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Galaxy core inc 2014-02-25-v1.0

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Galaxy core inc 2014-02-25-v1.0

  1. 1. GalaxyCore Inc. 2014-02-24
  2. 2. Company Information Founded Registered Capital 2003 US$ 20 million Headcount Business Nature 900+ Joint stock enterpriseBusiness Nature Primary Business R 2013 Joint stock enterprise Design and sale of CMOS image sensor & LCD driver US$ 303 illiRevenue 2013 Sales Volume 2013 US$ 303million 963 Million Units (CIS: 859M; LCD:103M)
  3. 3. Organization Structure R&D Centre (USA) IC Design Dept. I Digital Team A l T Board R&D Centre IC Design Dept. II Marketing&Application Dept. M f i T D Analog Team Operations Centre Manufacturing Test Dept. Quality Management Dept. Plan & Logistics Dept. CEO Process Technology Dept. Shanghai Sales Dept. Beijing Sales& FAE Team Sales & FAE Team Project Management Group Sales Centre Beijing Sales& FAE Team Taipei Sales Dept. Shenzhen Sales Branch Sales & FAE Team Custom Service Group HK St Resource Centre HR Dept. Administration Dept Process & IT Dept. HK Storage p CFO Finance Dept.
  4. 4. Branch Office Beijing,  China Silicon Valley  Silicon Valley,  US Shanghai (headquarter ),  ChinaChina Taipei, China Shenzhen, China
  5. 5. Investment Private FundsPrivate Funds Xin Hong
  6. 6. Milestones 5M pixel Mass Production 2013 BSI Mass Production in TSMC 2012 20VGA 65% of Market Share in China 2007 2011 4T Technology VGA Mass Production 2007 2005VGA Mass Production Founded 2003
  7. 7. Historical Sales Data 350 1200 303 250 300 9601000 194 210 200 250 601 650 600 800 65 130 100 150 355400 8 8 24 0 50 6 10 35 130 0 200 Revenue Shipment
  8. 8. Domestic Supply Chain (CMOS Sensor) IC DesignIC Design Foundry ColorFilter Packaging Testing
  9. 9. Automated Testing House -CMOS Sensor  Automatic Testing Process  Total Capacity :100million pcs/M Automatic testing machine, designed by GalaxyCore Manufacturing Execution System(MES) from IBM
  10. 10. Camera Sensor Roadmap Series Mass Production 2014/Q1 2014/Q2 2014/Q3 2014/Q4 >10M GC13003 Raw MIPI BSI 8M BSI GC8003 1/3.2" 1.4 μm Raw MIPI BSI Raw MIPI BSI BSI 5M HD/FHD GC1036 HD 1/6 5" 1 75 μm GC1004 HD 1/4" 3 4 μm GC2355 1/5" 1 75 μm GC1136 1/6 5" 1 75 μm GC5004 1/4" 1.4 μm Raw MIPI DVP GC5004A 1/4" 1.4 μm Raw MIPI GC5024 1/4" 1.4 μm Raw MIPI BSI BSI BSI HD/FHD 2M GC2035 1/5" 1.75 μm SOC MIPI DVP GC2235 1/5" 1.75 μm Raw MIPI DVP BSI 1/6.5 1.75 μm RAW MIPI DVP GC2155 1/5" 1.75 μm SOC MIPI DVP GC2145 1/5" 1.75 μm SOC MIPI DVP 1/4 3.4 μm Raw MIPI DVP 1/5 1.75 μm Raw MIPI DVP 1/6.5 1.75 μm SOC MIPI DVP GC2255 1/5" 1.75 μm Raw MIPI DVP BSI VGA GC0328 1/6.5" 3.4 μm SOC DVP GC0308 1/6.5" 3.4 μm SOC DVP GC0329 GC0339 GC0313 1/13" 1.75 μm SOC MIPI DVP GC0311 GC0310 1/10" 2.2 SOC DVP/MIPI/SPI GC0312 QVGA GC0329 1/9" 2.5 μm SOC DVP GC0339 1/9" 2.5 μm Raw MIPI GC0311 1/11" 2.0 μm SOC DVP GC6113 1/11" 3.2 μm GC6103 1/11" 3.2 μm R SPI GC6123 1/11" 2.8 μm SOC SPI GC0312 1/10" 2.2 SOC DVP GC6133 SOC SPI Mass Production Developing Planning SOC SPI Raw SPI SOC SPI SOC SPI
  11. 11. LCD Driver IC Roadmap Series Resolution Mass Production 2014/Q1 2014/Q2 2014/Q3 2014/Q4 2015/Q1 2015/Q2 2015/Q3 2015/Q4 >10M 1080RGBx1920 8M 720RGBx1280 GC9801 GC9701 QHD 540RGBx960 GC9601 GIP, MIPI/MDDI, 24b, CE,  w/CABC,  R/G/B, DC‐VCOM WVGA 480GBx800 HVGA 320RGBx480 MIPI/MDDI, w/CABC, R/G/B GC9404GC9403 GC9501 QVGA 240RGBx320 GC9312 2C GC9304 0C 0C QCIF+ 176RGBx220 QQVGA 128RGBx160 GC9201 2C GC9102 0C GC9103 0C GC9202 0C Mass Production Developing Planning
  12. 12. Customers

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