A New Integrated Circuit Fabricator Design to meet New Market Demands      Bevan Wu BW & Associates 2490 Cowper St,  Palo ...
Alternate New Fab Design
Contents <ul><li>Introduction </li></ul><ul><li>Deficiencies of Conventional Box IC Fab </li></ul><ul><li>ISMI Concerns ab...
 
 
 
 
Introduction <ul><li>Conventional 300mm IC Box Fab </li></ul><ul><ul><li>Costly, COO, long cycle time, inflexible </li></u...
Deficiencies of Conventional Ball Room Box Type IC Fab   <ul><li>High initial capital investment </li></ul><ul><li>Slow re...
Deficiencies of 300mm IC Fab per ISMI
Innovation #1 - Out of the Box thinking A New IC Fab Architecture <ul><li>Break IC Fab Ball Rm Box into Modules </li></ul>...
Innovation #2 - New Business Model for IC Fab Management <ul><li>Leasing equipment – Low Capital Expense </li></ul><ul><li...
New IC Fab Layout
Modular Processing Unit <ul><li>* </li></ul>Upper Sub-Module Interface   to Rapid   AHMS Monorail   Lower   Sub-module Fac...
New IC Fab Layout with Facility Supply Systems
Rapid AMHS Monorails and FOUP Carrier Buses <ul><li>* </li></ul>
Rapid AMHS Monorail and FOUP Bus Details
Benefits of New Fab Architecture and Business Model Innovations <ul><li>Lower capital investment for IC Fab </li></ul><ul>...
Successful Operational Module Prototype on ITRI Campus -1998
Conclusions <ul><li>Out of box thinking in IC Fab business & Arch will innovate S/C industry meeting new market challenges...
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A New IC Fab Architecture to meet 21st Century IC manufacturing

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  • ISSM 2003 Speaker Template Notes Title Slide If your Presentation Title is very long you may need to use plain text instead of bold or modify the font size to fit.
  • Ismi2008 Powerpoint Bw

    1. 1. A New Integrated Circuit Fabricator Design to meet New Market Demands      Bevan Wu BW & Associates 2490 Cowper St, Palo Alto, CA 94301 USA [email_address]
    2. 2. Alternate New Fab Design
    3. 3. Contents <ul><li>Introduction </li></ul><ul><li>Deficiencies of Conventional Box IC Fab </li></ul><ul><li>ISMI Concerns about 300mm IC Fab </li></ul><ul><li>Out of Box Innovation #1 - New Fab Architecture </li></ul><ul><li>Out of Box Innovation #2 - Business Model </li></ul><ul><li>Benefits of Out of Box Innovations </li></ul><ul><li>Conclusions </li></ul>
    4. 8. Introduction <ul><li>Conventional 300mm IC Box Fab </li></ul><ul><ul><li>Costly, COO, long cycle time, inflexible </li></ul></ul><ul><li>450mm Fab $9B each (Est) but may not solve 300mm box Fab Problems </li></ul><ul><li>Out of box innovations are needed </li></ul><ul><li>Propose out of box innovations </li></ul><ul><ul><li>Business Model for IC Fab Management </li></ul></ul><ul><ul><li>Fab Architecture to meet New Mkt Req’ts </li></ul></ul>
    5. 9. Deficiencies of Conventional Ball Room Box Type IC Fab <ul><li>High initial capital investment </li></ul><ul><li>Slow response – long product cycle time, high work in process (WIP) </li></ul><ul><li>Inflexible – multi-product, process, and new technology adaptation </li></ul><ul><li>18 to 24 month build time </li></ul><ul><li>High Cost of Operation (COO) </li></ul><ul><li>Green? EHS? Concerns </li></ul>
    6. 10. Deficiencies of 300mm IC Fab per ISMI
    7. 11. Innovation #1 - Out of the Box thinking A New IC Fab Architecture <ul><li>Break IC Fab Ball Rm Box into Modules </li></ul><ul><li>Rapid Monorail AMHS out of the Ball Room Box – full speed & no vibration problems </li></ul><ul><li>Fast and agile Mfg system with no stocker </li></ul><ul><li>Populate modules @ supplier’s local and build Fab Frame & facility Sys in Parallel </li></ul><ul><li>FOUP for transport & Single wafer processing whenever possible – Min WIP </li></ul>
    8. 12. Innovation #2 - New Business Model for IC Fab Management <ul><li>Leasing equipment – Low Capital Expense </li></ul><ul><li>Out Sourcing Equipment Maintenance </li></ul><ul><ul><li>Min equipment maintenance staff -$$ </li></ul></ul><ul><ul><li>Suppliers provide models with calibrated equipment on site, reduce MTTR and Fab down time </li></ul></ul><ul><li>Min/no re-calibration – saves test wafer $ </li></ul><ul><li>Flexibility & agile response to Mkt with quick adaptation of new technologies </li></ul>
    9. 13. New IC Fab Layout
    10. 14. Modular Processing Unit <ul><li>* </li></ul>Upper Sub-Module Interface to Rapid AHMS Monorail Lower Sub-module Facility supply system
    11. 15. New IC Fab Layout with Facility Supply Systems
    12. 16. Rapid AMHS Monorails and FOUP Carrier Buses <ul><li>* </li></ul>
    13. 17. Rapid AMHS Monorail and FOUP Bus Details
    14. 18. Benefits of New Fab Architecture and Business Model Innovations <ul><li>Lower capital investment for IC Fab </li></ul><ul><li>Provide fast response IC Fab to meet 21st century market demands </li></ul><ul><li>Lower COO for IC Manufacturers - $ </li></ul><ul><li>Increased IC Fab agility and flexibility </li></ul><ul><li>Provide steady income for equipment suppliers - R/D for future technology </li></ul><ul><li>Energy Green and improved Fab EHS </li></ul>
    15. 19. Successful Operational Module Prototype on ITRI Campus -1998
    16. 20. Conclusions <ul><li>Out of box thinking in IC Fab business & Arch will innovate S/C industry meeting new market challenges & provide a holistic eco-system for future growth </li></ul><ul><li>Energy Green and improved Fab EHS </li></ul><ul><li>No new technology inventions are required </li></ul><ul><li>Preliminary prototype results showed high potential of success </li></ul>

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