Avx tps

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Avx tps

  1. 1. Surface Mount Tantalum Capacitors
  2. 2. Surface Mount Tantalum Capacitors Foreword AVX offers a broad line of molded solid tantalum capacitors in a wide range of sizes, styles, and ratings to meet your design needs. This catalog combines into one source AVX’s SMD tantalum capacitor information from its worldwide tantalum operations. The TAJ series includes EIA standard case sizes and ratings, along with extended range values. Low profile packages and MIL-Style CWR11 components are available as part of the TAJ family. The TPS Low ESR SMD product line was introduced last year and is included in this catalog to provide a comprehensive listing of our tantalum surface mount lines. TPS has its own catalog which covers performance and applications in depth. This catalog may be obtained from your local AVX representative. The TAZ Series offers high volume efficiency components in a wide variety of footprints. Five of those footprints have a nominal height of 0.050 inches which make them ideal for low profile applications. The TAZ series is qualified as the MIL-Style CWR09, the molded equivalent of the MIL-Style CWR06. Two new case sizes are added to this series, increasing the capacitance/voltage ratings available for both low and high values. Extended range values are also available in all series. AVX offers tantalum applications service for use by our customers, please contact your local representative if you wish to discuss any special requirements. AVX has become a world leader in tantalum capacitor technology and is continuing to make significant investments in equipment and research to maintain that leadership. Contents Surface Mount Tantalum Capacitors Section 1 – TAJ, TAZ, and TPS Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 TAJ Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7 TPS Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8-9 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 TAZ Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-15 CWR09 Style (MIL-C-55365/4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-18 CWR11 Style (MIL-C-55365/8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19-21 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22-23 Technical Summary and Application Guidelines Contents/Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24-25 Electrical Characteristics and Explanation of Terms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26-29 A.C. Operation, Ripple Voltage and Ripple Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30-32 Reliability and Calculation of Failure Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33-34 Soldering Conditions and Board Attachment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Recommended Soldering Profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Mechanical and Thermal Properties/Qualification Approval Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Questions and Answers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39-40 Recommended Technical Publications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
  3. 3. Surface Mount Tantalum Capacitors Section 1 – TAJ, TAZ, and TPS The AVX series of molded tantalum chips are designed for surface mount applications and are equally suitable for hybrid applications. They are available tape and reel packaged for high volume automatic assembly techniques. + - Ta MnO 2 Carbon Silver Design and Application Features 1. Flat top surface for high speed pick-up — compatible with high speed automatic onsertion equipment. 2. Regular molded shape — allows accurate transfer and placement during onsertion. 3. Glue pads on underside of TAJ/TPS ranges permit consistent, strong bonding to circuit board prior to soldering. 4. Consistent termination dimensions — allows reliable pad design and a consistent “fit” — helps to eliminate “tombstoning” effects and reduces rotational effects. 5. Compliant terminations — transfer of thermomechanical stresses during operation and mechanical stresses during equipment servicing to the component are reduced. 6. Rugged construction helps to prevent damage during mounting and to ensure compatibility with all systems for soldering (infra-red, wave solder, reflow solder, vapor phase) and conductive epoxy resin mounting techniques. 7. Resistant to flux removal solvents including Aqueous systems used with vapor phase soldering. 8. All parts are coded on uppermost surface with videcon-readable polarity marking, cap value, and voltage. 9. High density packaging on 8 and 12 mm blister tape, available on 7" and 13" reels. 10. Qualified to IECQ, CECC and MIL specifications, TAJ/TPS in compliance with EIA standards. 11. New low profile case sizes including the new “R” case compatible with “0805” footprint. Maximum height for low profile is 1.2mm (0.047"). 1
  4. 4. Surface Mount Tantalum Capacitors TAJ Series — Solid Tantalum Chip Capacitors (EIA Standard) The TAJ standard series encompasses the four key sizes recognized by major OEMs throughout the world, together with the high profile E case (7343H size). Available with standard capacitance tolerances of ±10% and ±20%. Operational temperature -55°C to +85°C at rated voltage and up to +125°C with voltage derating in applications utilizing recommended series resistance. TAJ is available in standard and extended ranges. Note on sizes: A, B, C, D - EIA standard EIA-535BAAC E - Extended range (high profile D case, 7343H EIA-535BAAC) For CWR11 ratings see pages 19 - 21. Case Dimensions millimeters (inches) Code EIA Code W+0.2 (0.008) -0.1 (0.004) L± 0.2 (0.008) H+0.2 (0.008) - 0.1 (0.004) W1±0.2 (0.008) A+ 0.3 (0.012) - 0.2 (0.008) S Min. A 3216 1.6 (0.063) 3.2 (0.126) 1.6 (0.063) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043) B 3528 2.8 (0.110) 3.5 (0.138) 1.9 (0.075) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055) C 6032 3.2 (0.126) 6.0 (0.236) 2.6 (0.102) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114) D 7343 4.3 (0.169) 7.3 (0.287) 2.9 (0.114) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) E 7343H 4.3 (0.169) 7.3 (0.287) 4.1 (0.162) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) W1 dimension applies to the termination width for A dimensional area only. How to Order: TAJ C 106 M 025 Type Case Code (See table above) Capacitance Code pF code: 1st two digits represent significant figures, 3rd digit represents multiplier (number of zeros to follow) Tolerance K=±10%, M=±20%, (J=±5%, consult your AVX representative for details) Rated DC Voltage Packaging/Leadframe Finish (Consult page 10 for details) Additional characters may be added for special requirements Technical Data: Capacitance Range: Capacitance Tolerance: Rated Voltage DC (VR ) Category Voltage (VC ) Surge Voltage (VS ) Temperature Range: Environmental Classification: Ϲ+85°C: +125°C: Ϲ+85°C: +125°C: All technical data relate to an ambient temperature of +25°C 0.1 µF to 330 µF ±20%; ±10% 4 6.3 10 16 20 25 35 50 2.7 4 7 10 13 17 23 33 5.2 8 13 20 26 32 46 65 3.2 5 8 12 16 20 28 40 -55°C to +125°C 55/125/56 (IEC 68-2) 2 R **
  5. 5. Surface Mount Tantalum Capacitors TAJ Series — Solid Tantalum Chip Capacitors (EIA Standard) Standard Range (EIA sizes). See below for extended range. Capacitance Range (letter denotes case code) Capacitance µF Code 4V 6.3V 0.1 104 0.15 154 0.22 224 0.33 334 0.47 474 0.68 684 1.0 105 1.5 155 2.2 225 A 3.3 335 A 4.7 475 A A 6.8 685 A A/B 10 106 A A/B 15 156 B B 22 226 B/C 33 336 C 47 476 C/D 68 686 C/D 100 107 D 150 157 220 227 330 337 E E 10V Rated voltage DC (VR ) at 85°C 16V 20V A A A A/B B B C C C/D D D E 35V A A A A A/B A/B B B/C B/C C C/D D D D E 50V A A/B A/B B C C C D D D D D 35V 50V A A A A A/B A/B B B/C B/C C C/D D D D E A A A A/B A/B B/C B/C C C/D D D D E E A A A A/B A/B B/C B/C C C/D D D 25V C E Extended Range/Developmental Range Capacitance Range (letter denotes case code) Capacitance µF Code 4V 6.3V 0.1 104 0.15 154 0.22 224 0.33 0.47 0.68 105 155 225 3.3 4.7 6.8 Rated voltage DC (VR ) at 85°C 16V 20V 335 475 685 25V 334 474 684 1.0 1.5 2.2 10V A A A 10 15 22 106 156 226 A A A A A A B 33 47 68 336 476 686 A/B B C B B B B B/C 100 150 220 107 157 227 B/C C/D C D C/D C D D 330 470 680 337 477 687 E E E D D E 1000 108 E A B B B B C C C C D D D E D E B B C E Ratings outside this matrix may be available upon request. 3 B B C E C D E
  6. 6. Surface Mount Tantalum Capacitors TAJ Series — Low Profile Solid Tantalum Chip Capacitors (EIA Standard) Three additional case sizes are available in the TAJ range offering ultra low profile solid tantalum chip capacitors. Designed for applications where maximum height of components above or below board are of prime consideration, this height of 1.2mm equates to that of a standard integrated circuit package after mounting. Also available is the ultra compact 0805 equivalent in a fully molded package. The S&T footprints are identical to the A&B case size parts. Case Dimensions millimeters (inches—Metric Dimensions Govern) Code EIA Code W+0.2 (0.008) - 0.1 (0.004) L±0.2 (0.008) H max. W1±0.1 (0.004) A+ 0.3 (0.012) - 0.1 (.004) S Min. 2.05 (0.08) 1.2 (0.047) 1.2 (0.047) 0.5 (0.020) 0.85 (0.033) 0805 Equivalent R 2012 1.3 (0.05) Low Profile Versions of A & B Case S 3216L 1.6 (0.06) 3.2 (0.12) 1.2 (0.047) 1.2 (0.047) 0.8 (0.031) 1.1 (0.043) T 3528L 2.8 (0.11) 3.5 (0.14) 1.2 (0.047) 2.2 (0.087) 0.8 (0.031) 1.4 (0.055) W1 dimension applies to the termination width for A dimensional area only. Pad Stand-off is 0.1±0.1. Capacitance and Voltage Range*/Developmental Range Capacitance µF Code 2V 4V 0.1 104 0.15 154 0.22 224 0.33 0.47 0.68 334 474 684 1.0 1.5 2.2 105 155 225 3.3 4.7 6.8 335 475 685 106 Rated voltage DC (VR ) at 85°C 6.3V 10V 10 16V 20V R/S R/S R/S R/S R/S R/S R/S R R R/S R/S S/T R/S S/T T S T R/S R/S R/S/T R/S R/S S R/S/T S T S/T T T S T T T *Letter denotes case code. Note: Ratings outside this matrix may be available upon special request. Marking: TAJ Series A, B, R, S and T Case: 1. Voltage Code (see table) 2. Capacitance in µF 3. Date Code For TAJ, the positive end of body has videcon readable polarity bar marking, with the AVX logo “A” as shown in the diagram. Bodies are marked by indelible laser marking on top surface with capacitance value, voltage and date of manufacture. Due to the small size of the A, B, R, S and T cases, a voltage code is used as shown below: Voltage Code A, B, S and T Cases G J A C D E V T C, D and E Case: 1. Capacitance in µF 2. Rated Voltage at 85°C 3. Date Code Rated Voltage at 85°C 4 6.3 10 16 20 25 35 50 Polarity bar indicates anode (+) termination 4
  7. 7. Surface Mount Tantalum Capacitors TAJ Series — Solid Tantalum Chip Capacitors Ratings and Part Number Reference AVX Part No. Case Size Capacitance µF DCL (µA) Max. DF % Max. AVX Part No. ESR max. (⍀) @ 100 kHz A A A A B A B B C C D E 4.7 6.8 10 15 15 22 33 47 68 100 220 330 0.5 0.5 0.5 0.6 0.6 0.9 1.4 1.9 2.7 4.0 8.8 13.2 6 6 6 6 6 6 6 6 6 6 8 8 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 8 8 TAJA155(*)010 TAJA225(*)010 TAJA335(*)010 TAJA475(*)010 TAJB475(*)010 TAJA685(*)010 TAJB685(*)010 TAJA106(*)010 TAJB106(*)010 TAJC106(*)010 TAJB156(*)010 TAJC156(*)010 TAJB226(*)010 TAJC226(*)010 TAJC336(*)010 TAJD336(*)010 TAJC476(*)010 TAJD476(*)010 TAJD686(*)010 TAJD107(*)010 TAJD157(*)010 TAJE157(*)010 TAJE227(*)010 7.5 6.5 6.0 4.0 3.0 3.5 2.8 2.4 1.6 1.3 0.9 0.9 9.0 7.0 6.0 5.0 4.0 4.0 3.0 3.5 2.5 2.5 2.0 2.2 1.8 2.0 1.6 1.1 1.6 0.9 0.9 0.9 0.9 0.9 0.9 6.3 volt @ 85°C (4 volt @ 125°C) TAJA225(*)006 TAJA335(*)006 TAJA475(*)006 TAJA685(*)006 TAJB685(*)006 TAJA106(*)006 TAJB106(*)006 TAJA156(*)006 TAJB156(*)006 TAJB226(*)006 TAJC226(*)006 TAJB336(*)006 TAJC336(*)006 TAJB476(*)006 TAJC476(*)006 TAJD476(*)006 TAJC686(*)006 TAJD686(*)006 TAJC107(*)006 TAJD107(*)006 TAJD157(*)006 TAJD227(*)006 TAJE337(*)006 A A A A B A B A B B C B C B C D C D C D D D E 2.2 3.3 4.7 6.8 6.8 10 10 15 15 22 22 33 33 47 47 47 68 68 100 100 150 220 330 0.5 0.5 0.5 0.5 0.5 0.6 0.6 1.0 1.0 1.4 1.4 2.1 2.1 3.0 3.0 3.0 4.3 4.3 6.3 6.3 9.0 13.2 19.8 Capacitance µF DCL (µA) Max. DF % Max. ESR max. (⍀) @ 100 kHz 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 8 6 8 10.0 7.0 5.5 5.0 4.0 4.0 3.0 3.0 2.5 2.5 2.8 2.0 2.4 1.8 1.6 1.1 1.2 0.9 0.9 0.9 0.9 0.9 0.9 4 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 11.0 8.0 6.5 5.5 5.0 4.5 4.0 3.5 2.5 2.5 2.8 2.0 2.5 1.8 1.6 1.1 1.5 0.9 0.9 0.9 0.9 0.9 10 volt @ 85°C (6.3 volt @ 125°C) 4 volt @ 85°C (2.5 volt @ 125°C) TAJA475(*)004 TAJA685(*)004 TAJA106(*)004 TAJA156(*)004 TAJB156(*)004 TAJA226(*)004 TAJB336(*)004 TAJB476(*)004 TAJC686(*)004 TAJC107(*)004 TAJD227(*)004 TAJE337(*)004 Case Size A A A A B A B A B C B C B C C D C D D D D E E 1.5 2.2 3.3 4.7 4.7 6.8 6.8 10 10 10 15 15 22 22 33 33 47 47 68 100 150 150 220 0.5 0.5 0.5 0.5 0.5 0.7 0.7 1.0 1.0 1.0 1.6 1.5 2.2 2.2 3.3 3.3 4.7 4.7 6.8 10.0 15.0 15.0 22.0 16 volt @ 85°C (10 volt @ 125°C) TAJA105(*)016 TAJA155(*)016 TAJA225(*)016 TAJB225(*)016 TAJA335(*)016 TAJB335(*)016 TAJA475(*)016 TAJB475(*)016 TAJB685(*)016 TAJC685(*)016 TAJB106(*)016 TAJC106(*)016 TAJB156(*)016 TAJC156(*)016 TAJC226(*)016 TAJD226(*)016 TAJC336(*)016 TAJD336(*)016 TAJD476(*)016 TAJD686(*)016 TAJD107(*)016 TAJE107(*)016 A A A B A B A B B C B C B C C D C D D D D E 1.0 1.5 2.2 2.2 3.3 3.3 4.7 4.7 6.8 6.8 10 10 15 15 22 22 33 33 47 68 100 100 0.5 0.5 0.5 0.5 0.5 0.5 0.8 0.8 1.1 1.1 1.6 1.6 2.4 2.4 3.5 3.5 5.3 5.3 7.5 10.8 16.0 16.0 For 10% tolerance, insert ‘K’ in (*) above. For 20% tolerance, insert ‘M’ in (*) above. (K tolerance may be supplied in lieu of M tolerance.) NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards. 5
  8. 8. Surface Mount Tantalum Capacitors TAJ Series — Solid Tantalum Chip Capacitors Ratings and Part Number Reference (cont’d) AVX Part No. Case Size Capacitance µF DCL (µA) Max. DF % Max. 4 4 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 12.0 9.0 6.5 5.3 3.5 4.5 3.0 4.0 3.0 2.8 2.5 2.0 2.1 1.9 1.7 1.1 1.6 0.9 0.9 0.9 0.9 4 4 4 6 6 6 6 6 6 6 6 6 6 6 6 AVX Part No. ESR max. (⍀) @ 100 kHz A A A A B A B A B C B C B C C D C D D D E 0.68 1.0 1.5 2.2 2.2 3.3 3.3 4.7 4.7 4.7 6.8 6.8 10 10 15 15 22 22 33 47 68 0.5 0.5 0.5 0.5 0.5 0.7 0.7 1.0 1.0 1.0 1.4 1.4 2.0 2.0 3.0 3.0 4.4 4.4 6.6 9.4 13.6 14.0 10.0 8.0 7.5 5.0 4.5 3.5 2.8 2.4 2.0 1.8 1.2 1.0 0.9 0.9 TAJA104(*)035 TAJA154(*)035 TAJA224(*)035 TAJA334(*)035 TAJA474(*)035 TAJB474(*)035 TAJA684(*)035 TAJB684(*)035 TAJA105(*)035 TAJB105(*)035 TAJB155(*)035 TAJC155(*)035 TAJB225(*)035 TAJC225(*)035 TAJB335(*)035 TAJC335(*)035 TAJC475(*)035 TAJD475(*)035 TAJC685(*)035 TAJD685(*)035 TAJD106(*)035 TAJD156(*)035 TAJE226(*)035 25 volt @ 85°C (16 volt @ 125°C) TAJA474(*)025 TAJA684(*)025 TAJA105(*)025 TAJA155(*)025 TAJB155(*)025 TAJB225(*)025 TAJB335(*)025 TAJB475(*)025 TAJC475(*)025 TAJC685(*)025 TAJC106(*)025 TAJD106(*)025 TAJD156(*)025 TAJD226(*)025 TAJE336(*)025 A A A A B B B B C C C D D D E 0.47 0.68 1.0 1.5 1.5 2.2 3.3 4.7 4.7 6.8 10 10 15 22 33 0.5 0.5 0.5 0.5 0.5 0.6 0.8 1.2 1.2 1.7 2.5 2.5 3.8 5.5 8.3 Capacitance µF DCL (µA) Max. DF % Max. ESR max. (⍀) @ 100 kHz 4 4 4 4 4 4 4 4 4 4 6 6 6 6 6 6 6 6 6 6 6 6 6 24.0 21.0 18.0 15.0 12.0 10.0 8.0 8.0 7.5 6.5 5.2 4.5 4.2 3.5 3.5 2.5 2.2 1.5 1.8 1.3 1.0 0.9 0.9 4 4 4 4 4 4 4 4 4 6 6 6 6 6 6 8 22.0 15.0 17.0 18.0 14.0 12.0 8.0 7.0 5.5 5.0 4.0 2.5 2.0 1.4 1.0 1.0 35 volt @ 85°C (23 volt @ 125°C) 20 volt @ 85°C (13 volt @ 125°C) TAJA684(*)020 TAJA105(*)020 TAJA155(*)020 TAJA225(*)020 TAJB225(*)020 TAJA335(*)020 TAJB335(*)020 TAJA475(*)020 TAJB475(*)020 TAJC475(*)020 TAJB685(*)020 TAJC685(*)020 TAJB106(*)020 TAJC106(*)020 TAJC156(*)020 TAJD156(*)020 TAJC226(*)020 TAJD226(*)020 TAJD336(*)020 TAJD476(*)020 TAJE686(*)020 Case Size A A A A A B A B A B B C B C B C C D C D D D E 0.1 0.15 0.22 0.33 0.47 0.47 0.68 0.68 1.0 1.0 1.5 1.5 2.2 2.2 3.3 3.3 4.7 4.7 6.8 6.8 10 15 22 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.8 0.8 1.2 1.2 1.6 1.6 2.4 2.4 3.5 5.3 7.7 50 volt @ 85°C (33 volt @ 125°C) TAJA104(*)050 TAJA154(*)050 TAJB154(*)050 TAJA224(*)050 TAJB224(*)050 TAJB334(*)050 TAJC474(*)050 TAJC684(*)050 TAJC105(*)050 TAJC155(*)050 TAJD155(*)050 TAJD225(*)050 TAJD335(*)050 TAJD475(*)050 TAJD685(*)050 TAJE106(*)050 For parametric information on development codes, please contact your local AVX sales office. A A B A B B C C C C D D D D D E 0.1 0.15 0.15 0.22 0.22 0.33 0.47 0.68 1.0 1.5 1.5 2.2 3.3 4.7 6.8 10 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.8 0.8 1.1 1.7 2.4 3.4 5.0 All technical data relates to an ambient temperature of +25°C measured at 120 Hz, 0.5V RMS unless otherwise stated. *Insert J for ± 5% tolerance, K for ± 10% and M for ±20%. NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards. 6
  9. 9. Surface Mount Tantalum Capacitors TAJ Low Profile Series — Solid Tantalum Chip Capacitors Ratings and Part Number Reference (cont’d) AVX Part No. Case Size Capacitance µF DCL (µA) Max. DF % Max. ESR max. (⍀) @ 100 kHz AVX Part No. 2 volt TAJR475(*)002 TAJR685(*)002 TAJS106(*)002 4.7 6.8 10 0.5 0.5 0.5 6 6 6 20.0 20.0 20.0 R S R S R S S T T 2.2 2.2 3.3 3.3 4.7 4.7 6.8 6.8 10 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.6 6 6 6 6 6 6 6 6 6 25.0 25.0 20.0 18.0 12.0 10.0 8.0 6.0 5.0 R S R S R S S T T 1.5 1.5 2.2 2.2 3.3 3.3 4.7 4.7 6.8 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 6 6 6 6 6 6 6 6 6 25.0 25.0 20.0 18.0 12.0 9.0 7.5 6.0 5.0 R S R S T S T T 1.0 1.0 1.5 2.2 3.3 4.7 4.7 10 0.5 0.5 0.5 0.5 0.5 0.5 0.5 1.0 4 4 6 6 6 6 6 6 25.0 25.0 20.0 12.0 6.0 8.0 5.0 3.0 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 4 4 4 4 4 6 6 6 25.0 25.0 20.0 15.0 5.0 12.0 6.5 5.0 TAJR104(*)020 TAJS104(*)020 TAJR154(*)020 TAJS154(*)020 TAJR224(*)020 TAJS224(*)020 TAJR334(*)020 TAJS334(*)020 TAJR474(*)020 TAJS474(*)020 TAJR684(*)020 TAJS684(*)020 TAJT684(*)020 TAJS105(*)020 TAJT105(*)020 TAJT155(*)020 TAJT225(*)020 6.3 volt TAJR155(*)006 TAJS155(*)006 TAJR225(*)006 TAJS225(*)006 TAJR335(*)006 TAJS335(*)006 TAJS475(*)006 TAJT475(*)006 TAJT685(*)006 DF % Max. ESR max. (⍀) @ 100 kHz R S R S R S R S R S R S T S T T T 0.1 0.1 0.15 0.15 0.22 0.22 0.33 0.33 0.47 0.47 0.68 0.68 0.68 1.0 1.0 1.5 2.2 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 7.7 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 6 6 25.0 25.0 25.0 25.0 25.0 25.0 25.0 25.0 25.0 25.0 25.0 15.0 15.0 12.0 9.0 6.5 6.0 *Insert J for ± 5% tolerance, K for ± 10% and M for ±20%. NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards. 16 volts TAJR684(*)016 TAJS684(*)016 TAJR105(*)016 TAJS105(*)016 TAJT105(*)016 TAJS155(*)016 TAJT225(*)016 TAJT335(*)016 DCL (µA) Max. All technical data relates to an ambient temperature of +25°C measured at 120 Hz, 0.5V RMS unless otherwise stated. 10 volts TAJR105(*)010 TAJS105(*)010 TAJR155(*)010 TAJS225(*)010 TAJT335(*)010 TAJS475(*)010 TAJT475(*)010 TAJT106(*)010 Capacitance µF 20 volts R R S 4 volt TAJR225(*)004 TAJS225(*)004 TAJR335(*)004 TAJS335(*)004 TAJR475(*)004 TAJS475(*)004 TAJS685(*)004 TAJT685(*)004 TAJT106(*)004 Case Size R S R S T S T T 0.68 0.68 1.0 1.0 1.0 1.5 2.2 3.3 For parametric information on development codes, please contact your local AVX sales office. 7
  10. 10. Surface Mount Tantalum Capacitors TPS Series — Tantalum Low ESR Capacitors The TPS (Tantalum for Power Supplies) surface mount products have inherently low ESR (equivalent series resistance) and is capable of higher ripple current, handling, producing lower ripple voltages, less power and heat dissipation than standard product for the most efficient use of circuit power. TPS has been designed, manufactured, and preconditioned for optimum performance in typical power supply environments. By combining the latest improvements in tantalum powder technology, improved manufacturing processes, and application specific preconditioning tests, AVX is able to provide a technologically superior alternative to standard molded or conformal coated tantalum capacitors. Dimensions millimeters (inches) Code EIA Code C L±0.2 (0.008) W+0.2 (0.008) -0.1 (0.004) 6032 6.0 (0.236) 3.2 (0.126) H±0.2 (0.008) -0.2 (0.008) W1±0.2 (0.008) A+0.3 (0.012) -0.2 (0.008) S Min. 2.6 (0.102) 2.2 (0.087) 1.3 (0.051) 2.9 (0.114) D 7343 7.3 (0.287) 4.3 (0.169) 2.9 (0.114) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) E 7343H 7.3 (0.287) 4.3 (0.169) 4.1 (0.162) 2.4 (0.094) 1.3 (0.051) 4.4 (0.173) 7.0 (0.275) 6.0 (0.236) 3.6 (0.140) 3.1 (0.120) 1.4 (0.055) 3.4 (0.133) V W1 dimension applies to the termination width for A dimensional area only. Pad Stand-off is 0.1±0.1. How to Order: TPS D 107 M 010 R Technical Data: 0100 Series Maximum ESR in Milliohms Case Size Capacitance in Picofarads Tape and Reel Size R = 7" (180mm) S = 13" (330mm) Voltage Tolerance K= ±10%, M= ±20% Capacitance Range: Capacitance Tolerance: Rated Voltage DC (VR ) Ϲ+85°C: Category Voltage (VC ) Ϲ+125°C: Surge Voltage (VS) Ϲ+85°C: Ϲ+125°C: Temperature Range: Environmental Classification: All technical data relate to an ambient temperature of +25°C 10 µF to 470 µF ±20%; ±10% 6.3 10 16 20 25 35 4 7 10 13 17 23 8 13 20 26 32 46 5 8 12 16 20 28 -55°C to +125°C 55/125/56 (IEC 68-2) TPS Case Size (ESR) Matrix/Developmental Range Capacitance, µF 6.3V 4.7 6.8 10 15 22 33 47 68 100 C(150mΩ) 150 220 D(100mΩ) 330 E(100mΩ) 470 (Milliohms) 10V 16V V(100mΩ) V(55mΩ) 20V 25V 35V C(600mΩ) C(500mΩ) C(450mΩ) C(375mΩ) C(375mΩ) C(350mΩ) D(100mΩ) D(80mΩ) D(65mΩ) D(100mΩ) E(100mΩ) D(200mΩ) D(200mΩ) E(200mΩ) D(150mΩ) E(125mΩ) D(125mΩ) V(150mΩ) V(75mΩ) V(100mΩ) V(60mΩ) 8 E(150mΩ) V(200mΩ) V(85mΩ) V(150mΩ) D(300mΩ) E(300mΩ)
  11. 11. Surface Mount Tantalum Capacitors TPS Series — Tantalum Low ESR Capacitors For full details of TPS Series and comprehensive application notes, please reference “AVX TPS Catalog” available from your local AVX sales office. Ratings and Part Number Reference AVX Part No. Case Size Capacitance (µF) Rated Voltage DCL max (µA) Max. DF (%) Max. ESR max (mΩ) @ 100 kHz TPSC475*035R0600 TPSC106*025R0500 TPSC156*020R0450 TPSC226*016R0375 TPSC336*010R0375 TPSC476*010R0350 TPSC107*006R0150 TPSD156*035R0300 TPSD226*025R0200 TPSD336*020R0200 TPSD476*016R0150 TPSD107*016R0125 TPSD107*010R0100 TPSD107*010R0080 TPSD107*010R0065 TPSD157*010R0100 TPSD227*006R0100 TPSE226*035R0300 TPSE336*025R0200 TPSE686*020R0150 TPSE107*016R0125 TPSE227*010R0100 TPSE337*006R0100 C C C C C C C D D D D D D D D D D E E E E E E 4.7 10 15 22 33 47 100 15 22 33 47 100 100 100 100 150 220 22 33 68 100 220 330 35 25 20 16 10 10 6.3 35 25 20 16 16 10 10 10 10 6.3 35 25 20 16 10 6.3 1.6 2.5 3.0 3.5 3.3 4.7 6.0 5.3 5.5 6.6 7.5 16.0 10.0 10.0 10.0 15.0 13.2 7.7 8.3 13.6 16.0 22.0 19.8 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 8 6 6 6 6 8 8 100 kHz RIPPLE CURRENT (mA) Ratings 600 500 450 375 375 350 150 300 200 200 150 125 100 80 65 100 100 300 200 150 125 100 100 25ЊC 85ЊC 125ЊC 428 469 494 542 542 561 856 707 866 866 1000 1095 1225 1369 1519 1225 1225 742 908 1048 1149 1285 1285 383 420 442 485 485 502 766 632 775 775 895 980 1095 1225 1359 1095 1095 663 812 938 1027 1149 1149 171 188 198 217 217 224 343 283 346 346 400 438 490 547 608 490 490 297 363 420 459 514 514 For 10% tolerance, insert ‘K’ in (*) above. For 20% tolerance, insert ‘M’ in (*) above. NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards. Standard ESR Level: Ripple Ratings AVX Part Number Case Size Cap (µF) Rated Voltage DCL max (µA) DF (%) ESR max (mΩ) TPSV477*006R0100 TPSV337*010R0100 TPSV227*016R0150 TPSV107*020R0200 TPSV686*025R0150 V V V V V 470 330 220 100 68 6.3 10 16 20 25 28.2 33.0 35.2 20.0 17.0 10 10 10 10 10 100 100 150 200 150 100 kHz RIPPLE CURRENT (mA) 25ЊC 85ЊC 125ЊC 1581 1581 1291 1118 1291 1414 1414 1155 1000 1155 633 633 517 447 517 Level II ESR: Ripple Ratings AVX Part Number Case Size Cap (µF) Rated Voltage DCL max (µA) DF (%) ESR max (mΩ) TPSV477*006R0055 TPSV337*010R0060 TPSV227*016R0075 TPSV107*020R0085 V V V V 470 330 220 100 6.3 10 16 20 28.2 33.0 35.2 20.0 10 10 10 10 55 60 75 85 100 kHz RIPPLE CURRENT (mA) 25ЊC 85ЊC 125ЊC 2132 2041 1826 1715 1907 1826 1633 1534 (Ripple based on ESR Levels as supplied; allow 25% increase post PCB assembly) For 10% tolerance, insert ‘K’ in (*) above. For 20% tolerance, insert ‘M’ in (*) above. NOTE: Voltage ratings are minimum values. We reserve the right to supply higher voltage ratings in the same case size, to the same reliability standards. 9 853 817 730 686
  12. 12. Surface Mount Tantalum Capacitors Tape and Reel Packaging Solid Tantalum Chip TAJ and TPS Tape and reel packaging for automatic component placement. Millimeters (inches) Please enter required Suffix on order. Bulk product is not available. TAJ and TPS Taping Suffix Table Case Size Tape width reference mm A 8 P mm 4 180mm (7") reel Suffix Qty. R/A 330mm (13") reel Suffix Qty. 2000 S/B Total Tape Thickness — K max TAJ/TPS 8000 B 8 4 R/A 2000 S/B 12 8 R/A 500 S/B 3000 D 12 8 R/A 500 S/B 2500 E 12 8 R/A 400 S/B 1500 V 12 8 R/A 400 S/B 1500 R 8 4 R/A 2500 S/B 10000 S 8 4 R/A 2500 S/B 10000 T 8 4 R/A 2500 S/B Dims A B C D E R S T 8000 C Case size reference 2.3 (0.090) 2.6 (0.102) 3.3 (0.130) 3.6 (0.142) 4.8 (0.189) 1.9 (0.075) 1.9 (0.075) 1.9 (0.075) 10000 NOTE: TPS available as solder termination (R & S) only. R - Solder Termination A - Gold Termination, S - Solder Termination B - Gold Termination Code P* 8mm Tape 4±0.1 or 8±0.1 Tape Specification 12mm Tape (0.157±0.004) Tape dimensions comply to EIA RS 481 A (0.315±0.004) (0.157±0.004) 4±0.1 or (0.315±0.004) 8±0.1 Dimensions A0 and B0 of the pocket and the tape thickness, K, are dependent on the component size. G 1.75 min (0.03 min) 1.75 min (0.03 min) F 3.5±0.05 (0.138±0.002) 5.5±0.05 (0.22±0.002) E 1.75±0.1 (0.069±0.004) 1.75±0.1 (0.069±0.004) W 8±0.3 (0.315±0.012) 12±0.3 (0.472±0.012) P2 2±0.05 (0.079±0.002) 2±0.05 (0.079±0.002) P0 4±0.1 (0.157±0.004) 4±0.1 (0.157±0.004) D 1.5±0.1 -0 (0.059±0.004) 1.5±0.1 (-0) -0 (0.059±0.004) (-0) D1 1.0 min (0.039 min) 1.5 min Tape materials do not affect component solderability during storage. (0.059 min) Carrier Tape Thickness <0.4mm *See taping suffix tables for actual P dimension (component pitch). Plastic Tape Reel Dimensions ᭢ ᭡ D ± 2.0 ᭡ 70 ± 2.0 Standard dimensions mm A: 9.5mm (8mm tape) 13.0mm (12mm tape) ᭢ Cover Tape Dimensions Thickness: 75±25µ Width of tape: 5.5mm + 0.2mm (8mm tape) 9.5mm + 0.2mm (12mm tape) ᭢ ᭢ ᭢ ᭢ 2 ± 0.5 A ± 1.0 ᭢ 13±0.5 21 ± 1.0 ᭡ 10
  13. 13. Surface Mount Tantalum Capacitors TAZ Series Microminiature Surface Mount Technology Solid Tantalum Chip Capacitors The TAZ molded surface mount series is designed for use in applications utilizing either solder, conductive adhesive or thermal compression bonding techniques. Case sizes (A through H) are compatible with CWR06 pad layouts and are qualified as the CWR09 style. The two styles are interchangeable per MIL-C55365/4. Each chip is marked with polarity, capacitance code and rated voltage. There are three termination finishes available: fused solder plated (standard) (“K” per MIL-C-55365), hot solder dipped (“C”) and gold plated (“B”). In addition, the molding compound has been selected to meet the flammability requirements of UL94V-O and outgassing requirements of NASA SP-R-0022A. Case Dimensions millimeters (inches) Case Code Width W±.38 (0.015) Length L±.38 (0.015) Height H±.38 (0.015) Term. Width W1 Term. Length A+.13 (0.005) “S” Min A 1.27 (0.050) 2.54 (0.100) 1.27 (0.050) 1.27±0.13 (.050±.005) .76 (0.030) .38 (0.015) B 1.27 (0.050) 3.81 (0.150) 1.27 (0.050) 1.27±0.13 (.050±.005) .76 (0.030) 1.65 (0.065) D 2.54 (0.100) 3.81 (0.150) 1.27 (0.050) 2.41+0.13/-0.25 (.095+.005/-.010) .76 (0.030) 1.65 (0.065) E 2.54 (0.100) 5.08 (0.200) 1.27 (0.050) 2.41+0.13/-0.25 (.095+.005/-.010) .76 (0.030) 2.92 (0.115) F 3.43 (0.135) 5.59 (0.220) 1.78 (0.070) 3.30±0.13 (.130±.005) .76 (0.030) 3.43 (0.135) G 2.79 (0.110) 6.73 (0.265) 2.79 (0.110) 2.67±0.13 (.105±.005) 1.27 (0.050) 0.140 (3.56) H 3.81 (0.150) 7.24 (0.285) 2.79 (0.110) 3.68+.013/-0.51 (.145+.005/-.020) 1.27 (0.050) 4.06 (0.160) “Regular” NOTE: For solder coated terminations add 0.38 (0.015) max. to length and height dimensions. Additional special case sizes are available. Contact AVX for details. 11
  14. 14. Surface Mount Tantalum Capacitors TAZ Series How to Order: (professional grade) TAZ D 335 M 015 C R SZ* 0000* Type Case Code (See table on page 11) Capacitance Code pF code: 1st two digits represent significant figures, 3rd digit represents multiplier (number of zeros to follow) Tolerance (J=±5%, K=±10%, M=±20%) Rated DC Voltage Lead Configuration (C = Chip, X = Extended Range) Packaging (Consult pages 22-23 for details) Manufacturing Routing and Failure Rate* S = Standard, Z = Not applicable Termination Finish* 0000 = Fuse solder plated, 0800 = Hot solder dipped, 0900 = Gold plated* *Not applicable to European orders (other endings are assigned by the factory for special customer requirements) Technical Data: Capacitance Range: Capacitance Tolerance: Rated Voltage DC (VR ) Category Voltage (VC ) Surge Voltage (VS ) Operating Temperature Range: Ϲ+85°C: Ϲ+125°C: Ϲ+85°C: Ϲ+125°C: All technical data relate to an ambient temperature of +25°C 0.1 µF to 330 µF ±20%; ±10%; ±5% 4 6 10 15 20 25 35 50 2.7 4 7 10 13 17 23 33 5.2 8 13 20 26 32 46 65 3.2 5 8 12 16 20 28 40 -55°C to +125°C Marking Typical Lead Frame Material Thicknesses The positive end of body has videcon readable polarity bar marking along with the capacitance code and rated work voltage: Lead Frame: Alloy 194 Thickness: .005±.0002" 0000 - Fused Solder Plate: (60/40) 60-135 microinches nickel 300±75 microinches fused solder 0900 - Gold Plated: 35-100 microinches nickel 50-75 microinches gold 0800 - Hot Solder Dipped: (60/40) 50-100 microinches nickel Min. 60 microinches solder • Polarity Stripe (+) • Capacitance Code • Voltage Rating The electrical and mechanical parameters shown on the TAZ series are general. For specific circuit applications, special screening is available. Please contact AVX if you have special electrical or mechanical requirements. 12
  15. 15. Surface Mount Tantalum Capacitors TAZ Series Standard Range Series Capacitance and Voltage Range (letter denotes case code) Capacitance Rated voltage DC (VR ) at 85°C µF Code 4V 6V 10V 15V 20V 0.1 0.15 0.22 0.33 0.47 0.68 1.0 1.5 2.2 105 155 225 3.3 4.7 6.8 335 475 685 35V 50V A 334 474 684 25V 104 154 224 A A B A A B A A B A B D E 33 47 68 336 476 686 F G 100 107 D E D E D 106 156 226 D E D B B 10 15 22 B B A E F G F E B B F D D E E F F F G H G H H F F G G H G H G H G H H NOTE: TAZ Standard Range ratings are also available as CWR09 Military parts, see pages 16-18. Extended Range Series Capacitance and Voltage Range (letter denotes case code) Capacitance Rated voltage DC (VR ) at 85°C µF Code 4V 6V 10V 15V 20V 0.68 684 A 1.0 105 A A 1.5 155 A B 2.2 3.3 4.7 225 335 475 A A A A A B 6.8 10 15 685 106 156 A B B B B D B/D D E D E 22 33 47 226 336 476 D D/E F E E E F G F G H 68 100 150 686 107 157 F G G H H H H 220 330 227 337 H F G H Not available as CWR09 Military. Contact AVX for electrical limits. 13 B D 25V 35V B B D E D E E F H F H
  16. 16. Surface Mount Tantalum Capacitors TAZ Series Ratings and Part Number Reference (Standard Range and Special Case Sizes Only) AVX Part No. Case Size Capacitance µF DCL (µA) Max. DF % Max. AVX Part No. ESR max. (⍀) @ 100 kHz A B D E R F H 2.2 4.7 10.0 15.0 33.0 68.0 100.0 1.0 1.0 1.0 1.0 2.0 3.0 4.0 6 6 6 8 8 10 10 1.0 1.0 1.0 1.0 2.0 3.0 4.0 6 6 6 6 8 10 10 12.0 12.0 12.0 6.0 4.0 2.0 2.0 6 6 6 6 6 10 10 18.0 12.0 10.0 4.0 3.0 3.0 2.0 6 6 6 6 6 8 8 22.0 15.0 10.0 6.0 5.0 3.0 2.0 6 6 6 6 6 6 6 6 TAZA334(‡)025C* TAZB684(‡)025C* TAZD155(‡)025C* TAZE225(‡)025C* TAZF475(‡)025C* TAZG685(‡)025C* TAZG106(‡)025C* TAZH156(‡)025C* 20.0 10.0 10.0 5.0 4.0 2.0 1.0 20.0 15.0 15.0 10.0 8.0 5.0 3.0 2.0 6 volt @ 85°C (4 volt @ 125°C) TAZA155(‡)006C* TAZB335(‡)006C* TAZD685(‡)006C* TAZE106(‡)006C* TAZF226(‡)006C* TAZG476(‡)006C* TAZH686(‡)006C* A B D E F G H 1.5 3.3 6.8 10.0 22.0 47.0 68.0 A B D E F G H 1.0 2.2 4.7 6.8 15.0 33.0 47.0 1.0 1.0 1.0 1.0 2.0 3.0 5.0 A B D E F G H 0.68 1.5 3.3 4.7 10.0 22.0 33.0 1.0 1.0 1.0 1.0 2.0 4.0 5.0 TAZA104(‡)050C* TAZA154(‡)050C* TAZB224(‡)050C* TAZB334(‡)050C* TAZD684(‡)050C* TAZE105(‡)050C* TAZF155(‡)050C* TAZF225(‡)050C* TAZG335(‡)050C* TAZH475(‡)050C* A B B D E F G H 0.47 0.68 1.0 2.2 3.3 6.8 15.0 22.0 1.0 1.0 1.0 1.0 1.0 2.0 3.0 4.0 ESR max. (⍀) @ 100 kHz A B D E F G G H 0.33 0.68 1.5 2.2 4.7 6.8 10.0 15.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 4.0 6 6 6 6 6 6 6 6 25.0 15.0 10.0 8.0 6.0 4.0 3.0 2.0 A B D E F G H 0.22 0.47 1.0 1.5 3.3 4.7 6.8 1.0 1.0 1.0 1.0 1.0 2.0 3.0 6 6 6 6 6 6 6 25.0 20.0 12.0 6.0 6.0 3.0 3.0 A A B B D E F F G H 0.10 0.15 0.22 0.33 0.68 1.0 1.5 2.2 3.3 4.7 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 6 6 6 6 6 6 6 6 6 6 30.0 30.0 25.0 25.0 20.0 12.0 10.0 6.0 4.0 2.0 ‡ Insert J for ± 5% tolerance, K for ± 10%, M for ±20% * Insert letter for packing option. See ordering information on pages 22-23. All technical data relates to an ambient temperature of +25°C. Capacitance and DF are measured at 120Hz 0.5V RMS with a maximum DC bias of 2.2 volts. DCL is measured at rated voltage after 5 minutes . For any special electrical requirements, please contact factory. 20 volt @ 85°C (13 volt @ 125°C) TAZA474(‡)020C* TAZB684(‡)020C* TAZB105(‡)020C* TAZD225(‡)020C* TAZE335(‡)020C* TAZF685(‡)020C* TAZG156(‡)020C* TAZH226(‡)020C* DF % Max. 50 volt @ 85°C (33 volt @ 125°C) 15 volt @ 85°C (10 volt @ 125°C) TAZA684(‡)015C* TAZB155(‡)015C* TAZD335(‡)015C* TAZE475(‡)015C* TAZF106(‡)015C* TAZG226(‡)015C* TAZH336(‡)015C* DCL (µA) Max. 35 volt @ 85°C (23 volt @ 125°C) TAZA224(‡)035C* TAZB474(‡)035C* TAZD105(‡)035C* TAZE155(‡)035C* TAZF335(‡)035C* TAZG475(‡)035C* TAZH685(‡)035C* 10 volt @ 85°C (6.3 volt @ 125°C) TAZA105(‡)010C* TAZB225(‡)010C* TAZD475(‡)010C* TAZE685(‡)010C* TAZF156(‡)010C* TAZG336(‡)010C* TAZH476(‡)010C* Capacitance µF 25 volt@ 85°C (16 volt @ 125°C) 4 volt @ 85°C (2.5 volt @ 125°C) TAZA225(‡)004C* TAZB475(‡)004C* TAZD106(‡)004C* TAZE156(‡)004C* TAZF336(‡)004C* TAZG686(‡)004C* TAZH107(‡)004C* Case Size The electrical and mechanical parameters shown on the TAZ series are general. For special circuit requirements, application specific testing is available. Please contact AVX if you have special electrical or mechanical requirements. DCL, DF and ESR limits are general information only. Contact AVX if your application requires lower or tighter limits. 14
  17. 17. Surface Mount Tantalum Capacitors TAZ Extended Range Series Ratings and Part Number Reference AVX Part No. Case Size Capacitance µF DCL (µA) Max. DF % Max. ESR max. (⍀) @ 100 kHz AVX Part No. 4 volt TAZA475(‡)004X* TAZB106(‡)004X* TAZD226(‡)004X* TAZE336(‡)004X* TAZF107(‡)004X* TAZG157(‡)004X* A B D E F G 4.7 10 22 33 100 150 1 1 1 2 4 6 6 6 8 8 10 10 20 10 10 5 4 2 TAZA105(‡)015X* TAZB335(‡)015X* TAZD475(‡)015X* TAZE106(‡)015X* TAZF226(‡)015X* TAZH686(‡)015X* DCL (µA) Max. DF % Max. ESR max. (⍀) @ 100 kHz A B D E F H 1 3.3 4.7 10 22 68 1 1 1 2 3 10 6 6 6 6 6 8 22 12 10 6 5 2 A B D E E F G H 0.68 2.2 3.3 4.7 6.8 15 22 47 1 1 1 1 2 3 4 10 6 6 6 6 6 6 8 8 22 12 10 8 8 4 3 2 B D E F H 1 2.2 3.3 6.8 22 1 1 1 2 6 6 6 6 6 8 12 10 8 6 2 H 10 4 8 2 20 volt A B D E F G H 3.3 6.8 15 22 68 100 220 1 1 1 2 4 6 10 6 6 6 6 8 10 10 18 12 10 4 4 2 1 A B D D E E F G H 2.2 4.7 6.8 10 15 22 47 68 100 1 1 1 1 2 3 4 6 10 6 6 6 6 6 6 8 10 10 TAZA684(‡)020X* TAZB225(‡)020X* TAZD335(‡)020X* TAZE475(‡)020X* TAZE685(‡)020X* TAZF156(‡)020X* TAZG226(‡)020X* TAZH476(‡)020X* 20 12 8 10 4 4 3 2 1 10 volt TAZA225(‡)010X* TAZB475(‡)010X* TAZD685(‡)010X* TAZD106(‡)010X* TAZE156(‡)010X* TAZE226(‡)010X* TAZF476(‡)010X* TAZG686(‡)010X* TAZH107(‡)010X* Capacitance µF 15volt 6 volt TAZA335(‡)006X* TAZB685(‡)006X* TAZD156(‡)006X* TAZE226(‡)006X* TAZF686(‡)006X* TAZG107(‡)006X* TAZH227(‡)006X* Case Size 25 volt TAZB105(‡)025X* TAZD225(‡)025X* TAZE335(‡)025X* TAZF685(‡)025X* TAZH226(‡)025X* 35 volt TAZH106(‡)035X* ‡ Insert J for ± 5% tolerance, K for ± 10%, M for ±20% * Insert letter for packing option. See ordering information on pages 22-23. All technical data relates to an ambient temperature of +25°C. Capacitance and DF are measured at 120Hz 0.5V RMS with a maximum DC bias of 2.2 volts. DCL is measured at rated voltage after 5 minutes . For any special electrical requirements, please contact factory. The electrical and mechanical parameters shown on the TAZ series are general. For special circuit requirements, application specific testing is available. Please contact AVX if you have special electrical or mechanical requirements. DCL, DF and ESR limits are general information only. Contact AVX if your application requires lower or tighter limits. 15
  18. 18. Surface Mount Tantalum Capacitors CWR09 Style (MIL-C-55365/4) Marking (military qualified) v The “V” following rated voltage is replaced with a “J” for JAN Brand. v How to Order: (MIL-C-55365/4) CWR09 J B 225 Style Voltage C=4, D=6, F=10, H=15, J=20, K=25, M=35, N=50 Termination Finish B=Gold Plated, C=Hot Solder Dipped, K=Solder Fused Capacitance Code Tolerance (J=±5%, K=±10%, M=±20%) Failure Rate Exponential: (M=1%/1000 hours); (P=0.1%/1000 hours); (R=0.01%/1000 hours); (S=0.001%/1000 hours) Weibull: (B=0.1%/1000 hours); (C=0.01%/1000 hours) Optional Surge Current A=10 cycles at 25°C B=10 cycles at -55°C and +85°C Packaging Bulk (Standard if nothing is specified in this position) TR=7" Tape & Reel TR13=13" Tape & Reel W=Waffle Pack NOTES: CWR09 is fully interchangeable with CWR06. Case sizes correspond to TAZ A through H. Packaging information can be found on pages 22-23. 16 J Capacitance code v Polarity Stripe (+) Rated Voltage “J” for “JAN” Brand M A TR
  19. 19. Surface Mount Tantalum Capacitors CWR09 Style (MIL-C-55365/4) Electrical Ratings for CWR09 Capacitors +25°C (µA) +85°C (µA) +125°C (µA) +25°C (%) +85/125°C (%) -55°C (%) Max. ESR 100 kHz +25°C Style CWR09 (Ohms) 2.2 4.7 6.8 10.0 15.0 33.0 68.0 100.0 1.0 1.0 1.0 1.0 1.0 2.0 3.0 4.0 10 10 10 10 10 20 30 40 12 12 12 12 12 24 36 48 6 6 6 8 8 8 10 10 8 8 8 8 10 10 12 12 8 8 8 10 12 12 12 12 8.0 8.0 5.5 4.0 3.5 2.2 1.1 0.9 6 6 6 6 6 6 6 6 1.5 3.3 4.7 6.8 10.0 22.0 47.0 68.0 1.0 1.0 1.0 1.0 1.0 2.0 3.0 4.0 10 10 10 10 10 20 30 40 12 12 12 12 12 24 36 48 6 6 6 6 8 8 10 10 8 8 8 8 10 10 12 12 8 8 8 8 12 12 12 12 8.0 8.0 5.5 4.5 3.5 2.2 1.1 0.9 A B C D E F G H 10 10 10 10 10 10 10 10 1.0 2.2 3.3 4.7 6.8 15.0 33.0 47.0 1.0 1.0 1.0 1.0 1.0 2.0 3.0 5.0 10 10 10 10 10 20 30 50 12 12 12 12 12 24 36 60 6 6 6 6 6 8 10 10 8 8 8 8 8 8 12 12 8 8 8 8 8 10 12 12 10.0 8.0 5.5 4.5 3.5 2.5 1.1 0.9 CWR09H*684†@᭝ᮀ CWR09H*155†@᭝ᮀ CWR09H*225†@᭝ᮀ CWR09H*335†@᭝ᮀ CWR09H*475†@᭝ᮀ CWR09H*106†@᭝ᮀ CWR09H*226†@᭝ᮀ CWR09H*336†@᭝ᮀ A B C D E F G H 15 15 15 15 15 15 15 15 0.68 1.5 2.2 3.3 4.7 10.0 22.0 33.0 1.0 1.0 1.0 1.0 1.0 2.0 4.0 5.0 10 10 10 10 10 20 40 50 12 12 12 12 12 24 48 60 6 6 6 6 6 6 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 10 10 12.0 8.0 5.5 5.0 4.0 2.5 1.1 0.9 CWR09J*474†@᭝ᮀ CWR09J*684†@᭝ᮀ CWR09J*105†@᭝ᮀ CWR09J*155†@᭝ᮀ CWR09J*225†@᭝ᮀ CWR09J*335†@᭝ᮀ CWR09J*685†@᭝ᮀ CWR09J*156†@᭝ᮀ CWR09J*226†@᭝ᮀ A B B C D E F G H 20 20 20 20 20 20 20 20 20 0.47 0.68 1.0 1.5 2.2 3.3 6.8 15.0 22.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 3.0 4.0 10 10 10 10 10 10 20 30 40 12 12 12 12 12 12 24 36 48 6 6 6 6 6 6 6 6 6 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 14.0 10.0 12.0 6.0 5.0 4.0 2.4 1.1 0.9 MIL-C-55365/4 Part Number (See Note) Case Size Rated voltage (85°C) (volts) CWR09C*225†@᭝ᮀ CWR09C*475†@᭝ᮀ CWR09C*685†@᭝ᮀ CWR09C*106†@᭝ᮀ CWR09C*156†@᭝ᮀ CWR09C*336†@᭝ᮀ CWR09C*686†@᭝ᮀ CWR09C*107†@᭝ᮀ A B C D E F G H 4 4 4 4 4 4 4 4 CWR09D*155†@᭝ᮀ CWR09D*335†@᭝ᮀ CWR09D*475†@᭝ᮀ CWR09D*685†@᭝ᮀ CWR09D*106†@᭝ᮀ CWR09D*226†@᭝ᮀ CWR09D*476†@᭝ᮀ CWR09D*686†@᭝ᮀ A B C D E F G H CWR09F*105†@᭝ᮀ CWR09F*225†@᭝ᮀ CWR09F*335†@᭝ᮀ CWR09F*475†@᭝ᮀ CWR09F*685†@᭝ᮀ CWR09F*156†@᭝ᮀ CWR09F*336†@᭝ᮀ CWR09F*476†@᭝ᮀ Capacitance (nom.) (µF) DC Leakage (max.) Dissipation Factor (max.) Note: To complete the MIL-C-55365/4 Part Number, additional information must be added: * = Termination Finish Designator: B = Gold Plated C = Hot Solder Dipped K = Solder Fused † = Tolerance Code: J = ± 5% K = ± 10% M = ± 20% @ = Failure Rate Level: Exponential: M = 1.0% per 1000 hours P = 0.1% per 1000 hours R = 0.01% per 1000 hours S = 0.001% per 1000 hours Weibull: B = 0.1% per 1000 hours C = 0.01% per 1000 hours Note: The C case size has limited availability. Where possible, the D case size should be substituted. Contact factory for latest qualification status. 17 ᭝ = Optional Surge Current A = 10 cycles at 25°C B = 10 cycles at -55°C and +85°C ᮀ = Packaging Bulk Standard TR=7" Tape & Reel TR13=13" Tape & Reel W=Waffle Pack
  20. 20. Surface Mount Tantalum Capacitors TAZ Military Series MIL-C-55365 (Rev. C) (CWR09 Style) Electrical Ratings for CWR09 Capacitors MIL-C-55365/4 Part Number (See Note) Case Size Rated voltage (85°C) (volts) Capacitance (nom.) (µF) +25°C (µA) +85°C (µA) +125°C (µA) +25°C (%) +85/125°C (%) -55°C (%) Max. ESR 100 kHz +25°C Style CWR09 (ohms) DC Leakage (max.) Dissipation Factor (max.) CWR09K*334†@᭝ᮀ CWR09K*684†@᭝ᮀ CWR09K*105†@᭝ᮀ CWR09K*155†@᭝ᮀ CWR09K*225†@᭝ᮀ CWR09K*475†@᭝ᮀ CWR09K*685†@᭝ᮀ CWR09K*106†@᭝ᮀ CWR09K*156†@᭝ᮀ A B C D E F G G H 25 25 25 25 25 25 25 25 25 0.33 0.68 1.0 1.5 2.2 4.7 6.8 10.0 15.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 4.0 10 10 10 10 10 20 20 30 40 12 12 12 12 12 24 24 36 48 6 6 6 6 6 6 6 6 6 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 15.0 7.5 6.5 6.5 3.5 2.5 1.2 1.4 1.0 CWR09M*224†@᭝ᮀ CWR09M*474†@᭝ᮀ CWR09M*684†@᭝ᮀ CWR09M*105†@᭝ᮀ CWR09M*155†@᭝ᮀ CWR09M*335†@᭝ᮀ CWR09M*475†@᭝ᮀ CWR09M*685†@᭝ᮀ A B C D E F G H 35 35 35 35 35 35 35 35 0.22 0.47 0.68 1.0 1.5 3.3 4.7 6.8 1.0 1.0 1.0 1.0 1.0 1.0 2.0 3.0 10 10 10 10 10 10 20 30 12 12 12 12 12 12 24 36 6 6 6 6 6 6 6 6 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 18.0 10.0 8.0 6.5 4.5 2.5 1.5 1.3 CWR09N*104†@᭝ᮀ CWR09N*154†@᭝ᮀ CWR09N*224†@᭝ᮀ CWR09N*334†@᭝ᮀ CWR09N*474†@᭝ᮀ CWR09N*684†@᭝ᮀ CWR09N*105†@᭝ᮀ CWR09N*155†@᭝ᮀ CWR09N*225†@᭝ᮀ CWR09N*335†@᭝ᮀ CWR09N*475†@᭝ᮀ A A B B C D E F F G H 50 50 50 50 50 50 50 50 50 50 50 0.10 0.15 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 2.0 2.0 3.0 10 10 10 10 10 10 10 10 20 20 30 12 12 12 12 12 12 12 12 24 24 36 6 6 6 6 6 6 6 6 6 6 6 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 22.0 17.0 14.0 12.0 8.0 7.0 6.0 4.0 2.5 2.0 1.5 Note: To complete the MIL-C-55365/4 Part Number, additional information must be added: * = Termination Finish Designator: B = Gold Plated C = Hot Solder Dipped K = Solder Fused † = Tolerance Code: J = ± 5% K = ± 10% M = ± 20% @ = Failure Rate Level: Exponential: M = 1.0% per 1000 hours P = 0.1% per 1000 hours R = 0.01% per 1000 hours S = 0.001% per 1000 hours Weibull: B = 0.1% per 1000 hours C = 0.01% per 1000 hours Note: The C case size has limited availability. Where possible, the D case size should be substituted. Contact factory for latest qualification status. 18 ᭝ = Optional Surge Current A = 10 cycles at 25°C B = 10 cycles at -55°C and +85°C ᮀ = Packaging Bulk Standard TR=7" Tape & Reel TR13=13" Tape & Reel W=Waffle Pack
  21. 21. Surface Mount Tantalum Capacitors CWR11 Style (MIL-C-55365/8) MIL-C-55365/8 Marking (CWR11 style) Polarity Stripe “J” for JAN Brand Capacitance code Rated Voltage (with manufacturer’s ID) How to Order: (MIL-C-55365/8) CWR11 J B 225 K M A TR Style Voltage C=4, D=6, F=10, H=15, J=20, K=25, M=35, N=50 Termination Finish B=Gold Plated C=Hot Solder Dipped K=Solder Fused Capacitance Code Tolerance (J=±5%, K=±10%, M=±20%) Failure Rate Exponential: (M=1%/1000 hours); (P=0.1%/1000 hours); (R=0.01%/1000 hours); (S=0.001%/1000 hours) Weibull: (B=0.1%/1000 hours); (C=0.01%/1000 hours) Optional Surge Current A=10 cycles at 25°C B=10 cycles at -55°C and +85°C Packaging Bulk (Standard if nothing is specified in this position) TR=7" Tape & Reel TR13=13" Tape & Reel W=Waffle Pack Case Dimensions millimeters (inches) Case Code H A 1.6±.2 (0.063 ±.008) 1.9±.2 (.075±.008) 2.5±.3 (.098±.012) 2.8 ±.3 (.110±.012) B C D H2 (min) 0.7 (.028) 0.7 (.028) 1.0 (.039) 1.0 (.039) 19 L 3.2±.2 (.126 ±.008) 3.5±.2 (.138±.008) 6.0±.3 (.236 ±.012) 7.3±.3 (.287±.012) P ±0.3 (±0.012) 0.8 (.031) 0.8 (.031) 1.3 (.051) 1.3 (.051) W 1.6±.2 (.063±.008) 2.8±.2 (.110±.008) 3.2±.3 (.126±.012) 4.3±.3 (.169±.012) W2 ±0.1 (±0.004) 1.2 (.047) 2.2 (.087) 2.2 (.087) 2.4 (.094)
  22. 22. Surface Mount Tantalum Capacitors CWR11 Style (MIL-C-55365/8) Electrical Ratings for CWR11 Capacitors MIL-C-55365/8 Part Number (See Note) Case Size Rated voltage (85°C) (volts) Capacitance (nom.) (µF) +25°C (µA) +85°C (µA) +125°C (µA) +25°C (%) +85/125°C (%) -55°C (%) Max. ESR 100 kHz (⍀) DC Leakage (max.) Dissipation Factor (max.) CWR11D*155†@᭝ᮀ CWR11D*225†@᭝ᮀ CWR11D*335†@᭝ᮀ CWR11D*475†@᭝ᮀ CWR11D*685†@᭝ᮀ CWR11D*106†@᭝ᮀ CWR11D*156†@᭝ᮀ CWR11D*226†@᭝ᮀ CWR11D*476†@᭝ᮀ A A A B B B C C D 6 6 6 6 6 6 6 6 6 1.5 2.2 3.3 4.7 6.8 10.0 15.0 22.0 47.0 0.5 0.5 0.5 0.5 0.5 0.6 0.9 1.4 2.8 5.0 5.0 5.0 5.0 5.0 6.0 9.0 14.0 28.0 6.0 6.0 6.0 6.0 6.0 7.2 10.8 16.8 33.6 6 6 6 6 6 6 6 6 6 9 6 9 9 6 9 6 9 6 9 9 9 9 9 9 9 9 9 8.0 8.0 8.0 5.5 4.5 3.5 3.0 2.2 1.1 CWR11F*105†@᭝ᮀ CWR11F*155†@᭝ᮀ CWR11F*225†@᭝ᮀ CWR11F*335†@᭝ᮀ CWR11F*475†@᭝ᮀ CWR11F*685†@᭝ᮀ CWR11F*156†@᭝ᮀ CWR11F*336†@᭝ᮀ A A A B B B C D 10 10 10 10 10 10 10 10 1.0 1.5 2.2 3.3 4.7 6.8 15.0 33.0 0.5 0.5 0.5 0.5 0.5 0.7 1.5 3.3 5.0 5.0 5.0 5.0 5.0 7.0 15.0 33.0 6.0 6.0 6.0 6.0 6.0 8.4 18.0 39.6 4 6 6 6 6 6 6 6 6 6 9 9 9 9 6 6 6 9 9 9 9 9 9 9 10.0 8.0 8.0 5.5 4.5 3.5 2.5 1.1 CWR11H*684†@᭝ᮀ CWR11H*105†@᭝ᮀ CWR11H*155†@᭝ᮀ CWR11H*225†@᭝ᮀ CWR11H*335†@᭝ᮀ CWR11H*475†@᭝ᮀ CWR11H*106†@᭝ᮀ CWR11H*226†@᭝ᮀ A A A B B B C D 15 15 15 15 15 15 15 15 0.68 1.0 1.5 2.2 3.3 4.7 10.0 22.0 0.5 0.5 0.5 0.5 0.5 0.7 1.6 3.3 5.0 5.0 5.0 5.0 5.0 7.0 16.0 33.0 6.0 6.0 6.0 6.0 6.0 8.4 19.2 39.6 4 4 6 6 6 6 6 6 6 6 9 9 8 9 8 8 6 9 9 9 9 9 9 9 12.0 10.0 8.0 5.5 5.0 4.0 2.5 1.1 Note: To complete the MIL-C-55365/8 Part Number, additional information must be added: * = Termination Finish † = Tolerance Code: @ = Failure Rate Level: Designator: J = ± 5% Exponential: M = 1.0% per 1000 hours B = Gold Plated K = ± 10% P = 0.1% per 1000 hours C = Hot Solder Dipped M = ± 20% R = 0.01% per 1000 hours K = Solder Fused S = 0.001% per 1000 hours Weibull: B = 0.1% per 1000 hours C = 0.01% per 1000 hours Contact factory for latest qualification status. D = 0.001% per 1000 hours 20 ᭝ = Optional Surge Current A = 10 cycles at 25°C B = 10 cycles at -55°C and +85°C ᮀ = Packaging Bulk Standard TR=7" Tape & Reel TR13=13" Tape & Reel W=Waffle Pack
  23. 23. Surface Mount Tantalum Capacitors CWR11 Style (MIL-C-55365/8) Electrical Ratings for CWR11 Capacitors MIL-C-55365/8 Part Number (See Note) Case Size Rated voltage (85°C) (volts) Capacitance (nom.) (µF) +25°C (µA) +85°C (µA) +125°C (µA) +25°C (%) +85/125°C (%) -55°C (%) Max. ESR 100 kHz (⍀) DC Leakage (max.) Dissipation Factor (max.) CWR11J*474†@᭝ᮀ CWR11J*684†@᭝ᮀ CWR11J*105†@᭝ᮀ CWR11J*155†@᭝ᮀ CWR11J*225†@᭝ᮀ CWR11J*335†@᭝ᮀ CWR11J*475†@᭝ᮀ CWR11J*685†@᭝ᮀ CWR11J*156†@᭝ᮀ A A A B B B C C D 20 20 20 20 20 20 20 20 20 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 15.0 0.5 0.5 0.5 0.5 0.5 0.7 1.0 1.4 3.0 5.0 5.0 5.0 5.0 5.0 7.0 10.0 14.0 30.0 6.0 6.0 6.0 6.0 6.0 8.4 12.0 16.8 36.0 4 4 4 6 6 6 6 6 6 6 6 6 9 8 9 8 9 8 6 6 6 9 9 9 9 9 9 14.0 12.0 10.0 6.0 5.0 4.0 3.0 2.4 1.1 CWR11K*334†@᭝ᮀ CWR11K*474†@᭝ᮀ CWR11K*684†@᭝ᮀ CWR11K*105†@᭝ᮀ CWR11K*155†@᭝ᮀ CWR11K*225†@᭝ᮀ CWR11K*335†@᭝ᮀ CWR11K*475†@᭝ᮀ CWR11K*685†@᭝ᮀ CWR11K*106†@᭝ᮀ A A B B B C C C D D 25 25 25 25 25 25 25 25 25 25 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 6.8 10.0 0.5 0.5 0.5 0.5 0.5 0.6 0.9 1.2 1.7 2.5 5.0 5.0 5.0 5.0 5.0 6.0 9.0 12.0 17.0 25.0 6.0 6.0 6.0 6.0 6.0 7.2 10.8 14.4 20.4 30.0 4 4 4 4 6 6 6 6 6 6 6 6 6 6 8 9 8 9 9 8 6 6 6 6 9 9 9 9 9 9 15.0 14.0 7.5 6.5 6.5 3.5 3.5 2.5 1.4 1.2 CWR11M*104†@᭝ᮀ CWR11M*154†@᭝ᮀ CWR11M*224†@᭝ᮀ CWR11M*334†@᭝ᮀ CWR11M*474†@᭝ᮀ CWR11M*684†@᭝ᮀ CWR11M*105†@᭝ᮀ CWR11M*155†@᭝ᮀ CWR11M*225†@᭝ᮀ CWR11M*335†@᭝ᮀ CWR11M*475†@᭝ᮀ A A A A B B B C C C D 35 35 35 35 35 35 35 35 35 35 35 0.10 0.15 0.22 0.33 0.47 0.68 1.0 1.5 2.2 3.3 4.7 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.8 1.2 1.7 5.0 5.0 5.0 5.0 5.0 5.0 5.0 5.0 8.0 12.0 17.0 6.0 6.0 6.0 6.0 6.0 6.0 6.0 6.0 9.6 14.4 20.4 4 4 4 4 4 4 4 6 6 6 6 6 6 6 6 6 6 6 8 8 8 8 6 6 6 6 6 6 6 9 9 9 9 24.0 21.0 18.0 15.0 10.0 8.0 6.5 4.5 3.5 2.5 1.5 CWR11N*104†@᭝ᮀ CWR11N*154†@᭝ᮀ CWR11N*224†@᭝ᮀ CWR11N*334†@᭝ᮀ CWR11N*474†@᭝ᮀ CWR11N*684†@᭝ᮀ CWR11N*105†@᭝ᮀ CWR11N*155†@᭝ᮀ CWR11N*225†@᭝ᮀ A B B B C C C D D 50 50 50 50 50 50 50 50 50 0.10 0.15 0.22 0.33 0.47 0.68 1.0 1.5 2.2 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.8 1.1 5.0 5.0 5.0 5.0 5.0 5.0 5.0 8.0 11.0 6.0 6.0 6.0 6.0 6.0 6.0 6.0 9.6 13.2 4 4 4 4 4 6 6 6 6 6 6 6 6 6 6 6 8 8 6 6 6 6 6 6 6 9 9 22.0 17.0 14.0 12.0 8.0 7.0 6.0 4.0 2.5 Note: To complete the MIL-C-55365/8 Part Number, additional information must be added: * = Termination Finish † = Tolerance Code: @ = Failure Rate Level: Designator: J = ± 5% Exponential: M = 1.0% per 1000 hours B = Gold Plated K = ± 10% P = 0.1% per 1000 hours C = Hot Solder Dipped M = ± 20% R = 0.01% per 1000 hours K = Solder Fused S = 0.001% per 1000 hours Weibull: B = 0.1% per 1000 hours C = 0.01% per 1000 hours Contact factory for latest qualification status. D = 0.001% per 1000 hours 21 ᭝ = Optional Surge Current A = 10 cycles at 25°C B = 10 cycles at -55°C and +85°C ᮀ = Packaging Bulk Standard TR=7" Tape & Reel TR13=13" Tape & Reel W=Waffle Pack
  24. 24. Surface Mount Tantalum Capacitors Tape and Reel Packaging Solid Tantalum Chip TAZ Tape and reel packaging for automatic component placement. Please enter required Suffix on order. Bulk packaging is standard. TAZ Taping Suffix Table Case Size Tape width reference mm P mm 7" (180mm) reel Suffix Qty. 13" (330mm) reel Suffix Qty. A 8 4 R 2500 S 9000 B 12 4 R 2500 S 9000 C 12 4 R 2500 S 9000 D 12 4 R 2500 S 8000 E 12 4 R 2500 S 8000 F 12 8 R 1000 S 3000 G 12 8 R 500 S 2500 H 12 8 R 500 S 2500 Tape Specification Tape dimensions comply to EIA RS 481 A Dimensions A0 and B0 of the pocket and the tape thickness, K, are dependent on the component size. Tape materials do not affect component solderability during storage. Carrier Tape Thickness <0.4mm Total Tape Thickness — K max millimeters (inches) Code TAZ P* Case size reference Millimeters (Inches) Dims R 1.9 (0.075) A 2.0 (0.079) B 4.0 (0.157) C 4.0 (0.157) D 4.0 (0.157) E 4.0 (0.157) F 4.0 (0.157) G 4.0 (0.157) H 4.0 (0.157) G F E W P2 P0 D D1 4±0.1 or 8±0.1 1.75 min 3.5±0.05 1.75±0.1 8±0.3 2±0.05 4±0.1 1.5±0.1 -0 1.0 min 8mm Tape (0.157±0.004) 4±0.1 or (0.315±0.004) 8±0.1 (0.03 min) 1.75 min (0.138±0.002) 5.5±0.05 (0.069±0.004) 1.75±0.1 (0.315±0.012) 12±0.3 (0.079±0.002) 2±0.05 (0.157±0.004) 4±0.1 (0.059±0.004) 1.5±0.1 (-0) -0 (0.039 min) 1.5 min) 12mm Tape (0.157±0.004) (0.315±0.004) (0.03 min) (0.22±0.002) (0.069±0.004) (0.472±0.012) (0.079±0.002) (0.157±0.004) (0.059±0.004) (-0) (0.059 min) *See taping suffix tables for actual P dimension (component pitch). 22
  25. 25. Surface Mount Tantalum Capacitors Tape and Reel Packaging Plastic Tape Reel Dimensions 21 ± 1.0 ᭡ ᭡ ᭡ ᭢ Standard dimensions mm A: 9.5mm (8mm tape) 13.0mm (12mm tape) D ± 2.0 70 ± 2.0 13±0.5 Cover Tape Dimensions Thickness: 75±25µ Width of tape: 5.5mm + 0.2mm (8mm tape) 9.5mm + 0.2mm (12mm tape) ᭢ ᭢ ᭢ ᭢ ᭢ ᭢ 2 ± 0.5 A ± 1.0 Waffle Packaging - 2" x 2" hard plastic waffle trays. To order Waffle packaging use a “W” in part number’s packaging position. Case size Maximum Quantity Per Waffle TAZ A TAZ B TAZ C TAZ D TAZ E TAZ F TAZ G TAZ H CWR11 A CWR11 B CWR11 C CWR11 D 160 112 90 88 60 48 50 28 96 72 54 28 NOTE: Orientation of parts in waffle packs varies by case size. 23
  26. 26. Technical Summary and Application Guidelines Contents/Introduction Section 1: Electrical Characteristics and Explanation of Terms. Section 2: A.C. Operation and Ripple Voltage. Section 3: Reliability and calculation of failure rate. Section 4: Application guidelines for tantalum capacitors. Section 5: Mechanical and thermal properties of leaded capacitors. Section 6: Qualification approval status. where ␧o is the dielectric constant of free space (8.855 x 10-12 Farads/m) ␧r is the relative dielectric constant for Tantalum Pentoxide (27) and Introduction d is the dielectric thickness in meters (for a typical 25V part) C is the capacitance in Farads A is the surface area in meters Rearranging this equation gives Tantalum capacitors are manufactured from a powder of pure tantalum metal. The typical particle size is between 2 and 10 µm. A= Cd ␧o␧r thus for a 22µF/25V capacitor the surface area is 150 square centimeters, or nearly 1⁄2 the size of this page. 4000µFV 10000µFV 20000µFV The powder is compressed under high pressure around a Tantalum wire to form a ‘pellet’. The riser wire is the anode connection to the capacitor. The dielectric is then formed over all the tantalum surfaces by the electrochemical process of anodization. The ‘pellet’ is dipped into a very weak solution of phosphoric acid. The dielectric thickness is controlled by the voltage applied during the forming process. Initially the power supply is kept in a constant current mode until the correct thickness of dielectric has been reached (that is the voltage reaches the ‘forming voltage’), it then switches to constant voltage mode and the current decays to close to zero. The chemical equations describing the process are as follows: This is subsequently vacuum sintered at high temperature (typically 1500 - 2000°C). This helps to drive off any impurities within the powder by migration to the surface. During sintering the powder becomes a sponge like structure with all the particles interconnected in a huge lattice. This structure is of high mechanical strength and density, but is also highly porous giving a large internal surface area. The larger the surface area the larger the capacitance. Thus high CV (capacitance/voltage product) powders, which have a low average particle size, are used for low voltage, high capacitance parts. The figure below shows typical powders. Note the very great difference in particle size between the powder CVs. By choosing which powder is used to produce each capacitance/voltage rating the surface area can be controlled. The following example uses a 22µF 25V capacitor to illustrate the point. C = ␧o␧r A Anode: Cathode: 2 Ta → 2 Ta5+ + 10 e 2 Ta5+ 10 OH-→ Ta2O5 + 5 H2O 10 H2O – 10 e → 5H2 ↑ + 10 OH- The oxide forms on the surface of the Tantalum but it also grows into the metal. For each unit of oxide two thirds grows out and one third grows in. It is for this reason that there is a limit on the maximum voltage rating of Tantalum capacitors with present technology powders. The dielectric operates under high electrical stress. Consider a 22µF 25V part: Formation voltage d 24 = = = Formation Ratio x Working Voltage 4 x 25 100 Volts
  27. 27. Technical Summary and Application Guidelines Introduction(cont.) The pentoxide (Ta 2O 5 ) dielectric grows at a rate of 1.7 x 10-9 m/V Dielectric thickness (d) = 100 x 1.7 x 10-9 = 0.17 µm Electric Field strength = Working Voltage / d = 147 KV/mm Tantalum Manganese Dioxide Dielectric Oxide Film Tantalum Dielectric Oxide Film Manganese Dioxide Tantalum This process is repeated several times through varying specific densities of Nitrate to build up a thick coat over all internal and external surfaces of the ‘pellet’, as shown in the figure. The ‘pellet’ is then dipped into graphite and silver to provide a good connection to the Manganese Dioxide cathode plate. Electrical contact is established by deposition of carbon onto the surface of the cathode. The carbon is then coated with a conductive material to facilitate connection to the cathode termination. Packaging is carried out to meet individual specifications and customer requirements. This manufacturing technique is adhered to for the whole range of AVX tantalum capacitors, which can be sub-divided into four basic groups: Dielectric Oxide Film Tantalum Dielectric Oxide Film The next stage is the production of the cathode plate. This is achieved by pyrolysis of Manganese Nitrate into Manganese Dioxide. The ‘pellet’ is dipped into an aqueous solution of Nitrate and then baked in an oven at approximately 250°C to produce to Dioxide coat. The chemical equation is Mn (NO3)2 → Mn O2 + 2NO2↑ Chip / Resin dipped / Rectangular boxed / Axial For further info on production of Tantalum Capacitors see the technical paper "Basic Tantalum Technology", by John Gill, available from your local AVX representative. Anode Manganese Dioxide Graphite Outer Silver Layer 25 Silver Epoxy Leadframe
  28. 28. Technical Summary and Application Guidelines Electrical Characteristics and Explanation of Terms Section 1: Electrical Characteristics and Explanation of Terms 1.1 Capacitance 1.2 Voltage 1.1.1 Rated Capacitance (CR). This is the nominal rated capacitance. For tantalum capacitors it is measured as the capacitance of the equivalent series circuit at 20°C using a measuring bridge supplied by a 120Hz source, free of harmonics with a maximum bias of 2.2V d.c. 1.2.1 Rated d.c. voltage. (VR) This is the rated d.c. voltage for continuous operation at 85°C. 1.2.2 Category voltage (VC) This is the maximum voltage that may be applied continuously to a capacitor. It is equal to the rated voltage up to +85°C, beyond which it is subject to a linear derating, to 2/3 VR at 125°C. 1.1.2 Capacitance tolerance. This is the permissible variation of the actual value of the capacitance from the rated value. For additional reading, please consult the AVX technical publication "Capacitance Tolerances for Solid Tantalum Capacitors". MAXIMUM CATEGORY VOLTAGE vs. TEMPERATURE 1.1.3 Temperature dependence of capacitance. The capacitance of a tantalum capacitor varies with temperature. This variation itself is dependent to a small extent on the rated voltage and capacitor size. 100 % Rated Voltage 90 TYPICAL CAPACITANCE vs. TEMPERATURE 80 70 60 15 50 75 % Capacitance 10 5 105 115 125 0 1.2.3 Surge voltage.(US) This is the highest voltage that may be applied to a capacitor for short periods of time. The surge voltage may be applied up to 10 times in an hour for periods of up to 30s at a time. The surge voltage must not be used as a parameter in the design of circuits in which, in the normal course of operation, the capacitor is periodically charged and discharged. -5 -15 -55 -25 0 25 50 75 100 125 Temperature (°C) 1.1.4 Frequency dependence of the capacitance. The effective capacitance decreases as frequency increases. Beyond 100KHz the capacitance continues to drop until resonance is reached (typically between 0.5 - 5MHz depending on the rating). Beyond the resonant frequency the device becomes inductive. 85°C Rated Voltage (Vdc.) 4 6.3 10 16 20 25 35 40 50 CAPACITANCE VERSUS FREQUENCY 250 200 Capacitance (µF) 95 Temperature °C -10 150 50 1000 10000 100000 125°C Surge Voltage (Vdc.) 5.2 8 13 21 26 32 46 52 65 Category Voltage (Vdc.) 2.7 4 7.0 10 13 17 23 25 33 Surge Voltage (Vdc.) 3.2 5 8 13 17 20 30 33 43 1.2.4 Effect of surges The solid Tantalum capacitor has a limited ability to withstand voltage and current surges. This is in common with all other electrolytic capacitors and is due to the fact that they operate under very high electrical stress across the dielectric. For example a 25 volt capacitor has an Electrical Field of 147 KV/mm when operated at rated voltage. 100 0 100 85 1000000 Frequency (Hz) 220 µF @ 10 VDC 26
  29. 29. Technical Summary and Application Guidelines Electrical Characteristics and Explanation of Terms Non-Polar operation. If higher reverse voltages are unavoidable, then two capacitors, each of twice the required capacitance and of equal tolerance and rated voltage, should be connected in a back-to-back configuration, i.e. both anodes or both cathodes joined together. This is necessary in order to avoid a reduction in life expectancy. It is important to ensure that the voltage across the terminals of the capacitor never exceeds the specified surge voltage rating. Solid tantalum capacitors have a self healing ability of the Manganese Dioxide semiconducting layer used as the negative plate, however this is limited in low impedance applications. 1.2.6 Superimposed A.C. Voltage (Vr.m.s.) Ripple Voltage. This is the maximum r.m.s. alternating voltage; superimposed on a d.c. voltage, that may be applied to a capacitor. The sum of the d.c. voltage and peak value of the superimposed a.c. voltage must not exceed the category voltage, Uc. In the case of low impedance circuits, the capacitor is likely to be stressed by current surges. Derating the capacitor by 50% or more increases the reliability of the component. See figure 2 page 33. The “AVX Recommended Derating Table” (page 34) summarizes voltage rating for use on common voltage rails, in low impedance applications. In circuits which undergo rapid charge or discharge a protective resistor of 1⍀/V is recommended. If this is impossible, a derating factor of up to 70% should be used. Full details are given in section 2. 1.2.7 Forming voltage. This is the voltage at which the anode oxide is formed. The thickness of this oxide layer is proportional to the formation voltage for a tantalum capacitor and is a factor in setting the rated voltage. In such situations a higher voltage may be needed than is available as a single capacitor. A series combination should be used to increase the working voltage of the equivalent capacitor: For example two 22µF 25V parts in series is equivalent to a 11µF 50V part. For further details refer to J.A.Gill’s paper “Investigation into the effects of connecting Tantalum capacitors in series”, available from AVX offices worldwide. 1.3 Dissipation Factor and Tangent of Loss Angle (Tan ␦) 1.3.1 Dissipation factor (D.F.). Dissipation factor is the measurement of the tangent of the loss angle (tan ␦) expressed as a percentage. The measurement of DF is carried out at +20°C and 120Hz with 2.2V d.c. bias with an a.c. voltage free of harmonics. The value of DF is temperature and frequency dependent. NOTE: While testing a circuit (e.g. at ICT or functional) it is likely that the capacitors will be subjected to large voltage and current transients, which will not be seen in normal use. These conditions should be borne in mind when considering the capacitor’s rated voltage for use. These can be controlled by ensuring a correct test resistance is used. Note: For surface mounted products the maximum allowed DF values are indicated in the ratings table and it is important to note that these are the limits met by the component AFTER soldering onto the substrate. 1.2.5 Reverse voltage and Non-Polar operation. The reverse voltage ratings are designed to cover exceptional conditions of small level excursions into incorrect polarity. The values quoted are not intended to cover continuous reverse operation. 1.3.2 Tangent of Loss Angle (Tan ␦). This is a measurement of the energy loss in the capacitor. It is expressed as Tan ␦ and is the power loss of the capacitor divided by its reactive power at a sinusoidal voltage of specified frequency. Terms also used are power factor, loss factor and dielectric loss. Cos (90 - ␦) is the true power factor. The measurement of Tan ␦ is carried out at +20°C and 120 Hz with 2.2V d.c. bias with an a.c. voltage free of harmonics. The peak reverse voltage applied to the capacitor must not exceed: 10% of the rated d.c. working voltage to a maximum of 1.0v at 25°C 3% of the rated d.c. working voltage to a maximum of 0.5v at 85°C 1% of the category d.c. working voltage to a maximum of 0.1v at 125°C 27
  30. 30. Technical Summary and Application Guidelines Electrical Characteristics and Explanation of Terms current paths. To express the effect of these losses they are considered as the ESR of the capacitor. The ESR is frequency dependent and can be found by using the relationship; ESR = Tan Ѩ 2πfC 1.3.3 Frequency dependence of Dissipation Factor. Dissipation Factor increases with frequency as shown in the typical curves: DF vs. FREQUENCY (TPSE107M016R0100) Where f is the frequency in Hz, and C is the capacitance in farads. 500 450 The ESR is measured at 20°C and 100kHz. ESR is one of the contributing factors to impedance, and at high frequencies (100kHz. and above) it becomes the dominant factor. Thus ESR and impedance become almost identical, impedance being only marginally higher. 400 DF (%) 350 300 250 200 150 1.4.3 Frequency dependence of Impedance and ESR. ESR and Impedance both increase with decreasing frequency. At lower frequencies the values diverge as the extra contributions to impedance (due to the reactance of the capacitor) become more significant. Beyond 1 MHz. (and beyond the resonant point of the capacitor) impedance again increases due to the inductance of the capacitor. 100 50 0 100 1000 10000 Frequency (Hz) 100000 1.3.4 Temperature Dependence of Dissipation Factor. Dissipation factor varies with temperature as the typical curves show. For maximum limits please refer to ratings tables. DF VERSUS TEMPERATURE ESR VERSUS FREQUENCY (TPSE107M016R0100) 4.0 1 3.5 3.0 ESR (Ohms) DF (%) 2.5 2.0 1.5 0.1 1.0 0.5 0 -55 -40 -20 0 20 40 60 80 100 125 0.01 100 Temperature (°C) 1000 10000 100000 1000000 Frequency (Hz) 1.4 Impedance, (Z) and Equivalent Series Resistance (ESR) IMPEDANCE VERSUS FREQUENCY (TPSE107M016R0100) 10 Impedance (Ohms) 1.4.1 Impedance, Z. This is the ratio of voltage to current at a specified frequency. Three factors contribute to the impedance of a tantalum capacitor; the resistance of the semiconductor layer; the capacitance value and the inductance of the electrodes and leads. At high frequencies the inductance of the leads becomes a limiting factor. The temperature and frequency behavior of these three factors of impedance determine the behavior of the impedance Z. The impedance is measured at 20°C and 100kHz. 1 0.1 0.01 100 1000 10000 Frequency (Hz) 1.4.2 Equivalent Series Resistance, ESR. Resistance losses occur in all practical forms of capacitors. These are made up from several different mechanisms, including resistance in components and contacts, viscous forces within the dielectric and defects producing bypass 28 100000 1000000
  31. 31. Technical Summary and Application Guidelines Electrical Characteristics and Explanation of Terms 1.5.3 Voltage dependence of the leakage current. The leakage current drops rapidly below the value corresponding to the rated voltage UR when reduced voltages are applied. The effect of voltage derating on the leakage current is shown in the graph. This will also give a significant increase in the reliability for any application. See Section 3.1 for details. 1.4.4 Temperature Dependence of the Impedance and ESR. At 100kHz, impedance and ESR behave identically and decrease with increasing temperature as the typical curves show. ESR VERSUS TEMPERATURE 1 LEAKAGE CURRENT VERSUS RATED VOLTAGE ESR (Ohms) 1 0.1 Leakage Current ratio I/IVR 0.1 Typical Range 0.01 -55 -40 -20 0 20 40 60 80 100 125 Temperature (°C) 0.01 0 1.5 D.C. Leakage Current (IL) 100 10 Leakage Current (µA) 8 6 4 TAJD33M6.3 2 TAJD47M10 0 TAJD33M16 -2 TAJC6.8M20 -4 -6 -8 -10 -20 0 20 40 60 80 100 Applied Voltage (Volts) 1.5.2 Temperature dependence of the leakage current. The leakage current increases with higher temperatures, typical values are shown in the graph. For operation between 85°C and 125°C, the maximum working voltage must be derated and can be found from the following formula. For additional information on Leakage Current, please consult the AVX technical publication. "Analysis of Solid Tantalum Capacitor Leakage Current" by R. W. Franklin. 1.5.4 Ripple current. Umax = 1- (T - 85) x V volts, where T is the required 125 operating temperature. The maximum ripple current allowed can be calculated from the power dissipation limits for a given temperature rise above ambient temperature. Please refer to Section 2 for details. R 10 Leakage current 1 ratio I/IR20 0.1 -55 -40 -20 80 60 LEAKAGE CURRENT VERSUS BIAS VOLTAGE Reforming of tantalum capacitors is unnecessary even after prolonged periods without the application of voltage. ͨ 40 Rated Voltage (UR) % 1.5.1 Leakage current, IL The leakage current is dependent on the voltage applied, the elapsed time since the voltage was applied and the component temperature. It is measured at +20°C with the rated voltage applied. A protective resistance of 1000⍀ is connected in series with the capacitor in the measuring circuit. Three to five minutes after application of the rated voltage the leakage current must not exceed the maximum values indicated in the ratings tables. These tables are based on 0.01CV or 0.5µA, whichever is greater. ͧ 20 0 20 40 60 80 100 +125 Temperature (°C) 29
  32. 32. Technical Summary and Application Guidelines A.C. Operation, Ripple Voltage and Ripple Current Section 2: A.C. Operation, Ripple Voltage and Ripple Current 2.1 Ripple Ratings (a.c.) Where Pmax is the maximum permissible power dissipated as listed for the product under consideration (see tables). However care must be taken to ensure that: 1. The d.c. working voltage of the capacitor must not be exceeded by the sum of the positive peak of the applied a.c. voltage and the d.c. bias voltage. In an a.c. application heat is generated within the capacitor by both the a.c. component of the signal (which will depend upon the signal form, amplitude and frequency), and by the d.c. leakage. For practical purposes the second factor is insignificant. The actual power dissipated in the capacitor is calculated using the formula: 2. The sum of the applied d.c. bias voltage and the negative peak of the a.c. voltage must not allow a voltage reversal in excess of the “Reverse Voltage”. P = I2 R and rearranged to I = and substituting ͱ P ⁄R .....(Eq. 1) Historical ripple calculations. Previous ripple current and voltage values were calculated using an empirically derived power dissipation required to give a 10°C rise of the capacitors body temperature from room temperature, usually in free air. These values are shown in Table I. Equation 1 then allows the maximum ripple current to be established, and equation 2 the maximum ripple voltage. But as has been shown in the AVX article on thermal management by I. Salisbury, the thermal conductivity of a Tantalum chip capacitor varies considerably depending upon how it is mounted. P = E2R Z 2 where I=rms ripple current, amperes R=equivalent series resistance, ohms E=rms ripple voltage, volts P=power dissipated, watts Z=impedance, ohms, at frequency under consideration Maximum a.c. ripple voltage (Emax). From the previous equation: ͱ E max = Z P max R .....(Eq. 2) Table I: Power Dissipation Ratings (In Free Air) TAJ/TPS/CWR11 Series Molded Chip Case size A B C D E V M N R S T Max. power dissipation (W) 0.075 0.085 0.110 0.150 0.165 0.250 0.090 0.130 0.055 0.065 0.080 TAZ/CWR09 Series Molded Chip Case size A B C D E F G H Max. power dissipation (W) 0.050 0.070 0.075 0.080 0.090 0.100 0.125 0.150 30 TAJ/TPS/CWR11 TAZ/CWR09 Series Molded Chip Temperature derating factors Temp. °C Factor +25 1.0 +55 0.90 +85 0.80 +125 0.16
  33. 33. Technical Summary and Application Guidelines A.C. Operation, Ripple Voltage and Ripple Current A piece of equipment was designed which would pass sine and square wave currents of varying amplitudes through a biased capacitor. The temperature rise seen on the body for the capacitor was then measured using an infra-red probe. This ensured that there was no heat loss through any thermocouple attached to the capacitor’s surface. Typical ripple current versus temp rise for 100KHz and 1MHz sine wave inputs. 70 Temperature rise (°C) 60 Temperature rise ( o C) Results for the C, D and E case sizes 100 90 80 70 D case 40 30 20 10 0 0 40 100KHz 1 MHz 30 20 10 C case 60 50 50 0 0.00 E case 0.20 0.1 0.2 0.3 0.4 0.5 1.20 70.00 Temperature Rise (°C) 60.00 Several capacitors were tested and the combined results are shown here. All these capacitors were measured on FR4 board, with no other heatsinking. The ripple was supplied at various frequencies from 1KHz to 1MHz. As can be seen in the figure above, the average Pmax value for the C case capacitors was 0.11 Watts. This is the same as that quoted in Table I. 50.00 40.00 100KHz 30.00 1 MHz 20.00 10.00 0.00 0.00 The D case capacitors gave an average Pmax value 0.125 Watts. This is lower than the value quoted in the table by 0.025 Watts. 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 FR A square wave is the sum of an infinite series of sine waves at all the odd harmonics of the square waves fundamental frequency. The equation which relates is If a typical capacitor’s ESR with frequency is considered, e.g. figure below, it can be seen that there is variation. Thus for a set ripple current, the amount of power to be dissipated by the capacitor will vary with frequency. This is clearly shown in figure in top of next column, which shows that the units surface temperature rises less for a given value of ripple current at 1MHz than at 100KHz. ISquare = Ipksin (2πƒ) + Frequency 200 KHz 600 KHz 1 MHz 1.4 MHz ESR VERSUS FREQUENCY (TPSE107M016R0100) Frequency 200 KHz 600 KHz 1 MHz 1.4 MHz 0.1 100000 Peak-to-peak current (Amps) 2.000 0.667 0.400 0.286 RMS current (Amps) 0.707 0.236 0.141 0.101 Let us assume the capacitor is a TAJD68M6.3. Typical ESR measurements would yield 1 10000 Ipk I I sin (6πƒ) + pk sin (10πƒ) + pk sin (14πƒ) +... 3 5 7 Thus the spectral components are The graph below shows a typical ESR variation with frequency. 1000 0.45 0.50 Example A Tantalum capacitor is being used in a filtering application, where it will be required to handle a 2 Amp peak-to-peak, 200KHz square wave current. The E case capacitors gave an average Pmax of 0.200 Watts which was much higher than the 0.165 Watts from table 1. ESR (Ohms) 1.00 If I2R is then plotted it can be seen that the two lines are in fact coincident, as shown in figure below. Power (Watts) 0.01 100 0.40 0.60 0.80 RMS current (Amps) Typical ESR (Ohms) 0.120 0.115 0.090 0.100 Power (Watts) Irms2 x ESR 0.060 0.006 0.002 0.001 Thus the total power dissipation would be 0.069 Watts. From the D case results shown in figure top of previous column, it can be seen that this power would cause the capacitors surface temperature to rise by about 5°C. For additional information, please refer to the AVX technical publication “Ripple Rating of Tantalum Chip Capacitors” by R.W. Franklin. 1000000 Frequency (Hz) 31
  34. 34. Technical Summary and Application Guidelines A.C. Operation, Ripple Voltage and Ripple Current 2.2. Thermal Management. The heat generated inside a tantalum capacitor in a.c. operation comes from the power dissipation due to ripple current. It is equal to I2R, where I is the rms value of the current at a given frequency, and R is the ESR at the same frequency with an additional contribution due to the leakage current. The heat will be transferred from the outer surface by conduction. How efficiently it is transferred from this point is dependent on the thermal management of the board. In practice, in a high density assembly with no specific thermal management, the power dissipation required to give a 10°C rise above ambient may be up to a factor of 10 less. In these cases, the actual capacitor temperature should be established (either by thermocouple probe or infra-red scanner) and if it is seen to be above this limit it may be necessary to specify a lower ESR part or a higher voltage rating. Please contact application engineering for details or contact the AVX technical publication entitled “Thermal Management of Surface Mounted Tantalum Capacitors” by Ian Salisbury. The power dissipation ratings given in section 2.1 are based on free-air calculations. These ratings can be approached if efficient heat sinking and/or forced cooling is used. Thermal Dissipation from the Mounted Chip ENCAPSULANT LEAD FRAME TANTALUM ANODE COPPER SOLDER PRINTED CIRCUIT BOARD Thermal Impedance Graph with ripple current THERMAL IMPEDANCE GRAPH C CASE SIZE CAPACITOR BODY TEMPERATURE DEG C 140 121 CWATT 120 100 236 CWATT 80 60 40 20 73 CWATT X X X X - RESULTS OF RIPPLE CURRENT TEST - RESIN BODY 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 POWER IN UNIT CASE, DC WATTS = PCB MAX Cu THERMAL = PCB MIN Cu AIR GAP 32 = CAP IN FREE AIR
  35. 35. Technical Summary and Application Guidelines Reliability and Calculation of Failure Rate Section 3: Reliability and Calculation of Failure Rate 3.1 Steady-State (the ratio between applied and rated voltage) and the failure rate. The graph gives the correction factor F U for any operating voltage. Tantalum Dielectric has essentially no wear out mechanism and in certain circumstances is capable of limited self healing, random failures can occur in operation. The failure rate of Tantalum capacitors will decrease with time and not increase as with other electrolytic capacitors and other electronic components. Figure 2: Correction factor to failure rate F for voltage derating of a typical component (60% con. level). Voltage Correction Factor Figure 1: Tantalum reliability curve. 1.0000 Correction Factor Infant Mortalities 0.1000 0.0100 0.0010 0.0001 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Applied Voltage / Rated Voltage Infinite Useful Life Operating Temperature. If the operating temperature is below the rated temperature for the capacitor then the operating reliability will be improved as shown in figure 3. This graph gives a correction factor FT for any temperature of operation. Useful life reliability can be altered by voltage derating, temperature or series resistance The useful life reliability of the Tantalum capacitor is affected by three factors. The equation from which the failure rate can be calculated is: Figure 3: Correction factor to failure rate F for ambient temperature T for typical component (60% con. level). F = FU x FT x FR x FB Temperature Correction Factor where FU is a correction factor due to operating voltage/ voltage derating FT is a correction factor due to operating temperature FR is a correction factor due to circuit series resistance FB is the basic failure rate level. For standard Tantalum product this is 1%/1000hours Correction Factor 100.0 10.0 1.0 0.10 Base failure rate. Standard tantalum product conforms to Level M reliability (i.e., 1%/1000 hrs.) at rated voltage, rated temperature, and 0.1Ω/volt circuit impedance. This is known as the base failure rate, F(B), which is used for calculating operating reliability. The effect of varying the operating conditions on failure rate is discussed in this section. 0.01 20 30 40 50 60 70 80 90 100 110 120 Temperature Circuit Impedance. All solid tantalum capacitors require current limiting resistance to protect the dielectric from surges. A series resistor is recommended for this purpose. A lower circuit impedance may cause an increase in failure rate, especially at temperatures higher than 20°C. An inductive low impedance circuit may apply voltage surges to the capacitor and similarly a non-inductive circuit may apply current surges to Operating voltage/voltage derating. If a capacitor with a higher voltage rating than the maximum line voltage is used, then the operating reliability will be improved. This is known as voltage derating. The graph, figure 2, shows the relationship between voltage derating 33
  36. 36. Technical Summary and Application Guidelines Reliability and Calculation of Failure Rate the capacitor, causing localized overheating and failure. The recommended impedance is 1 ⍀ per volt. Where this is not feasible, equivalent voltage derating should be used (See MIL HANDBOOK 217E). The table below shows the correction factor, FR, for increasing series resistance. The table below summarizes the results of trials carried out at AVX with a piece of equipment which has very low series resistance and applied no derating. That is the capacitor was tested at its rated voltage. Results of production scale derating experiment Circuit Impedance Correction factor to failure rate F for series resistance R on basic failure rate FB for a typical component (60% con. level). Circuit Resistance ohms/volt 3.0 2.0 1.0 0.8 0.6 0.4 0.2 0.1 Capacitance and Number of units 50% derating Voltage tested applied 47µF 16V 1,547,587 0.03% 100µF 10V 632,876 0.01% 22µF 25V 2,256,258 0.05% FR 0.07 0.1 0.2 0.3 0.4 0.6 0.8 1.0 No derating applied 1.1% 0.5% 0.3% As can clearly be seen from the results of this experiment, the more derating applied by the user, the less likely the probability of a surge failure occurring. It must be remembered that these results were derived from a highly accelerated surge test machine, and failure rates in the low ppm are more likely with the end customer. Example calculation Consider a 12 volt power line. The designer needs about 10µF of capacitance to act as a decoupling capacitor near a video bandwidth amplifier. Thus the circuit impedance will be limited only by the output impedance of the boards power unit and the track resistance. Let us assume it to be about 2 Ohms minimum, i.e. 0.167 Ohms/Volt. The operating temperature range is -25°C to +85°C. If a 10µF 16 Volt capacitor was designed in the operating failure rate would be as follows. A commonly held misconception is that the leakage current of a Tantalum capacitor can predict the number of failures which will be seen on a surge screen. This can be disproved by the results of an experiment carried out at AVX on 47µF 10V surface mount capacitors with different leakage currents. The results are summarized in the table below. Leakage current vs number of surge failures Standard leakage range 0.1 µA to 1µA Over Catalog limit 5µA to 50µA Classified Short Circuit 50µA to 500µA a) FT = 0.8 @ 85°C b) FR = 0.7 @ 0.167 Ohms/Volt c) FU = 0.17 @ applied voltage/rated voltage = 75% Thus FB = 0.8 x 0.7 x 0.17 x 1 = 0.0952%/1000 Hours If the capacitor was changed for a 20 volt capacitor, the operating failure rate will change as shown. Number tested 10,000 Number failed surge 25 10,000 26 10,000 25 Again, it must be remembered that these results were derived from a highly accelerated surge test machine, and failure rates in the low ppm are more likely with the end customer. FU = 0.05 @ applied voltage/rated voltage = 60% FB = 0.8 x 0.7 x 0.05 x 1 = 0.028%/1000 Hours Voltage Rail Working Cap Voltage 3.3 6.3 5 10 10 20 12 3.2 Dynamic. As stated in section 1.2.4, the solid Tantalum capacitor has a limited ability to withstand voltage and current surges. Such current surges can cause a capacitor to fail. The expected failure rate cannot be calculated by a simple formula as in the case of steady-state reliability. The two parameters under the control of the circuit design engineer known to reduce the incidence of failures are derating and series resistance. 25 15 35 ≥24 Series Combinations (11) AVX recommended derating table For further details on surge in Tantalum capacitors refer to J.A. Gill’s paper “Surge in solid Tantalum capacitors”, available from AVX offices worldwide. An added bonus of increasing the derating applied in a circuit, to improve the ability of the capacitor to withstand 34
  37. 37. Technical Summary and Application Guidelines Reliability and Calculation of Failure Rate So there is an order improvement in the capacitors steadystate reliability. surge conditions, is that the steady-state reliability is improved by up to an order. Consider the example of a 6.3 volt capacitor being used on a 5 volt rail. The steady state reliability of a Tantalum capacitor is affected by three parameters; temperature, series resistance and voltage derating. Assuming 40°C operation and 0.1Ω/volt of series resistance, the scaling factors for temperature and series resistance will both be 0.05 [see section 3.1]. The derating factor will be 0.15. The capacitors reliability will therefore be Reliability testing AVX performs extensive life testing of all series of tantalum capacitors. Two criteria are especially tested: ᭿ 2,000 hour tests as part of our regular Quality Assurance Program. Test conditions: Failure rate = FU x FT x FR x 1%/1000 hours = 0.15 x 0.05 x 1 x 1%/1000 hours = 7.5% x 10-3/1000 hours If a 10 volt capacitor was used instead, the new scaling factor would be 0.017, thus the steady-state reliability would be ᭿ 85°C/rated voltage/circuit impedance =3Ω max. ᭿ 125°C/2/3 x rated voltage/circuit impedance =3Ω max. This data is kept under continuous review. Failure rate = FU x FT x FR x 1%/1000 hours = 0.017 x 0.05 x 1 x 1%/1000 hours = 8.5% x 10-4/ 1000 hours Section 4: Application Guidelines for Tantalum Capacitors. Soldering Conditions and Board Attachment. The soldering temperature and time should be the minimum for a good connection. Allowable range of peak temp./time combination for wave soldering 270 260 Dangerous Range 250 For vapor phase or infra-red reflow soldering the profile below shows allowable and dangerous time/temperature combinations. The profile refers to the peak reflow temperature and is designed to ensure that the temperature of the internal construction of the capacitor does not exceed 220°C. Preheat conditions vary according to the reflow system used, maximum time and temperature would be 10 minutes at 150°C. Small parametric shifts may be noted immediately after reflow, components should be allowed to stabilize at room temperature prior to electrical testing. Both TAJ and TAZ series are designed for reflow and wave soldering operations. In addition TAZ is available with gold terminations compatible with conductive epoxy or gold wire bonding for hybrid assemblies. Temperature 240 ( o C) 230 Allowable Range with Care 220 Allowable Range with Preheat 210 200 0 2 4 6 8 Soldering Time (secs.) 10 12 Allowable range of peak temp./time combination for IR reflow 260 DANGEROUS RANGE Temperature ( oC) A suitable combination for wavesoldering is 230 - 250°C for 3 - 5 seconds. 250 ALLOWABLE RANGE WITH CARE 240 230 RECOMMENDED RANGE 220 210 0 35 15 30 TIME IN SECONDS 45 60
  38. 38. Technical Summary and Application Guidelines Recommended Soldering Profiles Recommended soldering profiles for surface mounting of tantalum capacitors is provided in figure below. IR Reflow Recommended Ramp Rate Less than 2°C/sec. Wave Soldering Vapor Phase After soldering the assembly should preferably be allowed to cool naturally. In the event that assisted cooling is used, the rate of change in temperature should not exceed that used in reflow. 36
  39. 39. Technical Summary and Application Guidelines Mechanical and Thermal Properties/Qualification Approval Status Section 5: Mechanical and Thermal Properties of Capacitors 5.1 Acceleration D C z 98.1m/s2 (10g) Y B x 5.2 Vibration Severity PW A 10 to 2000Hz, 0.75 mm of 98.1m/s2 (10g) PL 5.3 Shock Trapezoidal Pulse, 98.1m/s for 6ms. PS PSL Dimensions PS (Pad Separation) and PW (Pad Width) are calculated using dimensions x and z. Dimension y may vary, depending on whether reflow or wave soldering is to be performed. For reflow soldering, the dimensions PL (Pad Length), PW (Pad Width), and PSL (Pad Set Length) have been calculated. For wave soldering the pad width (PWw) is reduced to less than the termination width to minimize the amount of solder pick up while ensuring that a good joint can be produced. Note: these recommendations (also in compliance with EIA) are guidelines only with care and control, smaller footprints may be considered for reflow soldering. Nominal footprint and pad dimensions for each case size are given in the following tables: 5.4 Adhesion to Substrate IEC 384-3. minimum of 5N. 5.5 Resistance to Substrate Bending The component has compliant leads which reduces the risk of stress on the capacitor due to substrate bending. 5.6 Soldering Conditions Dip soldering is permissible provided the solder bath temperature is Յ 270°C, the solder time Ͻ 3 seconds and the circuit board thickness Ն 1.0mm. 5.7 Installation Instructions Pad Dimensions: inches (mm) Case TAJ/ A TPS B C D V* E R S T The upper temperature limit (maximum capacitor surface temperature) must not be exceeded even under the most unfavorable conditions when the capacitor is installed. This must be considered particularly when it is positioned near components which radiate heat strongly (e.g. valves and power transistors). Furthermore, care must be taken, when bending the wires, that the bending forces do not strain the capacitor housing. 5.8 Installation Position No restriction. 5.9 Soldering Instructions PSL 0.157 (4.0) 0.157 (4.0) 0.257 (6.5) 0.315 (8.0) 0.325 (8.3) 0.315 (8.0) 0.100 (2.7) 0.160 (4.0) 0.160 (4.0) PL 0.055 (1.4) 0.055 (1.4) 0.079 (2.0) 0.079 (2.0) 0.090 (2.3) 0.079 (2.0) 0.040 (1.0) 0.050 (1.4) 0.050 (1.4) PS 0.047 (1.2) 0.047 (1.2) 0.098 (2.5) 0.157 (4.0) 0.145 (3.7) 0.157 (4.0) 0.040 (1.0) 0.040 (1.0) 0.040 (1.0) PW 0.071 (1.8) 0.110 (2.8) 0.110 (2.8) 0.119 (3.0) 0.245 (6.2) 0.119 (3.0) 0.060 (1.6) 0.070 (1.8) 0.110 (2.8) PWw 0.035 (0.9) 0.063 (1.6) 0.063 (1.6) 0.068 (1.7) 0.068 (1.7) 0.068 (1.7) 0.030 (0.8) 0.030 (0.8) 0.030 (0.8) Pad Dimensions: inches (mm) Fluxes containing acids must not be used. Case TAZ A B D E F G H 5.9.1 Guidelines for Surface Mount Footprints Component footprint and reflow pad design for AVX capacitors The component footprint is defined as the maximum board area taken up by the terminations. The footprint dimensions are given by A, B, C and D in the diagram, which corresponds to W1 max., A max., S min. and L max. for the component. The footprint is symmetric about the center lines. The dimensions x, y and z should be kept to a minimum to reduce rotational tendencies whilst allowing for visual inspection of the component and its solder fillet. PSL 0.128 (3.3) 0.178 (4.5) 0.178 (4.5) 0.228 (5.8) 0.248 (6.3) 0.293 (7.4) 0.313 (8.0) PL 0.054 (1.4) 0.054 (1.4) 0.054 (1.4) 0.054 (1.4) 0.054 (1.4) 0.074 (1.9) 0.074 (1.9) PS 0.020 (0.5) 0.070 (1.8) 0.070 (1.8) 0.120 (3.0) 0.140 (3.6) 0.145 (3.7) 0.165 (4.2) PW 0.098 (2.5) 0.098 (2.5) 0.143 (3.6) 0.143 (3.6) 0.178 (4.5) 0.157 (4.0) 0.197 (5.0) PWw 0.039 (1.0) 0.039 (1.0) 0.085 (2.2) 0.085 (2.2) 0.119 (3.0) 0.095 (2.4) 0.135 (3.4) Note: Wave solder pad lengths refer to parts mounted at right angles to the direction of travel through the wave. *Although these are the recommended pad dimensions for the V case capacitor, they will fit on TAJ/TPS D & E pad dimensions. 37
  40. 40. Technical Summary and Application Guidelines 8.2.4 Climatic sequence Capacitors are subjected to 16 hours at 125ЊC; accelerated DHSS (40ЊC/95% RH/5 x 12 hours cycle; 6 hours recovery between cycles). After 1-2 hours recovery, components must meet: Section 6: Epoxy Flammability EPOXY UL RATING OXYGEN INDEX TAJ Hysol MG 33 TPS Hysol MG 33 TAZ Hysol MG 40 UL94 Vл UL94 Vл UL94 Vл 35% 35% 35% TAJ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽ1.2 x Initial Limit Section 7: Qualification Approval Status DESCRIPTION STYLE TAJ CECC 30801 - 005 Issue 2 CECC 30801 - 011 Issue 1 IECQ PQC - 32 GB0003 Issue 1 MIL-C-55265/8 (CWR11) TAZ 8.2.5 Surge testing Capacitors are subjected to 1000 cycles of 1.3 x rated voltage for 30 seconds followed by a 30-second discharge period. SPECIFICATION Surface mount capacitors MIL-C-55365/4 (CWR09) TAJ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial Limit 8.1 Qualification tests When converting designs from through hole to surface mount, specifications should be checked to ensure compatibility with the performance standards of the surface mount devices. As a guide, test limits for TAJ and TAZ series are set out below. TAJ is qualified to IEC PQC-32 GB0003 and MIL-C-55365/8 (CWR11). TAZ is qualified to MIL-C-55365/4 (CWR09). 8.2 Qualification test limits STEP 1 (25Ϯ2)ЊC Meet initial limits for CAP, DCL, and DF STEP 2 (-55Ϯ3)ЊC TAJ ⌬CRϽϮ8% of Initial Value DFϽ9% TAJ ⌬CRϽϮ3% of Initial Value DCLϽInitial Limit DFϽInitial Limit TAJ TAJ ⌬CRϽ+8% of Initial Value DCLϽ0.1 CVR or 1 µA* DFϽ7.2% ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽ1.2 x Initial Limit TAZ ⌬CRϽϮ10% of Initial Value DCLϽ10 x Initial Limit DFϽ8% for VR Ն15v DFϽ12% for VR Ͻ15v *Whichever is greater STEP 5 (125Ϯ2)ЊC TAZ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial Limit TAJ ⌬CRϽ+12% of Initial Value DCLϽ0.125 CVC or 1 µA* DFϽ9% 8.2.3 Humidity test Capacitors are subjected to damp heat at steady state (DHSS). The conditions are 40ЊC with 95% RH (Relative Humidity) for 56 days. After 1-2 hours recovery, components must meet: TAJ TAZ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial Limit STEP 4 (85Ϯ2)ЊC TAZ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial 8.2.2 Thermal shock test Capacitors are subjected to 5 cycles of 30 mins. at -55ЊC followed by 30 mins at 125ЊC. After 1-2 hours recovery, components must meet: ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial Limit TAZ ⌬CRϽϮ10% of Initial Value DFϽ8% for VRм20v DFϽ12% for VRϽ20v STEP 3 (25Ϯ2)ЊC 8.2.1 Life test Capacitors are subjected to 85ЊC at rated volts, and 125ЊC at 2/3 x rated volts, for 2000 hrs. with 3⍀ circuit impedance. After 1-2 hours recovery, components must meet: TAJ TAZ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial Limit 8.2.6 Temperature stability Capacitors are subjected to the following sequence. Electrical requirements are tabulated below. Section 8: ⌬CRϽϮ10% of Initial Value DCLϽ1.25 x Initial Limit DFϽInitial Limit TAZ ⌬CRϽϮ10% of Initial Value DCLϽInitial Limit DFϽ1.2 x Initial Limit TAZ ⌬CRϽϮ15% of Initial Value DCLϽ12 x Initial Limit DFϽ8% for VR Ն20v DFϽ12% for VR Ͻ20v *Whichever is greater STEP 6 (25Ϯ2)ЊC TAJ TAZ ⌬CRϽϮ3% of Initial Value DCLϽInitial Limit DFϽInitial Limit ⌬CRϽϮ10% of Initial Value DCLϽInitial Limit DFϽ1.2 x Initial Limit 38 TAZ ⌬CRϽϮ5% of Initial Value DCLϽInitial Limit DFϽInitial Limit

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