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SMARC™The new standard for ComputerOn Modules (COM) based onARM architectureDov ShalevKontron Israel1/5/13
May 1, 2013- 2COM Market 2011 - 2016• COMs YoY growth is 20%-25%• Expected YoY growth for ARM is 25%+• Why?• ARM CPU cost ...
May 1, 2013- 3beyond x86ARM Computer-on-ModulesPositioningPositioningFebruary 2013
May 1, 2013- 4Parallel TFT display busMIPI display interfaceCamera interfacesMultiple SPI linksMultiple SDIO interfacesSer...
May 1, 2013- 5• ARM processors are powerful enough to drive a graphical userinterface at very low power consumption, (Smar...
May 1, 2013- 6Market Trends for ARM based Module• Technical trends:– PCIe– GbE– Multicore• Make Vs. Buy trends:– Declining...
May 1, 2013- 7SGETSMARC™standardized through SGETSGETFebruary 2013
May 1, 2013- 8Standardization Group for EmbeddedTechnologies (SGET)• Manufacturer-independent institution (no Intel, AMD, ...
May 1, 2013- 9SGET Founding Members - May 2012Kontron, ADLINK, Advantech, B-plus, Congatec, Data Module, EEPD,F&S, Fortec,...
May 1, 2013- 10• Mobile / Portable application requirements– Enclosure constraints– Thermal limits– Power / battery life• ...
May 1, 2013- 115.7 mm1.5 mmWhy a New Form Factor?• Ultra Low-Power-COM meets application needs– Enclosure constraints• Lim...
May 1, 2013- 12New COM Standard: SMARCScalability via two form factors
May 1, 2013- 13New COM StandardLow Power Embedded Architecture Platform• MXM 3.0 gold-finger-card-edge connector– 314 tota...
May 1, 2013- 14Kontron SMARC™ Architecture -Supported InterfacesFebruary 2013
May 1, 2013- 15User RequirementGUI / User InterfaceApplicationOperating SystemDriver (own/3rd party)InterfacerequirementsP...
May 1, 2013- 16Embedded Operating System support
May 1, 2013- 17• SMARC-sAT30– nVidia Tegra 3 Quad Core 1.2 GHz ARM Cortex A9– 1GB memory down– HD encode/decode MPEG2, dua...
www.kontron.comMunich/Eching Kaufbeuren Deggendorf San Diego Columbia Fremont Montreal Beijing Penang SydneyBangalore Mosc...
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TRACK B: The new standard for Computer On Modules (COM) based on ARM architecture/ Dov Shalev

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TRACK B: The new standard for Computer On Modules (COM) based on ARM architecture/ Dov Shalev

  1. 1. SMARC™The new standard for ComputerOn Modules (COM) based onARM architectureDov ShalevKontron Israel1/5/13
  2. 2. May 1, 2013- 2COM Market 2011 - 2016• COMs YoY growth is 20%-25%• Expected YoY growth for ARM is 25%+• Why?• ARM CPU cost 2x-3x less than x86• ARM processing capability has begun to catch up with x86 apps• Mobility, longer battery life and lower profile• IMS Research projects that 40% of COMs applications will be ARM based by 2016Source:IMS Research 20122011 2016
  3. 3. May 1, 2013- 3beyond x86ARM Computer-on-ModulesPositioningPositioningFebruary 2013
  4. 4. May 1, 2013- 4Parallel TFT display busMIPI display interfaceCamera interfacesMultiple SPI linksMultiple SDIO interfacesSerial portsMany USB (8 lanes)Lots of PCI Express (6 lanes)PCI Express graphics (16 lanes)LPC (an x86 only bus)…..and moreKey Feature DifferencesARM+X86+Designed for mobilityARM COM Designs requires fewer pins and lower cost power circuitry
  5. 5. May 1, 2013- 5• ARM processors are powerful enough to drive a graphical userinterface at very low power consumption, (Smartphone, Tablet)• ARM delivers exceptional performance/watt ratio– No bulky thermal solution• Extreme low power consumption at operation (<2W)– ARM better serves Ultra Low-Power market requirements• Extended temperature selections available• SOC performance with dual/quad core is comparable with ATOM range– ARM will not replace Intel x86 technology. Rather, it reaches segments that arecurrently underserved relative to ARM• Longevity up to 15 yearsARM Positioning
  6. 6. May 1, 2013- 6Market Trends for ARM based Module• Technical trends:– PCIe– GbE– Multicore• Make Vs. Buy trends:– Declining of OEM resources– TTM is getting short– Increasing Silicon “Complexity”
  7. 7. May 1, 2013- 7SGETSMARC™standardized through SGETSGETFebruary 2013
  8. 8. May 1, 2013- 8Standardization Group for EmbeddedTechnologies (SGET)• Manufacturer-independent institution (no Intel, AMD, Tyco etc.)• A new COMs standard incorporating ARM technology– Form factor– Optimized pinout– Alternative solution to x86 based COM apps• Ecosystem support• Layers of support to enable complete solution
  9. 9. May 1, 2013- 9SGET Founding Members - May 2012Kontron, ADLINK, Advantech, B-plus, Congatec, Data Module, EEPD,F&S, Fortec, Hectronic, Heitec, IES, Iwavesystems, Micro Consult, MSC,next System, publish-industry, Seco, speicherguide.de, TQ Group,www.sget.org
  10. 10. May 1, 2013- 10• Mobile / Portable application requirements– Enclosure constraints– Thermal limits– Power / battery life• Features not typically found on COM Express– MIPI I/F– Camera I/F– Multiple SPI and SDIO• COM Express is optimized for x86 features– Many USB– Multiple PCI Express– PEG graphics supportWhy a New Form Factor?SMARC compared with COM ExpressSMARC Requires fewer pins and lower cost power circuitry
  11. 11. May 1, 2013- 115.7 mm1.5 mmWhy a New Form Factor?• Ultra Low-Power-COM meets application needs– Enclosure constraints• Limited x, y & z dimensions– Small surface area 41 cm2– Height < 6mm – top and bottom– Well matched with SOC silicon– Connector style enables low profile insertion– Thermal limits• < 5W TDP - eliminate need for thermal solution– Shock & Vibration• Connector is approved for AutomotiveMXM3.0 connector
  12. 12. May 1, 2013- 12New COM Standard: SMARCScalability via two form factors
  13. 13. May 1, 2013- 13New COM StandardLow Power Embedded Architecture Platform• MXM 3.0 gold-finger-card-edge connector– 314 total pins available– Low profile options available– Used in high end laptops– Allows durable, slim designs– Shock-/vibration proof option for automotive applications
  14. 14. May 1, 2013- 14Kontron SMARC™ Architecture -Supported InterfacesFebruary 2013
  15. 15. May 1, 2013- 15User RequirementGUI / User InterfaceApplicationOperating SystemDriver (own/3rd party)InterfacerequirementsProductrequirementssizeLCDUSBETNCOMMsVoltageshapecolorcertificationsregulatoryFirmware (Bootloader/BIOS)HardwareThe product - Layer Model
  16. 16. May 1, 2013- 16Embedded Operating System support
  17. 17. May 1, 2013- 17• SMARC-sAT30– nVidia Tegra 3 Quad Core 1.2 GHz ARM Cortex A9– 1GB memory down– HD encode/decode MPEG2, dual GPU– < 3,5 W TDP, Commercial temp 0°C to 60°C– Medical, Energy, Infotainment , Transportation• SMARC-sA3874i– Ti AM3874 Single Core ARM Cortex-A8 processor 800MHz/1GHz– 1GB memory down, PCIe2 w/ integrated PHY– 2 W TDP, Industrial Temp -40°C to +85°C– Low cost when Graphics is needed. Harsh environments• SMARC-sAMX6i– Freescale i.MX6 Single – Dual - Quad Core ARM Cortex-A9 processor– Full HD 1080P encode/decode, single and dual display support– On chip LAN and PCIe to connect to external modem, WiFi– Industrial Temp -40°C to +85°C– Communications, Military, Industrial, Graphic applicationSMARC™ Product examples
  18. 18. www.kontron.comMunich/Eching Kaufbeuren Deggendorf San Diego Columbia Fremont Montreal Beijing Penang SydneyBangalore Moscow Warsaw Kiev Tel Aviv Liberec/Pilsen Chichester Copenhagen Brussels Toulon SolothurnThank youfor your attention

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