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  1. 1. Larry Pagaduan
  2. 2. <ul><li>Enumerate the SOP’s while doing inspection </li></ul><ul><li>Identify basic package types to inspect </li></ul><ul><li>Enumerate the different inspection procedures </li></ul><ul><li>Identify different defects per package types </li></ul><ul><li>Identify the acceptance and rejection criteria per defect type </li></ul><ul><li>Passed the qualification exam </li></ul><ul><li>Apply the knowledge learned on this training </li></ul>At the end of the training, the participants should be able to:
  3. 3. <ul><li>OBSERVE PROPER USE OF ESD APPARELS </li></ul><ul><li>- ESD shoes checked and passed </li></ul><ul><li>- Wear gloves, facemask & ground strap </li></ul><ul><li>- Ensure ground strap is connected on the CGM </li></ul><ul><li>CHECK PROPER LIGHTING </li></ul><ul><ul><ul><li>- Ensure that the workplace has enough lighting </li></ul></ul></ul><ul><li>- Luxolamp fluorescent should be operational </li></ul><ul><li>- Microscope fluorescent should be operational </li></ul>
  4. 4. <ul><li>FOLLOW THE DEFINED SAMPLING VM SCHEME </li></ul><ul><li>(DURING TEST) </li></ul><ul><li>-Randomly select 2 trays/tube from the lot being tested </li></ul><ul><li> ***ACCEPT = 0, process lot </li></ul><ul><li> ***REJECT = 1 , perform 100% VM </li></ul><ul><li> </li></ul>
  6. 6. <ul><li>QFP – acronym for QUAD FLATPACK </li></ul>FOOT PACKAGE LEAD SHOULDER BODY
  7. 7. <ul><li>BGA – acronym for BALL GRID ARRAY </li></ul>Encapsulant/Mold Package Solder Ball Substrate
  8. 8. <ul><li>FC – acronym for FLIP CHIP </li></ul>Die Solder Bumps Ni-plated Copper Heat spreader (LID) Organic Substrate Solder Ball, Sn63Pb37
  9. 9. <ul><li>LIVE BUG INSPECTION </li></ul><ul><li>- inspection procedure wherein the inspector is viewing the top part of the unit/s. </li></ul><ul><li>DEAD BUG INSPECTION </li></ul><ul><li>- inspection procedure wherein the inspector is viewing the bottom of the unit/s. </li></ul><ul><li>MIRROR BLOCK INSPECTION </li></ul><ul><li>- inspection procedure wherein the inspector is viewing the side of the unit/s with the aid of a microscope and mirror block </li></ul>
  10. 10. <ul><li>WHAT TO INSPECT? </li></ul><ul><li>SYMBOL </li></ul><ul><li>PACKAGE (ENCAP) </li></ul><ul><li>LEADS </li></ul>LIVE BUG INSPECTION
  11. 11. <ul><li>WHAT TO INSPECT? </li></ul><ul><li>SOLDER BALL </li></ul><ul><li>SUBSTRATE </li></ul>DEAD BUG INSPECTION
  12. 12. MIRROR BLOCK INSPECTION <ul><li>WHAT TO INSPECT? </li></ul><ul><li>LEAD COPLANARITY </li></ul><ul><li>PACKAGE WARPAGE </li></ul><ul><li>SUBSTRATE </li></ul>Seating plane
  13. 13. Lead – refers to terminal. - it serves as a connection between the chip/die and the application board of the customer
  14. 14. <ul><li>“ Misalignment from lead center” </li></ul>Seating plane
  15. 15. Mirror block view Top view
  16. 16. <ul><li>“ Deformity on leads such as broken, crushed and twisted” </li></ul>
  17. 18. <ul><li>“ Lead foot lifted opposite the required angle.” </li></ul>Positive Angle
  19. 20. <ul><li>“ Lead/s that have exceeded the required distance </li></ul><ul><li>between the lead foot and the seating plane.” </li></ul>
  20. 21. Lifted Leads Measurements from seating plane Accept – 2.5 mills Reject – above 2.5 mills Std. Thickness – 5 mills 2.5 mills
  21. 22. Mirror Block View
  22. 23. Solder Ball – refers to terminal. - it serves as a connection between the chip/die and the application board of the customer
  23. 24. <ul><li>“ Ball shorted to each other or caused by solder or any conductive material.” </li></ul>Scraped part of a solder ball connecting to the next solder ball adjacent to it.
  24. 25. <ul><li>“ Missing ball on the solder ball land” </li></ul>Exposed copper is visible on the ball land area (Ball-Attach Induced) A residue of solder is visible on the ball land area. Also referred as “SHEARED BALL”
  25. 27. <ul><li>“ Also referred as Deformed Ball. Characterization is broken down into four (4) criteria/specification. </li></ul>1. Diameter of the deformed ball does not meet the ball spec or size diameter.
  26. 28. 2. Deformed ball that reduces space between solder balls by more than 1/3 of its distance. 1/3
  27. 29. 3. Damaged ball that have crevices, cracks, or scratches exceeding 1/3 of the ball size.
  28. 30. 4. Damaged ball that have pressed area larger than half of the ball diameter.
  29. 31. Substrate - functions like a printed circuit board which has circuit patterns to form a connection with the chip/die
  30. 32. “ Bent tape greater than 0.2mm (0.008 inch) above or below the original position.”
  31. 33. Reject – Copper Traces Broken Accept – Copper Traces are in good condition
  32. 34. “ Broken tape exposing any pattern on the package bottom.”
  33. 35. Package – a container for die that provides external electrical and mechanical connection, heat removal, physical protection, environmental isolation, and distribution of power and signals
  34. 36. “ Package chips, gouges, and breaks that expose the pattern tape inside the package.”
  35. 37. “ Any package broken such that a part of the package can be moved or that allows an open path to the die, the wire or the circuit pattern area covered with the solder resist tape (substrate). Transverse cracks across the top surface of the package.”
  36. 38. “ Contaminated area greater than 10% (for BGA) or 5% (for FC) of the package surface.”