Molecular Beam Epitaxy (MBE)

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Integrated Circuit (IC) Manufacture
- Slicing the Silicon ingot
- Fabrication of IC’s (Lithography, Sputtering, diffused junction, …)
- Testing each IC on the slice

- Dicing (cutting each chip out with a diamond saw)
- Packaging

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Molecular Beam Epitaxy (MBE)

  1. 1. GLIMPSES AJAL.A.J
  2. 2. Fabrication Equipment Molecular Beam Epitaxy (MBE)
  3. 3. Fabrication Equipment Photoresist Spinner Bake-out Ovens
  4. 4. Fabrication Equipment Mask Aligner Reactive Ion Etching (RIE)
  5. 5. Fabrication Equipment Chemical Vapor Deposition (CVD) Plasma Quest Sputter
  6. 6. Fabrication Equipment Plasma Sputter Perkin-Elmer MBE
  7. 7. Aligned Wafer-Bonding System
  8. 8. PCB Manufacture Types of PCB's single-side, double-side and multi-layer Which type to use ? (a) Circuit complexity (b) Available space (c) Cost Typical PCB insulated substrate copper connections protective covering
  9. 9. Packaging Dual Inline Package and its lead-frame Steps in Lead Frame Manufacture: (1) Cut copper strips (2) Clean in a chemical bath (3) laminate a layer of photoresist (4) Expose photoresist through mask (5) Develop and etch (6) Remove lamination (7) Plate internal regions with gold/silver Dual Inline Package and its lead-frame Steps in Lead Frame Manufacture: (1) Cut copper strips (2) Clean in a chemical bath (3) laminate a layer of photoresist (4) Expose photoresist through mask (5) Develop and etch (6) Remove lamination (7) Plate internal regions with gold/silver - Make leadframe - Die attachment (chip bonded to leadframe using epoxy) - Wire bonding (ultrasonic welding) - Encapsulation (moisture resistant coating) - Molding (plastic package) - Marking (chip number, co. name, marked on package [laser, silkscreen]) - DTFS: deflash, trim the leadframe, form the leads, singulate (cut dambars) - Leadfinishing: electroplating the leads
  10. 10. Integrated Circuit (IC) Manufacture - Slicing the Silicon ingot - Fabrication of IC’s (Lithography, Sputtering, diffused junction, …) - Testing each IC on the slice [source: www.towajapan.co.jp] - Dicing (cutting each chip out with a diamond saw) - Packaging
  11. 11. Images of the CLEAN ROOM MONITORING UNIT
  12. 12. Schematic of Ion Beam Sculpting Apparatus
  13. 13. Sculpting of Nanopores: Sputtering versus Lateral Mass Transport
  14. 14. Fabrication Equipment Probe Station Scanning Electron Microscope (SEM)
  15. 15. We’re all searchers now…search smarter, not harder ? ( AJAL.A.J )
  16. 16. The ultimate passion of searching…
  17. 17. References • Carter, Ronald. “Lecture 9 – EE 5342” UTA • Cheung, Nathan “ Lecture 17 – EE 143” UC Berkeley • http: //et.nmso.edu/ETCLASSES/vlsi/files/CRYSTAL.HTM • Hastings, Alan “The Art of Analog Layout”, Prentice Hall, New Jersey, 2001 • Campbell, Stephen A. , “The Science and Engineering of Microelectronic Fabrication”, Oxford University Press, New York, 2001 • Alvarez, Antonio, “BiCMOS Technology and Applications”, Prentice Hall, New Jersey, 2001
  18. 18. The End

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