Overclocking Innovation: New Opportunities and Enhancements

8/16/2016
1
Overclocking Innovation:
2016 Enhancements and
New Opportunities
Dan Ragland – Overclocking System Architect, Intel Corporation
Jon Sandström – Hardware R&D Engineer, ASUS
Mark Yu – Product Marketing Engineer, G.SKILL

8/16/2016
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3
WARNING: Altering clock frequency and/or voltage may: (i) reduce
system stability and useful life of the system and processor; (ii) cause the
processor and other system components to fail; (iii) cause reductions in system
performance; (iv) cause additional heat or other damage; and (v) affect system
data integrity. Intel has not tested, and does not warranty, the operation of the
processor beyond its specifications. Intel assumes no responsibility that the
processor, including if used with altered clock frequencies and/or voltages, will
be fit for any particular purpose.
For more information, visit:
http://www.intel.com/consumer/game/gaming-power.htm
Intel’s focus on overclocking continues!
4

8/16/2016
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Agenda
• Overclocking (OC) Architecture: 10-Core OC on Intel® X99 Chipset
• Live Overclocking Demonstration
• Motherboard OC Technology
• OC Architecture: Intel® Core™ i7-6700K Processor with Intel® Z170
Chipset
• Tools and Technology for OC
• Memory OC
• Summary and Q&A
5
Overclocking Experience: You Decide
6
• 6700K/6600K
• 4 core
• 16 PCI Express*
(PCIe*) lanes
• Intel® HD Graphics
• Unlocked
• 6950X/6900K/
6850K/6800K
• 10, 8, 6 core
• 40 PCIe lanes
• Unlocked
• Quad-channel
memory
• Intel® Turbo Boost
Max Technology 3.0
Extreme
Performance
Performance
unlocked

8/16/2016
4
Agenda
• OC Architecture: Intel® Core™ i7-6700K Processor with Intel® Z170 Chipset
• Memory OC
• Summary and Q&A
7
Intel® Core™ i7-6950X Processor Extreme Edition
Overclocking Intel’s First 10-Core Desktop Processor
• New! 10 Cores, 20 Threads
• New! Intel® Turbo Boost Max
Technology 3.0
• 40 PCI Express* 3.0 lanes
• 4 channel DDR4-2400 memory support
• Fully unlocked for performance tuning
• 25 MB Intel® Smart Cache
• Intel® Hyper-Threading Technology
• Supports LGA 2011-v3 socket
• Intel® Ready Mode Technology
Intel’s highest desktop class processor core count yet!
8

8/16/2016
5
Desktop Processors for Intel® X99 Chipset Based
Systems
Brand Name &
Processor Number1
Base Clock
Speed
(GHz)
Turbo
Boost Max
Tech
3.0
Turbo
Boost Freq
uency†
(GHz)
Cores/
Threads
Cache
PCI Express*
3.0 Lanes
Memory
Support
TDP
Socket
(LGA)
Intel® Core™ i7 6950X 3.0 √ Up to 3.5 10/20 25MB 40
4 channels
DDR4-2400
140W
2011-
v3
Intel Core i7 6900K 3.2 √ Up to 3.7 8/16 20MB 40
4 channels
DDR4-2400
140W
2011-
v3
4 channels
DDR4-2400
140W
2011-
v3
4 channels
DDR4-2400
140W
2011-
v3
9 †Refers to the maximum single-core frequency that can be achieved with Intel® Turbo Boost Technology 2.0
4 & 15
Extreme Overclocking Results
†Source: HWBOT article dated 2016-06-01
http://hwbot.org/newsflash/3653_launch_day_intel_core_i7_6950x_processor_extreme_edition_4_world_records_15_global_first_places
Disclaimer: These overclocking
results are not typical. Scores were
achieved by extreme overclockers
using LN2 and other advanced
techniques not commonly available
to average consumers. Overclocking
results are not guaranteed nor
covered by warranty.
10
Achieved on launch day†
Rankings change regularly.
Visit HWBOT.org for the
latest updates.

8/16/2016
6
Intel® Core™ i7 Processors for High-end Desktop:
Based on Socket LGA 2011-3 with Intel® X99 Express Chipset
DMI
DMI
PEG
PCIE
DMICLK/BCLK
Memory
Memory×M
×D
OC
BCLK
Non-OC
100MHz
×P
• Core Frequency
- Unlocked Intel® Turbo Boost Technology Limits
- Unlocked core ratios up to 80 in 100MHz
increments
- Programmable voltage offset and override
voltage via iVR
• Memory Ratio
- Unlocked memory controller Unlocked memory
controller voltage levels
- Granularity options for 200 and 266MHz
• DMICLK (aka BCLK)
- Unlocked PCH clock controller (<1MHz
increments upwards of 200MHz)
• PEG and DMI Ratios
- Variable BCKL: PEG/DMI ratios 5:5, 4:5,
3:5, for BCKL@ 100, 125, and 167 MHz
×C
×M
×D×P
PCI Express® (PCIe)
1 2
3 4
5 6
7 8
×C
9 10
Cores
×D
11
Clock Tree: BCLK Tuning
• Single BCLK input comes from
PCH in <1MHz steps
• Acceptable input to CPU limited
by PCI Express® (PCIe) and DMI
PLL interface:
100MHz x ±5-7% PEG/DMI @ 5:5
125MHz x ±5-7% PEG/DMI @ 5:4
167MHz x ±5-7% PEG/DMI @ 5:3
• Frequency Relationships
Freq.(Core) = BCLK*Core Ratio
Freq.(Ring) = BCLK*Ring Ratio
Freq.(DDR) = BCLK*1.33*DDR Ratio
-or-
Freq.(DDR) = BCLK*1.00*DDR Ratio
PCI Express® (PCIe*)

8/16/2016
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New Overclocking Capabilities†
Feature Details
Per Core Overclocking
Ability to OC Turbo Ratio of specific individual processor Cores.
Creates the opportunity to unleash more headroom on certain cores.
AVX Ratio Offset
Enables overclocked diversity between non-AVX2 and AVX2 Core
frequency levels. Can be utilized to enable higher frequencies for
non-AVX2 enabled applications by allowing AVX2 instructions to run
at lower frequencies.
VccU Voltage Control
Voltage control used to extract more frequency from Ring
overclocking. This is useful particularly in extreme (LN2) overclocking
scenarios.
†Overclocking results not guaranteed and subject to change.13
VccU Voltage Control
VccU
• Exposing new voltage knob to help
overclocking
• Increasing VccU can improve
extreme overclocking of Ring
‒ Benefits are greater under LN2
• Not recommended for typical
overclocking of Ring
• Can be accessed through BIOS
14 PCI Express* (PCIe*)Overclocking results not guaranteed and subject to change.

8/16/2016
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AVX Ratio Offset
• Core frequency can be reduced when AVX2 instructions are utilized
• Processing AVX2 instructions consumes more power and has a lower
overclocked frequency ceiling as compared to non-AVX2 instructions
• Benefits: 1) more stable OC’ing and 2) higher OC non-AVX2 frequency
15
• Allows operating at a different Turbo Frequency (ratio) based on instruction type
AVX=Advanced Vector Extensions. SSE=Streaming SIMD Extensions.
Non-
AVX2 Non-
AVX2 AVX2
AVX2
Intel® Turbo Boost Max Technology 3.0
16
• The silicon wafer fabrication process yields a natural diversity in capability
between the cores within each processor die (performance/voltage)
• Intel® Turbo Boost Max Technology 3.0 identifies the best performing core to
provide increased single threaded performance
• OS awareness or Intel’s core affinitization driver is required to get the greatest
performance benefit
Improves single thread performance without overclocking!
Processor 1
…
Best Core
Core 0 Core 1 Core 2 Core 3
Core 4
Core 9
Core 4
Core 9
Processor 2

8/16/2016
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• Prior architectures use a single
overclocking ratio for all cores on the die
‒ Limited by slowest core on the die
• Per-Core Overclocking enables a unique
OC ratio for each individual core
‒ Based on manufacturing variation,
some cores can run faster than
others
• Some reliability improvements possible
by targeting cores with lower initial
voltage
Per Core Overclocking!
• As an example, some of the cores may be capable of
200-400MHz additional OC headroom†
• Multi-core application performance improves
when using this capability
† Overclocking results not guaranteed and subject to change.
Per-Core overclocking is a significant game changer!
17
Agenda
• Memory OC
• Summary and Q&A
18

8/16/2016
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Overclocking Demo!
19
Agenda
• Memory OC
• Summary and Q&A
20

8/16/2016
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ASUS* ROG Rampage V Edition 10
21
Built for Overclocking
• 3 Overclocking World
Records† and 14 GFP †
using Intel® Core™ i7
6950X Processor
• Quad-channel DDR4 3333
(OC) support
• OC Zone
• 3x ROG microcontrollers
• OC Panel support
† As reported on 2016-05-31 at HWBot.org. GFP = Global First Place.
Slide and data provided by ASUS
ASUS* OC Zone
22
Simplifies Overclocking
• ReTry button
• Safe Boot button
• Slow Mode switch
• LN2 Mode jumper
• PCIe x16 lane switch
• DRAM channel switch
• Voltage measurement points
Slide provided by ASUS

8/16/2016
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ASUS* ROG Microcontrollers
23
The Master Puppeteers
• Voltage adjustments and
readouts
• Temperature sensing
• Advanced Fan Control
• USB BIOS Flash Back
• KeyBot
• OC Panel support
Slide provided by ASUS
ASUS* OC Panel II
24 Slide and data provided by ASUS

8/16/2016
13
Agenda
• Motherboard OC Technology with ASUS
• OC Architecture: Intel® Core™ i7-6700K processor with Intel® Z170 Chipset
• Memory OC with G.SKILL
• Summary and Q&A
25
Overclocking SKU Options:
for 6th Generation Intel® Core™ Processors
Intel® 100 Series Chipset
Intel® Core™ i7-6700K
Intel® Core™ i5-6600K
Intel Z170 Chipset
• Unlocked BCLK Frequency
• Unlocked Processor Ratios
• Unlocked Memory Ratio
• Unlocked Processor Graphics Ratio
• Unlocked Voltage controls
Overclocking Capabilities
26

8/16/2016
14
Overclocking Architecture Overview
Core Frequency
- Unlocked core ratios up to 83 in 100MHz increments†
- Complete Turbo overrides for Voltage, Power Limits,
IccMax
Graphics Frequency (pGfx)
- Unlocked graphics ratios up to 60 in 50MHz increments†
- Turbo Voltage controls
Memory Ratio
- Options for 100 and 133 MHz steps†
- Logical ratios up to at least 4133 MHz†
BCLK
- PCH clock controller
- 1MHz increments
- Up to 200 MHz or higher†
- Note: Discrete clocking solutions exist which may
enable ranges far >250MHz †
×C
×G
×M
† Subject to change at any time. Overclocking results not guaranteed.PCI Express* (PCIe*) | pGfx = Intel® Processor Graphics27
Clocking Options (BCLK)
• No more PEG/DMI ratios required!
• BCLK has full fine grain overclocking capability
• Option for Discrete BCLK or Integrated (PCH)
• PEG/DMI domain has isolated 100 MHz clock
Some motherboard designs may offer “discrete”
clock generators for extreme BCLK OC’ing results!
PCI Express* (PCIe*)28

8/16/2016
15
Clock Tree: Base Clock Tuning
DDR
Cores
Last Level Cache System
Agent
Ring
• BCLK input can be
increased from 100MHz
SSC, in 1 MHz (or
smaller) increments
• PCI Express* (PCIe*) has
an isolated dedicated
reference clock
Graphics
PCIe & DMI
BCLK
PEG
DMI
29
Voltage Planes
DDR
Cores
Last Level Cache System
Agent
PCI Express*
DMI
VDDQ
Ring
VSA
• VCORE & VRING: dynamic VR
up to 1.52V (SVID) plus
“Vboost” offset
• VGT : dynamic VR up to
1.52V (SVID) plus offset
• VDDQ: 1.2V Nom for DDR4
Graphics
VCORE
VRING
VGT
30 Reminder: Increasing voltage is considered operating outside of specifications and is not covered by warranty.

8/16/2016
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Overclocking Highlights for Intel® Core™ i7-6700K
1. Core Overclocking performance improvements
 Overclock-ability of CPU cores is great!
 Instructions per clock (IPC) improvements over previous generation
2. Significant BCLK base-clock Overclocking enhancements
 BCKL granularity now 1MHz increments (was coarse ratios 125/167 on prior gen)
 Significant BCLK gain, over Intel® Core™ i7-4790K, with reports at >500MHz with LN2†
3. Amazing DDR4 Overclocking
 Ratio programmability up to 4133MHz† and improved granularity (100/133)
† Overclocking capabilities are subject to change at any time. Overclocking results not guaranteed.31
Agenda
• Memory OC
• Summary and Q&A
32

8/16/2016
17
Intel® Extreme Tuning Utility (Intel® XTU) 6.1
• Overclocking Software
• Real-time tuning
• Monitoring of system
performance
Download Here:
http://www.intel.com/go/xtu
• Profile Management
• App-Profile Pairing
• Benchmarking
• Stress Testing
• HWBOT benchmark
result submittals
33
Intel® Extreme Memory Profile (Intel® XMP) for DDR4
• Intel’s XMP and memory overclocking efforts are focused on DDR4
• DDR4 Intel XMP modules have been available for >1.5yrs
• The lower the voltage, at a given stable OC frequency, the better the quality
• Utilize XMP modules certified for your specific processor and motherboard
Partial list of Intel® Extreme Memory Profile (Intel® XMP) certified memory vendors.
34

8/16/2016
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An Intel XMP enabled BIOS
reads the DIMM’s SPD chip at
power-on to determine if XMP is
supported then:
1. System
boots with
highest
supported
JEDEC
defined
parameters
2. XMP profile can
be selected by
the end user
through BIOS
setup
3. Reboot
to apply
Intel® Extreme Memory Profile (Intel® XMP)
Intel® Extreme Memory Profile (Intel® XMP)
Intel XMP Ready: Module has been programmed
with an uncertified profile GOOD †
Intel XMP Certified: Module has passed supplier
test and submission process for specific CPU and
motherboard BEST †
† Good and Best refer to the level of testing involved in XMP modules.35
(BIOS Menu)
Agenda
• Memory OC
• Summary and Q&A
36

8/16/2016
19
OC Milestones
• World’s First DDR4-4266MHz Retail Kit
• First to Surpass 5GHz World Record Speed
• Current World Record Holder at DDR4-5189.2MHz
Performance Memory
• SO-DIMM Retail Kit at DDR4-3200MHz
• DDR4 Desktop Series: Trident Z, Ripjaws V, Ripjaws 4
Go Beyond the Extreme
37 Slide and data provided by G.SKILL.
Slide and data provided by G.SKILL.
Intro to Memory OC
• 4 Levels of Memory OC
Factors Impact Range
Frequency Main Performance Factor Higher is better
Timing Increase Efficiency Lower is better
Voltage Increase Stability
1.2V – 1.35V (XMP)
1.35V+ (Extreme)
• Juggling Factors of Memory OC
JEDEC G.SKILL OC XMP G.SKILL Extreme XMP Extreme Limit OC
DDR4-2133 2666 3200 4266 5000

8/16/2016
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39
Quad-Channel Memory OC
Capacity Config Haswell-E (MHz) Broadwell-E (MHz) Improvement (MHz)
8GBx4 (32GB) DDR4-3200 DDR4-3466 +266 (+8.31%)
8GBx8 (64GB) DDR4-3200 DDR4-3466 +266 (+8.31%)
16GBx4 (64GB) DDR4-3000 DDR4-3400 +400 (+13.3%)
16GBx8 (128GB) DDR4-2800 DDR4-3333 +533 (+19.0%)
Improved Memory OC Support:
• Intel® Core™ i7-6950X Processor based OC
performance shines with high density
memory
• More Capacity = More Difficult to Overclock
Slide and data provided by G.SKILL.
• DDR4 Memory bandwidth OC scaling on Broadwell-E (X99)
Reaching the Extremes
50000
55000
60000
65000
70000
75000
80000
2133 Baseline 2400 2666 2800 3000 3200
Bandwidth(MB/s)
DDR4 Memory Frequency (MHz)
Read (MB/s)
Test Setup: Intel i7-6900K @ 3.5GHz, ASUS ROG Rampage V Extreme Edition 10 (BIOS 0801), G.SKILL DDR4-3200MHz 64GB (16GBx4)

8/16/2016
21
Agenda
• Memory OC
• Summary and Q&A
41
Summary and Next Steps
• The Intel® Core i7-6700K based overclocking
continues
- Uncompromised 4-Core overclocking!
- Excellent option for form factor or budget minded overclockers
• Performance hungry overclockers get 10-Cores!
- The Intel® Core™ i7-6950X processor’s 10-Cores, 4-Channel DDR4, 40-lanes of PCIe, and
new game-changing overclocking capabilities is unstoppable!
- Ideal for the most demanding Content Creation, VR, and extreme Gaming
• New Overclocking features create opportunities for customers
- Motherboard BIOS and Software utility enhancements around Per Core Overclocking
and AVX Offset features
- Opportunities overclockers to extract > performance than previous generations
- Strong Intel® XMP ecosystem opportunities with memory OC enhancements
42 PCI Express* (PCIe*)

8/16/2016
22
Additional Sources of Information
• A PDF of this presentation is available from our Technical Session
Catalog: www.intel.com/idfsessionsSF.
- This URL is also printed on the top of Session Agenda Pages in the Pocket
Guide.
• Demos in the IDF’16 Showcase –
- Intel Overclocking Demo: booth 595,1st floor
- G.SKILL demo
- and more
• Intel.com website overclocking info: http://www.intel.com/overclocking
43
Technical Sessions in this Track
44
VRGTS03 — Developing Virtual Reality Solution with Intel® Architecture
Tuesday, 2:30 PM – 3:30 PM, Level 2 Room 2005,
VRGTS04 — The Sensification of Virtual Reality Using Intel® RealSense™ Technology
Tuesday, 4:00 PM – 5:00 PM, Level 2 Room 2005
CLDTS05 — Strategies and Tools to Optimize Modern Workloads
Wednesday, 2:30 PM – 3:30 PM, Level 2 Room 2002

8/16/2016
23
45
Day 1 Prize
Completing an Online Session Evaluation by 10am
Tomorrow Automatically Enters You in a Drawing to Win!
Day 2 Prize
Copies of the complete sweepstakes rules are available at the Info Desk
Winners will be notifiedbyemail
You will receive an email with a link to the online evaluation prior to the end of this session.
Day 3 Prize
Recon Jet™ Yuneec Typhoon* H Drone with
Intel® RealSense™ Technology
Intel® Joule ™ 570x
Developer Kit
46
Q&A

8/16/2016
24
Legal Notices and Disclaimers
• Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Performance varies depending on
system configuration. No computer system can be absolutely secure. Check with your system manufacturer or retailer or learn more at intel.com.
• Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult
other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit
http://www.intel.com/performance.
• Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary.
You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products. For more complete information visit http://www.intel.com/performance.
• Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may affect future costs and
provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
• This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel
representative to obtain the latest forecast, schedule, specifications and roadmaps.
• No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
• Statements in this document that refer to Intel’s plans and expectations for the quarter, the year, and the future, are forward-looking statements that involve a number of risks and
uncertainties. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.
• All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. The products described may
contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
• Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced
data are accurate.
• © 2016 Intel Corporation. Intel, the Intel logo, Core™, and others are trademarks of Intel Corporation in the U.S. and/or other countries.
• *Other names and brands may be claimed as the property of others.

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