About DAETEC

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About DAETEC

  1. 1. Diversified Applications Engineering Technologies Company Profile – www.daetec.com 1
  2. 2. Technology has many barriers Most are Internal • Ability to change with the markets • Ability to react • Ability to find answers • Ability to assemble resources • All at low cost Company Profile – www.daetec.com 2
  3. 3. How Does One Cross to a New Market, Reach a New Customer, or Find Answers? Will it be one or more of these? •Increase investment – testing & applications •New product development •New tool design •New process design •Modification or ancillary •Bundling Company Profile – www.daetec.com 3
  4. 4. What’s the right level of resources? What is needed to… •Stay on schedule •Overcome challenges •Acquire IP •Ready for scale-up •Train staff •Respond to customers •Support the Market Company Profile – www.daetec.com 4
  5. 5. What’s the shortest path to achieve your objective? How do you… •Stay on-track •Maintain revenue from core business •Avoid hitting road-blocks •Keep on schedule •Who will drive this effort? Company Profile – www.daetec.com 5
  6. 6. DAETEC We can be your bridge into new markets Company Profile – www.daetec.com 6
  7. 7. DAETEC is a Bridge Between One Source to Another •Suppliers •End-Users •Wafer Fabs •Assemblers •Manufacturers •Consumers •New Products •Solutions •New Markets •Ancillaries •New Processes Company Profile – www.daetec.com 7
  8. 8. Partner Facilities to Scale-Up • R&D in Camarillo, CA • Partner Fab in Santa Barbara, CA (30,000 sf) • Access to Toll Mftg at six (6) locations in USA Company Profile – www.daetec.com 8
  9. 9. History Daetec lab designed and ‘95 John Moore founds ‘05 Moore founds Daetec, built, equipment Moore Enviro-Chemical, Inc. resigns from GCC. capitalized. (MEC) ’95-’00 Moore develops PR ‘00-’05 Moore starts strippers, cleaners, specialty products division at polymers for GCC and designs semiconductors, GenSolveTM, GenTakTM, aerospace, and GenCleanTM for top-tier automotive. semiconductor firms. ‘99 Moore develops aqueous ‘00 General Chemical Corp soluble polymers and (GCC) purchases MEC, cleaners at MEC for Moore becomes Product slicing/dicing – used to found Development Director of Aquabond technologies, ‘02 Electronic Chem Division. sale to private investors. Company Profile – www.daetec.com 9
  10. 10. Successful Commercialization Product Application Industry Spin-On Polymer High Temperature Wafer Bonding Semiconductor Metal Safe PR Stripper Negative Tone and Acrylic Stripper Semiconductor Dissolving Gel Cured Polysulfide Resin Stripper Aviation EHS Safe Stripper Negative Tone Isoprene & Semiconductor Bisbenzocyclobutene Spin-On Thermoplastic Med Temperature Wafer Bonding Compound Semiconductor Aqueous Etch Residue Cleaner Copper/Low k residue remover Semiconductor Aqueous Based Spin-On Polymer Polishing, Slicing, Dicing Electronics/Semiconductor Aqueous Based Polymer Remover Remover of Aqueous Based Polymer Electronics/Semiconductor Spray Coat Polymer Wafer Protection/bonding Compound Semiconductor Spin-On Protection Coating Acid Etch Protection Layer MEMS Please contact us to see any pertinent publications and patents. Company Profile – www.daetec.com 10
  11. 11. Markets Served Microelectronics •Silicon, GaAs & other compound semi, FPD, data storage, MEMS •Cleans - PR stripper & rinsing •Coatings – cured polymers, adhesives •Rinses – surface active agents, non-foam •Inhibitors – substrate & metal protection Company Profile – www.daetec.com 11
  12. 12. Markets Served Aerospace/Aviation •Polymer sealants & coatings – high temp, low CTE, special engineering apps. •Cleaners – dissolve & remove oils, silicones, polysulfides, epoxies, others. Company Profile – www.daetec.com 12
  13. 13. Markets Served Industrial •Automotive •Construction, roofing, coating •Metal working, machining •EHS compliant coatings & cleans Company Profile – www.daetec.com 13
  14. 14. Just a few of our past partners… Company Profile – www.daetec.com 14
  15. 15. What We Do… • Product Development • Material Modification • New Application Development • Process Design • Tool Design Demo • Ancillaries • Yield Enhancement • EHS Compliance Review Company Profile – www.daetec.com 15
  16. 16. Technical Capabilities   Properties—physical and chemical Process modeling—screening testing  Cleaning and residue characterization  New process demonstration  Coating applications and processing  Etch rates  Polymer compounding—  Electrical properties for I-V curves  SEM & CD analysis thermoplastics  Curing—thermal & radiation  ESCA/XPS  Properties—mechanical and adhesion  FIB  Corrosion potential & evaluation  SIMS  Thin film analysis & electrical characterization These and other tests allows us to immediately focus on those areas with the most potential to improve the customers processes and applications. Company Profile – www.daetec.com 16
  17. 17. Program Planning with Market Targets Successful commercialization depends upon market experience installed into your development schedule Flat Panel Mftg Company Profile – www.daetec.com
  18. 18. Intellectual Property •IP Assigned to Customer •Greater Value to Investment •Greater Flexibility on Business Model Company Profile – www.daetec.com 18
  19. 19. Creativity to New Heights! • Creative ideas are the core of our business and we continually push those limits to new levels; • Your objective represents an important part of our growth. This interdependency fuels our program; • Creating new answers often provides new business options, leading to greater market capture. Company Profile – www.daetec.com 19
  20. 20. Results in Record Time Compatibility Applications DAETEC prefers screening tests over large DOEs. Screening tests = many options + statistics Options = less challenges + faster results Fast results = less cost Company Profile – www.daetec.com 20
  21. 21. Cost Effective We Stretch Our Resources to Reduce Costs • Screening tests are inherently less costly • Require a creative approach • Multi-tasked experiments using abbreviated number of specimens Company Profile – www.daetec.com 21
  22. 22. Applications Coatings Technologies Coating Optimization Understanding PR Polymers Coatings Electrical Testing Substrate Thinning Inhibitors for Corrosion Control CLEANING Materials and Processing Wafer Bumping Panels (Solar/FPD) PLATING Electrolytic/less Etchants and Surface Finishing Process Optimization Company Profile – www.daetec.com 22
  23. 23. Coatings Technologies • Spin-Coating • Spray Coating • Slit/Brush/Roll Cured Water Cleans (2 steps) • Films Coating Rinse 1 X Puddle + 1 X Spin • Molding • Photo initiated • Thermal/Electrical Conductive • Temporary/Permanent Company Profile – www.daetec.com 23
  24. 24. Coating Optimization State-of-the-art characterization techniques Conformal Planarize Company Profile – www.daetec.com
  25. 25. Understanding PR Polymers DNQ Ketene Acid Non-polar Polar Polar Company Profile – www.daetec.com
  26. 26. Coatings Electrical Testing •Hg Probe – Sensitive for Thin Films •Rapid Measurement •IV curves, Dielectric Const., Loss Tangent Hg-Probe I-V Plots of Triazoles on Cu 60.0 Triazoles, 0.5% Aqueous Solns RT 30sec Exposure 50.0 TTA Current (uAmps) 40.0 •Hg dot contact is non-destructive 30.0 BTA Triazole •Used for Epi-layers and films 20.0 Mix <50Angstroms 10.0 •Ideal for Oxide Layers, Inhibitors, 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 and Used for Residue Detection Voltage (volts) Company Profile – www.daetec.com
  27. 27. Substrate Thinning •Substrates to <20um •Protection for Backside Processing •Simple Application & Removal •Permanent Systems •High Temps >400C & Low CTE •Wide Range of Process Options •Coating Over Bumps •Applicable to MEMS •Aqueous Cleans Available •Cleans for Single Wafer & Batch Many Polymer Options Company Profile – www.daetec.com
  28. 28. Inhibitors for Corrosion Control Pourbaix Diagrams & Tafel Plots to Correct Corrosion Feature Inhibitor Corrosion Added Company Profile – www.daetec.com 28
  29. 29. Cleaning – Materials & Processing • Polymers & Residue • Cured Systems: Silicone, Urethane, Acrylic, Epoxy, Rubber, Sulfides • Insulators: Polyimide, Etch Residue, Before Clean Via BCB, PBO, Silicates • Hydrocarbons: Oils, Greases • Aqueous Cleans Polyimide, Before Polyimide Removal Company Profile – www.daetec.com 29
  30. 30. Cleaning – Wafer Bumping Plated Solder Before Strip After Strip Wet PR Wet PR App. Exposure & Develop Solder Plating PR Strip/Cleans Alkali + Solvent Minor Issues in Cleans Flux Reflow to 220C Company Profile – www.daetec.com 30
  31. 31. Cleaning – Panels (Solar/FPD) Company Profile – www.daetec.com 31
  32. 32. Plating – Electrolytic/less • Cu + Alloy Processes • Co Electroless Capping • Ni Hypophos • NiFe/NiFeCo Heads • Sn and Alloys • Au Processes • Exchange Processes • Initiating/Striking Company Profile – www.daetec.com 32
  33. 33. Etchants & Surface Finishing • Au Etch (aqueous & Irregular Etch solvent) • Buffered Oxide Etch (BOE) • Chrome Etch • Si Etch (acid & base) • Mixed Acid Etch (MAE) • Phos Acid Etch PAE) • Surfactanated Etchants Company Profile – www.daetec.com 33
  34. 34. Process Improvement Isolating Factors in the Process Step Company Profile – www.daetec.com 34
  35. 35. Process Improvement Factors Affecting Performance •Process Flow •Residue Removal •Cleans Improvement •Yield Improvement •Monitoring & Controls Survey Process Materials, Stability, Life •Product Development Simple, On-Site Eliminate Monitor & Process Controls Excursions Company Profile – www.daetec.com 35
  36. 36. Process Improvement Studying Interactions Between Process Steps 2. Resist 3. Exposure 1. Substrate Coating Cleaning Plasma 6. Resist 5. Etching 4. Develop Stripping Company Profile – www.daetec.com 36
  37. 37. Fab Equipment Optimization How Materials Work in a Specific Tool Company Profile – www.daetec.com 37
  38. 38. EHS Compliant Development • Solvent Replacement • Eliminate Toxic or Regulated Items with Aqueous Agents • Eliminate Haz Waste • Green Coatings • Green Cost Reduction • Green Cleaners • Reduced Energy Use Company Profile – www.daetec.com 38
  39. 39. Draft Plan to Contract 2-Objective 3-Plan 1-Contact * Solution Need * New Product * Deliverables Daetec * Complementary * Timing & Product * IP Customer * Bundle Option * Costs * New Technology Adjust 5-Action 4-Contract 6-Completion * Progress Reports * Written * Deliverables * Customer Meets Document * Payment for Objective * Work Plan – Services * Customer has IP * Completion – Same as (3) most in 6mos Company Profile – www.daetec.com 39
  40. 40. To implement a new and innovative plan, contact us! John Moore Technical Director jmoore@daetec.com Daetec, LLC Diversified Applications Engineering Technologies www.daetec.com 1227 Flynn Rd., Unit 310 Camarillo, CA 93012-8551 Phone: 805-484-5546 Fax: 805-484-5556 Company Profile – www.daetec.com 40

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