALFOUNDRIES simulation results and assumptions (TT condition)<br />4<br />
  5. 5. > 3GHz<br />Understanding and Delivering Market Needs<br />HIGH <br />PERFORMANCE<br />Watts<br />Games<br />Networking<br />1-3GHz<br />Laptop, Netbooks<br />Graphics<br />MOBILE COMPUTING<br />DTV<br />Up to ‘00s mW<br />DIGITAL CONSUMER<br />Mobile Desktop<br />Tablets<br />Up to 1GHz<br />STB<br />LOW POWER<br />Feature phones<br />Smartphones<br />Up to ‘0s mW<br />Wireless Connectivity<br />Performance<br />5<br />
  6. 6. Two Platforms to Cover Your Needs<br />28nm-HPP<br />> 3GHz<br />HIGH <br />PERFORMANCE<br />Stressors added for > 3.1Ghz<br />Watts<br />Games<br />Networking<br />1-3GHz<br />UHVt + LLSRAM for power mgmt<br />28nm-SLP<br />Laptop, Netbooks<br />Graphics<br />MOBILE COMPUTING<br />DTV<br />Up to ‘00s mW<br />DIGITAL CONSUMER<br />Mobile Desktop<br />Tablets<br />Up to 1GHz<br />STB<br />LOW POWER<br />Low maskcount, no stress engineering for lowest cost<br />Feature phones<br />Smartphones<br />Up to ‘0s mW<br />Wireless Connectivity<br />Performance<br />6<br />SLVT, OD option for > 2.3GHz <br />
  7. 7. Example of typical implementation of a Low Power product<br />With HP/HPM technology<br /> 28nm-SLP<br />“Gate First” 28nm Die Size Advantage <br />Up to 5-10 % additional increase with UHVt and power management<br />Up to 10% going to gate last<br />Up to 20% die size advantage with 28nm-SLP vs other foundries  superior GHz product costs/form factor <br />7<br />
  8. 8. 28nm-SLP: Best Performance at Low Cost<br />28nm-SLP has up to 30%cost benefit over HPM<br />3.0<br />28nm<br />HPP<br />Other foundry<br />28HPM<br />CPU Clock (GHz)<br />28nm<br />SLP<br />2.0<br />+ 5-10% <br />(area overhead for power management, larger UHVt device)<br />+10% <br />(area scaling disadvantage of gate last HKMG)<br />+10% <br />(mask adders due to stressors)<br />1.0<br />1.0<br />1.1<br />1.2<br />1.3<br />Increasing Cost (arb. units)<br />8<br />
  9. 9. Enablement is Structured to Provide Comprehensive and Differentiated Solutions <br />Collaboration with customers & ecosystem partners to optimize customers’ product performance, leakage and yields<br />Design Enablement Operations<br />Tapeout<br />Operation<br />Data delivery portal<br />Quality<br />conformance<br />Design Solutions<br />IP Eco-System<br />DesignInfrastructure<br />TechnologySolutions<br />SoCEnablement<br />Foundation IP<br />Differentiated IP<br />Design <br />services <br />Tech filesand PDK<br />Design Interface<br />Cultivation of Eco-System<br />Test Vehiclesand Shuttles<br />Reference EDA flow<br />Technology Services<br />Design enabling ecosystem with Reference Flows, DEM/DFM, PDKs and IPs flowing from multiple industry leaders<br />DFM<br />Technology IP<br />9<br />
  10. 10. 28nm – Extensive enablement in place<br />28nm-SLP <br /><ul><li> Full Design Kits Available NOW
  11. 11. Well suited to cover wireless comms, mobile computing and digital consumer needs </li></ul>28nm-HPP<br /><ul><li>Front End Views Available, Full Design Kits Q4
  12. 12. Targeted for mobile computing, digital consumer and certain segments of computing/networking</li></ul>10<br />
  13. 13. GLOBALFOUNDRIES 28nm Fabs<br />28nm manufacturing will be available in both Fab1 Germany and Fab8 New York<br />Dresden, Germany<br />Munich, Germany<br />London, UK<br />Yokohama,Japan<br />Saratoga, NY<br />Shanghai,China<br />Headquarters<br />Si Valley, CA<br />East Fishkill, NY<br />Hsinchu,Taiwan<br />Austin, TX<br />Singapore<br />Plus, Added Flexibility with Common Platform FabSync – IBM, SEC <br />Manufacturing sites<br />Sales and Support Offices<br />11<br />
  14. 14. Fab 1: Dresden, Germany<br />Fab 1 – Output Expanding to ~1M wafers/year<br /><ul><li>Construction of 110,000 sq ft of new clean room space
  15. 15. Brings total output to 80,000 wafers per month
  16. 16. Completely 45/40nm and below technology</li></ul>12<br />
  17. 17. Fab 8: Saratoga County, NY<br />Most advanced 300mm wafer fab in the world<br /><ul><li>Designed for 28/20nm technologies
  18. 18. 60,000 wafer starts per month once fully ramped
  19. 19. Construction started in July 2009 with production expected to come online in 2012
  20. 20. Campus accommodates up to 2 more fabs</li></ul>13<br />
  21. 21. Enabling 28nm IP Silicon validation with MPW Program<br />MPW0305<br />4 shuttles in 2011<br />MPW0309 and MPW0310 fully subscribed<br />28nm-HPP supported from MPW0311 onwards<br />4 shuttles planned for 2012<br />MPW0306<br />MPW0308<br />MPW0309<br />MPW0307<br />14<br />
  22. 22. Most competitive solution at 20nm<br /><ul><li>50% area scaling from 28nm
  23. 23. Single technology platform with multi Vt and multi Lg support
  24. 24. >30% performance over 28nm
  25. 25. Silicon-based PDK available
  26. 26. Innovative MOL, BEOL for cost/density optimization
  27. 27. First MPW in 4Q2011</li></ul>LOW POWER<br />Extreme low power & cost sensitive<br />20LPM<br />Cost<br />Low power GHz applications, cost optimized<br />Low Power<br />HIGH <br />PERFORMANCE<br />MOBILE , HIGH PERFORMANCE<br />Mobile, high end applications <br />> 3GHz<br />Wired, desktop applications<br />High Performance<br />20SHP<br />High performance to extreme high performance (>4GHz)<br />(additional perf option)<br />15<br />
  28. 28. Summary<br />16<br />