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IXRFSMPD Series Introduction

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The demand for higher power density in order to reduce the Power footprint, in addition to the need of flexibility in the design are priorities in any electrical or electronic system design today.

The new isolated package family SMPD (Surface Mount Power Device) gives the possibility to have a power module in a SMD outline with all the advantages of flexibility, automated assembly and reduced package size. With one of the lowest height profiles in the market, it also fulfills the demand for total size reduction and therefore facilitates system cost reduction requirements.

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IXRFSMPD Series Introduction

  1. 1. SMPD Series IXRFSM12N100 IXRFSM18N50 SURFACE MOUNT RF POWER MOSFETS
  2. 2. Sales Webinar Welcome  Introductions  Steve Krausse  Gib Bates  Recorded Webinar  Can you hear the Audio?  Can you see the video & presentation?  Chat Function  Questions  Public  Private  sales@ixyscolorado.com  Webinar Feedback  How can we improve?  Rate the webinar! 2
  3. 3. What We’ll Cover  Product Overview  Features  Advantages  Markets  Applications  Demonstration board  Price/Availability  Technical Overview  Q&A 3
  4. 4. Features 4 IXRFSM18N50  500V maximum drain voltage  18A maximum drain current  Low RDSON resistance at 0.34Ω IXRFSM12N100  1000V maximum drain voltage  12A maximum drain current  Low RDSON resistance at 1.05Ω Common Features  Low parasitic capacitances  Low gate charge  Isolated substrate  Excellent thermal transfer  Increased temperature and power cycling capabilities
  5. 5. Advantages 5  Optimized for RF and high speed switching  Automated assembly capable  Easy to mount, no insulators needed  High power density  RoHS compliant
  6. 6. Markets 6  RF power generation  Pulse-to-Pulse high speed switching for diode applications  Thin film deposition  Induction heating  Power conversion
  7. 7. Applications 7  Class D and E RF generators  Multi-MHz switch mode power supplies  Pulsed transformer drivers  Pulsed laser diode drivers  High speed pulse generators
  8. 8. Pricing & Availability  US MSRP  IXRFSM12N100 $27.24 ea. ($817.20/30 Rail)  IXRFSM18N50 $39.42 ea. ($1,182.60/30 Rail)  Outside the US  Taxes  Tariffs  Import Duties  Shipping/Delivery Costs  Etc. 8  Availability  Current: Stock  Normal: Stock to 8-10 Weeks  Digikey
  9. 9. Demonstration Board 9  Demonstration board DVRFDSMPD  Features  Easy to use  Used to construct low-side ground referenced switches  Select from any of our surface mount MOSFETs for installation  Availability- Fall 2017
  10. 10. Technical Overview Speaker: Gib Bates, IXYSRF R&D 10
  11. 11. What’s New? DE packaging  DE package has wide flat silver plated lead-frame  Typically needs lead forming for strain relief caused by thermal cycling  MSL 3 1 week limited exposure time  Beveled drain lead and case for orientation SMPD packaging  Surface Mount Power Device has tin palted gull wing lead-frame  No special lead forming required  MSL 1 unlimited exposure time  Missing pin for orientation 11
  12. 12. Technical Details  This example SMPD substrate drawing has large bond pads, outlined in green, to group multiple pins together 12 Grouped source pins Grouped gate pins Grouped drain pins
  13. 13. Technical Details  At the device level, gull wing pins has been grouped together to enhance current paths  Grouped pin layout resembles DE package pin layout 13 Grouped source pins Grouped gate pins Grouped drain pins
  14. 14. Technical Details  At the board level, pins are combined by way of the device footprint 14 PCB footprint pads
  15. 15. Common Topologies  Ground referenced power switch as provided by our demonstration board 15
  16. 16. Common Topologies  Class E resonant generator utilizing ground referenced MOSFET and driver 16
  17. 17. Common Topologies  Class D voltage fed half-bridge generator utilizing grounded and floating devices 17
  18. 18. Common Topologies  Class D current fed half-bridge generator utilizing grounded devices 18
  19. 19. Solutions For Common Issues Bulk and Bypass Capacitance 19  Bulk capacitance provides the energy needed to charge the gate during switching  Typical values are in the micro Farad range  Not enough energy storage results in voltage sag during switching events
  20. 20. Solutions For Common Issues Bulk and Bypass Capacitance 20  Bypass capacitance provides the decoupling needed to reduce switching noise and ringing  Typical values are in the nano Farad range  Due to self-resonance, values are an order of magnitude apart provide over-lapping impedance curves.  Over-lapping impedance curves lowers insertion impedance over a broad band Ideal response Self resonance response Over-lapping impedance curves
  21. 21. Q&A 21
  22. 22. Contacting Us 970-493-1901 sales@ixyscolorado.com Visit Us 1609 Oakridge Drive Suite 100 Fort Collins, CO 80525 USA 22

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