Recommended
Recommended
More Related Content
Viewers also liked
Similar to BCC Simulation Platform for Thermal Engineering
Similar to BCC Simulation Platform for Thermal Engineering (8)
Recently uploaded
Recently uploaded (20)
BCC Simulation Platform for Thermal Engineering
- 1. A Simulation Tool for Thermal Engineering 27th July 2011
- 2. Why thermal model is needed? Smaller chip reduces parasitic effect. Less parasitic allows for high frequency with less switching loss. Efficient high frequency allows further size reduction. In order to make a smaller and higher power switch, the thermal limit must be pushed back. COMPANY CONFIDENTIAL Culture creates future
- 3. What is thermal impedance Silicon chip Solder/Wire Copper frame Epoxy Tj Tam b Z th power COMPANY CONFIDENTIAL Culture creates future
- 4. What is Thermal impedance 4 t Foster circuit Z th t Rn 1 exp n 1 C n Rn Foster-equivalent model have a real physical meaning: each RC cell represents the contribution to the thermal impedance of a given part COMPANY CONFIDENTIAL Culture creates future
- 5. Deliverable of the Our Tool a universal and simple method of representing the thermal character of a device Interpret values from datasheet or measurement The tool would allow a power plot using a SPICE simulator to accurate represent package temperatures. Employed as vehicle to cross compare techniques. COMPANY CONFIDENTIAL Culture creates future
- 6. Tool Demonstration COMPANY CONFIDENTIAL Culture creates future
- 7. Results Temperature response to oscilloscope waveform Temperature Limit 80 80 70 70 Junction Temperature [ C] 60 60 Input power [W] 50 50 40 40 30 30 20 20 Junction temperature 10 Input Power 10 0 0 0 10 20 30 40 50 Time [us] COMPANY CONFIDENTIAL Culture creates future
- 8. Application 5 yr 300 100% beneficial of the tool 250 80% Quantity in Test Controlled lifetime 200 Failure Rate 60% 150 Reliable performance 100 40% Life e c/TJ 20% Reduced manufacture cost 50 0 0% Reduced maintenance costs 1 10 100 1000 10000 Test Time (Hours) Temperature Operating Life test underwent using JESD22-A108 standard Useful life period Failure rate EFR IFR (Intrinsic Failure Rate) Wearout low, constant period 0 Time COMPANY CONFIDENTIAL Culture creates future
- 9. Advantage Related Art benchmark Supplier A Supplier B Foster networks RC networks Cauer RC networks included in included in the datasheet the datasheet Supplier C Supplier D Use two additional pins Supplier E Online calculator and some for junction temperature Cauer RC networks included in a apps thermal RC networks from RC networks note for each part COMPANY CONFIDENTIAL Culture creates future
- 10. Thank you enquiry@bccwh.com www.bccwh.com
Editor's Notes
- On the other hand, the suppliers and manufacturers keep shrinking product size for cost down Technicallly, see bove
- Regardless of the operator or the specifics, the network is a point-to-multipoint distribution scheme, where a signal splits many times and can travel long distances from its point of origination to its destination at a customer premises. These splits and transmission distance create loss that system-level amplifiers at different points in the network must compensate.
- The clear trend in the industry is to increased output levels from the power amplifiers. With bandwidth consumption increasing, nodes can handle fewer homes before usage exceeds capacity. A common solution is to offload bandwidth by inserting more nodes into a network. The result of these additional nodes is to increase splitting of the input signals before they reach a customer premises.
- No standardManufacture varies