Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.

Nano scholar february08_presentation


Published on

Presentation made at the end of the year long Nanoscholar program at Sematech Austin.

Published in: Business, Technology
  • Be the first to comment

  • Be the first to like this

Nano scholar february08_presentation

  1. 1. Process Integration Asad Mohammed Process Integration Intern – Photolithography Rich Berger - ATDF
  2. 2. Outline <ul><li>Process Integration </li></ul><ul><li>3 mask capacitor reticle </li></ul><ul><li>Layout </li></ul><ul><li>Fabrication Cycle </li></ul><ul><li>E-Testing </li></ul><ul><li>3D Reticle </li></ul><ul><li>Typical Work Day </li></ul>
  3. 3. Process Integration Layout Mask(Reticle) Preparation Recipe Wafer Fabrication Testing Specifications
  4. 4. 3 mask Capacitor Reticle– 871AZ Dielectric constant  PolyGate SiO 2 Si Substrate Area A -Q E Separation d Area A +Q V
  5. 5. 861  871 Changes oxide Floating gate Control gate N-Si Substrate <ul><li>Circle  Square </li></ul><ul><li>Backside contact  Top side contact </li></ul>More structures Dummy Fill Novel structures <ul><li>1E-7 ~ 5E-4 </li></ul>
  6. 6. 871AZ Layout and Fabrication Underlap Structures Overlap Structures MultiDot Structures Transistors CV structures Dummy Fill Transistors CV structures FG Caps with sub FG Caps w/o sub Underlap Structures Overlap Structures MultiDot Structures Transistors CV structures Overlap Structures MultiDot Structures Transistors CV structures Large Caps UHFs Exposure Etch Deposition
  7. 7. Test Wafers 7082901-7082904 7082902-02; Scratch probably due to wanding Close up without flash 7082904-01; Backside scratch
  8. 8. Electrical Testing Results
  9. 9. 3D Reticle Multiple Wafer to Wafer Direct Copper Bonding Donor wafer aligned to substrate wafer
  10. 10. 3D Die Layout <ul><li>Via Density Structures </li></ul><ul><li>Combs W and W/O Vias </li></ul><ul><li>Vias on metal </li></ul><ul><li>All levels perfectly mirrored </li></ul><ul><li>Dummy fill </li></ul>
  11. 11. 3D Reticle Fab
  12. 12. Other Reticles Worked on <ul><li>Multilevel Flash </li></ul><ul><li>– extra metal layer </li></ul><ul><li>E-Beam </li></ul><ul><li> – Serps and Combs </li></ul>
  13. 13. Acknowledgements <ul><li>ACC </li></ul><ul><li>ATDF </li></ul><ul><li>Rich Berger </li></ul><ul><li>Romelia Distasio Kenneth Matthews </li></ul><ul><li>Bruce Wilks </li></ul><ul><li>Gregory Smith </li></ul>