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Status of the MEMS Industry 2014 Report by Yole Developpement


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Status of the MEMS Industry 2014

Challenged by newcomers proposing innovative low-cost solutions for consumer applications, established MEMS players must develop new strategies to ensure continued growth.

Although consumer applications will enjoy significant volume growth (around 20% expected between 2013- 2019), strong price pressure (-7% a year) will result in modest 13% revenue growth over the same time period. And although the MEMS sector achieved 10.4% overall growth in 2013, closing in on a US$12B business, established players are struggling to continue their usual consumer applications growth. If we look at the top MEMS players, we see that STMicroelectronics while still producing at high volume, is struggling to get good margins – even though it’s shown impressive growth over the last several years, and reached US$1B sales in 2012 – the first MEMS company to do so. Meanwhile, Texas Instruments’ DLP sales are flat, since pico projection applications are long to take off (at least for consumer applications), and the professional/commercial projection market isn’t growing either. Also, Hewlett-Packard, the major inkjet heads player, has seen sales decline, as have most other inkjet heads companies.
Another characterization of the current MEMS industry is the fact that there is almost no new, big companies entering the business. Instead, newcomers have opted for a fabless model, thus minimizing their infrastructure investments.
With this in mind, here are a few different ways that major MEMS companies can be more successful:
• MEMS product portfolio diversification: this is the case for STMicroelectronics, Robert Bosch and now InvenSense, while Texas Instruments is currently pursuing this strategy. Meanwhile, Knowles is benefiting from the microphone business’s growth – however, as with other MEMS devices, this market could level off in the future, so product diversification could be an option for them as well.
• Sharing production infrastructure between multiple markets: for example, Bosch’s MEMS automotive business compensates for the low margin in its consumer activity. STMicroelectronics has also entered the automotive business, but with only modest success thus far.
• Outsourcing manufacturing: InvenSense has shown impressive growth because, as a fabless company, its cost structure is less than other MEMS manufacturers.
Also, with the market requiring increasingly complex sensing functions, software has become a critical part of the sensing module, especially for combos. Invensense’s acquisition of Movea in July 2014 confirms this trend.

More information on that report at

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Status of the MEMS Industry 2014 Report by Yole Developpement

  1. 1. © 2014 Copyrights © Yole Développement SA. All rights reserved. Status of the MEMS Industry 2014 Challenged by newcomers proposing innovative low-cost solutions for consumer applications, established MEMS players must develop new strategies to ensure continued growth. SAMPLE
  2. 2. © 2014• 2 • This 2014 edition of “Status of the MEMS Industry” presents the MEMS device market and key industry changes and trends. • Yole is actively following the market evolution of more than 220+ MEMS applications and is tracking 350+ MEMS companies  this report combines all these applications into 15+ major MEMS devices: IJ heads, pressure sensors, microphones, accelerometers, gyroscopes, magnetometers, IMUs, micromirrors, MOEMS, microbolometers, IR sensors, microdisplays, microfluidics, RF MEMS, Oscillators, micro tips, and emerging MEMS devices. • Based on the thousands of direct interviews Yole Développement analysts are conducting annually in the MEMS field with MEMS manufacturers, system manufacturers integrating MEMS and MEMS designers, MEMS equipment and material manufacturers, and MEMS technology developers, this 11th version of the “Status of the MEMS Industry” provides up-to-date analyses and data on MEMS markets.
  3. 3. © 2014• 3 2012-2019 MEMS Markets (US$M)
  4. 4. © 2014• 4 2012-2019 MEMS Markets by Application (US$M)
  5. 5. © 2014• 5 Evolution 2009-2013: Maintaining growth is a challenge for consumer applications
  6. 6. © 2014• 6 Example of supply chain & infrastructure 15+ detailed supply chains
  7. 7. © 2014• 7 Consumer MEMS challenges PRICE PRESSURE SIZE REDUCTION NEW APPLICATIONS Internet of Things Mobility LBSE-Health Social networking Connectivity everywhere MORE INTELLIGENCE Sensor fusionSoftware Data discrimination Stronger RF specifications Closer integration with processing Better performance High volume production 3D integration New wafer bonding Fabless model Shared fab infrastructure MEMS across multiple markets New MEMS design Above IC
  8. 8. © 2014• 8 Accelerometer MEMS size evolution 2008 2010 2011 MEMS Size (mm²) 4 2 3 $0.03-0.075 $0.075-0.1 >$0.1 ST LIS331DLH ST LIS3DH BOSCH BMA180 BOSCH BMA250 / BMC050 Kionix KXTE9 5 ADI ADXL346 VTI CMA3000 n.a. 2007 ST LIS3L02AE12 2012 2013 ADI ADXL362 ST LIS302DL MCube BI3L BOSCH SMI540 ST LSM330 ST LSM303D AUTO CONSUMER 2014 BOSCH BMA355 1 2009 All are 3-axis accelerometers US$ values are Production Cost
  9. 9. © 2014• 9 New approaches to overcome MEMS challenges Maximum optimization Breakthrough • Single 3A gyro design (STM, Invensense) • Single 3A accelero + 3A gyro structure (STM, Invensense) • TSV via last (STM) • TSV via first (STM) • TSV in ASIC (Bosch) • 3D MEMS with TSV (mCube) • Eutectic Au-Si bonding (Maxim) • Eutectic Al-Ge bonding (Bosch, Invensense) • CMOS-MEMS (Invensense) • TSV platform (Teledyne Dalsa) Design Process • Single 3A gyro design (STM, Invensense) • Single 3A accelero + 3A gyro structure (STM, Invensense) New detection principles • BAW resonant sensor (Qualté) • M&NEMS (Tronic’s) • NEMS gas chromatography (APIX) • Suspended Microchannel Resonator (Affinity Biosensors) • Quartz Crystal Microbalance (Q-Sense)
  10. 10. © 2014• 10 2020+2010200019901960 Cost(US$) Size(mm²) FIRST INTEGRATED SENSOR Ex: SA20 Sensonor for Airbag systems. CAPACITIVE COMB DRIVE BECOMES DOMINANT Ex: ST, Bosch … PACKAGING / INTEGRATION AS ENABLING TECHNOLOGY Ex: SiTime, ST, Bosch … From micro machines to MEMS MEMS to NEMS NEMS MIX MEMS (thick layer) & NEMS (gauge) FOR MIN AREA & IMPROVED PERF. Ex: Tronics DISRUPTIVE APPROACHES Ex: EPFL, CNRS, CEA Leti, Caltech, Berkeley … 3 10 1 15 0.5 1 0.1 5 From micro machines to MEMS to NEMS …
  11. 11. © 2014• 11 Available MEMS reports Technology Trends for Inertials MEMS Trends in MEMS Manufacturing & Packaging Ferro-Electric Thin Films IMU & Gyro for Defense, Aerospace & Industrial Status of the CMOS Image Sensors Industry Thin Wafer Handling MEMS Cosim+ MEMS Manufacturing Cost Simulation Tool Motion Sensors for Consumer & Mobile applications Sensor fusion of acceleros, gyros & magnetometers Infrared Detectors Technology & Market Trends Inertial MEMS Manufacturing Trends 2014 RF Filters, PAs, Antenna Switches & Tunability for Cellular Handsets MEMS Front-End Manufacturing Trends MEMS Pressure Sensor Technologies & Sensors for the Internet of Things New! MEMS Microphones MEMS for Cell Phones and Tablets Status of the MEMS Industry Emerging MEMS New! New!New! New! New! New!
  12. 12. © 2014• 12 Yole activities in MEMS YOLE FINANCE M&A/ Due Diligence/ Fundraising/ Technology brokerage PARTNERS CONSULTING Market research/Technology & Strategy/Patent Investigation/ Reverse costing MEDIA News portal/Technology magazines/ Webcasts/Communication services REPORTS Market & technology/Patent Investigation/Reverse costing Status of the MEMS Industry
  13. 13. © 2014• 13 Our offices and contact information Japan Office • For custom research: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Phone: (81) 362 693 457 - Cell : (81) 80 3440 6466 - Fax: (81) 362 693 448 - Email: • For reports business: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: European and North America Office • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 - Cell: (82) 10 4097 5810 - Fax: (82) 2 2010 8899 – Email:
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