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What is a Smartphone?
Mokwon University
Yong Heui CHO(조용희)
yhcho@mu.ac.kr
Definition
 Smartphone
 Mobile phone + computer + sensors +
wireless I/O
 Mobile OS: speed vs. battery life
2
←inbritec...
Computer of Tomorrow
3
Devoid of CPU and memory
Smartphone HW: AP
 Application Platform Chip
 AP: Application Processor
 Flash memory
 Mobile Dynamic RAM
 PMU: Power...
 Connectivity Platform Chip
 CPU: Central Processing Unit
 DSP: Digital Signal Processing
 RF baseband processing
 Vo...
 UMTS/HSDPA/HSUPA
 850, 900, 1900, 2100 MHz
 GSM/EDGE
 850, 900, 1800, 1900 MHz
 CDMA EV-DO Rev. A
 800, 1900 MHz
Wo...
Openmoko Project
 Open source mobile phone project
7
UART: Universal Asynchronous Rx/Tx
SDIO: Secure Digital I/O
GPIO: Ge...
Apple iPhone 4S
8 ←techrepublic.com
 Apple released iPhone 4S in Oct. 2011.
 A5: powerful and faster than A4
 Twin ante...
Breakdown of iPhone 4S
9
EMI Shield
←ifixit.com
Without battery
Mother-Board
Li-ion Battery
 3.7 [V]: used for bias of active
devices (amplifiers, mixers, …)
 This voltage should be small to
consum...
A5 Processor
 1 GHz, 500 MB RAM
 Designed by Apple (licensed from
ARM) and manufactured by Samsung
11
Chip R,L,C
Instruc...
Power Amplifier
 PA: transmitting the RF power into air
 Heat sink is needed. Look at the metal
part below.
12
Avaga PA:...
Mother-Board
13
Qualcomm Multi-Band RF Transceiver
TriQuint SAW (Surface Acoustic Wave) BPF
TriQuint WCDMA/HSUPA PA-Duplex...
Samsung Galaxy S III
14 ←techrepublic.com
 Samsung released Galaxy S III in May 2012.
 Quad-core A9 processor
Breakdown of Galaxy S III
15
Li-ion Battery
 3.8 [V]: used for bias of active devices
(amplifiers, mixers, …)
 This voltage should be small to consum...
A9 Processor
 1.4 GHz, 2 GB RAM
 Designed by Samsung (licensed from
ARM) and manufactured by Samsung
17
NEON: Multimedia
Jack, Speaker, GPS Antenna
18
2 GB Mobile DRAM
19
PMIC
 Qualcomm Power Management IC
20
RF Transceiver
 Qualcomm multiband/mode RF
transceiver
21
Quad-Band PA
 TriQuint GSM/GPRS/EDGE power
amplifier
22
LTE PA
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  1. 1. What is a Smartphone? Mokwon University Yong Heui CHO(조용희) yhcho@mu.ac.kr
  2. 2. Definition  Smartphone  Mobile phone + computer + sensors + wireless I/O  Mobile OS: speed vs. battery life 2 ←inbritech.com
  3. 3. Computer of Tomorrow 3 Devoid of CPU and memory
  4. 4. Smartphone HW: AP  Application Platform Chip  AP: Application Processor  Flash memory  Mobile Dynamic RAM  PMU: Power Management Unit  Audio Codec  Bluetooth  WiFi 4
  5. 5.  Connectivity Platform Chip  CPU: Central Processing Unit  DSP: Digital Signal Processing  RF baseband processing  Voice processing  PA: Power Amplifier  Tx-Rx switch  DAC + ADC 5 Smartphone HW: CP
  6. 6.  UMTS/HSDPA/HSUPA  850, 900, 1900, 2100 MHz  GSM/EDGE  850, 900, 1800, 1900 MHz  CDMA EV-DO Rev. A  800, 1900 MHz World Phone Capability 6 -UMTS: Universal Mobile Telecommunications System -HSDPA: High Speed Downlink Packet Access -GSM: Global System for Mobile communication -EDGE: Enhanced Data rates for GSM Evolution -EV-DO: Evolution-Data Optimized
  7. 7. Openmoko Project  Open source mobile phone project 7 UART: Universal Asynchronous Rx/Tx SDIO: Secure Digital I/O GPIO: General Purpose I/O I2C: Inter-Integrated Circuit
  8. 8. Apple iPhone 4S 8 ←techrepublic.com  Apple released iPhone 4S in Oct. 2011.  A5: powerful and faster than A4  Twin antenna: diversity
  9. 9. Breakdown of iPhone 4S 9 EMI Shield ←ifixit.com Without battery Mother-Board
  10. 10. Li-ion Battery  3.7 [V]: used for bias of active devices (amplifiers, mixers, …)  This voltage should be small to consume smaller power (P = I x V)  5.3 [Whr]: unit for energy (W x hour) 10
  11. 11. A5 Processor  1 GHz, 500 MB RAM  Designed by Apple (licensed from ARM) and manufactured by Samsung 11 Chip R,L,C Instruction Data NEON: Multimedia
  12. 12. Power Amplifier  PA: transmitting the RF power into air  Heat sink is needed. Look at the metal part below. 12 Avaga PA: 2G and 3G Skyworks PA: GSM, EDGE, WCDMA
  13. 13. Mother-Board 13 Qualcomm Multi-Band RF Transceiver TriQuint SAW (Surface Acoustic Wave) BPF TriQuint WCDMA/HSUPA PA-Duplexer
  14. 14. Samsung Galaxy S III 14 ←techrepublic.com  Samsung released Galaxy S III in May 2012.  Quad-core A9 processor
  15. 15. Breakdown of Galaxy S III 15
  16. 16. Li-ion Battery  3.8 [V]: used for bias of active devices (amplifiers, mixers, …)  This voltage should be small to consume smaller power (P = I x V)  2,100 [mAh]: unit for energy (W x hour) 16
  17. 17. A9 Processor  1.4 GHz, 2 GB RAM  Designed by Samsung (licensed from ARM) and manufactured by Samsung 17 NEON: Multimedia
  18. 18. Jack, Speaker, GPS Antenna 18
  19. 19. 2 GB Mobile DRAM 19
  20. 20. PMIC  Qualcomm Power Management IC 20
  21. 21. RF Transceiver  Qualcomm multiband/mode RF transceiver 21
  22. 22. Quad-Band PA  TriQuint GSM/GPRS/EDGE power amplifier 22 LTE PA

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