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Qualcomm WCD9335 Fan-Out WLP Audio Codec 2016 teardown reverse costing report published by Yole Developpement

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Qualcomm’s Fan-Out Wafer-Level Package Chip Audio Codec in eWLB Package inside Samsung Galaxy S7 and S7 Edge

Qualcomm, a world leader in mobile technologies, offers the new Snapdragon 820, a complete chipset currently powering or in-development with more than 100 smartphones worldwide. The U.S. versions of Samsung’s latest flagship phones, the Galaxy S7 and Galaxy S7 Edge, integrate the

Snapdragon 820 chipset. In this chipset, we discovered for the first time a Qualcomm component featuring Fan-Out Wafer-Level Packaging (FOWLP): the Qualcomm Audio Codec WCD9335.
Located on the smartphone’s main board, the audio codec chip’s presence in the Samsung Galaxy S7 and S7 Edge depends on the smartphone version. The international version, featuring an Exynos chipset, integrates the audio codec chip from Cirrus Logic. The U.S. version, featuring the Snapdragon 820 chipset, integrates the audio codec from Qualcomm.
The Qualcomm WDC9335 is wafer-level packaged with fan-out technology. This is still relatively rare in the smartphone market but is expected to spread quickly. The FOWLP technology used is the eWLB, licensed by Intel/Infineon to several OSATs including ASE Group, Nanium, and STATS ChipPAC.
Thanks to this FOWLP process, Qualcomm is able to propose a very small die independent of the area required by the I/O pads. The result is a very cost-effective component that can compete with a standard fan-in WLP technology.
This report includes a comparison with the audio codec solution from Cirrus Logic for the international version, which uses a standard fan-in WLP technology. It also features comparisons with FOWLP technologies like RCP from NXP/nepes, and eWLB 1st-generation from Infineon.

More information on that report at http://www.i-micronews.com/reports.html

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Qualcomm WCD9335 Fan-Out WLP Audio Codec 2016 teardown reverse costing report published by Yole Developpement

  1. 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr April 2016 – Version 1 – Written by Stéphane ELISABETH
  2. 2. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 7 – Qualcomm – Snapdragon 820 Chipset 3. Physical Analysis 13 – Synthesis of the Physical Analysis – Samsung Galaxy S7 Teardown 15 – Smartphone Disassembly & Component Removal – eWLB Package Analysis 21 – View, Dimensions & Marking – eWLB Package – eWLB Package Cross-Section – eWLB Redistribution Layer – Summary of Physical Data – Die Analysis 37 – View, Dimensions & Marking – Die Main Blocks ID – Die Process – Die Cross-Section Analysis 47 – Die Cross-section – Metal Layer Cross Section – Process Characteristics 4. Manufacturing Process Flow 53 – Chip Fabrication Unit – eWLB Fabrication Unit – eWLB Process Flow 5. Cost Analysis 64 – Synthesis of the cost analysis – Main steps of economic analysis – Yields Hypotheses – Die Cost Analysis 69 – Wafer Front-End Cost – Probe Test Cost – Die Cost – eWLB Package Cost Analysis 73 – eWLB Wafer Cost – eWLB Cost per Process Step – Component Cost 78 6. Cost Analysis Simulation without Fan-Out Packaging 80 – Die Cost – WLP Package Cost – Component Cost Comparison 7. Estimated Price Analysis 86 – Manufacturer Financial Ratios – Estimated Selling Price 8. Package Comparison 89 – Fan-Out Comparison – Package process Comparison – Synthesis Comparison Contact 93
  3. 3. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 3 • This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of the Qualcomm WCD9335 Fan-Out WLP Audio Codec. • The Audio codec from Qualcomm should be found in all smartphone using Snapdragon 820 chipset. The packaging use fan-out technology. Actually more than 100 models all around the world featured the entire chipset, among them the Samsung Galaxy S7 and S7 Edge in their US version. • The WCD9335 is an audio codec from Qualcomm for smartphone. The WCD9335 is featuring a die packaged in a fan-out technology. • The analysis is focused on the fan-out packaging. • The package corresponds to wafer-level package licensed by Intel/Infineon called eWLB (embedded Wafer Level Ball Grid Array). • Based on a complete physical analysis of the WCD9335 component, this report provides the manufacturing cost of the component. It will be compared to other Fan-out package from Infineon and NXP.
  4. 4. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 4 Samsung S7 US Version Main Board (Bottom view) • The Audio Codec chip is located on the main board. Audio area Samsung S7 US Version Main Board view
  5. 5. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 5
  6. 6. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 6
  7. 7. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 7
  8. 8. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  9. 9. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 9
  10. 10. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  11. 11. Qualcomm WCD9335 eWLB Audio Codec Return to TOC © 2016 by SYSTEM PLUS CONSULTING, all rights reserved. 11 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated). These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: o Consulting and Specific Analysis – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: laferriere@yole.fr – Europe: Lizzie Levenez, Europe Middle East and Africa Business Development Manager, Yole Développement Email: levenez@yole.fr – Japan: Yutaka Katano, General Manager, Yole Japan & President, Yole K.K. Email: katano@yole.fr – RoW: Jean-Christophe Eloy, President & CEO, Yole Développement Email: eloy@yole.fr o Report business – North America: Steve LaFerriere, Director of Northern America Business Development, Yole Inc. Email: laferriere@yole.fr – Europe: Fayçal El Khamassi, Headquarter Sales Coordination & Customer Service Email: khamassi@yole.fr – Japan & Asia: Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole.fr – Korea: Hailey Yang, Business Development Manager, Korean Office Email: yang@yole.fr o Financial services – Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr o General: Email: info@yole.fr
  12. 12. COMPLETE TEARDOWN WITH: • Detailed photos • Precise measurements • Material analysis • Manufacturing process flow • Supply-chain evaluation • Manufacturing cost analysis • Estimated sales price • Comparison with Cirrus Fan-In WLP Audio Codec in Samsung S7 European Version • Comparison with Intel/Infineon’s eWLB & NXP/nepes RCP Qualcomm WCD9335 Fan-Out WLP Audio Codec Title: Qualcomm WCD9335 Fan-Out WLP Audio Codec Pages: 93 Date: April 2016 Format: PDF & Excel file Price: Full report: EUR 3,290 Qualcomm, a world leader in mobile technologies, offers the new Snapdragon 820, a complete chipset currently powering or in-development with more than 100 smartphones worldwide. The U.S. versions of Samsung’s latest flagship phones, the Galaxy S7 and Galaxy S7 Edge, integrate the Qualcomm’s Fan-Out Wafer-Level Package Chip Audio Codec in eWLB Package inside Samsung Galaxy S7 and S7 Edge Snapdragon 820 chipset. In this chipset, we discovered for the first time a Qualcomm component featuring Fan-Out Wafer-Level Packaging (FOWLP): the Qualcomm Audio Codec WCD9335. Located on the smartphone’s main board, the audio codec chip’s presence in the Samsung Galaxy S7 and S7 Edge depends on the smartphone version. The international version, featuring an Exynos chipset, integrates the audio codec chip from Cirrus Logic. The U.S. version, featuring the Snapdragon 820 chipset, integrates the audio codec from Qualcomm. The Qualcomm WDC9335 is wafer-level packaged with fan-out technology. This is still relatively rare in the smartphone market but is expected to spread quickly. The FOWLP technology used is the eWLB, licensed by Intel/Infineon to several OSATs including ASE Group, Nanium, and STATS ChipPAC. Thanks to this FOWLP process, Qualcomm is able to propose a very small die independent of the area required by the I/O pads. The result is a very cost- effective component that can compete with a standard fan-in WLP technology. This report includes a comparison with the audio codec solution from Cirrus Logic for the international version, which uses a standard fan-in WLP technology. It also features comparisons with FOWLP technologies like RCP from NXP/nepes, and eWLB 1st-generation from Infineon.
  13. 13. Performed by TABLE OF CONTENTS Overview/Introduction Company Profile & Supply Chain Physical Analysis Physical Analysis Methodology • Samsung Galaxy S7 Teardown  Component removal • Fan-Out Packaging Analysis  Package view, dimensions & marking  Fan-out package cross-section  Fan-out package process • Die Analysis  Die view, dimensions & marking  Die cross-section  Die process Manufacturing Process Flow • Chip Fabrication Unit • eWLB Fabrication Unit • eWLB Process Flow ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D Package CoSim+ and IC Price+ System Plus Consulting offers powerful costing tools to evaluate the production cost & selling price from single chip to complex structures. 3D Package Cosim+ Cost simulation tool to evaluate the cost of any Packaging process: Wafer-level packaging, TSV, 3D integration… IC Price+ The tool performs the necessary cost simulation of any Integrated Circuit: ASICs, microcontrollers, memories, DSP, smartpower… Yvon Le Goff has joined System Plus Consulting in 2011, in order to set up the laboratory of System Plus Consulting. He previously worked during 25 years in Atmel Nantes Technological Analysis Laboratory as fab support in physical analysis, and 3 years at Hirex Engineering in Toulouse, in a DPA lab. Author (Lab): Yvon Le Goff Author: Stéphane Elisabeth Dr Stéphane Elisabeth has joined our team this year. He has a deep knowledge of Materials characterizations and Electronics systems. He holds an Engineering Degree in Electronics and Numerical Technology, and a PhD in Materials for Microelectronics. IC Price+ Cost Analysis • Synthesis of the Cost Analysis • Die Cost Analysis  Wafer front-end cost  Probe test cost  Die cost • eWLB Cost Analysis  eWLB wafer cost  eWLB cost per process step • Component Cost Cost Analysis Simulation Without eWLB Packaging  Die cost  WLP package cost  Component cost comparison Estimated Price Analysis • Manufacturer Financial Ratios • Estimated Sales Price Technology and Cost Comparison with Infineon’s eWLB and NXP’s RCP 3D-Package CoSim+
  14. 14. NXP MR2001 Multi- Channel 77 GHz Radar Rx/Tx/VCO Fan-Out RCP Chipset Infineon RRN7745P & RTN7735P eWLB Fan-Out Package - 77GHz Radar Dies GaN Systems GaNpx Top Cooled AT&S ECP® Embedded Power Die Package The new 77 GHz Radar Chipset for ADAS from NXP/Freescale - SiGe:C xHBT technology & Fan-Out RCP Wafer-Level Packaging. New receiver & transmitter components with a SiGe:C HBT technology from Infineon & eWLB Fan-Out Wafer-Level Packaging. Latest GS66508T power transistor of GaN Systems packaged with a top-side cooling. Pages: 129 Date: March 2016 Full report: EUR 3,290* Pages: 104 Date: October 2015 Full report: EUR 2,990* Pages: 68 Date: October 2015 Full report: EUR 2,490* RELATED REPORTS ANNUAL SUBSCRIPTION OFFER You can choose to buy over 12 months a set of 3, 4, 5, 7, 10 or 15 Reverse Costing® reports. Up to 47% discount! More than 40 reports released each year on the following topics (considered for 2016): • MEMS & Sensors (20 reports): • Gyros/Accelerometers/IMU • Oscillators/RF switches • Pressure sensors/Gas sensors • Power Electronics & Systems (12 reports): • GaN and SiC devices • Inverters & modules • Automotive radars • Head Up displays, Displays Each year System Plus Consulting releases a comprehensive collection of new reverse engineering & costing analyses in various domains. • ICs (3 reports): • Multimedia SoC • Ethernet for car IC, etc. • Imaging & LEDs (11 reports): • Camera modules, Infrared sensors & cameras • LEDs • Advanced Packaging (5 reports): • WLP, TSV • Embedded devices, etc. Performed by
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