A stunning choice for “3D structuring LED Light”        TacLED-3D                       -1-
Structure and Features  Structure                                                      Dielectric                        ...
General Properties                                             Typical Values             Properties                      ...
Applications for 3D LED Light DK Thermal’s products (WWW.DKThermal.co.uk)                          -4-
Hi-Pot Test in 3D Structure☞ Bend Hi-Pot Test ( Compare to TacLED )√. Test Condition  - Peak Voltage : DC3000 volts and li...
▶ Stretched Result ( Bending with dielectric on outside )3.5                                                              ...
▶ Complex bending ( Stretched + Compressed )                ▶ Twist Bending ( Stretched )      1      2      3    4       ...
Complex bending ( Stretched + Compressed )+Twist Bending ( Stretched )3.5                                                 ...
▶ TacLED-3D-10/85 C2/Al1.5         ▶ TacLED -10/85 C2/Al1.5No microcrack                                         Microcrac...
Bending Test               - 10 -
Repeated Bending with 45 degree /4x bendingK Volts  3.5                                                             TacLED...
Bending Hi-Pot Property (standard copper type vs. high elongation copper)K Volts  3.5  3.0  2.5  2.0  1.5  1.0          Ta...
Bending Reliability Check by X-Ray√. Specimen :    -. TacLED-10/85 C2/Al1.5mm without/with solder resist ink coating      ...
No Bend            90°             45°               20°                 Twist                                            ...
No Bend           90°             45°               20°                 Twist                                          Wit...
Heat Dissipation   Overall Thermal Conductivity and Dielectric Thermal Impedance                Base Metal Trace         ...
Thermal Resistance Specimen : 2” x 2”, n=12 Test Condition : Floating for 30min @300℃          Solder Float Tester (Sold...
Peel Strength  Specimen : 2oz Cu / Al 1.5mm                            Peel Strength Tester (Instron)  Test Condition : ...
How To Order Available Size     Standard : 18”x24”                           - 19 -
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Taconic TacLED-3D

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Taconic TacLED-3D

  1. 1. A stunning choice for “3D structuring LED Light” TacLED-3D -1-
  2. 2. Structure and Features  Structure Dielectric Available Metal (Al2O3 filled PTFE) Cu Grade Dielectric Thermal Thickness Thickness Conductivity Type (㎛) (mm) (W/m·K)Base Metal Aluminium 0.6 TacLED-3D- (A-5052), 1.0 1.0 85 10/85 Copper 1.5 (C-106) 2.0  Features ● Bendable and formable for 3D LED light ● Excellent heat dissipation ● Ultra high thermal resistance ● Superior dielectric adhesion strength on Al and Copper -2-
  3. 3. General Properties Typical Values Properties Test Method Unit TacLED-3D-10/85 Thermal Conductivity(k) ASTM E1461 W/m∙K 1.0 Dielectric Thickness(t) - µm 85 Thermal Impedance(t/k)*1 - ℃ in2/W 0.13 kg/cm 2.0 IPC-TM-650 2.4.8 Peel Strength(1oz ED Cu) (Test Condition A) lbs/in 11 ASTM D149 Dielectric Breakdown kV(kV/mm) > 3(35.0) (Test Condition A) Dielectric Constant @10GHz - 4.2 IPC-TM-650 2.5.5.5.1 mod. Dissipation Factor @10GHz - 0.0016 Solder Resistance(@300℃) - min > 20 Surface Resistivity IPC-TM-650 2.5.17.1 Ω 1.5E+13 Volume Resistivity IPC-TM-650 2.5.17.1 Ω∙㎝ 2.5E+12 Moisture Absorption IPC-TM-650 2.6.2.1 % < 0.05 Tg*2 - ℃ 327 CTE[α1(50℃~250℃), X=Y/Z axis] ASTM D3386(TMA) ppm/℃ 18/65 Flammability Rating UL-94 - On process*1 Calculated Value, *2 Melting Point -3-
  4. 4. Applications for 3D LED Light DK Thermal’s products (WWW.DKThermal.co.uk) -4-
  5. 5. Hi-Pot Test in 3D Structure☞ Bend Hi-Pot Test ( Compare to TacLED )√. Test Condition - Peak Voltage : DC3000 volts and limited current 1mA - Ramp rate to peak voltage : 1000 volts per second - Hold time at peak voltage : 2 seconds√. Specimen Trace lengthXwidth : 180mmX200㎛√. Degree of bend 90° 45° 20° -5-
  6. 6. ▶ Stretched Result ( Bending with dielectric on outside )3.5 3.5 TacLED-3D 10/85 C2/Al1.5mm TacLED-3D 10/85 C2/Al1.0mm3.0 3R 3.0 4R 3R2.5 2.5 conventional 4R2.0 2.01.5 1.51.0 1.00.5 0.50.0 0.0 no bend 90° 45° 20° no bend 90° 45° 20°3.5 3.5 TacLED-3D 10/85 C1/Al 0.8mm TacLED-3D 10/85 C1/Al 0.6mm3.0 3.0 3R 2.5 3R2.5 4R 4R2.0 2.01.5 1.51.0 1.00.5 0.50.0 0.0 no bend 90° 45° 20° no bend 90° 45° 20° ※ All specimens passed 3KV Hi-Pot test in Compressed Bending ( Bending with dielectric on inside ) -6-
  7. 7. ▶ Complex bending ( Stretched + Compressed ) ▶ Twist Bending ( Stretched ) 1 2 3 4 5 1 2 3 4 5 1 2 3 4 5 Items No Bend Complex 90° Complex 45° Twist1 TacLED-3D 10/85 C2/Al 1.5mm 3 KV Pass 1.670 KV 1.359 KV 1.625 KV2 TacLED-3D 10/85 C2/Al 1.0mm 3 KV Pass 1.658 KV 1.362 KV 1.354 KV3 TacLED-3D 10/85 C2/Al 0.8mm 3 KV Pass 1.658 KV 1.293 KV 1.423 KV4 TacLED-3D 10/85 C2/Al 0.6mm 3 KV Pass 1.598 KV 1.230 KV 1.326 KV5 TacLED 10/85 C1/Al 1.5mm 3 KV Pass 0.667 KV 0.564 KV 0.661 KV -7-
  8. 8. Complex bending ( Stretched + Compressed )+Twist Bending ( Stretched )3.5 3D C2/Al 1.5mm3.0 3D C2/Al 1.0mm2.5 3D C2/Al 0.8mm 3D C2/Al 0.6mm2.0 TacLED C1/Al .5mm1.51.00.50.0 No Bend Complex 90° Complex 45° Twist -8-
  9. 9. ▶ TacLED-3D-10/85 C2/Al1.5 ▶ TacLED -10/85 C2/Al1.5No microcrack Microcrack in PTFE in epoxy -9-
  10. 10. Bending Test - 10 -
  11. 11. Repeated Bending with 45 degree /4x bendingK Volts 3.5 TacLED-3D 10/85 stanfard copper TacLED-3D 10/85 High Elongation copper 3.0 TacLED 10/85 stanfard copper 2.5 2.0 1.5 1.0 0.5 0.0 0 1 2 3 times ※ Circuit of TacLED 10/85 was opened after twice repeated bending - 11 -
  12. 12. Bending Hi-Pot Property (standard copper type vs. high elongation copper)K Volts 3.5 3.0 2.5 2.0 1.5 1.0 TacLED-3D 10/85 stanfard copper ( 3R) TacLED-3D 10/85 stanfard copper ( 4R) 0.5 TacLED-3D 10/85 High Elongation copper(3R) TacLED-3D 10/85 High Elongation copper(4R) 0.0 No bend 90° 45° 20° times - 12 -
  13. 13. Bending Reliability Check by X-Ray√. Specimen : -. TacLED-10/85 C2/Al1.5mm without/with solder resist ink coating -. TacLED-3D-10/85 C2/Al1.5mm without/with solder resist ink coating√. Bending : -. Angle : No bend -> 90 ° , 45 °, 20 ° & twist -. Direction : Stretched , Compressed ( hard to define defect after compressed direction bending )√. Test Equipment : X- eye SF160 model - 13 -
  14. 14. No Bend 90° 45° 20° Twist With solder resist coating Without solder resist coatingTacLED-10/85 C2/Al1.5mm With solder resist coating Without solder resist coatingflexible solder resist req. ※ open circuit and pad (land) lifting after bending - 14 -
  15. 15. No Bend 90° 45° 20° Twist With solder resist coating Without solder resist coatingTacLED-10/85-3DC2/Al1.5mm With solder resist coating Without solder resist coating※ No open circuit after bending but corner of pad was slightly lifted after 20 ° bending - 15 -
  16. 16. Heat Dissipation  Overall Thermal Conductivity and Dielectric Thermal Impedance Base Metal Trace Dielectric Dielectric OverallCopper Thermal Conductivity Thermal Impedance*1 Thermal Conductivity*2 (oz) Al-5052 Cu (W/m·K) (℃㎠/W) / (℃in2/W) (W/m·K) (mm) (mm) 1 1.0 1 0.85 / 0.13 25.0 1 1.0 1 0.85 / 0.13 34.0*1 Calculated Data*2 Measured in Laser Flash in Ajou Univ. Lab. in 2010 - 16 -
  17. 17. Thermal Resistance Specimen : 2” x 2”, n=12 Test Condition : Floating for 30min @300℃ Solder Float Tester (Solder Pot) Result : No Blister and No Delamination 1 2 3 4 5 6 7 8 9 10 11 12 OK OK OK OK OK OK OK OK OK OK OK OK - 17 -
  18. 18. Peel Strength  Specimen : 2oz Cu / Al 1.5mm Peel Strength Tester (Instron)  Test Condition : A Condition E-0.5/260 D-2/100  Result : [Unit : lbs/in] Item 1 2 3 4 5 6 7 8 9 10 AVG. A 18.9 16.3 16.3 16.2 17.8 17.5 17.7 16.2 17.3 17.3 17.1 E-0.5/260 16.6 12.8 11.9 17.6 13.9 14.6 D-2/100 18.9 17.6 16.1 15.9 17.4 17.2 - 18 -
  19. 19. How To Order Available Size  Standard : 18”x24” - 19 -

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