2.5D, 3DIC and TSV Interconnect Patent Investigation Report
3DIC technology is seen today as a new paradigm for the future of the semiconductor industry: understanding the status of the patent situation is key to understanding the business situation.
A very young patent landscape dominated by 10 companies...
For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened. 52% of the families have been classified as relevant and further studied. The indepth analysis quickly revealed that the overall patent landscape was pretty young with 82% of patents filed since 2006. Actually about 260 players are involved in 3DIC technology while the top 10 assignees represents 48% of patents filed in the 3DIC domain! We selected 5 companies from these 10 most active players to focus on and lead an accurate analysis of their patent portfolios.
The report also provides a database of all the relevant patents we have analyzed in an Excel file which allows multi-criteria searching. The criteria are basically those we used for the technological segmentation:
• Patent information ◦Patent publication number
◦ Link to the PDF document
◦ Oldest priority date
◦ Patent potential ranking
◦ Nb of citing patent families
• Technological segmentation ◦Design
◦ Process: lithography, etching, metallization, passivation, filling, repassivation, UBM, bonding, thinning
• End Application mentioned ◦Memory
◦ Logic Sip / SoC
We found 4 main types of business models among the top 10 assignees involved in this mutating middleend area:
• Foundries and IDM: IBM, Samsung, Intel
• OSATs: STATS ChipPAC, Amkor
• Memory IDM/Foundries: Micron, SK Hynix, Elpida
• Research centers: ITRI
It is also interesting to notice that the USA is the early player increasingly involved in 3DIC since 1969. China and Korea are new players since 2005.
This complete description of the patent landscape is included in the first part of the report and provides all the background materials for the 3DIC patent landscape analysis. The report provides a complete analysis of the patent landscape including geographical origins of the patents, companies or R&D organizations that have been granted the patents, historical data on when the companies that have applied for patents in the last 20 years, inventors of the patents, expiration status, R&D collaborations…
Understanding the patent portfolio of the top 10 3DIC asignees
The report provides a deep dive into each of the patent portfolios of assignees selected by Yole Développement, including Intel, Samsung, Micron, IBM and TSMC.
For each of these companies, the report provides an in-depth analysis of its patent portfolio, highlighting the following points:
• Company patent portfolio evolution
• Countries of deposition and origin of the patents
• Top inventors