Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.
Mokwon University          Yong Heui CHO(조용희)                yhcho@mu.ac.krSmartphone Hardware    Architecture
Definition Smartphone   Mobile phone + computer + sensors +    wireless I/O   Mobile OS: speed vs. battery life        ...
Computer of TomorrowDevoid of CPU and memory                           3
Smartphone HW: AP Application Platform Chip     AP: Application Processor     Flash memory     Mobile Dynamic RAM    ...
Smartphone HW: CP Connectivity Platform Chip   CPU: Central Processing Unit   DSP: Digital Signal Processing     RF ba...
Openmoko Project Open source mobile phone project           UART: Universal Asynchronous Rx/Tx                        SDI...
Samsung Galaxy S III Samsung released Galaxy S III in May 2012. Quad-core A9 processor                       7   ←techre...
Breakdown of Galaxy S III             8
Li-ion Battery 3.8 [V]: used for bias of active devices  (amplifiers, mixers, …)   This voltage should be small to consu...
A9 Processor   1.4 GHz, 2 GB RAM   Designed by Samsung (licensed from    ARM) and manufactured by SamsungNEON: Multimedi...
Jack, Speaker, GPS Antenna             11
2 GB Mobile DRAM            12
PMIC Qualcomm Power Management IC               13
RF Transceiver Qualcomm multiband/mode RF  transceiver               14
Quad-Band PA TriQuint GSM/GPRS/EDGE power  amplifier                      LTE PA               15
Upcoming SlideShare
Loading in …5
×

Smartphone Hardware Architecture

11,728 views

Published on

Published in: Technology, Business
  • Be the first to comment

Smartphone Hardware Architecture

  1. 1. Mokwon University Yong Heui CHO(조용희) yhcho@mu.ac.krSmartphone Hardware Architecture
  2. 2. Definition Smartphone  Mobile phone + computer + sensors + wireless I/O  Mobile OS: speed vs. battery life 2 ←inbritech.com
  3. 3. Computer of TomorrowDevoid of CPU and memory 3
  4. 4. Smartphone HW: AP Application Platform Chip  AP: Application Processor  Flash memory  Mobile Dynamic RAM  PMU: Power Management Unit  Audio Codec  Bluetooth  WiFi 4
  5. 5. Smartphone HW: CP Connectivity Platform Chip  CPU: Central Processing Unit  DSP: Digital Signal Processing  RF baseband processing  Voice processing  PA: Power Amplifier  Tx-Rx switch  DAC + ADC 5
  6. 6. Openmoko Project Open source mobile phone project UART: Universal Asynchronous Rx/Tx SDIO: Secure Digital I/O GPIO: General Purpose I/O I2C: Inter-Integrated Circuit 6
  7. 7. Samsung Galaxy S III Samsung released Galaxy S III in May 2012. Quad-core A9 processor 7 ←techrepublic.com
  8. 8. Breakdown of Galaxy S III 8
  9. 9. Li-ion Battery 3.8 [V]: used for bias of active devices (amplifiers, mixers, …)  This voltage should be small to consume smaller power (P = I x V) 2,100 [mAh]: unit for energy (W x hour) 9
  10. 10. A9 Processor  1.4 GHz, 2 GB RAM  Designed by Samsung (licensed from ARM) and manufactured by SamsungNEON: Multimedia 10
  11. 11. Jack, Speaker, GPS Antenna 11
  12. 12. 2 GB Mobile DRAM 12
  13. 13. PMIC Qualcomm Power Management IC 13
  14. 14. RF Transceiver Qualcomm multiband/mode RF transceiver 14
  15. 15. Quad-Band PA TriQuint GSM/GPRS/EDGE power amplifier LTE PA 15

×