Thin Wafers, Temporary Bonding Equipment & Materials Market 2012 Report by Yole Developpement

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Thin Wafers, Temporary Bonding Equipment & Materials Market

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Thin Wafers, Temporary Bonding Equipment & Materials Market 2012 Report by Yole Developpement

  1. 1. © 2012 Copyrights © Yole Développement SA. All rights reserved. Thin Wafers & Temporary Bonding Equipment & Materials Market Memories, Logic, Power Devices & Image Sensors markets will drive thin wafers market and related handling technologies. Infineon EVGroup Discera Sony PVA Tepla PlanOptik Matech SAMPLE
  2. 2. © 2012• 2 Copyrights © Yole Développement SA. All rights reserved. Why a thin wafers & temporary bonding equipment report? •This report is an update on two former 2011 Yole reports « Thin Wafer Manufacturing, Equipment & Materials Markets” and “Thin Wafer Market & Applications”. •Because some thin wafers, specially below 100μm thickness, will need a temporary bonding step, we decide to release this 2012 version bridging the gap between thin wafers and temporary bonding equipment.
  3. 3. © 2012• 3 Copyrights © Yole Développement SA. All rights reserved. What is NEW/2011 report •What is new: –Updated thin wafers forecast 2011-2017 •By application •By thickness •By wafer size –Updated players –New chapter on Power MOSFETs •Why thin wafers for power •Players •Roadmap –New chapter on Photovoltaic •Why thin wafers for PV •Players •Roadmap –New chapter on temporary bonding: •Players •Technologies •Applications •Challenges •Equipment forecast 2011-2017 –In units –In US$ –By application •Temporary chemistry forecast 2011-2017 •The report is now covering: –MEMS –CMOS Image Sensors (incl. BSI) –Power Devices –HBLEDs –RF –Memory & Logic –Interposers and Advanced Packaging –Photovoltaic •Compared to 2011, we have identified an increasing use for thin wafers in different applications: –Some MEMS devices are now using temporary bonding for Discear’s oscillators for example –Power devices wafer are getting thinner with 300 mm wafers coming, requiring 300 mm temporary bonding tools. –We now count power MOSFETs as devices requiring temporary bonding. –CIS’ Back Side Illumination is still a big hit for ultra thin wafers (below 10μ thickness). SONY, SONY ERICSSON, SAMSUNG, APPLE are using BSI CMOS Imagers in their camphones. –The Temporary Bonding equipment market is still small but 3D ICs will be a big push for this technology –We have estimated what the ratio for thin wafers using temporary bonding will be. We estimate that 10% of the total thin wafers shipment would go through a temporary bonding step by 2017.
  4. 4. © 2012• 4 Copyrights © Yole Développement SA. All rights reserved. From “standard” thickness to ultra-thin wafers •The demand for ultra-thin wafers has increased in a wide range of applications such as stacked packages, portable communication devices, smart cards, cellular phones … •This, in turn, requires new handling technologies. This report is dealing with all thin wafers applications with also a focus on thin wafers requiring temporary bonding step. High interconnect density: Aggressive TSV pitch & diameters IC package devices: Reduced package size and thickness Power dissipation, higher electrical performance Technology limit for handling: special equipment and processes are required (e.g. temporary bonding to a support carrier) Thin wafer drivers 100μ 10μ 1μ 500μ Standard wafers Thin wafers Ultra-thin wafers SCOPE OF THE REPORT 200μ
  5. 5. © 2012• 5 Copyrights © Yole Développement SA. All rights reserved. Thin wafer applications covered in the report MEMS CMOS Image Sensors Interposers Source: Micron 3D Stacking of memory, logic Power Devices HBLEDs RF Photovoltaic THIN WAFERS
  6. 6. © 2012• 6 Copyrights © Yole Développement SA. All rights reserved. Thinned Wafers vs. TOT Number of Shipped Wafers •By 2017, we estimate the ratio of THIN wafers vs. TOTAL number of wafers (in 300 mm eq.) to be 74%. •Compared to our 2011 forecasts, a larger growth in thin power devices and 3D stacking explain a larger increase than previously expected. CAGR 11% 14% 2011 2012 2013 2014 2015 2016 2017 Est 2011 ratio for thin wafers 34% 38% 41% 47% 53% 58% Est 2012 ratio for thin wafers 39% 43% 47% 53% 61% 69% 74% 0% 10% 20% 30% 40% 50% 60% 70% 80% Ratio Thinned Wafers/TOT IC Wafers (300 mm eq.) Thinned Wafers vs. TOTAL IC Wafers (300 mm eq.) 2011 vs. 2012 Forecast comparison
  7. 7. © 2012• 7 Copyrights © Yole Développement SA. All rights reserved. 2011 TOP Thin Wafer Processors (> 10kWSPY)
  8. 8. © 2012• 8 Copyrights © Yole Développement SA. All rights reserved. Why special thin wafer handling technologies? •New handling techniques for further wafer processing which must be performed on the backside of thin wafers (starting at 100μ thickness) are required such as temporary bonding/debonding technologies. •Actually, ginding below 50μm of residual thickness results in a great challenge for thinning and handling of ultra thin wafers in both front-end and back-end processes. Indeed, in this thickness range, the Si device wafer becomes fragile and flexible. •Today, temporary bonding technologies are numerous with no clear winning scenario coming out today. –We have identified at least 6 different technologies for temporary wafer bonding with carriers. –Each one of these approaches might have subtle differences in terms of chemistry, carriers… –Along with these approaches came temporary bonding without carrier and reconstituted wafer for Fan Out WLP. So, the total number of approaches is more than 10 as of today
  9. 9. © 2012• 9 Copyrights © Yole Développement SA. All rights reserved. Thin wafer handling solutions Thin wafer handling With carrier Without carrier Temporary bonding/debonding Mobile Electro Static Wafer Adhesive tape Peripheral Ring •Disco (TAIKO process) •DoubleCheck •Semitool (AMAT) Carriers/Equipment •FhG/ProTec •ProTec/ProTec Equipment & materials •TOK •3M •Nitto denko •Lintec With intermediate layer Without intermediate layer Materials •3M •TOK •Brewer Science •Lintec •Nitta Haas •Nitto Denko •Promerus •Shin Etsu •JSR •Thin Materials AG Equipment •EVG •SUSS MicroTEC •TEL •TOK •3M •AML
  10. 10. © 2012• 10 Copyrights © Yole Développement SA. All rights reserved. Who should buy •Foundries & chip manufacturers •Get an overview of the large panel of accessible temporary wafer bonding technologies •Spot the important temporary wafer bonding technologies in the future for your application •Temporary wafer bonder manufacturers •Identify and evaluate temporary bonding markets with market size, growth and key customers •Analyze the threads and opportunities •Monitor and benchmark your competitor’s advancements •Chemical companies •Identify and evaluate what the requirements for temporary bonding materials will be •Analyze the threads and opportunities •Financial & Strategic investors •Understand the main market dynamics and main technological trends •Get the list of the key players
  11. 11. © 2012• 11 Copyrights © Yole Développement SA. All rights reserved. For More Information … Take a look at our websites www.yole.fr and www.i-micronews.com Online free registration to YOLE publications

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