1 • Industry Analyst Day • May 2013CommunicationsNiall ShakeshaftSegment Marketing Manager - Communications
2 • Industry Analyst Day • May 2013Leading Positions: RF Tuning, Optical Image Stabilization, Power Supplies, Protection, ...
3 • Industry Analyst Day • May 2013Mobility and Big Data (The Cloud)DataCenterCDN(Enterprise)NetworkCarrierNetworkDevicesS...
4 • Industry Analyst Day • May 2013Smart Devices Continue to BoomSource: Corporate Marketing Analysis and Estimates. BMO C...
5 • Industry Analyst Day • May 2013Products for Smartphones and Tablets• Modular product architectures have largely ‘level...
6 • Industry Analyst Day • May 2013Broad Portfolio for Smartphones/TabletsPower TreeARM basedAppsProcessorLogicLogic, Inte...
7 • Industry Analyst Day • May 2013RF Tuning Essential for 4GGlobally Fragmented Spectrum AllocationNo. of defined frequen...
8 • Industry Analyst Day • May 2013Differentiated Solution Already Shipping• Barium Strontium Titanate (BST) capacitors• B...
9 • Industry Analyst Day • May 2013Strong Presence in Camera ModuleImageSensorOISAFEEPROMAF +OISLensUnitOISVCMAFVCMOISPosi...
10 • Industry Analyst Day • May 2013Optical Image StabilizationHigh Megapixels, Low LightDeviceVDD (V) VM (V) PWMmaxCPUIFG...
11 • Industry Analyst Day • May 2013Power Management ComponentsCore ChipsetSwitching BatteryChargerOVPACDCPowerManagementU...
12 • Industry Analyst Day • May 2013-50510152025303540-20 30 80 130Voltage(V)Time (ns)Common Mode Filters for LTE Phones80...
13 • Industry Analyst Day • May 2013Infrastructure Equipment SolutionsComplete System Clock Solutions• New Sub-1ps RMS Jit...
14 • Industry Analyst Day • May 2013Key Takeaways: Communications• Equipment volumes and ON Semiconductor SAM are bothgrow...
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Semiconductor Communication Applications by Naill Shakeshaft of ON Semiconductor

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We have one of the broadest and deepest portfolios to serve the communication segment as an ’innovation enabler’.

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  • We used to say there are three problems that antenna tuning solves:Broadband requirements, the antenna size, the use case, but now there is a thrid, the next gen of LTE will further complicate matters by stitching together bands
  • Semiconductor Communication Applications by Naill Shakeshaft of ON Semiconductor

    1. 1. 1 • Industry Analyst Day • May 2013CommunicationsNiall ShakeshaftSegment Marketing Manager - Communications
    2. 2. 2 • Industry Analyst Day • May 2013Leading Positions: RF Tuning, Optical Image Stabilization, Power Supplies, Protection, MOSFETsSmartphoneTabletBase StationCustomer Premise EquipmentEnterpriseRoutersCommunications Segment2012 Revenue = $395M (13% of Company Revenue)Source: iSuppli AMFT, Corporate Marketing*ON Semiconductor reported Tablet revenue in its Computing Segment for 2012 and prior years.Key Growth DriversDesign-In Activity (Major OEMs)Market: Smartphone / Tablet*2012 SAM 2015 SAM CAGR$3.2B $5.1B 17.0%BOM Opportunity ~$3.50 in 2012  ~$7.502012 Average BOM ~$0.38 High smartphone / tablet CAGR High resolution cameras 3G / 4G band fragmentationdrives need for RF tuning Power and backlighting for highresolution, low power displays+104%
    3. 3. 3 • Industry Analyst Day • May 2013Mobility and Big Data (The Cloud)DataCenterCDN(Enterprise)NetworkCarrierNetworkDevicesSource”: Cisco VIN (May 2012)• Smartphones and tablets• Social media• IP Services VoD/IPTV• Consumer Cloud Services• Enterprise virtualization• M2M ‘Internet of Things’
    4. 4. 4 • Industry Analyst Day • May 2013Smart Devices Continue to BoomSource: Corporate Marketing Analysis and Estimates. BMO Capital Markets (May 2013), IDC (May 2013)Key Themes• Featurephones in terminal decline• Rise of low-cost segment insmartphones and tablets• LTE becoming mainstream• War of ecosystems; iOS vsAndroid vs others• Margin pressure and integrationSamsung, 32.8%Apple, 17.5%LG, 4.8%Huawei, 4.7%ZTE, 4.0%Sony, 3.7%Lenovo, 3.7%Nokia, 2.9%Blackberry, 2.8%Yulong/Coolpad, 2.8%HTC, 2.0%Motorola, 1.3%Others, 17.0%Smartphone Shipment Share Q1/2013Apple, 39.60%Samsung, 17.90%ASUS, 5.50%Amazon, 3.70%Microsoft, 1.80%Others, 31.50%Tablet Shipment Share Q1/2013
    5. 5. 5 • Industry Analyst Day • May 2013Products for Smartphones and Tablets• Modular product architectures have largely ‘leveled theplaying field’ in the wireless device industry– Widely available operating systems (Android, WindowsPhone) and core application processor/chipset platforms(Qualcomm, Intel, MediaTek, Broadcom…)• Key to success for device manufacturers is rapid introductionof differentiated hardware – feature innovation on top of thechipset• ON Semiconductor provides a broad portfolio of solutions toenable hardware differentiation– Adding new sub-systems, powering them, managing andprotecting interfaces between sub-systems– Cooperating ahead of market with chipset reference designs
    6. 6. 6 • Industry Analyst Day • May 2013Broad Portfolio for Smartphones/TabletsPower TreeARM basedAppsProcessorLogicLogic, Interface &DiscretesInterfaceOpticalSensorCamera ModuleLensFlashFlash DriverImageSensorAuto FocusOISEEPROMMEMs SensorsGyroCompassAccele-rometerPressure ALS +ProximitySensorPower Mngmt UnitRAMModem SoC(BB + RF)PAMIPDDCDCPATunableRFWLAN/BT/FM/GPS CombosTouch Display SubsystemDisplayLED BacklightAMOLED pwrTouchInterfaceDispl. DriverMini PMICDCDCLDOLoadSwitchHigh IDCDC>5AVbatMass StorageEEPROMNFCModemSecureElementVibraMotorHaptics/Motor DriveSwitch ModeChargerESD/EMI Protn,AudioAudioCODEC/HUBSpeech DSPHeadphoneSpeaker/EarpieceANCOVP/OCPUSB/MHLBattery PackMOSFETProtectionICVbatTempSensorFuelGaugeWireless ChargingSystemCtrlPwr DiscGSM…WCDMA…HSPA…LTEON Product
    7. 7. 7 • Industry Analyst Day • May 2013RF Tuning Essential for 4GGlobally Fragmented Spectrum AllocationNo. of defined frequency bands by 3GPP releaseMore Antennae in Smaller SpaceChallenging Use Cases• Antennae performancerelated to size• Cross-coupling,correlation, SAR• Dependence betweenform factor and antennaperformance• Carrier emphasis on RFperformance• Antenna detuningdue to interactionwith head/hand/environmentLTE-Advanced: First Deployment 2012• Carrier aggregation:combination of non-contiguous spectrum tocreate up to 100MHzchannel• MIMO: Multi-antennatechniques for higherdata rates, bettercoverageSource: 3GPP, Intel, Apple, ZTE
    8. 8. 8 • Industry Analyst Day • May 2013Differentiated Solution Already Shipping• Barium Strontium Titanate (BST) capacitors• Best RF performance of technologies available in volume• Lower cost than competing technologies• Simpler implementation – continuous controlTransceiverBasebandFEMPA/Filters/SwitchesPTICSPI/MIPI controlHVDACPTIC SolutionDCBIASRFINDCBIASRFOUTcapacitorsresistorsresistorsTunablecapacitorelementControl ICON Product
    9. 9. 9 • Industry Analyst Day • May 2013Strong Presence in Camera ModuleImageSensorOISAFEEPROMAF +OISLensUnitOISVCMAFVCMOISPositionCamera PMIC LEDflashMEMsGyroSmartphone Camera Subsystem• Autofocus already standard in higher-end smartphones. Transition from opento closed loop• Optical Image stabilization becomingmainstream at 12MP+• ON Semiconductor (SANYO) withstrong technology for AF and OIS• Size and performance advantagesdeveloped from long experience inDSC market• Strong position in Smartphone CameraPMICs• Upstream collaboration with cameramodule and actuator vendors essentialON Product
    10. 10. 10 • Industry Analyst Day • May 2013Optical Image StabilizationHigh Megapixels, Low LightDeviceVDD (V) VM (V) PWMmaxCPUIFGyro IF DA AD Packagemin max min maxLC898111 2.6 3.6 2.6 3.6 6 MHzI2CSPII2C / SPI / Analog 8-bit 12-bit WLP48LC898111A* 2.6 3.6 2.6 3.6 6 MHzI2CSPII2C / SPI / Analog 10-bit & 8-bit 12-bit WLP48BenefitsHigh PWM carrier frequencySupports Hall and Photo Reflector position sensorsInternal circuit for position sensorOIS OFFOIS ONI2C/SPIDigitalGyro IFLDOOSCDAADEqualizerPWMControlLogicDriverPositionSensorOISGyroOISActuatorCPUAutofocus Driver Block Diagram
    11. 11. 11 • Industry Analyst Day • May 2013Power Management ComponentsCore ChipsetSwitching BatteryChargerOVPACDCPowerManagementUnitApplicationsProcessorBatteryPowerManagementUnitModemBlockEBlockDBlockCLDODCDCMini PMICBlockBSubsystem AMultiple differentcombinations of DCDCand LDO available e.g.Camera PMICSingle rail power suppliesMedium-scale Integration with fastdesign turn-aroundLoad SwitchesDiscrete MOSFETKey components for highly efficientbattery charging and protectionSingle and multi-cellHigh efficiency, smallpackage, competitivepricingNeed to be fast, agile and included inchipset reference designsON ProductÍntegrated SmartLoadswitches andEcoSwitches
    12. 12. 12 • Industry Analyst Day • May 2013-50510152025303540-20 30 80 130Voltage(V)Time (ns)Common Mode Filters for LTE Phones800 MHz CommonMode RejectionIntegrated ESD protection + EMIfiltering• Integrated ESD protection and EMI filtering highspeed, differential interfaces• Prevents propogation of common mode interferenceinto sensitive RF systems and outside of phone• First all-silicon solution. Saves 40% board space andhas superior ESD clamping performance than discretesolution• Less than 1pF capacitance, but strong noiseattenuation from 700MHz to 3GHz parts for internaland external interfaces USB2.0, MHL, HDMI, MDDI,MIPIRobust ESD perforance Excellent Signal IntegritySuppresses Common ModeInterference in key LTE band
    13. 13. 13 • Industry Analyst Day • May 2013Infrastructure Equipment SolutionsComplete System Clock Solutions• New Sub-1ps RMS Jitter PLL’s: PureEdgeTM• Crystal Oscillator Module Replacement Clocks• Flexible CMOS PLL Clocks• Spread-spectrum EMI reductionRecent launch of specialized ACDC and DCDC componentsASIC, FPGA, power, protection, discretes...
    14. 14. 14 • Industry Analyst Day • May 2013Key Takeaways: Communications• Equipment volumes and ON Semiconductor SAM are bothgrowing strongly• We have a very strong offering for RF tuning• We are building critical mass within the camera subsystem• We have one of the broadest and deepest portfolios toserve this segment as an ’innovation enabler’• Essential to win sockets in chipset reference designs andother upstream technology developers

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