Core i71


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Core i71

  1. 1. Welcome To Seminar OnINTEL CORE i7 Presented By: Isha Rana 11101333 1
  2. 2. INTRODUCTION• A Central Processing Unit (CPU), or sometimes just called processor, is a description of a class of logic machines that can execute computer programs.• Intel Core i7 is a family of three Intel desktop processors, the first processors released using the Intel Nehalem micro architecture and the successor to the Intel Core 2 family. All three models are quad-core processors. 2
  3. 3. INTEL CORE• Intel Core is a brand name used for various mid - range to high-end consumer and business micro processors made by Intel.• Identical or more capable versions of Core processors are also sold as Xeon processors for the server The current Core processors Intel core i7 Intel core i5 Intel core i3 The old core processors include: Intel core 2 solo Intel core 2 Duo Intel core 2 Quad Intel core 2 extreme 3
  4. 4. INTEL CORETypes of Intel core micro processors : Enhanced Pentium M based Core Duo Core Solo 64 bit Core micro architecture based Core 2 Duo Core 2 Solo Core 2 Quad Core 2 Extreme Nehalem micro architecture based Core i3 Core i5 Core i7 4
  5. 5. INTEL COREEnhanced Pentium M based :The original Core brand refers to Intel’s 32 bit mobile dual core x86 CPU s that derived from the Pentium M branded processors.Core Duo : Intel Core Duo (product code 80539) consists of two cores on one die, a 2 MB L2 cache shared by both cores, and an arbiter bus that controls both L2 cache and FSB(Front side bus).Core Solo : Intel Core Solo (product code 80538) uses the same two-core die as the Core Duo, but features only one active core. This allows Intel to sell dies that have a manufacturing defect in one but not both of the cores. 5
  6. 6. INTEL CORE64 bit micro architecture based : The successor to Core is the mobile version of the Intel core 2 line of processors using cores based upon the Intel Core micro architecture released on July 27, 2006.Core 2 Solo : The Core 2 Solo introduced in September 2007, is the successor to the Core Solo and is available only as an ultra-low-power mobile processor with 5.5 Watt thermal design power.Core 2 Duo : The majority of the desktop and mobile Core 2 processor variants are Core 2 Duo with two processor cores on a single Merom , Conroe , Allendale, Penryn or Wolfdale chip. 6
  7. 7. INTEL CORECore 2 Quad : Core 2 Quad processors are multi chip modules consisting of two dies similar to those used in Core 2 Duo, forming a quad-core processor. This allows twice the performance of a dual-core processors at the same clock frequency.Core 2 Extreme : Core 2 Extreme processors are enthusiast versions of Core 2 Duo and Core 2 Quad processors, usually with a higher clock frequency and an unlocked clock multiplier. 7
  8. 8. INTEL CORENehalem micro architecture based :The Nehalem micro architecture Intel introduced a new naming scheme for it . The Core i3 was intended to be the new low end of the performance processor line from IntelCore i3 : The first Core i3 processors were launched on January 7, 2010. The first Nehalem based Core i3 was Clarkdale based Core processors. There are three variants, Core i3, Core i5, and Core i7.Core i5 : Core i5, like Core i7, is based on the Nehalem micro architecture. The first Core i5 was introduced on September 8, 2009 and was a mainstream variant of the earlier Core i7. 8
  9. 9. INTEL CORECore i7 : The Core i7 brand remains the high-end for Intels desktop and mobile processors, featuring the Sandy Bridge models with the largest amount of L3 cache and the highest clock frequency.Processors :• The initial Core i7 processors released were codenamed Bloomfield, branded as Core i7-9xx along with their Xeon 3500-series counterparts.• Lynnfield is the second processor sold under the Core i7 brand, while at the same time being sold as Core i5• The second mobile Core i7 processor family is Arrandale, sold as the Core i7-6xx processors• Sandy bridge is the second generation Intel Core i7 series processor, and is based on micro architecture 9
  10. 10. FEATURES of i7 1. SOCKET: The Socket is a new LGA1366(Socket B) and is incompatible with the previous versions: LGA refers to Land Grid Array, a new type of socket for the latest range of processors. The LGA is used as a physical interface for microprocessors of the Intel Pentium 4, Intel Xeon, Intel Core 2 and AMD Opteron families. Unlike the pin grid array (PGA) interface found on most AMD and older Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch pins on the motherboard. Intel supposedly decided to switch to an LGA socket because it provides a larger contact point, allowing, for example, higher clock frequencies. The LGA setup provides higher pin densities, allowing more power contacts and thus a more stable power supply to the chip. 10
  11. 11. LGA1366 socket with pickand place cover removed
  12. 12. 2. ON-DIE MEMORY CONTROLLER: The memory is directly connected to the processor. Three channel memory: each channel can support one or two DDR3 RAM’s. Motherboards for Core i7 have four or six RAM slots. Supports DDR3• DDR3 RAM (double-data-rate three random access memory ) is a random access memory technology used for high speed storage of the working data in the computer.• The benefit of DDR3 is the ability to run its I/O bus at four times the speed of the memory cells it contains, thus enabling faster bus speeds and higher peak throughput than earlier memory technologies.• The DDR3 standard allows for chip capacities of 512 megabits to 8 gigabits, effectively enabling a maximum memory module size of 16 gigabytes.• There is a significant reduction in power consumption. It needs only 1.5V compared to 1.8V for DDR2. 12
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  14. 14. 3. Quick Path Interconnect:T he front side bus is replaced by Quick Path interconnect. Motherboards must use a chipset that supports Quick Path. the Front Side Bus (FSB) is the bus that carries data between the CPU and the north bridge. Front side buses serve as a connection between the CPU and the rest of the hardware via a so-called chipset. This chipset is usually divided in a north bridge and a south bridge part, and is the connection point for all other buses in the system Pros: FSB architecture is an aging technology. High flexibility , low cost and no theoretical limit to the number of CPUs that can be placed on a FSB. Cons: In recent years this has been breaking down with increasing use of individual point-to-point buses (see Hyper Transport and Quick Path). The front side bus has been criticized by AMD as being an old and slow technology that bottlenecks todays computer systems. 14
  15. 15.  The Intel QuickPath Interconnect (QPI) is a point-to-point processor interconnect developed by Intel to compete with HyperTransport. It will replace the Front Side Bus (FSB) for Desktop. The speed of data transfer is 25.6 Gbps, almost double that of FSB. 15
  16. 16. 4. Cache Memory 32 KB L1 instruction and 32 KB L1 data cache per core. 256 KB L2 cache (combined instruction and data) per core. 8 MB L3 (combined instruction and data) shared by all cores. 16
  17. 17. (a). Re-implemented Hyper-threading. Each of the four cores can process up to two threads simultaneously, so the processor appears to the OS as eight CPUs. Hyper-threading (officially termed Hyper-Threading Technology or HTT) is an Intel technology used to improve parallelization of computations performed on PC microprocessors.(b). 781M transistors for the quad core version.(c ). Sophisticated power management can place an unused core in a zero-power mode.5. Support for SSE4.2 & SSE4.1 instruction sets. SSE4 is an instruction set used in the Intel Core microarchitecture and AMD. Intel SSE4 consists of 54 instructions. A subset consisting of 47 instructions, referred to as SSE4.1. Additionally, SSE4.2, a second subset consisting of the 7 remaining instructions, will first be available in Core i7. 17
  18. 18. 6. Overclocking : Overclocking is the process of forcing a computer component to run at a higher clock rate (more clock cycles per second) than it was designed for or was designated by the manufacturer, usually practiced by personal computer enthusiasts in order to increase the performance of their computers. The idea is simple by varying the electrical and physical characteristics of computing systems. The first consideration is to ensure that the component is supplied with adequate power to operate at the new speed. However, supplying the power with improper settings or applying excessive voltage can permanently damage a component. 18
  19. 19. CHIPSET in i7 A chipset is a group of integrated circuits, or chips, that are designed to work together, and are usually marketed as a single product. In personal computers based on Intel Pentium-class microprocessors, the term often refers to a specific pair of chips on the motherboard: the northbridge and the southbridge. The northbridge links the CPU to very high-speed devices, especially main memory and graphics controllers, and the southbridge connects to lower-speed peripheral buses (such as PCI or ISA). In many modern chipsets, the southbridge actually contains some on-chip integrated peripherals, such as Ethernet, USB, and audio devices. A chipset is usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance. 19
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  21. 21.  The northbridge typically handles communications among the CPU, RAM, AGP or PCI Express, and the southbridge. Some northbridges also contain integrated video controllers, also known as a Graphics and Memory Controller Hub (GMCH) in Intel systems. The southbridge is a chip that implements the "slower" capabilities of the motherboard. Because the southbridge is further removed from the CPU, it is given responsibility for the slower devices on a typical microcomputer. 21
  22. 22. VARIANTS IN i7 22
  23. 23. Codename Brand name Cores L3 Cache Socket TDP I/O Bus(main article) (list) Core i7-980X Gulftown 6 12MB Core i7-970 Core i7-9xx LGA 1366 130 W QuickPath Extreme Bloomfield Edition Core i7-9xx Core i7-8xx 95 W Lynnfield LGA 1156 Core i7-8xxS 82 W 8 MB Core i7- 4 9xxXM 55 W Extreme Direct Media Edition Interface Clarksfield Core i7- 8xxQM 45 W Core i7- µPGA-989 6 MB 7xxQM Core i7-6xxM 35 W Core i7- Direct Media 25 W Arrandale 6xxLM 2 4 MB Interface, Integrated GPU Core i7- 18 W 6xxUM
  24. 24. COMPARISON BETWEEN i3, i5& i7 24
  25. 25. CONCLUSION In a test performed on a leaked hardware, the core i7 outperformed the currently fastest core2 extreme processor. It has got the advantages of high performance, highly overclockable, quite cooling and power efficient. Some of the disadvantages include the requirement of newer motherboards, sensitive to higher voltage. The technology keeps on improving as the need for faster and high end applications increases. The i9 core version is about to be released soon. 26
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