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InvenSense MPU-9250 9-Axis MEMS IMU teardown reverse costing report by published Yole Developpement

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2nd Gen. of InvenSense IMU - The Smallest 9-Axis IMU with only 9mm² footprint 40% area decrease of the gyro & magneto through key changes of the Nasiri process


For its second generation of 9 DoF sensor, InvenSense manages to integrate a 6-Axis Accelerometer/Gyroscope and a 3-Axis Magnetometer in a cost effective QFN package of only 3x3mm (45% footprint reduction compared to the previous generation).

This package reduction has been made possible thanks to a new design of the 3-axis gyroscope which now uses a single structure vibratory compared to three different structures for the previous generation of gyros. This new design results in a shrink of 40% of the 3-axis gyro area. The second benefice of this new design is that Nasiri process has been changed: cavities which were traditionally etched in the ASIC to allow MEMS structures moving are no longer used, thus resulting in cost reduction.

The MPU-9250 also integrates a new 3-Axis magnetometer from AKM, the AK8963, which features almost 40% size reduction compared to previous generation and sensitivity improvement with 0.15µT/LSB.

More information on that report at http://www.i-micronews.com/reports/InvenSense-MPU-9250-9-Axis-MEMS-IMU/1/426/

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InvenSense MPU-9250 9-Axis MEMS IMU teardown reverse costing report by published Yole Developpement

  1. 1. DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners. © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1 Electronic Costing & Technology Experts www.systemplus.fr 21 rue la Nouë Bras de Fer 44200 Nantes – France Phone : +33 (0) 240 180 916 email : info@systemplus.fr March 2014 – Version 1 – Written by Romain Fraux
  2. 2. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 2 Glossary 1. Overview / Introduction 4 – Executive Summary – Reverse Costing Methodology 2. Company Profile 7 – InvenSense Profile – MPU-9250 Specifications 3. Physical Analysis 15 – Synthesis of the Physical Analysis – Physical Analysis Methodology – Package – Package View, Dimensions & Pin-out – Package Opening – Package Cross-Section – MPU-6500 Die – View, Dimensions & Marking – MEMS Removed – MEMS Sensing Area – MEMS Cap – ASIC Delayering & Process – Die Cross-Section: ASIC – Die Cross-Section: MEMS (Pads Opening, Sealing) – Die Cross-Section: Sensor (Electrical Contacts, Standoffs) – Die Cross-Section: Sensor (Al-GE Bonding) – Die Cross-Section: Sensor (Mobile Elements) – Die Cross-Section: Cap – AK8963 Die – View, Dimensions & Marking – Hall Sensors – Delayering & Process – Die Cross-Section – Magnetic Concentrator Cross-Section 4. Comparison with previous generation 92 5. Manufacturing Process Flow 95 – Global Overview – MPU-6500 ASIC Front-End Process – MPU-6500 MEMS Process Flow – MPU-6500 Wafer Fabrication Unit – AK8963 ASIC Front-End Process – AK8963 Magnetic Concentrator Process Flow – AK8963 Wafer Fabrication Unit – Packaging Process Flow – Package Assembly Unit 6. Cost Analysis 112 – Main steps of economic analysis – Yields Hypotheses – MPU-6500 ASIC Front-End Cost – MPU-6500 MEMS Front-End Cost – MPU-6500 ASIC/MEMS Assembly Cost – MPU-6500 MEMS Front-End Cost per process steps – MPU-6500 Total Front-end Cost – MPU-6500 Back-End 0 : Probe Test & Dicing – MPU-6500 Wafer & Die Cost – AK8963 ASIC Front-End Cost – AK8963 Magnetic Concentrator Cost – AK8963 Total Front-end Cost – AK8963 Back-End 0 : Probe Test & Dicing – AK8963 Wafer & Die Cost – Back-End : Packaging Cost – Back-End : Packaging Cost per Process Steps – Back-End : Final Test & Calibration Cost – MPU-9250 Component Cost 7. Estimated Price Analysis 146 – InvenSense Financial Ratios – MPU-9250 Estimated Price Contact 150
  3. 3. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 3 The reverse costing analysis is conducted in 3 phases: Teardown analysis • Package is analyzed and measured • The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking • Setup of the manufacturing process. Costing analysis • Setup of the manufacturing environment • Cost simulation of the process steps Selling price analysis • Supply chain analysis • Analysis of the selling price
  4. 4. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 4 • Package: QFN 24-pin • Dimensions: 3.0 x 3.0 x 1.0mm • Pin Pitch: 0.4mm • Marking: MP92 C571D1 L1339 Package top view Package back viewPackage Side View Orientation of Axes for Accelerometer & Gyroscope (from datasheet) Orientation of Axes for Magnetometer (from datasheet)
  5. 5. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 5 • The die marking includes: InvenSense 2012 SCORPION-A02 ASIC Die Marking
  6. 6. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 6 • The die marking includes the logo of AKM and: 6473_ _ _ 2011 Magnetometer Die Marking
  7. 7. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 7
  8. 8. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 8
  9. 9. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 9 Packaging Cost Calibration & Final Test Cost MPU-6500 CMOS Front-End Cost MEMS Front-End Cost Probe Test Cost Dicing Cost • We perform the economic analysis of the CMOS with the IC Price+ tool. • We perform the economic analysis of the MEMS and packaging with the MEMS CoSim+ tool. Subcontractor Could also be
  10. 10. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 10
  11. 11. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 11
  12. 12. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 12
  13. 13. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 13
  14. 14. InvenSense MPU-9250 Return to TOC © 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 14 Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts. Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated) These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: USA Office • Michael McLaughlin, Business Development Manager, Phone: (650) 931 2552 - Cell: (408) 839 7178 Email: mclaughlin@yole.fr • Jeff Edwards, Sales Associate, Yole Inc., Cell: (972) 333 0986-Email: edwards@yole.fr Japan Office • Takashi Onozawa, Sales Asia & General Manager, Yole K.K. Email: onozawa@yole,fr European Office • Yves Devigne, Europe Business Development Manager, Cell: +33 6 75 80 08 25 -Email : devigne@yole.fr • Yole Développement Headquarter, France: David Jourdan, Sales Coordination & Customer Service, Tel: +33 472 83 01 90, Email: jourdan@yole.fr Korea Office • Hailey Yang, Business Development Manager, Phone : (82) 2 2010 883 -Cell: (82) 10 4097 5810 Fax: (82) 2 2010 8899 Email: yang@yole.fr

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