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Packaging Innovations
Working in collaboration with Antistat
Peel Pack Solution
Innovative, patented IC packaging solution, providing complete protection for small quantity shipments ...
•  Clear product identification   •  All round protection in transit and storage
•  Reduced moisture ingress       •  Use ...
• Eradicates pin damage
                  • Improved bin accuracy and reduced product damage
• Reduction in customer compl...
Bio Bag
Unique, fully biodegradable, static dissipative packaging solution for electronics and electronic components
This new, innovative packaging developed by Antistat exclusively for Farnell, provides an environmentally-
friendly altern...
Static charge decay: < 0.002s
                                                                                           S...
“Estimated to replace 3.6 million
polythene bags despatched by
Farnell in Europe each year, with
plans in place to extend ...
Jedec Trays
An exciting, new generation of industry standard, Jedec Trays in development
• Made from recycled and recyclable materials
• Currently in field trials with leading global component manufacturer
• Comparatively lighter in weight and offers significantly reduced cost over existing tray solutions
• Costs reduced by hal...
Working in collaboration with Antistat

Antistat are a leading packaging and supply chain specialist that, through a long-...
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Innovative Packaging Presentation

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Innovative Packaging for the Electronics Industry brought to you by Antistat.

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Innovative Packaging Presentation

  1. 1. Packaging Innovations Working in collaboration with Antistat
  2. 2. Peel Pack Solution Innovative, patented IC packaging solution, providing complete protection for small quantity shipments such as sample management, small production runs, customer trials
  3. 3. •  Clear product identification •  All round protection in transit and storage •  Reduced moisture ingress •  Use only what you need •  Anti static protection •  Made from recycled material and is recyclable
  4. 4. • Eradicates pin damage • Improved bin accuracy and reduced product damage • Reduction in customer complaints • Reduced packaging cost & dunnage due to smaller footprint • Customer satisfaction rates increase • Reduced packaging time
  5. 5. Bio Bag Unique, fully biodegradable, static dissipative packaging solution for electronics and electronic components
  6. 6. This new, innovative packaging developed by Antistat exclusively for Farnell, provides an environmentally- friendly alternative to standard polythene ESD packaging
  7. 7. Static charge decay: < 0.002s Surface resistivity: < 1x1010 ohms/sq •  Offers the same level of protection as standard ESD packaging •  Fully biodegradable to the recognised European standard (EN13432) •  No harmful chemicals released into the environment •  Biobags can be disposed of in general waste but are most effective in industrial composting systems
  8. 8. “Estimated to replace 3.6 million polythene bags despatched by Farnell in Europe each year, with plans in place to extend to APAC and the Americas”. Climate change and waste are growing global concerns. With the inherent static dissipative properties, it represents an electronics industry-first and provides an opportunity for your business to make a real difference to the impact we have on our environment as well as being a key differentiator We are currently working with Antistat to extend the use of the material to other packaging types.
  9. 9. Jedec Trays An exciting, new generation of industry standard, Jedec Trays in development
  10. 10. • Made from recycled and recyclable materials • Currently in field trials with leading global component manufacturer
  11. 11. • Comparatively lighter in weight and offers significantly reduced cost over existing tray solutions • Costs reduced by half! • Weight reduced by over 60% offering reduced shipping costs and improved carbon footprint
  12. 12. Working in collaboration with Antistat Antistat are a leading packaging and supply chain specialist that, through a long-standing partnership, have worked with us to create a suite of innovative, environmentally-friendly packaging solutions designed to protect electronic components in transit and storage. Collectively, they present an opportunity to reduce costs and reduce the impact our businesses and our industry has on the environment. Farnell Antistat Justin Willoughby John Hensley Head of Service – Europe Managing Director jwilloughby@farnell.com johnhensley@antistat.co.uk Tel: +44 (0)113 233 8127 Tel: +44 (0)1473 836200 Mobile: +44 (0)7730 015843 Mobile: +44 (0)771 422 0379

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