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An Example Investor Presentation
from Ziya’s Students
Ziya G. Boyacigiller
This presentation was created and given by Ziya...
Example Presentation to
Investors
Ziya G. Boyacigiller
Sabanci University
BA, MBA and EXEC MBA
2004 through 2013
THE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS
Mustafa Birinci
mustafa@sigyros.com
Mahmut Ikinci
mahmut@sigyros.c...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 4
Overview
• All positioning...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 5
$10B Market Opportunity
$0...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 6
Separate Component
─Requi...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 7
Solution:
Integrated Posit...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 8
Value-Add Capabilities
Siz...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 9
Benefits to End Customer
P...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 10
Silicon Gyros
CMOS + MEMS...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 11
Product / Go-to-Market St...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 12
Sustainable Advantage
(In...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 13
Customer Engagements
Iner...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 14
• Silicon Circuitry
— Mat...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 15
ilestones
equirements
MEM...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 16
Financial Summary ($M)
$0...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 17
Team• FOUNDERS:
—Mustafa ...
SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 18
The Deal
• Financing Obje...
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New 12 example investor presentation

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New 12 example investor presentation

  1. 1. An Example Investor Presentation from Ziya’s Students Ziya G. Boyacigiller This presentation was created and given by Ziya Boyacigiller who was leading Angel Investor and a loved mentor to many young entrepreneurs in Turkey. We have shared it on the web for everyone’s benefit. It is free to use but please cite Ziya Boyacigiller as the source when you use any part of this presentation. For more about Ziya Boyacigiller’s contributions to the start-up Ecosystem of Turkey, please go to www.ziyaboyacigiller.com
  2. 2. Example Presentation to Investors Ziya G. Boyacigiller Sabanci University BA, MBA and EXEC MBA 2004 through 2013
  3. 3. THE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS Mustafa Birinci mustafa@sigyros.com Mahmut Ikinci mahmut@sigyros.com Mehmet Ucuncu mehmet@sigyros.com +90 216 555 0000 SILICON GYROS MEMS+ GYROSCOPES + MEMS = Micro-Electro-Mechnanical-System
  4. 4. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 4 Overview • All positioning electronics rely on gyroscopes, creating a $10B market in 2010 • Fabless semiconductor company designing and marketing integrated MEMS+CMOS silicon components for communication, navigation, storage, and consumer markets • Silicon Gyros (SG) integrated positioning solutions solve critical power, cost, space, performance & reliability constraints
  5. 5. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 5 $10B Market Opportunity $0.3 $1.6 $0.9 $0.3 $1.7 $1.1 $0.3 $1.9 $1.3 $0.3 $2.1 $1.5 $0.3 $2.3 $1.7 $0.0 $0.5 $1.0 $1.5 $2.0 $2.5 $3.0 $3.5 $4.0 $4.5 2004 2005 2006 2007 2008 Worldwide Gyro Market ($B) $2.8 $3.1 $3.5 $3.9 $4.3 10% AGR ource: WTC Consulting, JPMorgan, IDC, iSupply, Reed Electronics, World Information Technologies, Gartner, In-Stat, ARC •Mechanical •NO GROWTH •2 chip •9% AGR Single chip / IPS 13% AGR
  6. 6. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 6 Separate Component ─Requires board space (>10mm2 ) ─Major source of board field failures Complex System Design ─One gyro per axis ─Multiple components required Limited Performance ─Inefficient, wastes power ─Limited range of sensitivity High System Costs ─Direct: component and assembly ─Indirect: long design cycles, procurement Pain: Off-chip Gyro Limits Integration
  7. 7. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 7 Solution: Integrated Positioning Solutions (IPS) MEMS Gyroscope  back-end CMOS compatible  wafer level encapsulation  bare-die or plastic packaging System Integration  IPS = CMOS circuitry+MEMS gyro • SiGe MEMS Gyro Advanced CMOS Circuitry Integrated Electronics (Gyro + Circuitry) •• ••••••• Si
  8. 8. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 8 Value-Add Capabilities Size Resonant Frequency Temperature Range Accuracy/Stability Sensitivity Packaging Reference Frequencies On-Chip Integration Synchronization 0.8 x 0.7 mm 32 kHz – 2 GHz -40°C to 120°C +/- 1ppm +/- 1ppm Plastic (or bare-die) Multiple Yes Yes 2.0 x 3.0 mm 32 kHz – 160 MHz -30°C to 80°C +/- 1ppm +/- 10ppm Ceramic 1 No No IPSQuartz
  9. 9. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 9 Benefits to End Customer Performance Consolidation Reliability  Single-chip design  Ultra-Low noise  Lower power  Less board space • Smaller plastic packages • Bare-die for MCM  High stability (1ppm)  Single-chip design • Lower mfg cost  Consolidate components • Reduce assembly cost • Reduce supplier costs  Consolidate SKUs • Increase design flexibility • Shorten design cycles  Integration minimizes number of components  Simplified system design  Standard semiconductor packaging and assembly
  10. 10. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 10 Silicon Gyros CMOS + MEMS Competition Standard CMOS Integration Stability QUARTZ-based • NDK, Epson, Vectron, Saronix • IDT/ICS, Cypress, Silego • Multiple ‘leaders’ each with fortes in certain niches GyroX • Polysilicon MEMS • Targeting low-end applications • $12M VC in April 2004 PolySi • Polysilicon MEMS + CMOS • $12M VC in December 2004
  11. 11. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 11 Product / Go-to-Market Strategy 2006 2007 2008 2-Chip (CMOS & MEMS) MEMS Gyro Low Noise (*) Integrated Lower-Performance (Consumer Quality) (CMOS + MEMS) Integrated High-Performance (Navigation Quality) (CMOS + MEMS) • Market MEMS Gyros during MEMS technology transfer/development • Establish 1st customer relationships (storage) • Vehicle for fully integrated MEMS/Gyro • Early revenue generation % of TAM • Exploit advantages of MEMS and CMOS • Pursue multiple range opportunities • Expand market to consumer, storage and communication MEMS Technology As Key Value Differentiator This product is already developed
  12. 12. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 12 Sustainable Advantage (Intellectual Property / IP) • World’s First fully integrated gyro+electronics using standard CMOS foundry processing ( low cost & high volume) • MEMS Process — Enables integration of MEMS and CMOS • Temperature Compensation (array of gyros) — Low-power and low-cost design enables high stability • Temperature Sensor — Low-cost, on-chip, temperature sensor enables high stability • Standard Manufacturing — Low-cost, robust manufacturing-proprietary layout of gyro design • Low-Noise Gyro — Gyros optimized for high volume applications • License from UC Berkeley for MEMS IP — Exclusive, world-wide rights — All inventors are members of Silicon Gyros — Fully characterized gyro cores (for commercial applications)
  13. 13. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 13 Customer Engagements Inertial Systems Hitachi / Maxtor Infineon CommentsCompany • Evaluating MEMS core Gyro for their next system • Evaluating MEMS core Gyro for H-M 55 tape drive • Interest in MEMS core Gyro for enterprise HDD • List of 500 target customers identified
  14. 14. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 14 • Silicon Circuitry — Mature standard wafer fabrication processes : 0.18u – 0.35u — World class foundries: UMC & TSMC — Mature small pin count semiconductor packaging and test • MEMS — Enable LPCVD furnace for standard post-process deposition — NNTC • turn-key foundry partner (CMOS + MEMS) • MOU and NRE agreements for product and process/mfg collaboration — Analog Devices • pure MEMS foundry partner already validated process compatibility • discussing price, volumes, and IP — Hitachi • turn-key foundry partner with strategic initiative evaluating MEMS Manufacturing
  15. 15. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 15 ilestones equirements MEMS Gyro Development Schedule Headcount abor Cost R&D SG&A otal Cumulative 6-12 $ 780k $ 640k $ 320k $1,740k $1,740k 12-24 $ 1,100 $ 300 $ 250 $ 1,650 $ 3,390 24-34 $ 1,910 $ 790 $ 550 $ 3,250 $ 6,640 34-45 $ 2,830 $ 720 $ 750 $ 4,300 $10,940 45-70 $ 4,000 $ 1,800 $ 1,150 $ 6,950 $17,890 0 months 6 12 18 24 30 MEMS Core CMOS XGyro Con XGyro Nav Qualify Prototype Prototype Finish Prototype Ship Qualify Ship Design Win Qualify Ship Yield ProcessTransfer Process Initial MEMS product samples
  16. 16. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 16 Financial Summary ($M) $0 $2 $4 $6 $8 $10 $12 $14 $16 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 2005 2006 2007 2008 Revenue Gross Profit Cash Revenue by Product Family ($M) $0 $2 $4 $6 $8 $10 $12 $14 $16 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 2005 2006 2007 2008 eadcount venue OGS oss Inc. G&A &D BIT d Cash 10 $ 0 $ 0 $ 0 $ 370 $ 510 ($ 880) $ 9,120 93 $ 36,020 $ 9,450 $ 26,570 $ 9,280 $ 5,500 $ 11,790 $ 6,440 24 $ 2,170 $ 650 $ 1,520 $ 1,770 $ 2,390 ($ 2,640) $ 4,400 49 $ 10,100 $ 3,370 $ 6,730 $ 4,620 $ 3,930 ($ 1,820) $ 13,320 Units (000s) Gyro MEMs XGyro (Nav) XGyro (Con) Revenues (000s) Gyro MEMs XGyro (Nav) XGyro (Con) 15,100 3,750 38,700 $ 12,500 $ 4,900 $ 18,500 10,100 230 480 $ 8,500 $ 300 $ 290 Financials 2,000 0 0 $ 2,150 $ 0 $ 0
  17. 17. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 17 Team• FOUNDERS: —Mustafa Birinci, CEO and Founder • Veteran gyro market entrepreneur: NovaSensor, VP Marketing at IC Works, CEO at GyroTech —Mahmut Ikinci, CTO and Founder • System design and SiGe MEMS: UC Berkeley PhD, Xenos, NovaSensor, GyroTech —Mehmet Ucuncu, VP Marketing and Founder • Early-stage start-up planning: NetX, GyroNet, UC Berkeley MBA, MIT MS • ADVISORY BOARD —Prof. Roger Howdy, Chief Scientist and Founder • MEMS gyro pioneer: Stanford, EECS UC Berkeley, BSAC Director, ADI Technical Advisor —Shusaku Sudaka, Sr. Advisor to CEO (Marketing, Ops, Biz Dev) • Japan semiconductor marketing: President and COO: Technology and Marketing at Oki America • MANAGEMENT —Leyla Basaran, Dir. Applications and Founder • Gyro marketing and application support: Stanford Telecom, ICWorks, Exar, UC Berkeley —Nilufer Calisan, Manufacturing • MEMS process transfer: VP Eng. Lilliputian, Dir. Eng. Candescent, Stanford Professor —Yasemin Kazanan, Design Engineer • Mixed Signal IC Designer: Exar, Cypress, Project leader for OC-98 transceiver —Lang-Lang Dang, Dir. Strategic Accounts - China • Chinese handset vendor relationships: Dir. Handset Engineering Enuvis (SiRF), Haier, Casio —Rafet Sevilen, Dir. Sales • Semiconductor sales: 20 years experience from Conx, SigmaGyros, AMD
  18. 18. SiGyrosTHE NEXT GENERATION OF INTEGRATED POSITIONING SOLUTIONS (proprietary and confidential) 18 The Deal • Financing Objectives — Seeking $10Mn investment for 40% of Shares • Signed term-sheet for $5Mn — Seeking two additional investors with (i) strong aerospace industry contacts and (ii) MEMS industry experience • Use of Funds — Transfer technology to commercial foundry — Develop integrated MEMS/Gyro products • for storage, consumer, and communications • for navigation — Recruit additional engineering and management expertise • Exit Strategy — Build full-support component manufacturing company — Profitable in 26 months, 15% earnings growth — IPO in year 4 ($100Mn estimated valuation)

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