Laser Technologies for Semiconductor Manufacturing 2017 Report by Yole Developpement

1. From Technologies to Market Sample Laser Technologies for Semiconductor Manufacturing October 2017

2. 2| Sample | www.yole.fr | ©2017 REPORT OBJECTIVES • This report is the first research performed on the laser technologies in the field of semiconductor • The objectives of the report are to • Provide detailed information regarding the applicability of the laser technologies in the field of semiconductor • Detailed analysis of the major applications using laser methods today or potential/attractive applications that could require the use of laser technology • Laser process roadmap application • Give the current status of the laser technology adoption and the various type of laser available on the market • Provide an overview of the technological trends for laser • Understand the key benefits and added value of the laser material in the field of semiconductor • How do the laser technology differ from the other alternatives technologies? • Understand what are the remaining challenges of the implementation of the laser technology in the field of semiconductor • Offer market metrics at laser equipment and laser source market level for semiconductor applications (2016-2022) • Evaluate market developments in terms of market size (volume, value), by semiconductor process step • Provide a competitive landscape, identify key players in technology development and manufacturing • Give an overview of the key laser equipment suppliers and position them by application, laser type and process step • Technology process, specification and value chain • The report does not cover the following applications, where laser is applied or could be applied • Laser for flat panel display • Laser used for EUV lithography • Laser for solar cells Laser technologies for semiconductor manufacturing processes

5. 5 TABLE OF CONTENT Laser technologies for semiconductor manufacturing • Introduction, definition & methodology 6 • Objectives of the report • Report scope • Who Should be Interested in this Report? • Companies Cited in this Report • Definitions, Limitations & Methodology • Glossary • Executive Summary 16 • Laser techniques classification and definition 26 • Laser properties: how to define a laser? • Laser manufacturing • Laser principle • Laser classifications • Wavelengths, pulsed laser, operation modes • Laser technologies in the field of semiconductor 44 • Laser at a glance • Laser applicability in the field of semiconductor • Laser technologies benefits and drivers • Substrate type that the laser can process • Material type that the laser can process • Overview of the laser technologies • Laser type applicability by semiconductor process step • Applicability or potential applications of the laser technology in the field of Semiconductor area/ For which process step is laser required ? • Laser equipment & source suppliers:competitive landscape 59 • Positioning of the laser equipment and source suppliers by process step in semiconductor • Positioning of the equipment suppliers for each process step by Substrate/material type to be processed • 2016 - 2022 Laser Market Forecast 76 • Laser Equipment Market Forecasts Breakdown by Laser type • in Units, in $M • Laser Equipment Market Forecasts Breakdown by process step • in Units, in $M • Positionnement of the laser equipment suppliers by • Laser type, application • Semiconductor process step • Substrate/Material type • Laser Equipment Players’ Market Share and Revenue | Sample | www.yole.fr | ©2017Laser technologies for semiconductor manufacturing processes

6. 6 TABLE OF CONTENT Laser technologies for semiconductor manufacturing In-depth analysis on the laser technologies by semiconductor process step • Laser for dicing/cutting 85 • Dicing principle • Laser dicing’s application segments • Laser dicing technologies drivers: added value of the laser • Tipping point to use laser process • Type of laser used for dicing: laser technology available on the market • Type of semiconductor devices using laser • Benchmark of laser technologies available for dicing • Choice of the right laser technology • Market forecast in units and in revenue • By laser type and laser process • Laser equipment and laser source manufacturers involved in the dicing/cutting step • Positionment of the key suppliers by laser type and material type • 2016 laser dicing equipment Market share • Laser for drilling 114 • Drilling principle and drilling technologies • Laser drilling technologies drivers: added value of the laser • Laser drilling’s application segments • Via diameters roadmap • Type of laser used for drilling • Benchmark of drilling technologies • Market forecast in units and in revenue • By laser type and application segment • Laser equipment and laser source manufacturers involved in the drilling process • Positionment of the key suppliers by laser type and material type • 2016 laser drilling equipement Market share | Sample | www.yole.fr | ©2017Laser technologies for semiconductor manufacturing processes • Laser for patterning 125 • Patterning principle and patterning technologies • Laser patterning technologies drivers: added value of the laser • Laser patterning’s application segments • Resolution trends L/S roadmap • Type of laser used for patterning • Benchmark of laser patterning technologies • Market forecast in units and in revenue • By laser type and application segment • Laser equipment and laser source manufacturers involved in the patterning process • Positionment of the key suppliers by laser type and material type • Laser for debonding/lift-off 165 • Debonding principle and debonding technologies • Laser debonding technologies drivers: added value of the laser • Laser debonding’s application segments and status of laser debonding by application segment • Debonding temperature requirement by application • Type of laser used for debonding • Benchmark of laser debonding technologies • Market forecast in units and in revenue • By laser type and application segment • Laser equipment and laser source manufacturers involved in the debonding/lift-off process • Positionment of the key suppliers by laser type and material type

7. 7 TABLE OF CONTENT Laser technologies for semiconductor manufacturing In-depth analysis on the laser technologies by semiconductor process step • Laser annealing 210 • Annealing principle • Laser annealing’s application segments • Laser annealing technologies drivers: added value of the laser • Type of laser used for annealing: laser technology available on the market • Benchmark of laser technologies available for annealing • Market forecast in units and in revenue • By laser type and laser process • Laser equipment and laser source manufacturers involved in the annealing • Positionment of the key suppliers by laser type and material type • 2016 laser annealing equipment Market share • Laser for inspection & metrology 230 • Inspection & metrology principle • Laser inspection & metrology’s application segments • Laser inspection & metrology technologies drivers: added value of the laser • Type of laser used for inspection & metrology | Sample | www.yole.fr | ©2017Laser technologies for semiconductor manufacturing processes • Benchmark of laser technologies available for inspection & metrology • Market forecast in units and in revenue • By laser type and laser process • Laser equipment and laser source manufacturers involved in the inspection & metrology • Positionment of the key suppliers by laser type and material type • 2016 laser inspection & metrology equipment Market share • Other laser process steps: laser marking, laser trimming, deposition laser 250 • Conclusions & Perspectives 280 • Appendix 285 • Description and principle of laser dicing technologies • Company Presentation 290

8. 8 Biography & contact | Sample | www.yole.fr | ©2017 ABOUT THE AUTHOR Amandine PIZZAGALLI,Market &Technology Analyst,Equipment and Materials Manufacturing Amandine Pizzagalli is a Technology & Market Analyst atYole Développement (Yole).Amandine is part of the development of the Advanced Packaging & Semiconductor Manufacturing Business Unit ofYole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes. Previously,Amandine was engaged in many projects of development focused on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine is graduated in Electronics from CPE Lyon (France), with a technical expertise in Semiconductor & Nano-Electronics and has a master focused on Semiconductor ManufacturingTechnology, from KTH Royal Institute of Technology (Sweden). She has spoken in numerous international conferences and has authored or co-authored more than 10 papers. Contact: pizzagalli@yole.fr Laser technologies for semiconductor manufacturing processes

9. 9| Sample | www.yole.fr | ©2017 Accretech, Amplitude systems,Amphos, Applied Materials,AP systems,ASM Pacific,Aurotek, Coherent/Rofin, 3D Micromac, 3M, Corning, Delphi Laser, Disco, Edgewave, Electro Scientific Industries(ESI), Eolite, EO Technics, E&R Engineering, EVG, Hamamatsu, Han’s laser, Hanmi Semiconductor, HG Tech, Intelume, IPG Photonics, Lumentum, LPKF, JSW, JT Corp, K-Jet, Manz, MKS Instrument, Mitsubishi Electric, ORC, Orbotech/SPTS, PacTech, QMC, Screen, Schmoll, Shanghai Micro Electronics Equipment (SMEE), Solmates, Synova, Sumito Heavy Industries, SUSS MicroTech, Nikon, Screen, SMEE,Tazmo,TOK,Trumpf, United Winners Laser (UW), Ushio,Veeco/Ultratech,Via Mecha, and more… COMPANIES CITED IN THE REPORT Laser technologies for semiconductor manufacturing processes

10. 10| Sample | www.yole.fr | ©2017 LASER TECHNOLOGIES AT A GLANCE Application markets There are numerous potential applications for laser market including semiconductor processing, PCB processing, flat panel display processing as well as solar cells processing However, we decided to cover this 1st report the largest potential market segment for laser such as semiconductor wafer and PCB processing applications o In the section semiconductor, we excluded the EUV lithography part where laser method is not applied as a semiconductor manufacturing process step but more as a component part of a lithography toolThis report focuses on semiconductor as well as PCB processing applications which represent the largest applications potential for laser processing technologies SC processing: 45% PCB processing35% FDP:15% Solar cells: 5% Focus on this report Laser technologies for semiconductor manufacturing processes

11. 11| Sample | www.yole.fr | ©2017 WHERE LASER IS APPLIED IN THE FIELD OF SEMICONDUCTOR? From Front-end to back-end assembly Laser technologies for semiconductor manufacturing processes Dicing / Scribing Drilling Inspection and Metrology Marking IR measurement Removal process Trimming Pulsed laser deposition Bonding interface Bonding process Reforming process Bonding / Welding Temporary bonding and debonding Laser annealing Patterning / Lithography Thin Si wafer HDI for PCB, LTCC Metal welding Semiconductor debonding (carrier) Alignment Post thinning Voids LED Lift-off FO WLP debonding Power ICs debonding IC substrate interposer Low-k on IC, backside metal LED sapphire dicing Packaging dicing (ICs, LEDs with PCB) Memory repair cells PCBs flex/rigid FC BGA/FC CSPHDI PCBs Advanced packaging platforms (RDL, seed layer) Sensor debonding PVD Thin film deposition IGBTs: dopants activation Embedded chip in PCB Mold compound Silicon wafers Plastic welding (MEMS, µF) 3D memory LASER PROCESSING PROCESS STEP APPLICATIONS Compound Semi. Solder bonding / flip chip bonding Li-ion battery Li-ion battery CMOS Image Sensor 3D Integration

12. 12| Sample | www.yole.fr | ©2017 LASER TECHNOLOGIES BENEFITS AND DRIVERS In the Semiconductor field Lower risk of breakage/die quality Shrinking dimension/ Die size reduction Particles avoided No residues Higher yield and thoughput LASER DRIVERS Inspection of particles and voids allowed Cost effective solution Dicing/Scribing Drilling Debonding Patterning/Lithography DebondingDicing/Scribing Dicing/Scribing DebondingDicing/Scribing Laser welding Dicing/Scribing (for thin wafers) Debonding High selectivity Laser annealing Laser technologies for semiconductor manufacturing processes

13. 13| Sample | www.yole.fr | ©2017 LASER PROCESS CAPABILITIES Type of substrate that can be processed Dicing/Scribing Drilling Inspection & Metrology Marking IR measurement Removal process Trimming Pulsed laser deposition Bonding process Reforming process Bonding/Welding Temporary bonding & debonding Laser annealing Patterning/Lithography LASER PROCESSING PROCESS STEP Substrate/material type Silicon Glass Sapphire SiC GaAs/Ge Ceramic LTCC/HTCC PCB flex PCB HDI Laser technologies for semiconductor manufacturing processes

14. 14| Sample | www.yole.fr | ©2017 LASER PROCESS CAPABILITIES Material or layers that can be processed Dicing/Scribing Drilling Inspection & Metrology Marking IR measurement Removal process Trimming Pulsed laser deposition Bonding process Reforming process Bonding/Welding Temporary bonding & debonding Laser annealing Patterning/Lithography LASER PROCESSING PROCESS STEP Material type Low-k Material ICs Material package Material PCB EMC Dielectric PI/PBO/BCB Organic (epoxy) Dielectric: Polymer, ABF… Metal Cu, Al… Laser technologies for semiconductor manufacturing processes

15. 15| Sample | www.yole.fr | ©2017 OVERVIEW OF THE LASERTECHNOLOGIES Classification of laser technologies 1 Laser technologies Gas laser Excimer CO2/CO He-Ne Argon-ion Optically Pumped Solid State Lamp Pumped (LPSSLs) Rod laser Diode pumped (DPSSLs) Fiber laser Disc laser Diode/SC laser GaN, InGaN, AlGaIn,AlGaAs VCSEL Quantum cascade Dye laserDiode Slab/rod laser Laser technologies for semiconductor manufacturing processes

16. 16| Sample | www.yole.fr | ©2017 LASER TYPE APPLICABILITY BY SEMICONDUCTOR PROCESS STEP Laser type Gas laser SSL Diode laser CO2 Excimer ns ps fs Removal Dicing/Cutting Drilling Patterning Marking Bonding Welding Debonding Reforming Annealing Laser technologies for semiconductor manufacturing processes

18. 18 LASER EQUIPMENT SUPPLIERS In the field of Semiconductor Japan Germany China Korea USA • EU: majority based in Germany • Asia: majority based in Japan Netherlands Switzerland Israel Dicing division | Sample | www.yole.fr | ©2017Laser technologies for semiconductor manufacturing processes

19. 19| Sample | www.yole.fr | ©2017 LASER EQUIPMENT SUPPLIERS FOR SEMICONDUCTOR PER PROCESS STEP Positioning of the equipment suppliers by process step in semiconductor DICING/SCRIBING DRILLING Laser source suppliers as well PATTERNING DEBONDING & LIFT-OFF BONDING/WELDING Non exhaustive list of players - Process steps «laser marking, inspection & metrology , annealing, deposition» are included in the report Similar slide with an overview of the laser source suppliers will be included as well | Sample | www.yole.fr | ©2017

20. 20 LASER TYPE APPLICABILITY BY SEMICONDUCTOR PROCESS STEP (NON-EXHAUSTIVE LIST) Laser type Gas laser SSL Diode laser CO2 Excimer ns ps fs Removal Dicing/Cutting Drilling Patterning Marking Bonding Welding Debonding Reforming Annealing | Sample | www.yole.fr | ©2017Laser technologies for semiconductor manufacturing processes

21. 21 OVERVIEW OF THE KEY LASER EQUIPMENT SUPPLIERS FOR DICING Positioning of the equipment suppliers by Substrate/material type to be processed Dicing/Cutting/Scribing Silicon Glass SiC Sapphire GaAs/Ge Low-k Ceramic: LTCC/HTCC Metal EMC Organic Material type/layer Substrate type PCB Flex HDI Polymer PCB:ABF Material ICs Material package Material PCB Dielectric PI/PBO Non exhaustive list of players - Similar slide will be included as well for the process steps « laser drilling, bonding/welding, debonding, inspection & metrology , annealing, deposition, trimming »

24. Since its invention in 1958, laser technology has become well-established in various scientific, military, medical, and commercial applications. And over the last several years, the laser industry has found new opportunities and garnered significant interest for use in semiconductor manufacturing. Today, laser applications in the semiconductor industry are broad and diversified. Various laser technologies have started integrating into major semiconductor processes, including laser cutting, drilling, welding/bonding, debonding, marking, patterning, marking, measurement, deposition, driven by motherboards. They are used to process semiconductor devices, flexible and high density interconnect (HDI) printed circuit boards (PCBs), and in integrated circuit (IC) packaging applications. Drivers of laser methods differ from one process step to another. However, there are similar and common drivers for applicability of lasers to semiconductor and PCB processing applications. The key trends driving laser applicability and contributing to its growth are: • The desire for die size reduction and thus further miniaturization of devices driven by computers, hand-held electronic devices such as mobile phones, tablets and electronic book readers, wearable devices and consumer electronics • Demand for increased yield and throughput • Better die quality • The need to inspect voids and particles through a transparent material such as glass, which requires the use of laser methods • Laser annealing for very high flexibility However, the choice of the most suitable laser processing type depends strongly on the material to be processed, processing parameters, and the manufacturing process step. Yole Développement’s Laser Technologies for Semiconductor Manufacturing report provides a thorough analysis of the different existing laser equipment and laser source solutions used for each semiconductor process step, along with the status of the technologies. This report will present the maturity level of each laser type, by semiconductor process step and application. A technical roadmap showing the future steps for these laser solutions is also included. LASER TECHNOLOGIES FOR SEMICONDUCTOR MANUFACTURING Market Technology report - October 2017 WHICH SEMICONDUCTOR PROCESS STEPS, MARKET SEGMENTS, AND LASER TYPES WILL DRIVE THE LASER EQUIPMENT MARKET’S GROWTH? Which semiconductor manufacturing processes and solutions will drive the laser equipment market’s growth? KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com • Laser equipment for semiconductor manufacturing market volume and value metrics forecasted for 2016 - 2022 • Laser equipment market forecast, segmented by semiconductor process step including drilling, dicing, patterning, marking, trimming, bonding/debonding/ welding, measurement and annealing, and by laser type • Laser equipment market forecast, by laser type, including gas lasers such as excimer and CO2 and solid-state lasers • Market shares for key laser equipment and laser sources involved in the semiconductor industry • Overview and status of the laser equipment and laser sources applied today for each key semiconductor process step • Comprehensive overview of the competitive landscape and market shares for all main laser equipment manufacturers involved in the semiconductor industry • 2016 market shares for key laser equipment suppliers • Important technical insights and a detailed analysis of laser tool solutions, trends, requirements, and challenges by semiconductor process step • Laser solution technology roadmap for new technology adoption Laser applications: From front-end to back-end assembly Dicing / Scribing Drilling Inspection and Metrology Marking IR measurement Removal process Trimming Pulsed laser deposition Bonding interface Bonding process Reforming process Bonding / Welding Temporary bonding and debonding Laser annealing Patterning / Lithography Thin Si wafer HDI for PCB, LTCC Metal welding Semiconductor debonding (carrier) Alignment Post thinning Voids LED Lift-off FO WLP debonding Power ICs debonding IC substrate interposer Low-k on IC, backside metal LED sapphire dicing Packaging dicing (ICs, LEDs with PCB) Memory repair cells PCBs flex/rigid FC BGA/FC CSPHDI PCBs Advanced packaging platforms (RDL, seed layer) Sensor debonding PVDThin film deposition IGBTs: dopants activation Embedded chip in PCB Mold compound Silicon wafers Plastic welding (MEMS, F) 3D memory LASER PROCESSING PROCESS STEP APPLICATIONS Compound Semi. Solder bonding / flip chip bonding Li-ion battery Li-ion battery (Yole Développement, October 2017) Find all our reports on www.i-micronews.com RELATED REPORT Benef it from our Bundle Annual Subscription offers and access our analyses at the best available price and with great advantages

25. LASER TECHNOLOGIES FOR SEMICONDUCTOR MANUFACTURING INCREASED COMPETITION IN THE LASER EQUIPMENT SEMICONDUCTOR INDUSTRY The laser equipment market is diversified, with several different equipment suppliers involved in various semiconductor process steps and able to process diverse material types. While it is a highly- concentrated group of suppliers, they come from myriad fields and span the whole range from front- end to back-end. Meanwhile, the laser equipment supply chain is highly fragmented. Additionally new companies are entering the laser equipment market with well-honed expertise in specific equipment lines other than laser tools. Overall, there are more than 30 companies worldwide intensively active in laser semiconductor manufacturing technologies and offering different types of machine. However, the majority of laser equipment vendors can be found in three regions: Germany, Asia and the USA. The laser industry remains mostly concentrated in Germany. However, we see increased competition with the entrance of Chinese and Korean players with competitive laser solutions that could lower costs. There are a wide variety of laser technologies available to semiconductor manufacturers. Typically, laser type is defined by parameters such as wavelength, emitting ultraviolet (UV), green, or infrared (IR) light, for example, as well as the duration of pulse, for example nanosecond, picosecond or femtosecond. Users must consider which pulse length and wavelength is right for their semiconductor process step and application. The laser equipment market will grow at a 15% compound annual growth rate from 2016-2022 (CAGR 2016-2022) to more than $4B by 2022 (excluding marking and annealing). This is mainly driven by dicing, via drilling and patterning in flexible PCBs, IC substrates and semiconductor device processing. Nanosecond lasers are the most commonly used type of laser applied in semiconductor manufacturing and PCB processing, with more than 60% market share. They are followed by picosecond, CO2 and femtosecond lasers. In the case of dicing step, the choice of laser type also depends on the material and substrate to be diced. For low dielectric constant (low-k) materials, nanosecond and picosecond UV lasers are used to optimise optical absorption. Picosecond and femtosecond IR lasers are typically used for cutting glass and sapphire substrates but not singulating SiC substrates. In drilling, the type of laser employed depends on the substrate. Nanosecond UV lasers are usually employed in flexible PCBs, while CO2 lasers are largely applied for PCB HDI and IC substrates. However, for IC substrates, the choice between CO2 and nanosecond or picosecond UV lasers depends on via diameters. Below 20µm diameters, the industry tends to go to picosecond UV lasers which are much more expensive than nanosecond UV lasers but offer superior quality. Generally speaking, CO2 is the cheapest and fastest laser solution and used in preference to nanosecond, picosecond or femtosecond solid state lasers for dicing, drilling, patterning, marking for applications that require high power and do not care about heat damage or dicing width. However, CO2 is limited when small features are needed. Nanosecond lasers are currently the dominant technology, but picosecond and femtosecond lasers could move ahead in the laser dicing equipment market. However, femtosecond laser implementation is more complex and expensive. This report will provide a comprehensive overview of the laser equipment and laser sources used for each semiconductor process step application, along with a detailed analysis of laser technology trends and a market forecast. It will also offer a detailed analysis of the laser equipment market by volume and value, its growth for the 2016-2022 timeframe, and breakdowns by laser type and process step application. Laser market revenue ($B) split by laser type (Yole Développement, October 2017) 1 0 2 3 4 2016 2017 2018 2019 2020 2021 2022 Femtosecond Picosecond Nanosecond Excimer CO2 Revenue($B) LASER TECHNOLOGIES: MASSIVE MARKET ADOPTION DICING/SCRIBING DRILLING Laser source suppliers as well PATTERNING DEBONDING AND LIFT-OFF BONDING/WELDING Non exhaustive list of players – the process steps laser marking, inspection and metrology, annealing and deposition are included in the report.A similar slide with an overview of the laser source suppliers will be included as well. Competition in the laser equipment semiconductor industry (Yole Développement, October 2017)

26. Find more details about this report here: MARKET TECHNOLOGY REPORT COMPANIES CITED IN THE REPORT (non exhaustive list) Accretech, Amplitude systems, Amphos, Applied Materials, AP systems, ASM Pacific, Coherent/ Rofin, 3D Micromac, 3M, Corning, Delphi Laser, Disco, Edgewave, Electro Scientific Industries(ESI), Eolite, EO Technics, EVG, Hamamatsu, Han’s laser, Hanmi Semiconductor, HG Tech, IPG Photonics, Lumentum, LPKF, JSW, JT Corp, K-Jet, Manz, MKS Instrument, ORC, Orbotech/SPTS, PacTech, QMC, Screen, Shanghai Micro Electronics Equipment (SMEE), Solmates, Synova, Sumito Heavy Industries, SUSS MicroTech, Nikon, Screen, SMEE, Tazmo, TOK, Trumpf, United Winners Laser (UW), Ushio, Veeco/Ultratech, Via Mecha, and more… REPORT OBJECTIVES • Provide detailed information regarding the applicability of the laser technologies in the field of semiconductor manufacturing • Detailed analysis of the major applications using laser methods today or potential attractive applications that could require the use of laser technology • Laser process roadmap application • Give the current status of the laser technology adoption and the various types of laser available on the market • Provide an overview of the technological trends for laser • Understand the key benefits and added value of lasers in semiconductor manufacturing • Understand how do laser tools differ from alternative technologies • Understand the remaining challenges in the implementation of laser technology in the field of semiconductor manufacturing • Offer market metrics at laser equipment and laser source market level for semiconductor applications from 2016-2022 • Give an overview of the key laser equipment suppliers and position them by application, laser type and process step • Technology process, specification and value chain AUTHOR Amandine Pizzagalli is a Technology Market Analyst at Yole Développement (Yole). Amandine is part of the development of the Advanced Packaging Semiconductor Manufacturing Business Unit of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes. Previously, Amandine was engaged in many projects of development focused on CVD and ALD processes for semiconductor applications at Air Liquide. Amandine is graduated in Electronics from CPE Lyon (France), with a technical expertise in Semiconductor Nano- Electronics and has a master focused on Semiconductor Manufacturing Technology, from KTH Royal Institute of Technology (Sweden). She has spoken in numerous international conferences and has authored or co- authored more than 10 papers. Introduction, definition methodology 6 Who should be interested in this report? Companies cited in this report Definitions, limitations and methodology Executive summary 16 Laser techniques classification and definition 26 Laser technologies in the field of semiconductor 44 Laser at a glance Laser applicability in the field of semiconductor Laser technologies benefits and drivers Substrate and material types that the laser can process Overview of the laser technologies Laser type applicability by semiconductor process step Laser equipment and source suppliers: competitive landscape 59 2016 - 2022 laser market forecast 76 Laser equipment market forecasts breakdown by laser type and by process steps in units and in $M Positionnement of the laser equipment suppliers by laser type, application, semiconductor process step, material type, laser equipment players’ market share and revenue In-depth analysis on the laser technologies by semiconductor process step 84 Laser for dicing/cutting 85 Laser for drilling 114 Laser for patterning 125 Laser for debonding/lift-off 165 Laser annealing 210 Laser for inspection metrology 230 Other laser process steps: laser marking, laser trimming, deposition laser 250 Conclusions Perspectives 280 TABLE OF CONTENTS Han’s Laser and Delphi Laser already dominate the Chinese market and together account for 100% of their growing domestic market. Local government support helps their market position. Increased competition is driving acquisition or merger deals between laser source companies and laser equipment vendors, such as those between ESI and EOLITE, and Rofin and Coherent. These deals will help suppliers gain more value from the supply chain by capturing share in both laser source and laser equipment markets. This report provides a map of the key laser equipment and laser source manufacturers involved in each semiconductor process step, as well as the material types their products can process. This report also includes a quantified, detailed analysis based on the competitive landscape and major laser equipment suppliers’ market shares, segmented by process step and laser solution type.

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34. 30©2017 | www.yole.fr | About Yole Développement SERVING THE ENTIRE SUPPLY CHAIN Our analysts provide market analysis, technology evaluation, and business plans along the entire supply chain Integrators and end-users Device manufacturers Suppliers: material, equipment, OSAT, foundries… Financial investors, RD centers

35. 31©2017 | www.yole.fr | About Yole Développement SERVING MULTIPLE INDUSTRIAL FIELDS We work across multiples industries to understand the impact of More-than- Moore technologies from device to system From A to Z… Transportation makers Mobile phone and consumer electronics Automotive Medical systems Industrial and defense Energy management

36. 32©2017 | www.yole.fr | About Yole Développement o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in: • MEMS Sensors • RF devices technologies • Imaging • Medical technologies (MedTech) • Photonics • Advanced packaging • Manufacturing • Advanced substrates • Power electronics • Batteries and energy management • Compound semiconductors • Solid state lighting • Displays o You are looking for: • An analysis of your product market • A review of your competitors evolution • An understanding of your manufacturing and production costs • An understanding of your industry technology roadmap and related IPs • A clear view on the evolution of the supply chain The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 19 years, we worked on more than 2 000 projects, interacting with technology professionals and high level opinion makers from the main players of the industry. o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers. REPORTS COLLECTION www.i-Micronews.com

37. 33©2017 | www.yole.fr | About Yole Développement OUR 2017 REPORTS PLANNING (1/2) MARKET ANDTECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Acoustic MEMS and Audio Solutions 2017 − Integrated Passive Devices Market Status 2017 − 3D Imaging Sensing 2017 − Status of the MEMS Industry 2017 − Silicon Photonics 2017* − MEMS Sensors for Automotive 2017 − High End Inertial Sensors for Defense and Industrial Applications 2017* − Magnetic Sensors Market and Technologies 2017 − Sensors and Sensing Modules for Smart Homes and Buildings 2017 − Sensing and Display for AR/VR/MR 2017** − MEMS Packaging 2017 − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 o RF DEVICES AND TECHNOLOGIES − RF Front End Modules and Components for Cellphones 2017 − Advanced RF SiP for Cellphones 2017 − 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017 − RF Technologies for Automotive Applications 2017 − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 o MANUFACTURING − Glass Substrate Manufacturing 2017 − Equipment Materials for Fan Out Technology 2017 − Equipment and Materials for 3D TSV Applications 2017 − Emerging Non Volatile Memories 2017* o MEDTECH − Status of the Microfluidics Industry 2017 − Solid State Medical Imaging 2017 − Connected Medical Devices: the Internet of Medical Things 2017 − Sensors for Medical Robotics 2017 − Artificial Organs: Market Technology Analysis 2017 − Organs-on-a Chip 2017 o ADVANCED PACKAGING − Advanced Substrates Overview 2017 − Integrated Passive Devices Market Status 2017 − Status of the Advanced Packaging Industry 2017 − Fan Out Packaging: Market Technology Trends 2017* − 3D TSV and 2.5D Business Update - Market and Technology Trends 2017 − Advanced QFN: Market Technology Trends 2017** − MEMS Packaging 2017 − Advanced Packaging for Memories 2017 − Advanced RF SiP for Cellphones 2017 − Power Packaging Market and Technology Trends 2017 − Embedded Die Packaging: Technologies and Markets Trends 2017 o IMAGING OPTOELECTRONICS − 3D Imaging Sensing 2017 − Status of the CMOS Image Sensor Industry 2017* − Camera Module for Consumer and Automotive Applications 2017* − Uncooled Infrared Imaging Technology Market Trends 2017* − Solid State Medical Imaging 2017 − Embedded Software for Machine Vision Systems 2017** o BATTERY AND ENERGY MANAGEMENT − Status of the Rechargeable Li-ion Battery Industry*2016 version still available / **To be confirmed

38. 34©2017 | www.yole.fr | About Yole Développement OUR 2017 REPORTS PLANNING (2/2) o POWER ELECTRONICS − Status of Power Electronics Industry 2017 − Power MOSFET 2017: Market and Technology Trends − IGBT Market and Technology Trends 2017 − Power Module Packaging: Material Market and Technology Trends 2017 − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications* − Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, etc.) 2017 − Gate Driver Market and Technology Trends 2017 − Power Management ICs Market Quarterly Update 2017 − Integrated Passive Devices Market Status 2017 − Thermal Management for LED and Power 2017 o COMPOUND SEMICONDUCTORS − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications* − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − 5G Impact on RF Industry: From Wireless Infrastructure to Cellphone Terminals 2017 − Bulk GaN Substrate Market 2017 o DISPLAYS − MicroLED Displays 2017 − MicroLED IP 2017 − Quantum Dots for Display Applications 2017 − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays o SOLID STATE LIGHTING − UV LEDs 2017 - Technology, Manufacturing and Application Trends* − Horticultural Lighting 2017 - Technology, Industry and Market Trends − Automotive Lighting 2017 - Technology, Industry and Market Trends* − Active Imaging and Lidar 2017 - IR Lighting** − LED Lighting Module 2017 - Technology, Industry and Market Trends − IR LEDs and VCSELs - Technology Applications and Industry Trends 2017 − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − MicroLED Displays 2017 − CSP LED Lighting Module 2017 − LED Packaging 2017 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 PATENT ANALYSIS by Knowmade − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017 − Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets 2017 − MEMS Microphone: Patent Landscape Analysis 2017 − Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping − Microbolometer: Patents Used in Products 2017 − Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017 − Pumps for Microfluidic Devices Patent Landscape − III-N Patent Watch − MicroLEDs: Patent Landscape Analysis 2017 − Uncooled Infrared Imaging: Patent Landscape Analysis 2017 − 3D Monolithic Memory: Patent Landscape Analysis 2017 − NMC Lithium-Ion Batteries Patent Landscape Analysis − FLUIDIGM Patent Portfolio Analysis TEARDOWN REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in 2017. *2016 version still available / **To be confirmed

39. 35©2017 | www.yole.fr | About Yole Développement OUR 2016 PUBLISHED REPORTS LIST (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS SENSORS − Gas Sensors Technology and Market 2016 − Status of the MEMs Industry 2016 − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads 2016 − Sensors for Biometry and Recognition 2016 − Silicon Photonics 2016 o IMAGING OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016 − Uncooled Infrared Imaging Technology Market Trends 2016 − Imaging Technologies for Automotive 2016 − Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH − BioMEMS 2016 − Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING − Embedded Die Packaging: Technology and Market Trends 2017 − 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 − Fan-Out: Technologies and Market Trends 2016 − Fan-In Packaging: Business update 2016 − Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING − Thin Wafer Processing and Dicing Equipment Market 2016 − Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 − Sapphire Applications Market 2016: from LED to Consumer Electronics − Power SiC 2016: Materials, Devices, Modules, and Applications o LED − UV LED Technology, Manufacturing and Applications Trends 2016 − OLED for Lighting 2016 – Technology, Industry and Market Trends − Automotive Lighting: Technology, Industry and Market Trends 2016 − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Sapphire Applications Market 2016: from LED to Consumer Electronics o POWER ELECTRONICS − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Status of Power Electronics Industry 2016 − Passive Components Technologies and Market Trends for Power Electronics 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends − Inverter Technologies Trends Market Expectations 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 − Stationary Storage and Automotive Li-ion Battery Packs 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016

40. 36©2017 | www.yole.fr | About Yole Développement OUR 2016 PUBLISHED REPORTS LIST (2/2) PATENT ANALYSIS by Knowmade − Microbattery Patent Landscape Analysis − Miniaturized Gas Sensors Patent Landscape Analysis − 3D Cell Culture Technologies Patent Landscape − Phosphors and QDs for LED Applications Patent Landscape − TSV Stacked Memory Patent Landscape − Fan-Out Wafer Level Packaging Patent Landscape Analysis TEARDOWN REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published in 2016. MORE INFORMATION o All the published reports from the Yole Group of Companies are available on our website www.i-Micronews.com. o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide).

41. 37©2017 | www.yole.fr | About Yole Développement MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.We will ensure you benefit from this. ONLINE ONSITE INPERSON @Micronews e-newsletter i-Micronews.com i-Micronewsjp.com FreeFullPDF.com Events Webcasts Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility.They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively – but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Targeted audience involvement equals clear, concise perception of your company’s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience.Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Benefit from the i-Micronews.com traffic generated by the 8,500+ monthly visitors, the 11,500+ weekly readers of @Micronews e-newsletter Seven main events planned for 2017 on different topics to attract 100 attendees on average Gain new leads for your business from an average of 300 registrants per webcast Contact: CamilleVeyrier (veyrier@yole.fr), Marketing Communication Project Manager.

42. 38©2017 | www.yole.fr | About Yole Développement CONTACT INFORMATION o CONSULTING AND SPECIFIC ANALYSIS • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – +1 31 06 008 267 • Japan Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • RoW: Jean-Christophe Eloy, CEO President, Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 o REPORT BUSINESS • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – +1 31 06 008 267 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Japan Asia: Miho Othake, Account Manager Email: ohtake@yole.fr - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 o FINANCIAL SERVICES (in partnership with Woodside Capital Partners) • Jean-Christophe Eloy, CEO President Email: eloy@yole.fr - +33 4 72 83 01 80 o GENERAL • Public Relations: leroy@yole.fr - +33 4 72 83 01 89 • Email: info@yole.fr - +33 4 72 83 01 80 Follow us on