DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices o...
SORAA MR16-50-B01-12-830-25 - LED
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Glossary
1. Overv...
SORAA MR16-50-B01-12-830-25 - LED
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• This full Rever...
SORAA MR16-50-B01-12-830-25 - LED
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Lightchip Package...
SORAA MR16-50-B01-12-830-25 - LED
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Track
Wire bondin...
SORAA MR16-50-B01-12-830-25 - LED
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Optical views : c...
SORAA MR16-50-B01-12-830-25 - LED
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Optical view : cr...
SORAA MR16-50-B01-12-830-25 - LED
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SORAA MR16-50-B01-12-830-25 - LED
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• The front-end c...
SORAA MR16-50-B01-12-830-25 - LED
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SORAA MR16-50-B01-12-830-25 - LED
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• This reverse c...
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SORAA Tri-LED & Lightchip 2013 teardown reverse costing Report by Yole Developpement

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First GaN on GaN LED packaged in a silicon WLP

New in this LED: GaN substrate, triangular shape chip, simplified epitaxial structure and an original silicon-based wafer level packaging

SORAA has recently released the first GaN on GaN LED in a 50W halogen equivalent MR16 lamp with several new features.

SORAA smartly used the GaN characteristics like the optical transparency and the high electrical and thermal conductivity to create a unique vertical structure for these LEDs. The layers deposited by epitaxy are very thin.

A high current density per sq cm is obtained, estimated at 120A / sq cm. The SORAA LEDs have a triangular shape to limit the internal reflection of the light and thus increase the light extraction.

An original silicon package with a multilayer mirror is used to increase the light extraction of the LED lamp.

This report provides a complete teardown of the LED and the package with:
Detailed photos
Material analysis
Detailed structure of dies and package
Manufacturing Process Flow
In-depth economical analysis
Manufacturing cost breakdown
Selling price estimation
More information on that report at http://www.i-micronews.com/reports/SORA-Tri-LED-Lightchip/14/382/

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SORAA Tri-LED & Lightchip 2013 teardown reverse costing Report by Yole Developpement

  1. 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr June 2013 – Version 1 – Written by Sylvain Hallereau
  2. 2. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Companies Profile 8 – SORAA Profile 3. Lightchip Package and Tri-LED Characteristics 10 – Lightchip Characteristics 4. Physical Analysis 14 – Physical Analysis Methodology – SORAA MR16 Lamp – Lightchip Package Views & Dimensions – Lightchip Package and the Flex – Lightchip Package Opening – Lightchip Package Cross-Section – Phosphor – Tri-LED Assembly – Lightchip Package Characteristics – Tri-LED Views & Dimensions – Cathode – Tri-LED Singulation – Anode – Epitaxy – Tri-LED Thickness – Tri-LED Characteristics 5. Manufacturing Process Flow 42 – Global Overview – Tri-LED Fabrication Unit – Tri-LED Process Flow – Lightchip Fabrication Unit – Lightchip Process Flow 6. Cost Analysis 53 – Synthesis of the cost analysis – Main steps of economic analysis – Yields Hypotheses – GaN Substrate – Epitaxy Step – Tri-LED Front-End Cost – Tri-LED Wafer Cost – Tri-LED Cost per process steps – Tri-LED Equipment Cost per Family – Tri-LED Material Cost per Family – Back-End : Probe and cleaving Cost – Lightchip Packaging Cost – Lightchip Wafer Cost – Final Assembly Cost – Component Cost & Price Future 74 Contact 75
  3. 3. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 3 • This full Reverse Costing study has been conducted in order to give insight on technology data, manufacturing cost of the Light chip and the 36 Tri-LED in the MR16-50-B01-12-830-25 MR16 lamp from SORAA. The tri-LED component is a LED in GaN on GaN . The Lightchip is a silicon based wafer level packaging. • The MR16-50-B01-12-830-25 lamp contains 36 Tri-LED dies. Each LED is triangular and measures 0.07sq mm. • We estimated that SORAA design and manufacture the GaN on GaN LED and the silicon based wafer level package in their factories in California. Tri-LED – Triangular LED (SORAA designation) Lightchip – name of the silicon based wafer level packaging (SORAA designation)
  4. 4. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 4 Lightchip Package cross-section Lightchip Package bottom side Lightchip dimensions: 8.4mm x 8mm x 0.66mm = 67.2sq mm Flex dimensions: 13mm x 13.5mm x 0.145mm = 175.5 sq mm 13mm 13.5mm 8.5mm 8mm 0.66mm 0.145mm
  5. 5. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 5 Track Wire bonding Tri-LED Silicon Substrate Detachment of the film due to the analysis SEM view : cross section of the track on the silicon Track SEM top view : Tracks, LEDs and wire bondings Reflective surface
  6. 6. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 6 Optical views : cross_section Cross- Section SEM views : top view Cathode Anode • Tri-LED dimensions: - Shape: equilateral triangle - Thickness: xxµm - Side: 400µm - Surface: 0.07 sq mm 400µm xxµm 350µm
  7. 7. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 7 Optical view : cross-section die, edge of the transistor. Silicone P doped GaN: xxnm P layer End of the silver layer SEM view : cross-section detail of the edge of the LED 1µm Drift layer SEM view : cross-section detail of the edge of the LED Silver: 200nm Tungsten/Titanium: xxnm SiO2 : xxnm Nickel: xxnm Bump in Gold/Tin: xxµm Silver: xxµm Nickel: xxµm Detachment of the film due to the analysis
  8. 8. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  9. 9. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 9 • The front-end cost ranges from $xx to $xx according to yield variations. • The high cost of the wafer explain the portion of the manufacturing cost is due to yield losses in the cost. • The new equipment explain the portion of the manufacturing cost is due to the equipment at xx%. • The manufacturing yield is between xx% and xx% in 2013
  10. 10. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  11. 11. SORAA MR16-50-B01-12-830-25 - LED Return to TOC © 2013 by SYSTEM PLUS CONSULTING, all rights reserved. 11 • This reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates. • These results are open for discussion. We can re-evaluate this circuit with your information. Please contact us: Partner: Le Quartz 75 cours Emile Zola 69100 Lyon-Villeurbanne +33 (0)4 72 83 01 80 www.yole.fr

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