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Fan-Out Technologies and Market Trends 2017 Report by Yole Developpement

Fan-Out packaging growth is now a fact: Who can challenge TSMC to get market shares, and how would panel technology impact that?

FAN-OUT PACKAGING CONFIRMS ITS SUCCESS STORY… AND CREATES A COMPLEX MARKET

Many important questions face the Fan-Out Packaging world. Will the growth keep going? Who can challenge TSMC? Is panel technology coming? What will be the next killer application? This report will bring you the answers – and here is a preview of some: Fan-Out Wafer Level Packaging (FOWLP), and also Fan-Out packaging solutions not based on wafers, have been the hottest topic in the advanced packaging industry for two years, and that will remain true.

In 2016, TSMC’s InFO FOWLP solution was used to package Apple’s A10 application processor, which was implemented in the iPhone 7. It created huge interest in the platform and demonstrated its capability to address complex applications in large volumes. Its potential was confirmed by Apple when it chose InFO for its next application processor, the A11, in 2017. Could it mean Fan-Out packaging is going to spread all over the market? Will every Fan-Out supplier benefit fromthat? As usual in the advanced packaging industry, things are not that simple.

The Fan-Out packaging market can actually be split into two:
• The “core” Fan-Out market, including single die applications such as baseband, power management and RF transceivers.
• The “high-density” (HD) Fan-Out market, started by Apple’s Application Processor Engine (APE), which includes applications with higher counts of input-output (IO) connections such as processors and memory.

While both markets have great potential and are expected to grow fast, they have different drivers and can be addressed by different players. The core market is the main historic pool for FOWLP solutions, which initially to address Intel Mobile’s needs in 2009. Now, the technology has managed to convince several heavyweights in the industry, like Qualcomm, for numerous small size/ low IO count applications such as audio codecs, power management integrated circuits, baseband, radars, etc. Major Outsourced Semiconductor Assembly and Test companies (OSATs) are well positioned in that market and have been supplying the technology for quite some time. Players include JCET/STATs ChipPAC, ASE, Amkor, especially after its purchase of Nanium, etc. With FOWLP being acknowledged for its advantages such as reducing form-factor size, flexibility in die embedding and electrical performance, the market is expected to grow steadily in coming years, especially in mobile applications.

More information on that report at http://www.i-micronews.com/reports.html

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Fan-Out Technologies and Market Trends 2017 Report by Yole Developpement

  1. 1. October 2017 From Technologies to Market Fan-Out Packaging Technologies and Market Trends Sample
  2. 2. 2 REPORT SCOPE The main objectives of this report are the following: o To identify and describe which technologies can be classified as “Fan-Out” o To update the business status of Fan-Out technologies markets o To provide a market forecast for the coming years, and estimate future trends o To analyze key market drivers, benefits and challenges of Fan-Out packages by application o To describe the different existing technologies, their trends and roadmaps o To analyze supply chain and Fan-Out landscape The Fan-Out markets are studied from the following angles: o State-of-the-art technologies and trends o End-User applications and drivers o Market value o Industrial supply chain & value chain ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  3. 3. 3 TABLE OF CONTENTS 2017 ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample • Report scope & definitions p.7 o Scope of the report o Companies cited in this report o Glossary • What’s new p.13 • Executive summary p.19 • Advanced packaging trends p.52 o Advanced Packaging platforms segmentation • Motivations and drivers p.67 o Fan-Out Definition o Thickness, electrical performance, integration o Cost • Products and technologies p.96 o Segmentation o Fan-Out PackagingTechnologies available and expected (eWLB, RCP, InFO, SWIFT, M-Series, etc…) o IP status o Limitations and challenges + Roadmaps • Supply Chain p.178 o Players and positioning within the supply chain • Commercialization Status p.193 o Type of products and markets of interest o Which type of Fan-Out for which application? • Telecom products,APE, Automotive, MEMS, HPC, etc… o Stories and Analysis: Who sold what and where? / Manufacturing capabilities / Alliances o Market shares o Limitations for the market • Market forecasts p.242 o Revenues (per end-markets, per applications) o Volumes (in wafers, in packages) • Panel Manufacturing p.268 o Panel/carriers for Fan-Out status, cost comparison and forecast • Conclusions p.286 • Related Reports / Company presentation p.289
  4. 4. 4 Biography & contact ABOUT THE AUTHOR Jérôme Azémar Jérôme Azémar is a senior member of the Advanced Packaging & Manufacturing team of Yole Développement. As a technology and market analyst since 2013, Jérôme provided numerous market research and strategy analysis on Power Electronics, Advanced Packaging and Semiconductor Manufacturing and he performed several presentations, keynotes and market briefings in semiconductors conferences. Upon graduating from INSA Toulouse with a master’s in Microelectronics and Applied Physics, he joined ASML and worked in Veldhoven for three years as an Application Support Engineer, specializing in immersion scanners. During this time he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics. While with ST he developed new processes, co-authored an international publication and worked on metrology structures embedded on reticules before joining Yole Développement in 2013. azemar@yole.fr ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  5. 5. 5 FAN-OUT TECHNOLOGY PRINCIPLE Fan-Out: Dies embedded in mold compound, no advanced substrate and interconnectio ns fanned out of chip surface eWLB example (chip-first face- down) Pick and place Wafer level molding Carrier removal/de-bonding Tape lamination StandardWLB process (Passivation, pattern, RDL, bonding) Dicing Source: Infineon Carrier Carrier with foil and chips Molding with liquid mold compound WLP Fan-Out wafer After singulation Reconstituted wafer after molding ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  6. 6. 6 Smaller footprint and thinner package than Flip-Chip BGA Lower thermal resistance compared to Flip-Chip BGA Simplified supply chain and manufacturing infrastructure No laminate substrate required No restriction in bump pitch Shorter interconnections Fan-Out zone adaptable to customer needs FAN-OUT KEY DIFFERENTIATORS Fan-Out provides several advantages Mold Chip And others such as: • Better board level reliability compared toWLCSP • RoHS an REACH compliant package • Excellent electrical performance • High degree of package design freedom • Reliable, miniaturized high performance package ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  7. 7. 7 EMBEDDED PACKAGING TECHNOLOGIES Embedded packaging technologies with connections fanned out of IC surface Embedding in organic laminate Embedding in epoxy mold compound CHIP FIRST: CF CHIP LAST: CL FACE UP: FU FACE DOWN: FD Process type Lamination around the chip Cavity dig in substrate Interconnections type RDL Foundry BEOL + RDL Advanced Substrate Chip orientation Encapsulator type CF / CLCF / CL CL FU / FD FU / FD Chip placing Embedded Die Fan-Out Packaging (Focus of the report) Flip-Chip ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  8. 8. 8 Chip-First Face-Down Chip-First Face-Up Chip-Last - Co-planarity of active surfaces of dies makes it easier to embed - Wafer-level-package  Lower cost than Chip-Last - Face-up allows to have mold compound in between die surface and RDL which allows better high frequency performance (optimized spacing, less parasitic inductances) and higher reliability vs mechanical stress - Face-up can have higher misalignment tolerance than Face-Down (limited die pad size vs full pillar size) - Easier debonding on non-active IC faces. - No loss of KGD: Known good die check before process to wafer and known good RDL check before IC flip - Higher yield: - No die shift nor warpage due to compound thermal expansion - No need for low temperature cure dielectric material - Higher IO count embedding: - Higher number of RDL achievable and high resolution - Easiness of embedding because of flip-chip (thickness of the die is not an issue) - Sensitivity to Die-Shift: Face-Down is constrained by via to die pad tolerance - If failure, known good die is lost: No info on known good RDL before the package is done - Wafer-Level-Package  Tight requirements for materials to avoid issues with mold (low cure dielectric materials, warpage, etc…) - Non co-planarity of active surface of dies makes it harder to embed - If failure, known good die is lost: No info on known good RDL before the package is done - Wafer-Level-Package  Tight requirements for materials to avoid issues with mold (low cure dielectric materials, warpage, etc…) - Higher cost than chip-first solutions (more process steps, two parts to assemble) - More complex process DIFFERENT PROCESS APPROACH FOR DIFFERENT RESULTS Pros and cons of different Fan-Out process approaches ©2016 | www.yole.fr | Fan-Out Packaging: Technologies & Market Trends©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  9. 9. 9 Topography Due to different sizes of devices to embed, non planarity can become an issue for SiP integration Chip-to-mold non-planarity Die protrusion at the interface can lead to RDL distortion Die shift Lack of precision in die positioning during pick and place induces challenges for lithography steps and alignments Reliability In case of large packages (beyond 15*15mm) creep fatigue and solder joint issues appear  Issue for large die embedding and PoP Warpage Nonuniform stress during process steps like molding compound deposition and die placing can impact wafer flatness and stress on dies IC 1 IC 2 FAN-OUT PACKAGING: TECHNICAL CHALLENGES Fan-Out packaging faces technical challenges it must over- come to enlarge its scope of compatible applications ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  10. 10. 10 PATENT LANDSCAPE OVERVIEW Time evolution of patent publications related to Fan-OutWafer Level Packaging Patent activity in the field of fan-out wafer level packaging 4,008 patents (1,534 patent families*), including 2,083 granted patents and 1,517 pending patent applications Knowmade © 2017 Note: The data corresponding to the year 2017 is not complete patent search was performed in June 2017. Extension of priority patents First wave of patented inventions The second wave of patent filings combined to an increase of patent extensions worldwide is an indication of the technology maturity and market ramping up General Electric US5353498 (expired) Substrate for IC module with molding material around semiconductor chips, except for chip surfaces containing contact pads MCNC / Unitive International US5892179 (expired) Patent rights acquired by Amkor in 2012 Redistribution routing conductor EPIC Technologies US5841193 (expired) Thin multichip and single chip modules Fraunhofer US6093971 (granted) Patent rights acquired by PacTech in 2000 Chip module 22% CAGR 2008-2016 * A patent family is a set of patents filed in multiple countries by a common inventor(s) to protect a single invention. Innovation triggers Expected patent publications in 2017 ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  11. 11. 11 FAN-OUT 2017 FORECAST REVENUES MARKET SHARES (IN $M) 2017 FOWLP market status is representative of FO market duality. HD FO represent more than 50% of the value andTSMC takes it all ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  12. 12. 12 WHAT TO EXPECT FROM THE HIGH-DENSITY MARKET? Focus on APE packaging – Apple case Die manufacturer Package Manufacturer ? ? 2013 2014 2015 2016 2017 2018 Package type FC-PoP FC-PoP FC-PoP FO-PoP FO-PoP FO-PoP? Apple is king and uses its dominance over the two global innovation leaders available • Only TSMC and Samsung can have enough resources to be leading edge innovation players satisfying enough for Apple from volume capability, performance and cost • As a major customer,Apple has enough influence to put bothTSMC and Samsung in competition at both die and package levels.With FO-PoP offerTSMC took the lead in 2016/2017 but choice is not clear for 2018 ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  13. 13. 13 $ 0M $ 500M $1 000M $1 500M $2 000M $2 500M 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 Fan-Out activity revenues forecast (M$) Breakdown per Fan-Out market type "Core" Fan-Out "High Density" Fan-Out FAN-OUT ACTIVITY MARKET FORECAST Core FO market with steady growth and HD FO follows flagships’ production CAGR ~ 90% APPLE/TSMC entry • Entry of A10 APE of iPhone7, 7+ and newer in 2016 doubled the market! • After the first jump, further acceptance by players other than Apple (Qualcomm?) is appearing, maintaining the growth • Market estimated to exceed $2B by 2021 and keep growing after CAGR ~ 10% Intel Mobile/ Infineon eWLB-driven Transition phase 1 2 3 4 ~$2.3B $80M $244M Confirmation phase:Apple keeps its APE in FO and other players follow the trend $131M $1.4B ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  14. 14. 14 FAN-OUT ACTIVITY MARKET Focus on capacity So far large players already have decent capacity but landscape may change with new comers and panel investment 2017 capacity per player (in 300mm eq. wafers per month) ? ? ? ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  15. 15. 15 WHICH TYPE OF PANEL? Two main trends… Different sizes, different challenges, different success? From Fan-Out on wafers to Fan-Out on panel From panel to Fan-Out on panel • Several actors used to manufacture panels are willing to use their panel know-how and aging equipment to build FO panel line • Several advantages: • Most of equipment are panel ready, no big investment required • Line can be used for its initial purpose (depending on the player it can be LCD, PCB or advanced substrate) • Some concerns: • How can resolution with such tools compete with FO at wafer level? • What about specific FO steps such as molding?  This approach leads to standard sizes of PCB (ex: 600x600mm²) and LCD (ex: 650x650mm²) • Fan-out specialists are willing to reduce their costs through moving to panel • Several advantages: • Fan-Out process well mastered and specs well established (line/space, etc..) • Some concerns: • Big investment to build a new line for panel • How good can the process be transferred on panel? This approach can lead to any size of panel because lines are new. Most likely close to PCB too due to equipment being cheaper. Small size as start to develop process and limit investment cost also exit (ex: 300x300mm²) LCD PCB MEOL Wafer 650x650mm² 300x300mm² ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  16. 16. 16 2015 2016 2017 2018 2019 2020 2021 2022 Fan-Out Revenues Forecast (M$) Panel/wafer breakdown Wafer 300mm Panel FAN-OUT COST EVOLUTION: MARKET TRENDS FOR CARRIERS Panel will progressively take market shares Yole Développement August 2017 ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  17. 17. 17 RELATED REPORTS ©2017 | www.yole.fr | Fan-Out Packaging Technologies and Market Trends 2017 | Sample
  18. 18. © 2017 Yole Développement FromTechnologies to Market Source: Wikimedia Commons
  19. 19. 19©2017 | www.yole.fr | About Yole Développement FIELDS OF EXPERTISE Yole Développement’s 35+ analysts operate in the following areas MEMS & Sensors Compound Semi. Imaging Photonics MedTech Manufacturing Advanced Packaging Batteries / Energy Management Power Electronics Displays RF Devices & Techno. Advanced Substrates Solid State Lighting (LED, OLED, …)
  20. 20. 20©2017 | www.yole.fr | About Yole Développement 4 BUSINESS MODELS o Consulting and Analysis • Market data & research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering & costing • Patent analysis www.yole.fr o Reports • Market & technology reports • Patent investigation and patent infringement risk analysis • Teardowns & reverse costing analysis • Cost simulation tool www.i-Micronews.com/reports o Financial services • Due diligence • Fundraising • Maturation of companies • IP portfolio management & optimization www.yole.fr www.bmorpho.com o Media • i-Micronews.com website • @Micronews e-newsletter • Communication & webcast services • Events www.i-Micronews.com
  21. 21. 21©2017 | www.yole.fr | About Yole Développement A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr Due diligences www.yole.fr Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr Innovation and business maker www.bmorpho.com Test lab Expertise Research & innovation www.piseo.fr
  22. 22. 22©2017 | www.yole.fr | About Yole Développement OUR GLOBAL ACTIVITY 30%of our business 40%of our business 30%of our business Yole Inc. Greater China office Yole Japan HQ in Lyon Nantes Paris Nice Vénissieux Europe office Frankfurt Hsinchu Tokyo Phoenix Yole Korea Seoul
  23. 23. 23©2017 | www.yole.fr | About Yole Développement ANALYSIS SERVICES - CONTENT COMPARISON Multi- Customers Action Technology and Market Report Leadership Meeting Q&A Service Depth of the analysis Breadthoftheanalysis Meet the Analyst Custom Analysis High High Low
  24. 24. 24©2017 | www.yole.fr | About Yole Développement SERVING THE ENTIRE SUPPLY CHAIN Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain Integrators and end-users Device makers Suppliers: material, equipment, OSAT, foundries… Financial investors, R&D centers
  25. 25. 25©2017 | www.yole.fr | About Yole Développement SERVING MULTIPLE INDUSTRIAL FIELDS We are working across multiples industries to understand the impact of More-than- Moore technologies from device to system From A to Z… Transportation makers Mobile phone and consumer electronics Automotive Medical systems Industrial and defense Energy
  26. 26. 26©2017 | www.yole.fr | About Yole Développement o Yole Développement publishes a comprehensive collection of market & technology reports and patent analysis in: • MEMS & Sensors • RF devices & technologies • Imaging • Medical technologies (MedTech) • Photonics • Advanced packaging • Manufacturing • Advanced substrates • Power electronics • Batteries and energy management • Compound semiconductors • Solid state lighting • Displays o You are looking for: • An analysis of your product market • A review of your competitors evolution • An understanding of your manufacturing and production costs • An understanding of your industry technology roadmap and related IPs • A clear view on the evolution of the supply chain The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 19 years, we worked on more than 2 000 projects, interacting with technology professional and high level opinion makers from the main players of the industry. o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. Gain full benefit from our Bundle and Annual Subscription offers. REPORTS COLLECTION www.i-Micronews.com
  27. 27. 27©2017 | www.yole.fr | About Yole Développement OUR 2017 REPORTS PLANNING (1/2) MARKET ANDTECHNOLOGY REPORTS byYole Développement o MEMS & SENSORS − Acoustic MEMS and Audio Solutions 2017 − 3D Imaging & Sensing 2017 − Microspectrometers Markets and Applications 2017 − Status of the MEMS Industry 2017* − MEMS & Sensors for Automotive 2017 − High End Inertial Sensors for Defense and Industrial Applications 2017* − Magnetic Sensors Market and Technologies 2017 − Sensors and Sensing Modules for Smart Homes and Buildings 2017 − Sensing and Display for AR/VR/MR 2017 − MEMS Packaging 2017 − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 o RF DEVICES AND TECHNOLOGIES − RF Front End Modules and Components for Cellphones 2017 − Advanced RF SiP for Cellphones 2017 − 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals 2017 − 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals 2017 − RF Technologies for Automotive Applications 2017 − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 o MANUFACTURING − Glass Substrate Manufacturing 2017 − Equipment & Materials for Fan Out Technology 2017 − Equipment and Materials for 3D TSV Applications 2017 − Emerging Non Volatile Memories 2017* o MEDTECH − Status of the Microfluidics Industry 2017 − Solid State Medical Imaging 2017 − Connected Medical Devices: the Internet of Medical Things 2017 − Sensors for Medical Robotics 2017 − Artificial Organs: Market & Technology Analysis 2017 − Organs-on-a Chip 2017 o ADVANCED PACKAGING − Advanced Substrates Overview 2017 − Status of the Advanced Packaging Industry 2017 − Fan Out Packaging: Market & Technology Trends 2017* − 3D Business Update: Market & Technology Trends 2017* − Advanced QFN: Market & Technology Trends 2017** − Inspection and Metrology for Advanced Packaging Platform 2017** − MEMS Packaging 2017 − Advanced Packaging for Memories 2017 − Advanced RF SiP for Cellphones 2017 − Power Packaging Market and Technology Trends 2017 − Embedded Die Packaging: Technologies and Markets Trends 2017 o IMAGING & OPTOELECTRONICS − 3D Imaging & Sensing 2017 − Status of the CMOS Image Sensor Industry 2017* − Camera Module for Consumer and Automotive Applications 2017* − Uncooled Infrared Imaging Technology & Market Trends 2017* − Solid State Medical Imaging 2017 o BATTERY AND ENERGY MANAGEMENT − Status of Battery Industry for Stationary, Automotive and Consumer Applications *2016 version still available / **To be confirmed
  28. 28. 28©2017 | www.yole.fr | About Yole Développement OUR 2017 REPORTS PLANNING (2/2) o POWER ELECTRONICS − Status of Power Electronics Industry 2017* − Silicon Power Mosfet: Market and Technology Trends 2017 − IGBT Market and Technology Trends 2017 − Power Packaging Market and Technology Trends 2017 − Power SiC 2017: Materials, Devices, and Applications* − Power GaN 2017: Materials, Devices, and Applications* − Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017 − Gate Driver Market and Technology Trends 2017 − Power Management ICs Market Quarterly Update 2017 − Power Electronics for Electrical Aircraft, Rail and Buses 2017** − Thermal Management for LED and Power 2017 o COMPOUND SEMICONDUCTORS − Power SiC 2017: Materials, Devices, and Applications* − Power GaN 2017: Materials, Devices, and Applications* − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals 2017 − Bulk GaN Substrate Market 2017 o DISPLAYS − MicroLED Displays 2017 − Display for Augmented Reality, Virtual Reality and Mixed Reality 2017 − Quantum Dots for Display Applications 2017 − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Automotive Lighting 2017 - Technology, Industry and Market Trends o SOLID STATE LIGHTING − UV LEDs 2017 - Technology, Manufacturing and Application Trends* − Horticultural Lighting 2017 - Technology, Industry and Market Trends − Automotive Lighting 2017 - Technology, Industry and Market Trends* − Active Imaging and Lidar 2017 (Vol 2) - IR Lighting** − LED Lighting Module 2017 - Technology, Industry and Market Trends − IR LEDs and Lasers - Technology Applications and Industry Trends 2017 − Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays − MicroLED Displays 2017 − CSP LED Lighting Module 2017 − LED Packaging 2017 − Thermal Management for LED and Power 2017 PATENT ANALYSIS by Knowmade − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017 − Patent Licensing Companies in the Semiconductor Market - Patent Litigation − Risk and Potential Targets 2017 − MEMS Microphone: Patent Landscape Analysis 2017 − MEMS Microphone: Knowles’ Patent Portfolio Analysis 2017 − Microbolometer: Patents Used in Products 2017 − Microfluidic Technologies for Diagnostic Applications Patent Landscape 2017 − Micropumps: Patent Landscape Analysis 2017 − GaN Technology: Top-100 IP Profiles 2017 − MicroLEDs: Patent Landscape Analysis 2017 − Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping 2017 − Uncooled Infrared Imaging: Patent Landscape Analysis 2017 − 3D Monolithic Memory: Patent Landscape Analysis 2017 TEARDOWN & REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in 2017.*2016 version still available / **To be confirmed
  29. 29. 29©2017 | www.yole.fr | About Yole Développement OUR 2016 PUBLISHED REPORTS LIST (1/2) MARKET AND TECHNOLOGY REPORTS by Yole Développement o MEMS & SENSORS − Gas Sensors Technology and Market 2016 − Status of the MEMs Industry 2016 − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads 2016 − Sensors for Biometry and Recognition 2016 − Silicon Photonics 2016 o IMAGING & OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016 − Uncooled Infrared Imaging Technology & Market Trends 2016 − Imaging Technologies for Automotive 2016 − Sensors for Drones & Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH − BioMEMS 2016 − Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING − Embedded Die Packaging: Technology and Market Trends 2017 − 2.5D & 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 − Fan-Out: Technologies and Market Trends 2016 − Fan-In Packaging: Business update 2016 − Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING − Thin Wafer Processing and Dicing Equipment Market 2016 − Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 − Sapphire Applications & Market 2016: from LED to Consumer Electronics − Power SiC 2016: Materials, Devices, Modules, and Applications o LED − UV LED Technology, Manufacturing and Applications Trends 2016 − OLED for Lighting 2016 – Technology, Industry and Market Trends − Automotive Lighting: Technology, Industry and Market Trends 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Sapphire Applications & Market 2016: from LED to Consumer Electronics − LED Packaging 2017: Market, Technology and Industry Landscape o POWER ELECTRONICS − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Status of Power Electronics Industry 2016 − Passive Components Technologies and Market Trends for Power Electronics 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends − Inverter Technologies Trends & Market Expectations 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 − Stationary Storage and Automotive Li-ion Battery Packs 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016
  30. 30. 30©2017 | www.yole.fr | About Yole Développement OUR 2016 PUBLISHED REPORTS LIST (2/2) PATENT ANALYSIS by Knowmade − Microbattery Patent Landscape Analysis − Miniaturized Gas Sensors Patent Landscape Analysis − 3D Cell Culture Technologies Patent Landscape − Phosphors and QDs for LED Applications Patent Landscape − TSV Stacked Memory Patent Landscape − Fan-Out Wafer Level Packaging Patent Landscape Analysis TEARDOWN & REVERSE COSTING by System Plus Consulting More than 45 teardowns and reverse costing analysis and cost simulation tools published in 2016. MORE INFORMATION o All the published reports from the Yole Group of Companies are available on our website www.i-Micronews.com. o Ask for our Bundle and Annual Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then have up to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports automatically (multi-user format). Contact your sales team according to your location (see the last slide).
  31. 31. 31©2017 | www.yole.fr | About Yole Développement MICRONEWS MEDIA o About Micronews Media To meet the growing demand for market, technological and business information, Micronews Media integrates several tools able to reach each individual contact within its network.We will ensure you benefit from this. ONLINE ONSITE INPERSON @Micronews e-newsletter i-Micronews.com i-Micronewsjp.com FreeFullPDF.com Events Webcasts Unique, cost-effective ways to reach global audiences. Online display advertising campaigns are great strategies for improving your product/brand visibility.They are also an efficient way to adapt with the demands of the times and to evolve an effective marketing plan and strategy. Brand visibility, networking opportunities Today's technology makes it easy for us to communicate regularly, quickly, and inexpensively – but when understanding each other is critical, there is no substitute for meeting in-person. Events are the best way to exchange ideas with your customers, partners, prospects while increasing your brand/product visibility. Targeted audience involvement equals clear, concise perception of your company’s message. Webcasts are a smart, innovative way of communicating to a wider targeted audience.Webcasts create very useful, dynamic reference material for attendees and also for absentees, thanks to the recording technology. Benefit from the i-Micronews.com traffic generated by the 8,500+ monthly visitors, the 11,500+ weekly readers of @Micronews e-newsletter Seven main events planned for 2017 on different topics to attract 140 attendees on average Gain new leads for your business from an average of 300 registrants per webcast Contacts: CamilleVeyrier (veyrier@yole.fr) and Clotilde Fabre (fabre@yole.fr), Marketing & Communication Project Managers.
  32. 32. 32©2017 | www.yole.fr | About Yole Développement CONTACT INFORMATION o CONSULTING AND SPECIFIC ANALYSIS • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – +1 31 06 008 267 • Japan & Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • RoW: Jean-Christophe Eloy, CEO & President, Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 o REPORT BUSINESS • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr – +1 31 06 008 267 • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • Rest of Asia: Takashi Onozawa, General Manager, Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Japan & Asia: Miho Othake, Account Manager Email: ohtake@yole.fr - +81 3 4405 9204 • Greater China: Mavis Wang, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 o FINANCIAL SERVICES • Jean-Christophe Eloy, CEO & President Email: eloy@yole.fr - +33 4 72 83 01 80 o GENERAL • Public Relations: leroy@yole.fr - +33 4 72 83 01 89 • Email: info@yole.fr - +33 4 72 83 01 80 Follow us on

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