SlideShare a Scribd company logo
1 of 16
Download to read offline
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not
bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The
quoted trademarks are property of their owners.
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1
Electronic Costing & Technology Experts
www.systemplus.fr
21 rue la Nouë Bras de Fer
44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr
April 2016 – Version 1 – Written by Stéphane ELISABETH
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2
Glossary
1. Overview / Introduction 4
– Executive Summary
– Reverse Costing Methodology
2. Company Profile 7
– Qualcomm
– Snapdragon 820 Chipset
3. Physical Analysis 13
– Synthesis of the Physical Analysis
– Samsung Galaxy S7 Teardown 15
– Smartphone Disassembly & Component Removal
– eWLB Package Analysis 21
– View, Dimensions & Marking
– eWLB Package
– eWLB Package Cross-Section
– eWLB Redistribution Layer
– Summary of Physical Data
– Die Analysis 37
– View, Dimensions & Marking
– Die Main Blocks ID
– Die Process
– Die Cross-Section Analysis 47
– Die Cross-section
– Metal Layer Cross Section
– Process Characteristics
4. Manufacturing Process Flow 53
– Chip Fabrication Unit
– eWLB Fabrication Unit
– eWLB Process Flow
5. Cost Analysis 64
– Synthesis of the cost analysis
– Main steps of economic analysis
– Yields Hypotheses
– Die Cost Analysis 69
– Wafer Front-End Cost
– Probe Test Cost
– Die Cost
– eWLB Package Cost Analysis 73
– eWLB Wafer Cost
– eWLB Cost per Process Step
– Component Cost 78
6. Cost Analysis Simulation without Fan-Out Packaging 80
– Die Cost
– WLP Package Cost
– Component Cost Comparison
7. Estimated Price Analysis 86
– Manufacturer Financial Ratios
– Estimated Selling Price
8. Package Comparison 89
– Fan-Out Comparison
– Package process Comparison
– Synthesis Comparison
Contact 93
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3
• This full reverse costing study has been conducted to provide insight on technology data,
manufacturing cost and selling price of the Qualcomm WCD9335 Fan-Out WLP Audio Codec.
• The Audio codec from Qualcomm should be found in all smartphone using Snapdragon 820 chipset.
The packaging use fan-out technology. Actually more than 100 models all around the world featured
the entire chipset, among them the Samsung Galaxy S7 and S7 Edge in their US version.
• The WCD9335 is an audio codec from Qualcomm for smartphone. The WCD9335 is featuring a die
packaged in a fan-out technology.
• The analysis is focused on the fan-out packaging.
• The package corresponds to wafer-level package licensed by Intel/Infineon called eWLB (embedded
Wafer Level Ball Grid Array).
• Based on a complete physical analysis of the WCD9335 component, this report provides the
manufacturing cost of the component. It will be compared to other Fan-out package from Infineon
and NXP.
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4
Samsung S7 US Version
Main Board (Bottom view)
• The Audio Codec chip is located on the main board.
Audio area
Samsung S7 US Version
Main Board view
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10
Qualcomm WCD9335 eWLB Audio Codec
Return to TOC
© 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates
completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the
manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:
o Consulting and Specific Analysis
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole Développement
Email: levenez@yole.fr
– Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K.
Email: katano@yole.fr
– RoW: Jean-Christophe Eloy, President & CEO, Yole Développement
Email: eloy@yole.fr
o Report business
– North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc.
Email: laferriere@yole.fr
– Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service
Email: khamassi@yole.fr
– Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K.
Email: onozawa@yole.fr
– Korea: Hailey Yang, Business Development Manager, Korean Office
Email: yang@yole.fr
o Financial services
– Jean-Christophe Eloy, CEO & President
Email: eloy@yole.fr
o General: Email: info@yole.fr
COMPLETE TEARDOWN WITH:
• Detailed photos
• Precise measurements
• Material analysis
• Manufacturing process flow
• Supply-chain evaluation
• Manufacturing cost analysis
• Estimated sales price
• Comparison with Cirrus
Fan-In WLP Audio Codec in
Samsung S7 European
Version
• Comparison with
Intel/Infineon’s eWLB &
NXP/nepes RCP
Qualcomm WCD9335
Fan-Out WLP Audio Codec
Title: Qualcomm WCD9335
Fan-Out WLP Audio Codec
Pages: 93
Date: April 2016
Format: PDF & Excel file
Price: Full report: EUR 3,290
Qualcomm, a world leader in mobile
technologies, offers the new Snapdragon
820, a complete chipset currently powering
or in-development with more than 100
smartphones worldwide. The U.S. versions
of Samsung’s latest flagship phones, the
Galaxy S7 and Galaxy S7 Edge, integrate the
Qualcomm’s Fan-Out Wafer-Level Package Chip
Audio Codec in eWLB Package inside Samsung Galaxy S7 and S7 Edge
Snapdragon 820 chipset. In this chipset, we discovered for the first time a
Qualcomm component featuring Fan-Out Wafer-Level Packaging (FOWLP):
the Qualcomm Audio Codec WCD9335.
Located on the smartphone’s main board, the audio codec chip’s presence in
the Samsung Galaxy S7 and S7 Edge depends on the smartphone version. The
international version, featuring an Exynos chipset, integrates the audio codec
chip from Cirrus Logic. The U.S. version, featuring the Snapdragon 820 chipset,
integrates the audio codec from Qualcomm.
The Qualcomm WDC9335 is wafer-level packaged with fan-out technology.
This is still relatively rare in the smartphone market but is expected to spread
quickly. The FOWLP technology used is the eWLB, licensed by Intel/Infineon to
several OSATs including ASE Group, Nanium, and STATS ChipPAC.
Thanks to this FOWLP process, Qualcomm is able to propose a very small die
independent of the area required by the I/O pads. The result is a very cost-
effective component that can compete with a standard fan-in WLP
technology.
This report includes a comparison with the audio codec solution from Cirrus
Logic for the international version, which uses a standard fan-in WLP
technology. It also features comparisons with FOWLP technologies like RCP
from NXP/nepes, and eWLB 1st-generation from Infineon.
Performed by
TABLE OF CONTENTS
Overview/Introduction
Company Profile & Supply
Chain
Physical Analysis
Physical Analysis Methodology
• Samsung Galaxy S7 Teardown
 Component removal
• Fan-Out Packaging Analysis
 Package view, dimensions &
marking
 Fan-out package cross-section
 Fan-out package process
• Die Analysis
 Die view, dimensions & marking
 Die cross-section
 Die process
Manufacturing Process Flow
• Chip Fabrication Unit
• eWLB Fabrication Unit
• eWLB Process Flow
ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D Package CoSim+ and IC Price+
System Plus Consulting offers
powerful costing tools to
evaluate the production cost
& selling price from single
chip to complex structures.
3D Package Cosim+
Cost simulation tool to
evaluate the cost of any
Packaging process:
Wafer-level packaging, TSV,
3D integration…
IC Price+
The tool performs the
necessary cost simulation of
any Integrated Circuit: ASICs,
microcontrollers, memories,
DSP, smartpower…
Yvon Le Goff has joined System
Plus Consulting in 2011, in order
to set up the laboratory of
System Plus Consulting. He
previously worked during 25
years in Atmel Nantes
Technological Analysis Laboratory
as fab support in physical analysis,
and 3 years at Hirex Engineering in
Toulouse, in a DPA lab.
Author (Lab):
Yvon
Le Goff
Author:
Stéphane
Elisabeth
Dr Stéphane Elisabeth has joined
our team this year. He has a deep
knowledge of Materials
characterizations and Electronics
systems. He holds an Engineering
Degree in Electronics and
Numerical Technology, and a PhD
in Materials for Microelectronics.
IC Price+
Cost Analysis
• Synthesis of the Cost Analysis
• Die Cost Analysis
 Wafer front-end cost
 Probe test cost
 Die cost
• eWLB Cost Analysis
 eWLB wafer cost
 eWLB cost per process step
• Component Cost
Cost Analysis Simulation
Without eWLB Packaging
 Die cost
 WLP package cost
 Component cost comparison
Estimated Price Analysis
• Manufacturer Financial Ratios
• Estimated Sales Price
Technology and Cost
Comparison with Infineon’s
eWLB and NXP’s RCP
3D-Package CoSim+
NXP MR2001 Multi-
Channel 77 GHz
Radar Rx/Tx/VCO Fan-Out RCP
Chipset
Infineon RRN7745P &
RTN7735P
eWLB Fan-Out Package -
77GHz Radar Dies
GaN Systems GaNpx
Top Cooled
AT&S ECP® Embedded
Power Die Package
The new 77 GHz Radar Chipset for
ADAS from NXP/Freescale - SiGe:C
xHBT technology & Fan-Out RCP
Wafer-Level Packaging.
New receiver & transmitter
components with a SiGe:C HBT
technology from Infineon & eWLB
Fan-Out Wafer-Level Packaging.
Latest GS66508T power
transistor of GaN Systems
packaged with a top-side
cooling.
Pages: 129
Date: March 2016
Full report: EUR 3,290*
Pages: 104
Date: October 2015
Full report: EUR 2,990*
Pages: 68
Date: October 2015
Full report: EUR 2,490*
RELATED REPORTS
ANNUAL SUBSCRIPTION OFFER
You can choose to buy over 12
months a set of 3, 4, 5, 7, 10 or
15 Reverse Costing® reports.
Up to 47% discount!
More than 40 reports released each year on the following topics (considered for 2016):
• MEMS & Sensors (20 reports):
• Gyros/Accelerometers/IMU
• Oscillators/RF switches
• Pressure sensors/Gas sensors
• Power Electronics & Systems (12 reports):
• GaN and SiC devices
• Inverters & modules
• Automotive radars
• Head Up displays, Displays
Each year System Plus Consulting releases a comprehensive collection of new reverse engineering &
costing analyses in various domains.
• ICs (3 reports):
• Multimedia SoC
• Ethernet for car IC, etc.
• Imaging & LEDs (11 reports):
• Camera modules, Infrared
sensors & cameras
• LEDs
• Advanced Packaging (5 reports):
• WLP, TSV
• Embedded devices, etc.
Performed by
*For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT.
ORDER FORM
Performed by
DELIVERY on receipt of payment:
By credit card:
Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__|
Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__|
By bank transfer:
BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France,
Bank code : 30056, Branch code : 00170
Account No : 0170 200 1565 87,
SWIFT or BIC code : CCFRFRPP,
IBAN : FR76 3005 6001 7001 7020 0156 587
Return order by:
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DEVELOPPEMENT,
75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne
Contact:
David Jourdan, jourdan@yole.fr, Tel: +33 (0)4 72 83 01 90
BILLING CONTACT
ABOUT YOLE DEVELOPPEMENT
Name (Mr/Ms/Dr/Pr):
......................................................................................
Job Title:
......................................................................................
Company:
......................................................................................
Address:
......................................................................................
City: State:
......................................................................................
Postcode/Zip:
......................................................................................
Country:
......................................................................................
VAT ID Number for EU members:
......................................................................................
Tel:
......................................................................................
Email:
.....................................................................................
Date:
.......................................................................................
Signature:
......................................................................................
Distributed by
First Name: .................................................................. Last Name: ............................................................................
Email:............................................................................ Phone:.....................................................................................
About Yole Développement – www.yole.fr / www.i-micronews.com
Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy
consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro
manufacturing, Yole has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semi., LED, Image
Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing and Power Electronics. We
support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends
to develop their business.
CONSULTING
• Market data & research,
marketing analysis
• Technology analysis
• Reverse engineering & costing
services
• Strategy consulting
• Patent analysis
FINANCIAL SERVICES
• Mergers & Acquisitions
• Due diligence
• Fundraising
More information on
www.yolefinance.com
REPORTS
• Collection of technology &
market reports
• Manufacturing cost
simulation tools
• Component reverse
engineering & costing analysis
• Patent investigation
MEDIA & EVENTS
• i-Micronews.com, online disruptive
technologies website
• @Micronews, weekly e-newsletter
• Technology Magazines dedicated to
MEMS, Advanced Packaging, LED and
Power Electronics
• Communication & webcasts services
• Events: Yole Seminars, Market Briefings
SHIP TO PAYMENT
 Full Reverse Costing report: EUR 3,290*
Please process my order for “Qualcomm WCD9335 Fan-Out WLP Audio Codec” Reverse Costing Report
Performed by
TERMS AND CONDITIONS OF SALES
. Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of
Sale”.
“Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal
interests.
“Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical
information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of
one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included.
• Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12
calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a
consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With
more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends.
1. Scope
1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY
OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE
BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts
these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any
confirmation in writing, orders shall be deemed to have been accepted.
2. Mailing of the Products
2.1 Products are sent by email to the Buyer:
- within [1] month from the order for Products already released; or
- within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in
progress.
2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to
compute or compare the data in order to enable the Seller to deliver a high quality Products.
2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3.
2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to
replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in
writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under
article 2.5 shall remain at the Buyer’s risk.
3. Price, invoicing and payment
3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time
to time. The effective price is deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange
to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
Distributed by

More Related Content

More from Yole Developpement

Computing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - SampleComputing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
 
Processor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - SampleProcessor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - SampleYole Developpement
 
Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021Yole Developpement
 
MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
 
System-in-Package Technology and Market Trends 2021 - Sample
System-in-Package Technology and Market Trends 2021 - SampleSystem-in-Package Technology and Market Trends 2021 - Sample
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
 
Neuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - SampleNeuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - SampleYole Developpement
 
Future Soldier Technologies 2021
Future Soldier Technologies 2021Future Soldier Technologies 2021
Future Soldier Technologies 2021Yole Developpement
 
High-end Performance Packaging 2020
High-end Performance Packaging 2020High-end Performance Packaging 2020
High-end Performance Packaging 2020Yole Developpement
 
Computing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - SampleComputing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - SampleYole Developpement
 
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 20205G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
 
Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020Yole Developpement
 
Status of the Memory Industry 2020
Status of the Memory Industry 2020Status of the Memory Industry 2020
Status of the Memory Industry 2020Yole Developpement
 
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
 
Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
 
GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
 
BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020Yole Developpement
 
Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020Yole Developpement
 
Point-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based TestingPoint-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based TestingYole Developpement
 
Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020Yole Developpement
 

More from Yole Developpement (20)

Computing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - SampleComputing and AI technologies for mobile and consumer applications 2021 - Sample
Computing and AI technologies for mobile and consumer applications 2021 - Sample
 
Processor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - SampleProcessor Quarterly Market Monitor Q3 2021 - Sample
Processor Quarterly Market Monitor Q3 2021 - Sample
 
Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021Automotive Semiconductor Trends 2021
Automotive Semiconductor Trends 2021
 
MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021MicroLED Displays - Market, Industry and Technology Trends 2021
MicroLED Displays - Market, Industry and Technology Trends 2021
 
System-in-Package Technology and Market Trends 2021 - Sample
System-in-Package Technology and Market Trends 2021 - SampleSystem-in-Package Technology and Market Trends 2021 - Sample
System-in-Package Technology and Market Trends 2021 - Sample
 
Neuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - SampleNeuromorphic Computing and Sensing 2021 - Sample
Neuromorphic Computing and Sensing 2021 - Sample
 
Silicon Photonics 2021
Silicon Photonics 2021Silicon Photonics 2021
Silicon Photonics 2021
 
Future Soldier Technologies 2021
Future Soldier Technologies 2021Future Soldier Technologies 2021
Future Soldier Technologies 2021
 
High-end Performance Packaging 2020
High-end Performance Packaging 2020High-end Performance Packaging 2020
High-end Performance Packaging 2020
 
Computing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - SampleComputing for Datacenter Servers 2021 - Sample
Computing for Datacenter Servers 2021 - Sample
 
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 20205G’s Impact on RF Front-End and Connectivity for Cellphones 2020
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020
 
Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020Ultrasound Sensing Technologies 2020
Ultrasound Sensing Technologies 2020
 
Status of the Memory Industry 2020
Status of the Memory Industry 2020Status of the Memory Industry 2020
Status of the Memory Industry 2020
 
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...
 
Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020Status of the Radar Industry: Players, Applications and Technology Trends 2020
Status of the Radar Industry: Players, Applications and Technology Trends 2020
 
GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020GaN RF Market: Applications, Players, Technology and Substrates 2020
GaN RF Market: Applications, Players, Technology and Substrates 2020
 
BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020BioMEMS Market and Technology 2020
BioMEMS Market and Technology 2020
 
Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020Optical Transceivers for Datacom & Telecom 2020
Optical Transceivers for Datacom & Telecom 2020
 
Point-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based TestingPoint-of-Need 2020 – Including PCR-Based Testing
Point-of-Need 2020 – Including PCR-Based Testing
 
Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020Silicon Photonics Market & Technology 2020
Silicon Photonics Market & Technology 2020
 

Recently uploaded

AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)Samir Dash
 
Introduction to Multilingual Retrieval Augmented Generation (RAG)
Introduction to Multilingual Retrieval Augmented Generation (RAG)Introduction to Multilingual Retrieval Augmented Generation (RAG)
Introduction to Multilingual Retrieval Augmented Generation (RAG)Zilliz
 
ADP Passwordless Journey Case Study.pptx
ADP Passwordless Journey Case Study.pptxADP Passwordless Journey Case Study.pptx
ADP Passwordless Journey Case Study.pptxFIDO Alliance
 
API Governance and Monetization - The evolution of API governance
API Governance and Monetization -  The evolution of API governanceAPI Governance and Monetization -  The evolution of API governance
API Governance and Monetization - The evolution of API governanceWSO2
 
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers:  A Deep Dive into Serverless Spatial Data and FMECloud Frontiers:  A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FMESafe Software
 
Choreo: Empowering the Future of Enterprise Software Engineering
Choreo: Empowering the Future of Enterprise Software EngineeringChoreo: Empowering the Future of Enterprise Software Engineering
Choreo: Empowering the Future of Enterprise Software EngineeringWSO2
 
Introduction to use of FHIR Documents in ABDM
Introduction to use of FHIR Documents in ABDMIntroduction to use of FHIR Documents in ABDM
Introduction to use of FHIR Documents in ABDMKumar Satyam
 
Modernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using BallerinaModernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using BallerinaWSO2
 
WSO2's API Vision: Unifying Control, Empowering Developers
WSO2's API Vision: Unifying Control, Empowering DevelopersWSO2's API Vision: Unifying Control, Empowering Developers
WSO2's API Vision: Unifying Control, Empowering DevelopersWSO2
 
MINDCTI Revenue Release Quarter One 2024
MINDCTI Revenue Release Quarter One 2024MINDCTI Revenue Release Quarter One 2024
MINDCTI Revenue Release Quarter One 2024MIND CTI
 
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....rightmanforbloodline
 
"I see eyes in my soup": How Delivery Hero implemented the safety system for ...
"I see eyes in my soup": How Delivery Hero implemented the safety system for ..."I see eyes in my soup": How Delivery Hero implemented the safety system for ...
"I see eyes in my soup": How Delivery Hero implemented the safety system for ...Zilliz
 
Quantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation ComputingQuantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation ComputingWSO2
 
CNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In PakistanCNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In Pakistandanishmna97
 
Simplifying Mobile A11y Presentation.pptx
Simplifying Mobile A11y Presentation.pptxSimplifying Mobile A11y Presentation.pptx
Simplifying Mobile A11y Presentation.pptxMarkSteadman7
 
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers:  A Deep Dive into Serverless Spatial Data and FMECloud Frontiers:  A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FMESafe Software
 
Tales from a Passkey Provider Progress from Awareness to Implementation.pptx
Tales from a Passkey Provider  Progress from Awareness to Implementation.pptxTales from a Passkey Provider  Progress from Awareness to Implementation.pptx
Tales from a Passkey Provider Progress from Awareness to Implementation.pptxFIDO Alliance
 
Exploring Multimodal Embeddings with Milvus
Exploring Multimodal Embeddings with MilvusExploring Multimodal Embeddings with Milvus
Exploring Multimodal Embeddings with MilvusZilliz
 
Design Guidelines for Passkeys 2024.pptx
Design Guidelines for Passkeys 2024.pptxDesign Guidelines for Passkeys 2024.pptx
Design Guidelines for Passkeys 2024.pptxFIDO Alliance
 

Recently uploaded (20)

AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
AI+A11Y 11MAY2024 HYDERBAD GAAD 2024 - HelloA11Y (11 May 2024)
 
Introduction to Multilingual Retrieval Augmented Generation (RAG)
Introduction to Multilingual Retrieval Augmented Generation (RAG)Introduction to Multilingual Retrieval Augmented Generation (RAG)
Introduction to Multilingual Retrieval Augmented Generation (RAG)
 
ADP Passwordless Journey Case Study.pptx
ADP Passwordless Journey Case Study.pptxADP Passwordless Journey Case Study.pptx
ADP Passwordless Journey Case Study.pptx
 
API Governance and Monetization - The evolution of API governance
API Governance and Monetization -  The evolution of API governanceAPI Governance and Monetization -  The evolution of API governance
API Governance and Monetization - The evolution of API governance
 
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers:  A Deep Dive into Serverless Spatial Data and FMECloud Frontiers:  A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
 
Choreo: Empowering the Future of Enterprise Software Engineering
Choreo: Empowering the Future of Enterprise Software EngineeringChoreo: Empowering the Future of Enterprise Software Engineering
Choreo: Empowering the Future of Enterprise Software Engineering
 
Understanding the FAA Part 107 License ..
Understanding the FAA Part 107 License ..Understanding the FAA Part 107 License ..
Understanding the FAA Part 107 License ..
 
Introduction to use of FHIR Documents in ABDM
Introduction to use of FHIR Documents in ABDMIntroduction to use of FHIR Documents in ABDM
Introduction to use of FHIR Documents in ABDM
 
Modernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using BallerinaModernizing Legacy Systems Using Ballerina
Modernizing Legacy Systems Using Ballerina
 
WSO2's API Vision: Unifying Control, Empowering Developers
WSO2's API Vision: Unifying Control, Empowering DevelopersWSO2's API Vision: Unifying Control, Empowering Developers
WSO2's API Vision: Unifying Control, Empowering Developers
 
MINDCTI Revenue Release Quarter One 2024
MINDCTI Revenue Release Quarter One 2024MINDCTI Revenue Release Quarter One 2024
MINDCTI Revenue Release Quarter One 2024
 
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
TEST BANK For Principles of Anatomy and Physiology, 16th Edition by Gerard J....
 
"I see eyes in my soup": How Delivery Hero implemented the safety system for ...
"I see eyes in my soup": How Delivery Hero implemented the safety system for ..."I see eyes in my soup": How Delivery Hero implemented the safety system for ...
"I see eyes in my soup": How Delivery Hero implemented the safety system for ...
 
Quantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation ComputingQuantum Leap in Next-Generation Computing
Quantum Leap in Next-Generation Computing
 
CNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In PakistanCNIC Information System with Pakdata Cf In Pakistan
CNIC Information System with Pakdata Cf In Pakistan
 
Simplifying Mobile A11y Presentation.pptx
Simplifying Mobile A11y Presentation.pptxSimplifying Mobile A11y Presentation.pptx
Simplifying Mobile A11y Presentation.pptx
 
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers:  A Deep Dive into Serverless Spatial Data and FMECloud Frontiers:  A Deep Dive into Serverless Spatial Data and FME
Cloud Frontiers: A Deep Dive into Serverless Spatial Data and FME
 
Tales from a Passkey Provider Progress from Awareness to Implementation.pptx
Tales from a Passkey Provider  Progress from Awareness to Implementation.pptxTales from a Passkey Provider  Progress from Awareness to Implementation.pptx
Tales from a Passkey Provider Progress from Awareness to Implementation.pptx
 
Exploring Multimodal Embeddings with Milvus
Exploring Multimodal Embeddings with MilvusExploring Multimodal Embeddings with Milvus
Exploring Multimodal Embeddings with Milvus
 
Design Guidelines for Passkeys 2024.pptx
Design Guidelines for Passkeys 2024.pptxDesign Guidelines for Passkeys 2024.pptx
Design Guidelines for Passkeys 2024.pptx
 

Qualcomm WCD9335 Fan-Out WLP Audio Codec 2016 teardown reverse costing report published by Yole Developpement

  • 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr April 2016 – Version 1 – Written by Stéphane ELISABETH
  • 2. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 7 – Qualcomm – Snapdragon 820 Chipset 3. Physical Analysis 13 – Synthesis of the Physical Analysis – Samsung Galaxy S7 Teardown 15 – Smartphone Disassembly & Component Removal – eWLB Package Analysis 21 – View, Dimensions & Marking – eWLB Package – eWLB Package Cross-Section – eWLB Redistribution Layer – Summary of Physical Data – Die Analysis 37 – View, Dimensions & Marking – Die Main Blocks ID – Die Process – Die Cross-Section Analysis 47 – Die Cross-section – Metal Layer Cross Section – Process Characteristics 4. Manufacturing Process Flow 53 – Chip Fabrication Unit – eWLB Fabrication Unit – eWLB Process Flow 5. Cost Analysis 64 – Synthesis of the cost analysis – Main steps of economic analysis – Yields Hypotheses – Die Cost Analysis 69 – Wafer Front-End Cost – Probe Test Cost – Die Cost – eWLB Package Cost Analysis 73 – eWLB Wafer Cost – eWLB Cost per Process Step – Component Cost 78 6. Cost Analysis Simulation without Fan-Out Packaging 80 – Die Cost – WLP Package Cost – Component Cost Comparison 7. Estimated Price Analysis 86 – Manufacturer Financial Ratios – Estimated Selling Price 8. Package Comparison 89 – Fan-Out Comparison – Package process Comparison – Synthesis Comparison Contact 93
  • 3. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3 • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Qualcomm WCD9335 Fan-Out WLP Audio Codec. • The Audio codec from Qualcomm should be found in all smartphone using Snapdragon 820 chipset. The packaging use fan-out technology. Actually more than 100 models all around the world featured the entire chipset, among them the Samsung Galaxy S7 and S7 Edge in their US version. • The WCD9335 is an audio codec from Qualcomm for smartphone. The WCD9335 is featuring a die packaged in a fan-out technology. • The analysis is focused on the fan-out packaging. • The package corresponds to wafer-level package licensed by Intel/Infineon called eWLB (embedded Wafer Level Ball Grid Array). • Based on a complete physical analysis of the WCD9335 component, this report provides the manufacturing cost of the component. It will be compared to other Fan-out package from Infineon and NXP.
  • 4. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4 Samsung S7 US Version Main Board (Bottom view) • The Audio Codec chip is located on the main board. Audio area Samsung S7 US Version Main Board view
  • 5. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
  • 6. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6
  • 7. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7
  • 8. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  • 9. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9
  • 10. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  • 11. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: o Consulting and Specific Analysis – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: laferriere@yole.fr – Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole Développement Email: levenez@yole.fr – Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Email: katano@yole.fr – RoW: Jean-Christophe Eloy, President & CEO, Yole Développement Email: eloy@yole.fr o Report business – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: laferriere@yole.fr – Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: khamassi@yole.fr – Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr – Korea: Hailey Yang, Business Development Manager, Korean Office Email: yang@yole.fr o Financial services – Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr o General: Email: info@yole.fr
  • 12. COMPLETE TEARDOWN WITH: • Detailed photos • Precise measurements • Material analysis • Manufacturing process flow • Supply-chain evaluation • Manufacturing cost analysis • Estimated sales price • Comparison with Cirrus Fan-In WLP Audio Codec in Samsung S7 European Version • Comparison with Intel/Infineon’s eWLB & NXP/nepes RCP Qualcomm WCD9335 Fan-Out WLP Audio Codec Title: Qualcomm WCD9335 Fan-Out WLP Audio Codec Pages: 93 Date: April 2016 Format: PDF & Excel file Price: Full report: EUR 3,290 Qualcomm, a world leader in mobile technologies, offers the new Snapdragon 820, a complete chipset currently powering or in-development with more than 100 smartphones worldwide. The U.S. versions of Samsung’s latest flagship phones, the Galaxy S7 and Galaxy S7 Edge, integrate the Qualcomm’s Fan-Out Wafer-Level Package Chip Audio Codec in eWLB Package inside Samsung Galaxy S7 and S7 Edge Snapdragon 820 chipset. In this chipset, we discovered for the first time a Qualcomm component featuring Fan-Out Wafer-Level Packaging (FOWLP): the Qualcomm Audio Codec WCD9335. Located on the smartphone’s main board, the audio codec chip’s presence in the Samsung Galaxy S7 and S7 Edge depends on the smartphone version. The international version, featuring an Exynos chipset, integrates the audio codec chip from Cirrus Logic. The U.S. version, featuring the Snapdragon 820 chipset, integrates the audio codec from Qualcomm. The Qualcomm WDC9335 is wafer-level packaged with fan-out technology. This is still relatively rare in the smartphone market but is expected to spread quickly. The FOWLP technology used is the eWLB, licensed by Intel/Infineon to several OSATs including ASE Group, Nanium, and STATS ChipPAC. Thanks to this FOWLP process, Qualcomm is able to propose a very small die independent of the area required by the I/O pads. The result is a very cost- effective component that can compete with a standard fan-in WLP technology. This report includes a comparison with the audio codec solution from Cirrus Logic for the international version, which uses a standard fan-in WLP technology. It also features comparisons with FOWLP technologies like RCP from NXP/nepes, and eWLB 1st-generation from Infineon.
  • 13. Performed by TABLE OF CONTENTS Overview/Introduction Company Profile & Supply Chain Physical Analysis Physical Analysis Methodology • Samsung Galaxy S7 Teardown  Component removal • Fan-Out Packaging Analysis  Package view, dimensions & marking  Fan-out package cross-section  Fan-out package process • Die Analysis  Die view, dimensions & marking  Die cross-section  Die process Manufacturing Process Flow • Chip Fabrication Unit • eWLB Fabrication Unit • eWLB Process Flow ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D Package CoSim+ and IC Price+ System Plus Consulting offers powerful costing tools to evaluate the production cost & selling price from single chip to complex structures. 3D Package Cosim+ Cost simulation tool to evaluate the cost of any Packaging process: Wafer-level packaging, TSV, 3D integration… IC Price+ The tool performs the necessary cost simulation of any Integrated Circuit: ASICs, microcontrollers, memories, DSP, smartpower… Yvon Le Goff has joined System Plus Consulting in 2011, in order to set up the laboratory of System Plus Consulting. He previously worked during 25 years in Atmel Nantes Technological Analysis Laboratory as fab support in physical analysis, and 3 years at Hirex Engineering in Toulouse, in a DPA lab. Author (Lab): Yvon Le Goff Author: Stéphane Elisabeth Dr Stéphane Elisabeth has joined our team this year. He has a deep knowledge of Materials characterizations and Electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics. IC Price+ Cost Analysis • Synthesis of the Cost Analysis • Die Cost Analysis  Wafer front-end cost  Probe test cost  Die cost • eWLB Cost Analysis  eWLB wafer cost  eWLB cost per process step • Component Cost Cost Analysis Simulation Without eWLB Packaging  Die cost  WLP package cost  Component cost comparison Estimated Price Analysis • Manufacturer Financial Ratios • Estimated Sales Price Technology and Cost Comparison with Infineon’s eWLB and NXP’s RCP 3D-Package CoSim+
  • 14. NXP MR2001 Multi- Channel 77 GHz Radar Rx/Tx/VCO Fan-Out RCP Chipset Infineon RRN7745P & RTN7735P eWLB Fan-Out Package - 77GHz Radar Dies GaN Systems GaNpx Top Cooled AT&S ECP® Embedded Power Die Package The new 77 GHz Radar Chipset for ADAS from NXP/Freescale - SiGe:C xHBT technology & Fan-Out RCP Wafer-Level Packaging. New receiver & transmitter components with a SiGe:C HBT technology from Infineon & eWLB Fan-Out Wafer-Level Packaging. Latest GS66508T power transistor of GaN Systems packaged with a top-side cooling. Pages: 129 Date: March 2016 Full report: EUR 3,290* Pages: 104 Date: October 2015 Full report: EUR 2,990* Pages: 68 Date: October 2015 Full report: EUR 2,490* RELATED REPORTS ANNUAL SUBSCRIPTION OFFER You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! More than 40 reports released each year on the following topics (considered for 2016): • MEMS & Sensors (20 reports): • Gyros/Accelerometers/IMU • Oscillators/RF switches • Pressure sensors/Gas sensors • Power Electronics & Systems (12 reports): • GaN and SiC devices • Inverters & modules • Automotive radars • Head Up displays, Displays Each year System Plus Consulting releases a comprehensive collection of new reverse engineering & costing analyses in various domains. • ICs (3 reports): • Multimedia SoC • Ethernet for car IC, etc. • Imaging & LEDs (11 reports): • Camera modules, Infrared sensors & cameras • LEDs • Advanced Packaging (5 reports): • WLP, TSV • Embedded devices, etc. Performed by
  • 15. *For price in dollars please use the day’s exchange rate. All reports are delivered electronically in pdf format. For French customer, add 20 % for VAT. ORDER FORM Performed by DELIVERY on receipt of payment: By credit card: Number: |__|__|__|__| |__|__|__|__| |__|__|__|__| |__|__|__|__| Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__| By bank transfer: BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code : 30056, Branch code : 00170 Account No : 0170 200 1565 87, SWIFT or BIC code : CCFRFRPP, IBAN : FR76 3005 6001 7001 7020 0156 587 Return order by: • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DEVELOPPEMENT, 75 Cours Emile Zola, F - 69100 Lyon - Villeurbanne Contact: David Jourdan, jourdan@yole.fr, Tel: +33 (0)4 72 83 01 90 BILLING CONTACT ABOUT YOLE DEVELOPPEMENT Name (Mr/Ms/Dr/Pr): ...................................................................................... Job Title: ...................................................................................... Company: ...................................................................................... Address: ...................................................................................... City: State: ...................................................................................... Postcode/Zip: ...................................................................................... Country: ...................................................................................... VAT ID Number for EU members: ...................................................................................... Tel: ...................................................................................... Email: ..................................................................................... Date: ....................................................................................... Signature: ...................................................................................... Distributed by First Name: .................................................................. Last Name: ............................................................................ Email:............................................................................ Phone:..................................................................................... About Yole Développement – www.yole.fr / www.i-micronews.com Founded in 1998, Yole Développement (Yole) has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semi., LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing and Power Electronics. We support industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. CONSULTING • Market data & research, marketing analysis • Technology analysis • Reverse engineering & costing services • Strategy consulting • Patent analysis FINANCIAL SERVICES • Mergers & Acquisitions • Due diligence • Fundraising More information on www.yolefinance.com REPORTS • Collection of technology & market reports • Manufacturing cost simulation tools • Component reverse engineering & costing analysis • Patent investigation MEDIA & EVENTS • i-Micronews.com, online disruptive technologies website • @Micronews, weekly e-newsletter • Technology Magazines dedicated to MEMS, Advanced Packaging, LED and Power Electronics • Communication & webcasts services • Events: Yole Seminars, Market Briefings SHIP TO PAYMENT  Full Reverse Costing report: EUR 3,290* Please process my order for “Qualcomm WCD9335 Fan-Out WLP Audio Codec” Reverse Costing Report
  • 16. Performed by TERMS AND CONDITIONS OF SALES . Definitions: “Acceptance”: Action by which the Buyer accepts the terms and conditions of sale in their entirety. It is done by signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. “Buyer”: Any business user (i.e. any person acting in the course of its business activities, for its business needs) entering into the following general conditions to the exclusion of consumers acting in their personal interests. “Contracting Parties” or “Parties”: The Seller on the one hand and the Buyer on the other hand. “Intellectual Property Rights” (“IPR”) means any rights held by the Seller in its Products, including any patents, trademarks, registered models, designs, copyrights, inventions, commercial secrets and know-how, technical information, company or trading names and any other intellectual property rights or similar in any part of the world, notwithstanding the fact that they have been registered or not and including any pending registration of one of the above mentioned rights. “License”: For the reports and databases, 3 different licenses are proposed. The buyer has to choose one license: • One user license: one person at the company can use the report. • Multi-user license: the report can be used by unlimited users within the company. Subsidiaries and Joint-Ventures are not included. • Corporate license: purchased under “Annual Subscription” program, the report can be used by unlimited users within the company. Joint-Ventures are not included. “Products”: Depending on the purchase order, reports or database on MEMS, CSC, Optics/MOEMS, Nano, bio… to be bought either on a unit basis or as an annual subscription. (i.e. subscription for a period of 12 calendar months). The annual subscription to a package (i.e. a global discount based on the number of reports that the Buyer orders or accesses via the service, a global search service on line on I-micronews and a consulting approach), is defined in the order. Reports are established in PowerPoint and delivered on a PDF format and the database may include Excel files. “Seller”: Based in Lyon (France headquarters), Yole Développement is a market research and business development consultancy company, facilitating market access for advanced technology industrial projects. With more than 20 market analysts, Yole works worldwide with the key industrial companies, R&D institutes and investors to help them understand the markets and technology trends. 1. Scope 1.1 The Contracting Parties undertake to observe the following general conditions when agreed by the Buyer and the Seller. ANY ADDITIONAL, DIFFERENT, OR CONFLICTING TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS ISSUED BY THE BUYER AT ANY TIME ARE HEREBY OBJECTED TO BY THE SELLER, SHALL BE WHOLLY INAPPLICABLE TO ANY SALE MADE HEREUNDER AND SHALL NOT BE BINDING IN ANY WAY ON THE SELLER. 1.2 This agreement becomes valid and enforceable between the Contracting Parties after clear and non-equivocal consent by any duly authorized person representing the Buyer. For these purposes, the Buyer accepts these conditions of sales when signing the purchase order which mentions “I hereby accept Yole’s Terms and Conditions of Sale”. This results in acceptance by the Buyer. 1.3 Orders are deemed to be accepted only upon written acceptance and confirmation by the Seller, within [7 days] from the date of order, to be sent either by email or to the Buyer’s address. In the absence of any confirmation in writing, orders shall be deemed to have been accepted. 2. Mailing of the Products 2.1 Products are sent by email to the Buyer: - within [1] month from the order for Products already released; or - within a reasonable time for Products ordered prior to their effective release. In this case, the Seller shall use its best endeavours to inform the Buyer of an indicative release date and the evolution of the work in progress. 2.2 Some weeks prior to the release date the Seller can propose a pre-release discount to the Buyer The Seller shall by no means be responsible for any delay in respect of article 2.2 above, and including incases where a new event or access to new contradictory information would require for the analyst extra time to compute or compare the data in order to enable the Seller to deliver a high quality Products. 2.3 The mailing of the Product will occur only upon payment by the Buyer, in accordance with the conditions contained in article 3. 2.4. The mailing is operated through electronic means either by email via the sales department or automatically online via an email/password. If the Product’s electronic delivery format is defective, the Seller undertakes to replace it at no charge to the Buyer provided that it is informed of the defective formatting within 90 days from the date of the original download or receipt of the Product. 2.5 The person receiving the Products on behalf of the Buyer shall immediately verify the quality of the Products and their conformity to the order. Any claim for apparent defects or for non-conformity shall be sent in writing to the Seller within 8 days of receipt of the Products. For this purpose, the Buyer agrees to produce sufficient evidence of such defects. . 2.6 No return of Products shall be accepted without prior information to the Seller, even in case of delayed delivery. Any Product returned to the Seller without providing prior information to the Seller as required under article 2.5 shall remain at the Buyer’s risk. 3. Price, invoicing and payment 3.1 Prices are given in the orders corresponding to each Product sold on a unit basis or corresponding to annual subscriptions. They are expressed to be inclusive of all taxes. The prices may be reevaluated from time to time. The effective price is deemed to be the one applicable at the time of the order. 3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange to this uncertainty, the company will get a discount that can vary from 15% to 10%. 3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account: HSBC, 1 place de la Bourse 69002 Lyon France Bank code: 30056 Branch code: 00170 Account n°: 0170 200 1565 87 BIC or SWIFT code: CCFRFRPP IBAN: FR76 3005 6001 7001 7020 0156 587 To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order. 3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered only after reception of the payment. 3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages. 4. Liabilities 4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof. 4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement 4.3 In no event shall the Seller be liable for: a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products; b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof. 4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below. 4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages. 4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. Force majeure The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. Protection of the Seller’s IPR 6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions. 6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: - Information storage and retrieval systems; - Recordings and re-transmittals over any network (including any local area network); - Use in any timesharing, service bureau, bulletin board or similar arrangement or public display; - Posting any Product to any other online service (including bulletin boards or the Internet); - Licensing, leasing, selling, offering for sale or assigning the Product. 6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety. 6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company. 6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password. 6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price. 7. Termination 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. Miscellaneous All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. Governing law and jurisdiction 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. Distributed by