Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.

Embedded Die Packaging: Technology and Market Trends 2017 - Report by Yole Developpement

6,638 views

Published on

Embedded Die is finally passing the threshold from incubation to volume. Which markets are starting first, with which technology and supply chain?
Embedded Die in PCB: From incubation to volume
The semiconductor industry today is highly focused on weathering the market storms caused by the gradual saturation of the market driving mobile segment. Supply chain consolidation and vertical integration is trending among key players in the industry in order to reduce cost and raise preparedness for future uncertainty and diversity of upcoming applications and products. Advanced Packaging is one of the spotlights as a key enabling technology that can on one hand continue the cost reduction curve and on the other increase functionality by system level integration approaches.
Most of the attention in advanced packaging in the past year has been given to 2 platforms: Fan-Out WLP/PLP and 2.5D/3D IC packaging. Fundamentally, these packaging technologies have a sweet spot in the mobile and computing sector, respectively, with potential to grow into other market segments. However, the Embedded Die in PCB platform has a distinctively different history, path and adoption scheme than other advanced packaging platforms. While the first significant volume of Embedded Die in IC package substrate came from DC/DC converters in smartphones, penetration in other market segments of interest to Embedded Die such as automotive, medical or aerospace was simply delayed due to much longer qualification times and regulatory approval cycles. Furthermore, embedding a die in an IC package substrate and especially in the board can have distinctively different drivers than other advanced packaging platforms – not just form factor scaling or electrical performance increase, but better thermal management and reliability advantages. The Embedded Die platform has been incubated and brewed for years patiently waiting for the right moment to appear on the scene in considerable volume. It seems we are finally nearing the point of inflection – from incubation to volume...
More information : http://www.i-micronews.com/reports/advanced-packaging-reports.html

Published in: Technology

Embedded Die Packaging: Technology and Market Trends 2017 - Report by Yole Developpement

  1. 1. © 2016 Embedded Die Packaging: Technology and Market Trends 2016 November 2016 From Technologies to Market Report Sample
  2. 2. 2©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample REPORT OBJECTIVES To provide a market overview of the Embedded Die landscape o Emerging and declining applications o Forecasts until 2021: Revenue, unit count o Identify main players and provide supply chain analysis To provide analysis of technology trends o Technology roadmap o Latest technical innovations To assess the future development of the Embedded Die market o Outlook on volume growing disruptions: new market drivers, infrastructure, expanding business models, new entries, competing packaging solutions o Impact on supply chain and technology roadmap
  3. 3. 3 REPORT METHODOLOGY Market segmentation methodology Market forecast methodology ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  4. 4. 4 REPORT METHODOLOGY Technology analysis methodology Information collection ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  5. 5. 5 REPORT OUTLINES Part I/II Report scope & objectives 6 • Scope of the report • What’s new since last report ? • Companies cited in this report • Glossary Executive summary 16 • Key points and take-aways Market Drivers 31 • Advanced Packaging drivers • Advanced packaging market status • Advanced packaging platforms • Technical gaps & positioning of embedded die packaging vs other packaging platforms • Embedded Die drivers • Definition of embedded die • EDTechnology segmentation • Embedded die in substrate • Embedded die in PCB • Embedded die in flexible board • Embedded interconnections in substrate • Technology trends Market forecasts for embedded die 63 • Market forecasts • Market forecasts by units breakdown by markets • Market forecasts by revenues by markets • Market dynamics Embedded Die Markets & Applications 74 • Market and applications matrix • Detailed review of applications by market • Motivations and drivers • Rationales for adopting embedded die technology • Cost considerations Roadmaps 98 • Volume production technical roadmap for • Embedded die in substrate • Embedded die in PCB • Embedded die in flexible board • Challenges in embedding die for volume production • Overview of R&D programs around Embedded Die packaging ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  6. 6. 6 REPORT OUTLINES Part II/II Supply chain & Commercialization 116 • Examples of commercialization of embedded die packaging • Embedded die packaging main players mapping • Supply chain 2016 • Key partnerships in 2016 • Challenges related to supply chain • Embedded die ecosystems • PCB and substrate makers new position • Potential new entrants in the ED packaging business Main technology review by player 133 • Key players process flows • Focus on embedded interconnects in substrate Conclusions 150 • SWOT analysis for embedded die packaging stakeholders • Conclusions • Highlight of what is coming next ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  7. 7. 7 Biography & contact ABOUT THE AUTHORS Emilie Jolivet Emilie Jolivet is a Technology & Market Analyst, in the Advanced Packaging and Semiconductor Manufacturing team, at Yole Développement the "More than Moore" market research and strategy consulting company. She holds a master’s degree Applied Physics specialized in Microelectronics from INSA Toulouse. After an internship in failure analysis in Freescale, she took the position of R&D engineer for 7 years in photovoltaic business and co-authored several scientific articles. Strong for this experience, she graduated from a master in Business Administration at IAE Lyon and then joined EV Group as a business development manager in 3D & Advanced Packaging before joining Yole Développement in 2016. ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  8. 8. 8 SYNERGIESTOTHIS REPORT Status of the Advanced Packaging Industry 2017 January 2017 Fan-In Packaging: Business Update 2016 November 2016 Status and Prospects for the Advanced Packaging Industry in China July 2016 3D TSV & 2.5D Interconnect for Advanced Packaging: Technologies and Market Trends October 2016 Thin Wafer Processing and Dicing Equipment Market August 2016 Fan-Out Packaging: Technologies and Market Trends September 2016 Status of the CMOS Image Sensor Industry 2016 June 2016 Embedded Die Packaging: Technology and Market Trends November 2016 Readiness for Panel Manufacturing November 2015 ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  9. 9. 9©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample THE 2016 EMBEDDED DIE REPORT New content with respect to previous edition The 1st standalone edition of Embedded Die Packaging report fromYole Développement brings: • Focus exclusively on the Embedded Die packaging platform • Analysis of Embedded Die technology on IC package substrate and board level • Updated market forecasts, from 2015 to 2021 • Revised technology roadmaps, from 2015 to 2021 • Updated supply chain • Embedded Die market dynamics and future disruptions What’s New?
  10. 10. 10 SCOPE OF THE REPORT • The industry is using the term embedded die packaging for a broad range of packaging architectures and technologies • This report covers die embedding in laminate layers, namely IC package substrates and boards • This report will cover all types of active die embedded in layers of laminate, focusing on products with embedded active dies only or active dies and passives • Within the scope of embedding in laminate, this report also covers the emerging technologies involving the embedding of passive interconnects • On the other hand, die embedding in mold compound is termed Fan-Out and is covered in the report « Fan-Out Packaging 2016 » • Yole has reviewed:  Market and applications using embedded die technology today and in the future  Industrial and R&D players and supply chains  Business models and its challenges  Market forecasts • Market forecasts will take into account embedding active dies in laminate IC package substrates, in printed circuit boards and in flexible printed circuit boards ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  11. 11. 11 EMBEDDED PACKAGING TECHNOLOGIES Embedded packaging technologies with connections fanned out of the IC surface Embedding in organic laminate Embedding in epoxy mold compound (Fan-OutWLP/PLP) CHIP FIRST: CF CHIP LAST: CL FACE UP: FU FACE DOWN: FD Process type Lamination around the chip Cavity dig in substrate Interconnections type RDL Foundry BEOL Coreless Substrate Chip orientation Encapsulator type CF / CLCF / CL CL FU / FD FU / FD Chip placing Scope of the Embedded die report ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  12. 12. 12©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample Leadframes QFN,QFP w/o IC substrates Fan-in Fan-out IC substrates-based Package Substrate (organic) W/B BGA Flip Chip BGA 3DIC Interposer based (Si, Glass, Org) SiP Embedded die (in substrate) ADVANCED PACKAGING PLATFORMS Overview of advanced packaging platforms PCB (organic board) Increased functionality,performance… Interconnect: Single die Multiple Dies Integration:2D 3D Embedded die (in substrate or PCB) Bumping,Pillars,Studs,Through-silicon-via,Bump-less,EmbeddedTechnologies...
  13. 13. 13 What’s new since our last report
  14. 14. 14©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample WHAT’S NEW ONTHE MARKET SINCE OUR EMBEDDED DIE 2015 REPORT? • Mobile segment is slowing down causing a ripple effect of consolidation (M&A) throughout the semiconductor industry • Attention turns to advanced packaging in attempt to continue the cost reduction curve and increase functionality of devices • Embedded Die packaging is in the initial stage of market development, in favorable position to catch a part of the new wave Market dynamics – WW semiconductor industry • New semiconductor drivers are sought with R&D efforts transitioning to IoT and automotive segments • Higher emphasis on countries in transition in pursuit of new business opportunities, primarily China
  15. 15. 15©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample o Although unit growth has continued, the Embedded Die revenue has decreased from 2015 to 2016 mainly due to decline of higher value camera modules in Embedded Die packaging o A complete recovery and upward slope is expected from 2018 o The mobile segment might still bring highest volumes and revenues, but also highest uncertainty and competition o Automotive and Medical segment emerge as significant opportunities for the Embedded Die platform with highest projected growth o The supply chain continues to mature with more participating players in preparation for new products o New opportunities arise both for Embedding in board and IC package substrate WHAT’S NEW ONTHE MARKET SINCE OUR EMBEDDED DIE 2015 REPORT? Mobile => Mobile segment is still driving Embedded Die production, however, high uncertainty and competition leads to Automotive and Medical segments as more stable opportunities with highest projected market growth
  16. 16. 16 GAP IN INTEGRATED PACKAGING FOR MIDDLE AND HIGH POWER APPLICATIONS Filled in by embedding the die in the PCB Embedded die packaging already offers solution both for ultra-low and middle power applications POWER (Watt) PACKAGING INTEGRATION Ultra-low Low Middle High Laminate - Embedded die package - PCB Flip-Chip BGA panel wafer WL-CSP SMD QFN & Leadframe (advanced, ceramic, …) WLP (Fan-out) 3D-IC A gap to fill in 0,01 1 1 000 100 000 Discrete/ Module 10 00010 100 TO package Power module Need more integration ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  17. 17. 17 Embedding die packaging platforms Embedded die in laminate (substrate) A die packaged between layers of laminate which is attached to a final PCB Embedded die in PCB A die packaged between layers of laminate forming the final PCB Embedded die in flexible substrate A die packaged between layers of FLEXIBLE laminate forming the final PCB Embedded interconnections in substrate A silicon bridge is embedded acting as die-to-die interconnect EMBEDDED DIE TECHNOLOGIES SEGMENTATION Definitions EMIB technology from INTEL WABE technology from Fujikura Courtesy of AT&S ACTIVE & PASSIVE DICE PASSIVE INTERCONNECT ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  18. 18. 18 KEY PLAYER’S ACTIVITY SUMMARY Pioneers have paved the way from incubation to volume PLAYER PRODUCTION STATUS HISTORY PCB ASSEMBLY & TEST TECHNOLOGY MARKET POSITIONING ASE (TW) middle volume own technology but also produced for external companies (Infineon) internal internal aEASI Mobile, Consumers AT&S (AT) middle volume own technology and partnered with UTAC internal UTAC ECP Mobile, Automotive, Medical, AD and Industry Fujikura (JP) low volume own technology internal NA WABE Medical General Electric (US) currently licensing own technology and acquired Imbera and licensed to Taiyo Yuden and Shinko Shinko and TY Shinko and TY POL Automotive, Mobile, Consumers Infineon (GE) middle volume outsourced to ASE own technology and partnered with ASE ASE ASE Dr Blade ICT, Automotive, Mobile, Consumers Microsemi (US) low volume acquired Zarlink internal internal NA Medical and power electronic Schweizer (GE) not started yet own technology internal to be determined P² Pack Automotive Shinko (JP) high volume own technology internal internal MCeP Mobile Taiyo Yuden (JP) high volume already proven technology EOMIN and licensing from GE ventures internal internal EOMIN Mobile, Consumers TDK-EPCOS (JP) middle volume own technology and partnered with ASE internal ASE SESUB Mobile, Consumers ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  19. 19. 19 MOTIVATIONS AND DRIVERS FOR EMBEDDING COMPONENTS By applications Form factor Shorter interconnections Higher components integration Protection against harsh environment Thermal management Design flexibility Wireless module Digital and processor module Wireless module Digital and processor module Lighting module Power management module Power management unit Power management unit Wireless module Sensor module Wireless module Lighting module Sensor module Digital and processor module ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  20. 20. 20 EMBEDDED DIE MARKET Mobile Consumers Information Communication & Technology Automotive Medical A&D and Industry Thanks to its diversity, embedded die packaging serves different markets, which are not submitted to the same business cycles. Initially present in mobile market, ED packaging have penetrated ICT and medical market demanding on customed solutions ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  21. 21. 21 EMBEDDED DIE ACTIVITY MARKET FORECAST Breakdown by market: revenues analysis (1/2) • In 2021, ED packaging revenues will reach 50 million dollars * These revenues do not include revenues from MCeP packaging from Shinko 0 10 000 000 20 000 000 30 000 000 40 000 000 50 000 000 60 000 000 2015 2016 2017 2018 2019 2020 2021 CAGR EmbeddedDiePackagingRevenue($) Embedded Die Packaging REVENUE FORECAST 2015 - 2021 MOBILE CONSUMERS MEDICAL AUTOMOTIVE ICT A&D and INDUSTRY TOTAL ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  22. 22. 22 EMBEDDED DIE ACTIVITY MARKET FORECAST Breakdown by market: units analysis (1/2) ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  23. 23. 23 EMBEDDED DIE ACTIVITY MARKET FORECAST Forecasts including MCeP ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  24. 24. 24 EMBEDDED DIE MARKET AND APPLICATIONS MATRIX MODULES MARKETS APPLICATIONS Wireless module Power Management Sensor module Digital & Processor module Lighting module MOBILE Smartphone & Tablet x x x x MEDICAL Medical implants x x Medical wearables x AEROSPACE AND DEFENSE Commercial aircraft x Military communication x Security x x AUTOMOTIVE Vehicles x x CONSUMERS Wearables x x INFORMATION AND COMMUNICATION TECHNOLOGY Telecommunication x High-end computing x ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  25. 25. 25 Middle performance component for mobile and power electronics for automotive Low-end component for mobile market High-end component available in premium mobile market EMBEDDED DIE PACKAGING COST CONSIDERATIONS Year Packaging cost (Assembly, Test & Yield loss) Cooled power switch transistor DC-DC converter Power Management 2011 2016 Microprocessor for smartphone Cost available in report $$$$$ $$$$ $ ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  26. 26. 26 VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN LAMINATE Key parameters 2020 ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  27. 27. 27 IN BOARD 2013 2014 2015 2016 2017 2018 2019 2020 Pad pitch on die 250 µm 200 µm 150 µm 120 µm 80 µm 50 µm Nb of chips embedded 1 2* Line/space 25/25 µm 15/15 µm Min package thickness 800 µm 650 µm 400 µm Copper layer thickness (Min-Max) Build-up layers 4 (standard app) Max I/O numbers 40 100 VOLUME PRODUCTIONTECHNICAL ROADMAP FOR EMBEDDED DIE IN RIGID PCB Key parameters ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  28. 28. 28 IN FLEXIBLE 2013 2014 2015 2016 2017 2018 2019 2020 Pad pitch on die 150 µm 125 µm Number of chips stacked Stacked by folding Line/space 50/50 µm 25/25 µm 20/20 µm Min package thickness 800 µm 650 µm 400 µm 320 µm Chip thickness (Min-Max) 150 – 350 µm 80 – 100 µm 30 – 80 µm Build-up layers 4 (standard) 6 (available) Max I/O (die) numbers 80 120 VOLUME PRODUCTION TECHNICAL ROADMAP FOR EMBEDDED DIE IN FLEXIBLE SUBSTRATE Key parameters ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  29. 29. 29 EMBEDDED DIE PACKAGING MAIN PLAYERS MAPPING Passives manufacturers Substrate & PCB mnf OSAT companies Fabless companies Component & IDM Research institutes & Governmental agencies ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  30. 30. 30 EXAMPLES OF BUSINESS ECOSYSTEM CASE 1: OSAT as prime contractor OSAT Responsible for yield & delivering final component Customer (final product maker/ end-user) Laminate & PCB supplier In charge of : - SMT assembly - product level assembly - Singulation and final testing Subcontractor In charge of : - Final finish of wafers (copper pads) In charge of : - PCB manufacturing - Die placement - Build-up - Circuitization - PCB design (optional) In charge of : - Die specifications - PCB design (optional) Wafer foundry In charge of : - Die design - Wafer production - KGD testing - Final finish of wafers (copper pads) ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  31. 31. 31 Chip Passives Laminate & board maker OSAT Components & IDM Fabless Final products End-users EMBEDDED DIE PACKAGING SUPPLY CHAIN Examples of commercial and development partnerships ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  32. 32. 32 RELATED REPORTS Discover more related reports within our bundles here. ©2016 | www.yole.fr | Embedded Die Packaging: Technology and Market Trends 2016 | Sample
  33. 33. ORDER FORM Embedded Die Packaging: Technology and Market Trends 2017 SHIPPING CONTACT First Name: Email: Last Name: Phone: PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code: 00170 Account No: 0170 200 1565  87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587 RETURN ORDER BY • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • North America - Steve Laferriere: +13106 008 267 laferriere@yole.fr • Europe RoW - Lizzie Levenez: + 49 15 123 544 182 levenez@yole.fr • Japan Rest of Asia - Takashi Onozawa: +81 3 6869 6970 onozawa@yole.fr • Greater China - Mavis Wang: +886 979 336 809 wang@yole.fr • Specific inquiries: +33 472 830 180 – info@yole.fr (1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: December 19, 2016 / ABOUT YOLE DEVELOPPEMENT BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Email: Date: PRODUCT ORDER Please enter my order for above named report: One user license*: Euro 5,490 Multi user license: Euro 6,490 - The report will be ready for delivery from December 19, 2016 - For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: *One user license means only one person at the company can use the report. Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing (technology or process), Yole Développement group has expanded to include more than 50 associates worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics. The group supports industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends to develop their business. MEDIA EVENTS • i-Micronews.com, online disruptive technologies website • @Micronews, weekly e-newsletter • Communication webcasts services • Events: Yole Seminars, Market Briefings… More information on www.i-micronews.com CONTACTS For more information about : • Consulting Services: Jean-Christophe Eloy (eloy@yole.fr) • Financial Services: Jean-Christophe Eloy (eloy@yole.fr) • Report Business: Fayçal Khamassi (khamassi@yole.fr) • Press relations: Sandrine Leroy (leroy@yole.fr) CONSULTING • Market data research, marketing analysis • Technology analysis • Reverse engineering costing services • Strategy consulting • Patent analysis More information on www.yole.fr REPORTS • Collection of technology market reports • Manufacturing cost simulation tools • Component reverse engineering costing analysis • Patent investigation More information on www.i-micronews.com/reports FINANCIAL SERVICES • Mergers Acquisitions • Due diligence • Fundraising More information on Jean-Christophe Eloy (eloy@yole.fr)
  34. 34. © 2016 Yole Développement FromTechnologies to Market
  35. 35. 34 FIELDS OF EXPERTISE Yole Développement’s 30 analysts operate in the following areas MEMS Sensors LED Compound Semi. Imaging Photonics MedTech Manufacturing Advanced Packaging Batteries / Energy Management Power Electronics Displays RF Devices Techno. ©2016 | www.yole.fr | About Yole Développement
  36. 36. 35 4 BUSINESS MODELS o Consulting and Analysis • Market data research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering costing • Patent analysis www.yole.fr o Reports • Market Technology reports • Patent Investigation and patent infringement risk analysis • Teardowns Reverse Costing Analysis • Cost SimulationTool www.i-Micronews.com/reports o Financial services • MA (buying and selling) • Due diligence • Fundraising • Maturation of companies • IP portfolio management optimization www.yolefinance.com www.bmorpho.com o Media • i-Micronews.com website • @Micronews e-newsletter • Communication webcast services • Events www.i-Micronews.com ©2016 | www.yole.fr | About Yole Développement
  37. 37. 36 A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr MA operations Due diligences www.yolefinance.com Innovation and business maker www.bmorpho.com Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr ©2016 | www.yole.fr | About Yole Développement
  38. 38. 37 OUR 2016 REPORTS PLANNING (1/2) MARKET ANDTECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Gas Sensor Technology and Market 2016 − Status of the MEMS Industry 2016 − Sensors for Cellphones andTablets 2016 − Inkjet Printhead Market Technology Trends 2016 − Sensors for Biometry and Recognition 2016 − Finger Print Sensors Market andTechnologies 2016 − Silicon Photonics 2016 − Emerging NonVolatile Memories 2016 o IMAGING OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016 − Uncooled Infrared Imaging Technology MarketTrends 2016 − Imaging Technologies for Automotive 2016 − Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016 − Silicon Photonics 2016 o MEDTECH − BioMEMS: Microsystems for Healthcare Applications 2016 − Point of Need Testing 2016:Application of MicrofluidicTechnologies o ADVANCED PACKAGING − Fan-Out WLP:Technology Trends and Business Update 2016 − Embedded Die Packaging:Technologies and Markets Trends 2016 − 2.5D 3D IC Business Update 2016 − Status and Prospects for the Advanced Packaging Industry in China 2016 − Fan-in Wafer Level Packaging: Market and Technology Trends 2016 o MANUFACTURING − Thinning Dicing Equipment for Advanced Packaging, MEMS, Photovoltaics, LED, CMOS 2016 ©2016 | www.yole.fr | About Yole Développement
  39. 39. 38 OUR 2016 REPORTS PLANNING (2/2) o COMPOUND SEMICONDUCTORS − Power SiC 2016: Materials, Devices, Modules, and Applications − GaN Modules, Devices and Substrates for Power Electronics 2016 − Sapphire Applications Market 2016: from LED to Consumer Electronics − GaN RF Devices Market:Applications, Players,Technology, and Substrates 2016 – 2022 − RF components and modules for cellphones 2016** o LED − Sapphire Applications and Market 2016: From LED to Consumer Electronics − Thermal Management for LED and Power 2016 − LED Packaging 2016 − Microdisplays and MicroLEDs 2016** − UV LEDs - Technology, Manufacturing and Application Trends − OLED for Lighting - Technology, Industry and Market Trends 2016 − Automotive Lighting:Technologies, Industry and MarketTrends 2016 o POWER ELECTRONICS − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Status of Power Electronics Industry 2016 − Passive Components Technologies and MarketTrends for Power Electronics 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − GaN Modules, Devices and Substrates for Power Electronics 2016 − InverterTechnologies Trends Market Expectations 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Thermal Management for LED and Power 2016 − GaN RF Devices Market:Applications, Players,Technology, and Substrates 2016 - 2022 o BATTERY − Stationary Storage and Automotive Li-ion Battery Packs − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers PATENT ANALYSIS by Knowmade o Patent Infringement (crossed analysis based on Knowmade and System Plus Analysis expertise) o Patent Investigation (crossed analysis based on Knowmade Yole Développement expertise) o Patent Landscape TEARDOWN REVERSE COSTING by System Plus Consulting More than 30 teardowns and reverse costing analysis and cost simulation tools to be published in 2016. ©2016 | www.yole.fr | About Yole Développement
  40. 40. 39 OUR 2015 PUBLISHED REPORTS LIST o MEMS SENSORS − Sensors and Data Management for Autonomous Vehicles − Sensors for Wearable Electronics And Mobile Healthcare − Status of the MEMS Industry − Uncooled Infrared Imaging Technology Market Trends − Infrared Detector Technology Market Trends − High-End Gyroscopes, Accelerometers and IMUs for Defense, Aerospace Industrial − Emerging Non Volatile Memory (NVM) Technology Market Trends o IMAGING OPTOELECTRONICS − Camera Module Industry − Uncooled Infrared Imaging Technology Market Trends − Status of the CMOS Image Sensors − Infrared Detector Technology Market Trends o MEDTECH − Sample Preparation Automation Through Emerging Microfluidic Technologies − 2015 Microfluidic Applications in the Pharmaceutical, Life Sciences, In-Vitro Diagnostic, and Medical Device Markets − Sensors for Wearable Electronics And Mobile Healthcare o COMPOUND SEMICONDUCTORS − Sapphire Applications Market 2015: from LED to Consumer Electronics − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications − GaN and SiC Devices for Power Electronics Applications o LED − LED Lighting Module Technology, Industry and Market Trends 2015 − UV LED - Technology, Manufacturing and Application Trends − Phosphors Quantum Dots 2015: LED Downconverters for Lighting Displays − Sapphire Applications Market 2015: from LED to Consumer Electronics o POWER ELECTRONICS − Power Packaging Technology Trends and Market Expectations − Energy Management for Smart Grid, Cities and Buildings: Opportunities for Battery Electricity Storage Solutions − Status of Chinese Power Electronics Industry − New Technologies and Architectures for Efficient Data Center − IGBT Market and Technology Trends − Status of Power Electronics Industry − SiC, GaN, and other Wide Band Gap (WBG) materials for power electronics applications − GaN and SiC Devices for Power Electronics Applications o ADVANCED PACKAGING − Status of the Advanced Packaging Industry − Supply Chain Readiness for Panel Manufacturing in Packaging − Fan-in Wafer Level Packaging: Market and Technology Trends − Flip Chip: Technologies and Markets Trends − Fan-Out and Embedded Die: Technologies Market Trends o MANUFACTURING − Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED Applications − Emerging Non Volatile Memory (NVM) Technology Market Trends ©2016 | www.yole.fr | About Yole Développement
  41. 41. 40 CONTACT INFORMATION Follow us on • Consulting and Specific Analysis • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr • Japan Asia:Takashi Onozawa, Representative Director,Yole KK Email: onozawa@yole.fr • RoW: Jean-Christophe Eloy, CEO President,Yole Développement Email eloy@yole.fr • Report business • North America: Steve LaFerriere, Director of Northern America Business Development Email: laferriere@yole.fr • Europe: Lizzie Levenez, EMEA Business Development Manager Email: levenez@yole.fr • Japan Asia:Takashi Onozawa, Representative Director,Yole KK. Email: onozawa@yole.fr • Greater China: Mavis Wang, Business Development Director Email: wang@yole.fr • Financial services • Jean-Christophe Eloy, CEO President Email: eloy@yole.fr • General • Email: info@yole.fr ©2016 | www.yole.fr | About Yole Développement

×