Embedded Die is finally passing the threshold from incubation to volume. Which markets are starting first, with which technology and supply chain?
Embedded Die in PCB: From incubation to volume
The semiconductor industry today is highly focused on weathering the market storms caused by the gradual saturation of the market driving mobile segment. Supply chain consolidation and vertical integration is trending among key players in the industry in order to reduce cost and raise preparedness for future uncertainty and diversity of upcoming applications and products. Advanced Packaging is one of the spotlights as a key enabling technology that can on one hand continue the cost reduction curve and on the other increase functionality by system level integration approaches.
Most of the attention in advanced packaging in the past year has been given to 2 platforms: Fan-Out WLP/PLP and 2.5D/3D IC packaging. Fundamentally, these packaging technologies have a sweet spot in the mobile and computing sector, respectively, with potential to grow into other market segments. However, the Embedded Die in PCB platform has a distinctively different history, path and adoption scheme than other advanced packaging platforms. While the first significant volume of Embedded Die in IC package substrate came from DC/DC converters in smartphones, penetration in other market segments of interest to Embedded Die such as automotive, medical or aerospace was simply delayed due to much longer qualification times and regulatory approval cycles. Furthermore, embedding a die in an IC package substrate and especially in the board can have distinctively different drivers than other advanced packaging platforms – not just form factor scaling or electrical performance increase, but better thermal management and reliability advantages. The Embedded Die platform has been incubated and brewed for years patiently waiting for the right moment to appear on the scene in considerable volume. It seems we are finally nearing the point of inflection – from incubation to volume...
More information : http://www.i-micronews.com/reports/advanced-packaging-reports.html