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From Technologies to Market
CSP LED
Lighting Modules
2017
Technology,
Manufacturing and
ApplicationsTrends
Market and Tech...
2
To understand
how CSP LEDs
modify the
device and
module
landscape, and
identify real
opportunities
associated to
the tec...
3
• In this report we looked at the CSP values from the integrator
perspective.
• It means we used our deep understanding ...
4
REPORT METHODOLOGY
Market segmentation methodology
Market forecast methodology
©2017 | www.yole.fr | CSP LED Lighting Mo...
5
REPORT METHODOLOGY
Technology analysis methodology Information collection
©2017 | www.yole.fr | CSP LED Lighting Modules...
6
o About the Authors of the Report P5
o Report Objectives P6
o Companies Cited in This Report P7
o Glossary P8
o Methodol...
7
o CSP LED Device P68
 CSP LED Device Manufacturing Process
• Conventional LED Manufacturing Process
• Flip Chip CSP LED...
8
o CSP LED Lighting Module P112
 Thermal Management of CSP LED Lighting Modules
• Why Thermal Management is Required for...
9
Pars MUKISH (Business Unit Manager - LED/OLED, Sapphire and Lighting Systems - Yole Développement)
• Pars MUKISH holds a...
10
Report sample
11
• Flashlight is the main applications for CSP LEDs. Due to their small form factor and ability to deliver high lumen ou...
12
What is Chip Scale Package (CSP)?
• CSP are novel to the LED industry but they are the mainstay of the semiconductor in...
13
While
traditional LEDs
are split in
different
categories, CSP
LEDs are part
of both high or
mid-power
LEDs.
CSP LEDs De...
14
CSP LEDs Structure - Focus on Packaging
CSP LED DEVICE -TECHNOLOGY
User perspective is focused on external packaging pr...
15
LED chip
Phosphor
SMD pads – cathode/anode
Underfill
• The last known CSP structure is a packaged Flip Chip LED
• Like ...
16
Flip Chip CSP LED Manufacturing Process
CSP LED DEVICE - MANUFACTURING PROCESS
Die formation by
epitaxy
Singulation
Epi...
17
• LED CSP ASP is clearly at an intermediate level between Mid Power and High Power LED.
• The price level reflects the ...
18
In 2013,
Lumileds was
the first to
commercialize
LEDs in CSP
format. But several
other
manufacturers
(mostly Taiwanese)...
19
CSP LEDs
represented a
market volume
of 2.3B units in
2016 and should
grow to a size of
Xx B units in
2021.
As a refere...
20
CSP LED
Devices have
specific
characteristics
which offer
certain
advantages but
also require
particular
attention for
...
21
CSP LED shows
a direct thermal
path from active
layer to solder
pads
Thermal Path inside the CSP LEDs
CSP LED LIGHTING ...
22
• High Power LED & CoB modules:
• High luminous efficacy with moderate
luminous density.
• Cree XQ-E module:
• Cree XQ-...
23
CSP LED allows
more flux than
a Mid Power
LED, with a
better cost than
High Power
LED
CSP LEDs in Lighting Products - P...
24
CSP LED Module Positioning vs OtherTechnologies
CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS
High Bay / Low B...
25
CSP LEDs
represented less
than 1% of LED
module
business in
2016.
It should
represent more
nearly 6% by
2021.
MarketTre...
26
RELATED REPORTS
Discover more related reports
within our bundles here.
©2017 | www.yole.fr | CSP LED Lighting Modules 2...
Chip-scale packages (CSPs) are new to the LED
industry, but are the mainstay of the traditional
semiconductor industry, wh...
CSP LED LIGHTING MODULES
COMPANIES CITED IN THE REPORT (non exhaustive list)
Apple, ATS, Audi, BMW, BREE Optronics, Bright...
Find more
details about
this report here:
MARKET  TECHNOLOGY REPORT

About the authors of the report	 5
Report objectives	...
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From Technologies to Market
Presentation of Yole
Développement
With Focus on Solid
State Lighting (LED,
OLED…) and Display...
28
Yole Développement
FromTechnologies to Market
©2017 | www.yole.fr | CSP LED Lighting Module | Sample
29
Our 30 analysts
operate in the
following areas.
FIELDS OF EXPERTISE
Compound Semi.
Imaging
Photonics
Batteries / Energy...
30
Consulting and Analysis
• Market data  research, marketing analysis
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A GROUP OF COMPANIES
Market, technology
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consulting
www.yole.fr
Manufacturing costs analysis
Teardown and r...
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OUR GLOBAL ACTIVITY
30%of our business
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Custom analysis scope is defined with
you to meet your information and
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Suppliers: material,
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sy...
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o Yole Développement publishes a comprehensive collection of market  technology reports and patent analysis in:
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MARKET ANDTECHNOLOGY REPORTS byYole Développement
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About Solid State Lighting (LED,
OLED…) and Display Activities
©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sa...
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AboutYole’s AnalystTeam
FOCUS ON SOLID STATE LIGHTIN...
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A collection of
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Report collection
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CSP LED Lighting Modules - 2017 Report by Yole Developpement

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CSP LED lighting modules: a potential revolution for the LED industry?

CSP LEDS: A PROMISING SOLUTION WITH CHALLENGES TO OVERCOME

Chip-scale packages (CSPs) are new to the LED industry, but are the mainstay of the traditional semiconductor industry, where they improve reliability, thermal management and enable smaller packages. CSP LEDs can be less than a tenth of the size of high and middle power LEDs, increasing power density and simplifying integration into final products. This new architecture can also lower thermal resistance, improve reliability and widen viewing angles compared to other traditional packages. However, there are also several challenges to overcome at the device manufacturing and module integration levels. These include color uniformity, chemical stability, given there is little to no sealing off from the external environment, and control of optical properties like the radiation pattern. In this context, Yole Développement estimates that CSP LED modules represented less than 1% of the LED module business in 2016. However, with strong potential in multiple applications and the lighting industry getting experience with integrating such technology, we forecast a market share of nearly 6% by 2021. This report provides a comprehensive analysis of CSP LED devices, with analyses including: chip and package technology, manufacturing processes, related costs/prices, industry and market trends. The report details deeply analyses CSP LED lighting module design, with focuses including: optical design, thermal and electrical management and precautions for CSP LED integration.

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CSP LED Lighting Modules - 2017 Report by Yole Developpement

  1. 1. From Technologies to Market CSP LED Lighting Modules 2017 Technology, Manufacturing and ApplicationsTrends Market and Technology Report SAMPLE From Technologies to Market
  2. 2. 2 To understand how CSP LEDs modify the device and module landscape, and identify real opportunities associated to the technology. UNDERSTAND CSP LEDTECHNOLOGY: • Difference with other packages. • Impact on manufacturing process. • Potential for cost reduction. UNDERSTAND CHANGES IN SYSTEM DESIGN AND INTEGRATION RULES: • Impact on optical design. • Impact on thermal management. • Impact on electrical management. UNDERSTAND PERFORMANCES IN APPLICATIONS: • Positioning of CSP LEDs compared to middle power, high power LED and COB LED modules. • Opportunities for CSP LEDs in applications. UNDERSTAND COMPETITIVE LANDSCAPE AND SUPPLY CHAIN: • Key players. • Impact on the LED supply chain. REPORT OBJECTIVES ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  3. 3. 3 • In this report we looked at the CSP values from the integrator perspective. • It means we used our deep understanding of application requirements together with our insights in LED packages architectures and long lasting system (LED luminaires) design capabilities. • We investigated architectures, electrical and thermal behaviors and optical characteristics of CSP LED’s . • We performed samples light flux and color point characterizations under different current and temperature settings, together with luminance measurement at PISEO's lab. • Then we integrated all the gathered parameters in our LED based system models and performed optical simulations using ZEMAX Optic Studio 16. • By using the models and optical simulations we were able to understand how the different CSP LED types would perform depending on the application. • Based on this deep understanding we were then able to draw conclusions on the values of CSP LED depending on the applications. How did we get to evaluate CSP LED values? METHODOLOGY 100 200 400 600 800 1000 -40 264 536 937 1325 1588 1864 -10 254 515 902 1277 1529 1793 10 248 503 879 1244 1491 1739 30 241 489 857 1209 1438 1668 50 235 477 829 1164 1371 1579 60 231 468 813 1133 1333 1533 70 227 459 793 1102 1294 1487 80 222 448 771 1070 1255 1441 Ambianttemperature(°C) current (mA) System flux (lm) 100 200 400 600 800 1000 -40 -34 -28 -16 -3 9 22 -10 -4 2 14 26 39 51 10 16 22 34 46 58 71 30 36 42 53 65 78 90 50 56 61 73 85 97 109 60 66 71 83 95 107 119 70 76 81 93 105 117 129 80 86 91 103 115 126 138 Ambianttemperature(°C) Tjunction (°C) Driving current If (mA) Embedded Projector lighting system - Optical design optimization and system performance calculation Sce PISEO – Zemax Optical Studio 16 / Piseo configurator ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  4. 4. 4 REPORT METHODOLOGY Market segmentation methodology Market forecast methodology ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  5. 5. 5 REPORT METHODOLOGY Technology analysis methodology Information collection ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  6. 6. 6 o About the Authors of the Report P5 o Report Objectives P6 o Companies Cited in This Report P7 o Glossary P8 o Methodology P9 o Executive Summary P10 o Status of the LED Industry and Recent Trends P40  Status of the LED Industry • Introduction - Segmentation of Packaged LEDs • History of the LED Industry • Market Landscape • Industrial Landscape • Key Highlights • Packaged LED Revenue Forecast - Split by Application • 2015 & 2016 in a Nutshell • Future Trends • LED Market Trends • Displays • General Lighting  Recent Trends in the LED Industry • Overview • Product Diversification (Level 1) • LED Filaments • COB LEDs • Flip Chip (FC) LEDs • Chip Scale Packaged (CSP) LEDs • Application Diversification - Automotive Lighting • Product Diversification (Level 2) - UV LEDs • Vertical Integration - LED Module • Conclusion o CSP LED Applications Landscape P61  Overview  Flash  Backlighting  General Lighting  Automotive Lighting o CSP LED Device P68  Introduction to CSP LED Device • Definition • Benefits  CSP LED Device Family Description • Introduction • Size Criterion • Power Density Criterion • CSP or Not CSP? • Power Criterion  CSP LED Device Technology • Difference with Other Packages • Chip Level • Package Level • CSP LEDs Structure • Overview • Focus on Packaging • CSP LEDs in the LED Package Proliferation • Flip Chip CSP LEDs vs High Power Type LEDs • Wafer Level CSP LED vs High Power Type LED • Vertical Thin Film CSP LED vs High Power Type LED • Flip Chip packaged CSP LED vs High Power Type LED TABLE OF CONTENT (1/3) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  7. 7. 7 o CSP LED Device P68  CSP LED Device Manufacturing Process • Conventional LED Manufacturing Process • Flip Chip CSP LED Manufacturing Process • Wafer Level CSP LED Manufacturing Process • CSP LEDs vs Conventional LEDs • Impact on Supply / Value Chain • Overview • Highlights on Phosphor Sheet / Film Suppliers  CSP LED Device Cost / Price • Potential for Cost Reduction • The Case of CSP Architecture for Low and Middle Power LEDs • The Case of CSP Architecture for High Power LEDs • Price Positioning of CSP LEDs (Vs. Traditional LEDs) • Price Positioning of CSP LED Modules (Vs. Traditional Modules)  CSP LED Device Industry • Key Players Identified • Highlights on US and European Players • Highlights on Japanese Players • Highlights on Korean Players • Highlights on Taiwanese and Chinese Players • Trends - Flow Chart Comparison between Standard, CSP and COB LEDs  CSP LED Market  CSP LED Market Volume (2012 - 2021) o CSP LED Lighting Module P112  Objectives, Methodology and Synthesis • From Device Characteristics to Performance in Application • System Design and Performance Assessment • Impact of CSP LED Device on System/Module Design • CSP LED System/Module Performance in Application  Definition and Types of LED Lighting Modules • Definitions • LED Module in the Global LED Value Chain • The Different Types of LED Modules - Taxonomy • The Different Types of LED Modules - Positioning  Main Functions in LED Lighting Modules • System Structure • Parameter Interdependence  Optical Design of CSP LED Lighting Modules • Optical Management inside LED Devices • CSP LED Optical Behavior • Light Side Emission of a Package Free CSP LED Device • Introduction • Discontinuities • Consequences • Influence of CSP LED Package on Emission Profile • Light Emission Profile • CSP LED FWHM • Observations • Measurement on Cube and Rim CSPs • Light Emitting Surface (LES) and Beam Angle • Optical Management in the Application • Luminance Control • Optical Integration - Single LED and Arrays • Shadowing Effect in Close Pack Arrangements • Main Consequences and Opportunities of the Optic Properties of CSP LEDs TABLE OF CONTENT (2/3) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  8. 8. 8 o CSP LED Lighting Module P112  Thermal Management of CSP LED Lighting Modules • Why Thermal Management is Required for LED Systems? • Importance of Thermal Management for LED Reliability • Thermal Path inside the CSP LEDs • CSP Thermal Architecture Compared to Standard LEDs • Thermal Resistance of CSP LEDs • Maximal Junction Temperature of CSP LEDs • Influence Parameters on Thermal Resistance • Size and Power • Package Type • Substrate/PCB • Contact Pads • Thermal Resistance in the Application • Reliability of CSP LEDs Compare to Traditional LED Components • Major Trends in Thermal Management • Main Consequences and Opportunities of the Thermal Properties of CSP LEDs  Electrical Management of CSP LED Lighting Modules • Electrical Behavior • Resistive Behavior • Binning Repartition • Multiple LEDs Arrangements • Introduction • Middle and High Power LED Modules • CSP LED Modules • LED Modules Operating Window • LED Balancing Circuit (Electrical Behavior) • Electrical Static Discharge (ESD) and Electrical Over Stress (EOS) • Electrical Static Discharge (ESD) Protection in LED Package • Electrical Static Discharge (ESD) Protection in LED Global System • Electrical Management - Minimal Spacing • Main Consequences and Opportunities of the Electrical Properties of CSP LEDs  Precautions for CSP LED Integration into Modules • Handling Precautions • PCB Design for Optimal Performance • Solder Recommendations • Reflow Process for CSP LEDs  CSP LED Lighting Module Performance in Applications • Is a CSP a Cost Effective High Power LED or a Super Mid Power LED? • CSP LEDs in Lighting Products - Positioning • CSP LED vs COB LED • CSP LEDs in Lighting Products - Opportunities • Opportunities for Accent Lighting • Cost Value for Accent Lighting • Opportunities for Spot Light Integration • Opportunities for Global Indoor Application (i.e.: General Lighting) • Integration in General Lighting Applications - Pros & Cons • Integration in General Lighting Applications - Case Study • Spotlighting • Downlight • Outdoor Lighting • Linear Tube • High Bay • Lamp • Spectrum Control with CSP LEDs • CSP LEDs Diversity • The Different Types of LED Modules - Positioning • CSP LED Module Positioning vs Other Technologies • Market Trends - Share of CSP LED Module Revenue (2016 vs. 2021) o Conclusion P208 o Appendix - About Yole Développement P211 o Appendix - About PISEO P230 TABLE OF CONTENT (3/3) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  9. 9. 9 Pars MUKISH (Business Unit Manager - LED/OLED, Sapphire and Lighting Systems - Yole Développement) • Pars MUKISH holds a master’s degree in Materials Science & Polymers from ITECH in France and a master’s degree in Innovation & Technology Management from EM Lyon, also in France. He works at Yole Développement, the "More than Moore" market research and strategy consulting company, as Senior Market and Technology Analyst in the fields of LED, OLED, Lighting Technologies and Compound Semiconductors, carrying out technical, economic and marketing analyses. In 2015, Pars has also taken on responsibility for developing LED/OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst for several years at the French Research Center CEA. Pierrick BOULAY (Market & Technology Analyst - LED/OLED and Lighting Systems - Yole Développement) • Pierrick BOULAY works as a Market and Technology Analyst in the fields of LED, OLED and Lighting Systems, carrying out technical, economic and marketing analysis at Yole Développement, the "More than Moore" market research and strategy consulting company. He has experience in both LED lighting, including general and automotive lighting, and OLED lighting. In the past, he mostly worked in R&D departments for LED lighting applications. Pierrick holds a master’s degree in Electronics from ESEO in France. Dr. Olivier ANDRIEU (System Architect & Senior Research and Innovation Consultant - PISEO) • Dr Olivier Andrieu is an R&D Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team to perform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking into account mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and more recently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level. Joël THOME (General Manager & Senior Research and Innovation Consultant - PISEO) • Joel Thome is the General Manager & Senior Research & Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Joel Thome performs numerous technical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s R&D team. With a Master’s Degree in mechanical engineering, Joel has been working in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business, marketing and R&D senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes including strategic roadmaps and project portfolio management. Today, Joel Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the Cluster Lumière association. Grégory DUCHENE (Senior Optical Systems Engineer - PISEO) • As a Senior Optical Systems Engineer, Grégory Duchêne is in charge of optics related projects at PISEO. He has created numerous innovative designs for optical systems, based on spectral optimization and light conversion approaches. These disruptive solutions, developed in collaboration with other PISEO experts, are dedicated to general lighting, automotive and imaging applications. Gregory also collaborates with Yole Développement analysts to perform comprehensive technical and marketing analyses focusing on LED lighting modules. Before PISEO, he worked for over ten years on the development of optical designs, including control benches, LED-based lighting systems, CMOS and CCD sensors, signal processing solutions and more. Gregory Duchene has a Master’s Degree in optics from the Institut d’Optique Graduate School (IOGS - France). ABOUT THE AUTHORS OFTHE REPORT ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  10. 10. 10 Report sample
  11. 11. 11 • Flashlight is the main applications for CSP LEDs. Due to their small form factor and ability to deliver high lumen output, CSP LEDs have a fast growth in this market. Moreover, a trend in flashlight application is to use multiple LEDs to implement a dual color flash. • TV manufacturers are using CSP LED because of their small for factor and their large beam angle. It allow to reduce the thickness of the panel and reduce the number of LEDs used in. • General lighting is the latest industry using CSP LEDs in luminaire. It will be used for large area lighting, spot lighting applications or to bring new functionalities like tunable white applications. • CSP LED are being developed to be used in headlamp application for automotive lighting with higher reliability compared to traditional LEDs. Overview CSP LED APPLICATIONS LANDSCAPE 2016 2017 Back Light Unit forTV General Lighting Flash for Smartphone 2014 Applications: Some Integrators: 2015 Time Automotive Lighting Probably : ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  12. 12. 12 What is Chip Scale Package (CSP)? • CSP are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Silicon ICs was driven by miniaturization, improved thermal management, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever shrinking die. Chip Scale Packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging (e.g.: module packaging for LED). It is therefore a natural evolution for such packaging innovation to proliferate into other industries (such as the LED industry). • Basically, a CSP represents a single chip direct mountable package that have the same size as the chip. • In reality, the package must have an area no larger than 1.2 times that of the die. • Regarding LED device, CSPs are made of blue Flip Chip LED die on which a phosphor layer is coated (as main application of such package is General Lighting). • Flip Chip technology is an enabling technology to develop CSP as such package require no wire bonding (to have package size at the chip scale level). • As getting rid of several process steps of traditional LED packaging, CSPs are also impacting the industry structure with some LED chip manufacturers directly supplying their products to LED module manufacturers. Definition CSP LED DEVICE - INTRODUCTION TSMC Chip Scale Package Source: TSMC Samsung Chip Scale Package Source: Samsung ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  13. 13. 13 While traditional LEDs are split in different categories, CSP LEDs are part of both high or mid-power LEDs. CSP LEDs Definition - Power Density Criterion CSP LED DEVICE - FAMILY DESCRIPTION LEDs technologies have their own power range : • Middle Power LED : 0 < MP < 1W • CSP LED : 1 < CSP < 7W • High Power LED : 3 < HP < 8,5W CSP LEDs can be separated into 2 groups according to their power range : • Middle Power CSP: from 1W to 3W • High Power CSP: from 3 to 7 W Middle Power LEDHigh Power LEDCSP LED High Power LED Middle Power LED CSP LED High Power Middle Power ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  14. 14. 14 CSP LEDs Structure - Focus on Packaging CSP LED DEVICE -TECHNOLOGY User perspective is focused on external packaging properties, more than internal structure. • Two types of packaging can be observed, according to the presence or not of walls around the LED. • Cube design • Rim design • The “cube design” appears new on the market and offer singular optical properties. • The “rim design” has a conventional behavior compared to the cube design "Cube Design" CSP Packaging without walls "Rim Design" CSP Packaging with walls Silicone Encapsulated Package Free Ceramic Substrate Entirely Package Vertical thin film X Wafer Level Chip Flip Chip X ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  15. 15. 15 LED chip Phosphor SMD pads – cathode/anode Underfill • The last known CSP structure is a packaged Flip Chip LED • Like the Vertical Thin Film CSP, this packaged FC structure enables to introduce an ESD protection diode inside the LED package Flip Chip packaged CSP LED vs High PowerType LED CSP LED DEVICE -TECHNOLOGY Get the power in / out Power to light conversion Spectral converter (White LED) Optical extraction functions : light extraction, internal reflection Thermal extraction Lens LED chip Encapsulate Reflector Substrate Bond wire Die attach substrate SMD pads – cathode/anode Lead frame Thermal pad Flip Chip packaged CSP LEDHigh Power type LED Silicone Over mold Substrate White Silicone ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  16. 16. 16 Flip Chip CSP LED Manufacturing Process CSP LED DEVICE - MANUFACTURING PROCESS Die formation by epitaxy Singulation EpiWafer LED Chips on EpiWafer Chip transfer & binningPhosphor dispensing Chip formation Attach on substrate Thermal pad Thermal pad Die Substrate Transfer & Singulation Cutting tape Flip Chip CSP LED In the Flip Chip CSP LED manufacturing process, interconnection, encapsulation and lens attach steps have been removed compared to conventional LED process LED Packaging ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  17. 17. 17 • LED CSP ASP is clearly at an intermediate level between Mid Power and High Power LED. • The price level reflects the success of the cost breakdown made by suppressing a large part of the packaging. • However, the ratio Power to Cost is similar to the other packages and not technology dependent. The price is also market oriented, with a clear trend of lm/$ control. Price Positioning of CSP LEDs (Vs.Traditional LEDs) CSP LED - COST / PRICE Type of LED ASP Traditional middle power LEDs $0,01 to $0,10 CSP middle power LEDs $XX CSP high power LEDs $XX Traditional high power LEDs $XX 4 3 2 1 Power Range (W) 0,500 0,25 CSP LEDs Middle Power - High Power Traditional Middle Power LEDs Traditional High Power LEDs Single LED ASP1 ($) 0,75 ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  18. 18. 18 In 2013, Lumileds was the first to commercialize LEDs in CSP format. But several other manufacturers (mostly Taiwanese) and material suppliers were also following the same development trends. Key Players Identified CSP LED - INDUSTRY US: Xxx, Lumileds, Xxx South Korea: Seoul, Xxx (…) Taiwan: Edison Opto, Xxx(…) China: Xxx (…) Germany: Osram1 Japan: Xxx, Xxx, Nichia, (…) UK: Xxx 1Manufacturer of CSP-like LEDs ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  19. 19. 19 CSP LEDs represented a market volume of 2.3B units in 2016 and should grow to a size of Xx B units in 2021. As a reference, in 2016, HP LEDs represented a volume of 25.4B units , and MP LED a volume of 76.7 Bunits. CSP LEDVolume Forecast (2012 - 2021) CSP LED - MARKET Note: CSP LEDs “are / will be” used both in middle power and high power LEDs. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  20. 20. 20 CSP LED Devices have specific characteristics which offer certain advantages but also require particular attention for integration. Impact of CSP LED Device on System/Module Design CSP LED LIGHTING MODULE - OBJECTIVES, METHODOLOGY AND SYNTHESIS Electrical Management To ensure optimal performances Optical Design To shape the light beam Thermal Management To ensure life time and luminous efficacy • Less thermal interfaces • Xxx • Xxx • Small soldering surface • Small size permitting close pack • Xxx • Xxx • Small dimensions • Xxx • Xxx Key System/Module Parameters Key characteristics of CSP LED Devices Impact on System/Module • Xxx • Heat sink to keep a low Tj • Xxx • Xxx • Xxx • Take special precautions (design, manufacturing, logistics) • Need for a perfect optical alignment • Xxx • Xxx Beneficial property Critical property that may impact module integration ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  21. 21. 21 CSP LED shows a direct thermal path from active layer to solder pads Thermal Path inside the CSP LEDs CSP LED LIGHTING MODULES - THERMAL MANAGEMENT • Direct connection to metal parts (solder bump, lead frame) allows good thermal conduction between materials. • Low number of interfaces participates to the improvement of the thermal conduction. • Difference between the LED chip temperature and the solder pad temperature is reduced compared to standard LED chip Wafer Level CSPFlip Chip CSP Heat production areas Heat transfer Active layer Xxx Xxx Solder pads Xxx Active layer Solder pads ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  22. 22. 22 • High Power LED & CoB modules: • High luminous efficacy with moderate luminous density. • Cree XQ-E module: • Cree XQ-E has the same internal structure as HP and MP LED (chip connected with wire bonds), but its size is closer to CSP LED. • XQ-E follows High Power LED tendency. • CSP LED module: High luminous density but moderately effective. • Mid Power LED module: High efficacy but very poor luminous density. Luminous performances of CSP LED modules are closer to CoB and High Power LED modules than Mid Power LED modules. Those performances can be correlated to the internal structure as shown by Cree XQ-E LED which has a chip scaled size but wire bonded. Is a CSP a Cost Effective High Power LED or a Super Mid Power LED? CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS Luminous performances of different LED technology modules ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  23. 23. 23 CSP LED allows more flux than a Mid Power LED, with a better cost than High Power LED CSP LEDs in Lighting Products - Positioning CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS • CSP LED have clearly been created by the major LED manufacturer to fill the gap between Mid Power LED and High Power LED. • This technology doesn’t have the required qualities to directly compete Mid Power LED neither High Power LED. • lm/$ is too low compared to the achievable lm/$ based on Mid Power LED. • Lower performances than High Power LED: lm/W, optical properties, thermal properties. • However, properties like embedded power, light flux performance, diversity of color, CCT, CRI allow much more possibilities than those achieved with mainstream Mid Power LED. • This open the way for intermediate products, between core market and high level positioning, which suffer today from low competitivity or bad perceived performance. Mid Power LED CSP LED High Power LED Product performances More flux Less cost Office Retail Hospitality Lamps… Highbay Outdoor Accent Lamps … System cost ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  24. 24. 24 CSP LED Module Positioning vs OtherTechnologies CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS High Bay / Low Bay Spot Lighting Troffer Downlight Linear Lighting Street Lighting WallWasher Middle Power LED Module High Power LED Module COB LED Module MAIN LUMINAIRE TYPE LAMP Can be used but not mainstream  Custom solution mostly Mainstream technology CSP LED Module Opportunities to be evaluated Automotive Headlamp ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample Complete analysis in the report!
  25. 25. 25 CSP LEDs represented less than 1% of LED module business in 2016. It should represent more nearly 6% by 2021. MarketTrends CSP LED LIGHTING MODULE - PERFORMANCES IN APPLICATIONS ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  26. 26. 26 RELATED REPORTS Discover more related reports within our bundles here. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  27. 27. Chip-scale packages (CSPs) are new to the LED industry, but are the mainstay of the traditional semiconductor industry, where they improve reliability, thermal management and enable smaller packages. CSP LEDs can be less than a tenth of the size of high and middle power LEDs, increasing power density and simplifying integration into final products. This new architecture can also lower thermal resistance, improve reliability and widen viewing angles compared to other traditional packages. However, there are also several challenges to overcome at the device manufacturing and module integration levels. These include color uniformity, chemical stability, given there is little to no sealing off from the external environment, and control of optical properties like the radiation pattern. In this context, Yole Développement estimates that CSP LED modules represented less than 1% of the LED module business in 2016. However, with strong potential in multiple applications and the lighting industry getting experience with integrating such technology, we forecast a market share of nearly 6% by 2021. This report provides a comprehensive analysis of CSP LED devices, with analyses including: chip and package technology, manufacturing processes, related costs/prices, industry and market trends. The report details deeply analyses CSP LED lighting module design, with focuses including: optical design, thermal and electrical management and precautions for CSP LED integration. CSP LED LIGHTING MODULES Market & Technology report - February 2017 CSP LEDS: A PROMISING SOLUTION WITH CHALLENGES TO OVERCOME CSP LED lighting modules: a potential revolution for the LED industry? KEY FEATURES OF THE REPORT Get the sample of the report on www.i-Micronews.com • CSP LED device technology, manufacturing and industry • CSP LED application landscape • CSP LED module pros and cons, and impact on supply/value chain • CSP LED module design: thermal management, optical design, power supply and driver OBJECTIVES OF THE REPORT Objectives are to understand: CSP LED technology: • Differences from other packages • Impact on manufacturing processes • Potential for cost reduction Changes in system design and integration rules: • Impact on optical design • Impact on thermal management • Impact on electrical management Performances in applications: • Positioning of CSP LEDs compared to mid-power, high-power LEDs and COB LED modules • Opportunities for CSP LEDs in applications Competitive landscape and supply chain: • Identify key players • Impact on the LED supply chain (Yole Développement, February 2017) LED lighting module market revenue in 2021 Breakdown by module technology in US$ Others (Middle power LED module, high power LED module, COB LED module) 94.4% CSP LED module 5.6% A CSP LED market size multiplied by more than 3 since 2016 AFTER SMARTPHONES AND TVS, A POTENTIAL REVOLUTION IN GENERAL AND AUTOMOTIVE LIGHTING APPLICATIONS? CSP LEDs add value through power density offered from a small surface. The first targeted application was smartphone flashes. As smartphones get thinner and add functions, so too must integrated components/modules. The small form factor and wide beam angle of CSP LEDs have also driven their use in TV backlighting units. Wide beam angles mean the pitch between LEDs can be larger, reducing the number of devices needed and in turn lowering backlight cost. But CSP LEDs are also a means to develop new functions in lighting products. Some general lighting applications are likely to adopt these light sources to reduce the cost of the lamp/luminaire. Their small size enables LED clusters, similar to chip- on-board (COB) LED modules but with more functionality. CSP LED clusters promise tunable white, human centric light (HCL), intended to promote a person’s well-being, mood and health, and others smart lighting functions. Last but not least, high luminance and uniformity will mean CSP LEDs enter automotive headlamp applications, which requires high intensity and beam shape control. New developments in • Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 • LED Packaging 2017: Market, Technology and Industry Landscape •Automotive Lighting: Technology, Industry, and Market Trends • UV LEDs - Technology, Manufacturing and Application Trends Find all our reports on www.i-micronews.com RELATED REPORTS Benefit from our Bundle Annual Subscription offers and access our analyses at the best available price and with great advantages
  28. 28. CSP LED LIGHTING MODULES COMPANIES CITED IN THE REPORT (non exhaustive list) Apple, ATS, Audi, BMW, BREE Optronics, Bright LED, Carclo, Cree, Dow Corning, Edison Opto, Epistar, ETI, Everlight, Fraen, Genesis Photonic Inc., Haeusermann, Hakko, Harvatek, Honglitronics, Huawei, ITRI, Jufei, Kathod, Kingbright, Ledil, Lextar, LG, Lite On, Luminus Devices, Mason, Maven Optronics, Mercedes- Benz, MLS, Nationstar, Nichia, Oasis, Opel, Optotech, Osram, Philips Lumileds, Plessey Semiconductors, Refond, Samsung, Sanan, Seoul Semiconductors, Toshiba, Toyoda Gosei, Tridonic, Trilux, TSMC, Unistars Mercury, Unity Opto, Wellypower... matrix headlamps will include CSP LEDs to increase matrix resolution, enhance driver vision and improve Advanced Front Light Systems (AFLS) in combination with cameras. In this report, Yole Développement maps the CSP LED application landscape. It analyses CSP LED lighting module performance in general lighting applications, identifying opportunities, describing case studies, and comparing positioning against other module technologies. (Yole Développement, February 2017) CSP LED application landscape 2016 2017 Backlighting unit forTV General lighting Flash smartphone 2014 APPLICATIONS: EXAMPLE OF INTEGRATORS: 2015 Time Automotive lighting Probably: SIMPLIFIED MANUFACTURING PROCESS IMPACTS THE SUPPLY/VALUE CHAIN Comparison between standard, COB and CSP LED module manufacturing chain COB is considered as a module itself. Therefore, there is no need for a module manufacturer in the manufacturing chain. CSP LEDs can be made by chip manufacturers because most of the package steps are removed. However,additional expertise is required, for example in applying phosphores LED Chip manufacturing Standard LED package manufacturing Standard LED module manufacturing LED Chip manufacturing LED Chip + CSP LED manufacturing COB LED manufacturing Standard low / middle / high power LED module COB LED module CSP LED module CSP LED module manufacturing LED die / Chip Packaged LED Light / LED module CSP LED technology eliminates some package assembly and die attach stages. This is likely to benefit to LED chip manufacturers, who can develop packages and supply them directly to LED module manufacturers more easily, bypassing their traditional customers, and so increasing their profits. Vertically integrated LED manufacturers can also decrease their packaging costs. However, adopting the technology requires development of new expertise, modifying the traditional packaging landscape. For example, phosphor and encapsulant deposition processes will move from dispensing to phosphor sheet/film deposition or molding. This evolution affects equipment and material suppliers, who have to develop new solutions. Operationally, Lumileds was the first company to commercialize LEDs in CSP format in 2013. The company was rapidly followed by several other players, mostly Taiwanese. But some others, like Osram, still have doubts about the necessity of such technology, and instead are positioned toward traditional middle and high power LEDs, including COBs. This debate is also relevant at the LED module level, where CSPs cause some difficulties. For example, during PCB design, special care should be given to copper traces and solder masks for optimum performance. Some critical properties, like their small soldering surfaces and sideways light emission, may impact module integration. And while the benefits of CSP LEDs are not yet clear for them, they question the real opportunity of this solution. This report provides insights into the changes in manufacturing and integration processes CSP LEDs bring, and potential consequences on the supply/value chain. Additionally, it analyses real opportunities for such technologies based on simulations and case studies. (Yole Développement, February 2017)
  29. 29. Find more details about this report here: MARKET TECHNOLOGY REPORT About the authors of the report 5 Report objectives 6 Companies cited in this report 7 Glossary 8 Methodology 9 Executive summary 10 Status of the LED industry and recent trends 40 Status of the LED industry including - Introduction - Segmentation of packaged LEDs - History of the LED industry - Packaged LED revenue forecast - Split by application - 2015 and 2016 in a nutshell - Future trends - LED market trends Recent trends in the LED industry - Overview - Product diversification (Level 1) - Application diversification - Automotive lighting - Product diversification (Level 2) - UV LEDs - Vertical integration - LED module - Conclusion CSP LED application landscape 61 Overview Flash Backlighting General lighting Automotive lighting CSP LED devices 68 Introduction to CSP LED devices - Definition - Benefits CSP LED device family description - Introduction - Size criterion - Power density criterion - CSP or not CSP? - Power criterion CSP LED device technology - Differences from other packages - CSP LED structures - CSP LEDs in LED package proliferation - Flip Chip CSP LEDs vs high power-type LEDs - Wafer Level CSP LEDs vs high power-type LEDs - Vertical thin film CSP LEDs vs high power-type LEDs - Flip Chip packaged CSP LEDs vs high power-type LEDs CSP LED device manufacturing process - Conventional LED manufacturing process - Flip Chip CSP LED manufacturing process - Wafer Level CSP LED manufacturing process - CSP LEDs vs conventional LEDs - Impact on supply/value chain CSP LED device cost/price - Potential for cost reduction - The case of CSP architecture for low and middle power LEDs - The case of CSP architecture for high power LEDs - Price positioning of CSP LEDs vs. traditional LEDs - Price positioning of CSP LED modules vs. traditional modules CSP LED device industry - Key players identified - Highlights of US and European Players - Highlights of Japanese Players - Highlights of Korean Players - Highlights of Taiwanese and Chinese Players - Trends - Flow chart comparison between standard, CSP and COB LEDs CSP LED market - CSP LED market volume (2012 - 2021) CSP LED lighting module 112 Chip singulation - Objectives, methodology and synthesis - From device characteristics to performance in applications - System design and performance assessment - Impact of CSP LED device on system/module design - CSP LED system/module performance in application Definition and types of LED lighting modules - Definitions - LED module in the overall LED value chain - The different types of LED modules – Taxonomy - The different types of LED modules – Positioning Main functions in LED lighting modules - System structure - Parameter interdependence Optical design of CSP LED lighting modules - Optical management inside LED devices - CSP LED optical behavior - Sideways light emission of a package-free CSP LED device - Influence of CSP LED package on emission profile - Light emission profile - Light Emitting Surface (LES) and beam angle - Optical management in the application - Luminance control - Optical integration - Single LED and arrays - Shadowing effect in close pack arrangements - Main consequences and opportunities of the optical properties of CSP LEDs Thermal management of CSP LED lighting modules - Why is thermal management required for LED systems? - Importance of thermal management for LED reliability - Thermal path inside the CSP LEDs - CSP thermal architecture compared to standard LEDs - Thermal resistance of CSP LEDs - Maximal junction temperature of CSP LEDs - Influence parameters on thermal resistance - Thermal resistance in the application - Reliability of CSP LEDs compare to traditional LED components - Major trends in thermal management - Main consequences and opportunities arising from the thermal properties of CSP LEDs Electrical management of CSP LED lighting modules - Electrical behavior - Resistive behavior - Binning distribution - Multiple LED arrangements - LED module operating window - LED balancing circuit (electrical behavior) - Electrical Static Discharge (ESD) and Electrical Over Stress (EOS) - Electrical Static Discharge (ESD) protection in LED package - Electrical Static Discharge (ESD) protection in LED global system - Electrical management - Minimal spacing - Main consequences and opportunities of the electrical properties of CSP LEDs Precautions for CSP LED integration into modules - Handling precautions - PCB design for optimal performance - Solder recommendations - Reflow process for CSP LEDs CSP LED lighting module performance in applications - Is a CSP a cost effective high power LED or a super mid power LED? - CSP LEDs in lighting products - Positioning - CSP LED vs COB LED - CSP LEDs in lighting products - Opportunities - Opportunities for accent lighting - Cost value for accent lighting - Opportunities for spot light integration - Opportunities for global indoor application (i.e.: general lighting) - Integration in general lighting applications - Pros and cons - Integration in general lighting applications - Case studies - Spectrum control with CSP LEDs - CSP LED diversity - The different types of LED modules - Positioning - CSP LED module positioning vs other technologies - Market trends - Share of CSP LED module revenue (2016 vs. 2021) Conclusion 208 Appendix - About Yole Développement 211 Appendix - About PISEO 230 TABLE OF CONTENTS (complete content on i-Micronews.com) Pars MUKISH holds a master’s degree in materials science and polymers from ITECH in France and a master’s degree in innovation and technology management from EM Lyon in France. Since 2015, Mukish has taken on responsibility for developing LED, OLED and sapphire activities as Business Unit Manager at Yole Développement. Previously, he worked as Marketing Analyst and Techno-Economic Analyst for several years at the French Research Center, CEA. Pierrick BOULAY works as Market and Technology Analyst in the fields of LED, OLED and lighting systems, doing technical, economic and marketing analysis at Yole Développement, the “More than Moore” market research and strategy consulting company. He has experience in both LED lighting, including general lighting and automotive lighting, and OLED lighting. In the past, he mostly worked in RD departments for LED lighting applications. Pierrick holds a master degree in Electronics from ESEO in France. YOLE DÉVELOPPEMENT Dr Olivier ANDRIEU is RD Project Director and Mechatronic and LED System Architect at PISEO. He is working in collaboration with Yole Développement’s team to perform comprehensive technical analyses of innovative LED-based optical systems and markets. His expertise is based on the development of disruptive solutions taking into account mechanical, electronic, optic and thermal issues to achieve application requirements. Previously, Dr Andrieu worked for EFI Automotive as head of innovation and more recently for Philips Lighting where he developed and implemented numerous LED lighting solutions on a global level. Joel THOME is the General Manager and Senior Research and Innovation Consultant at PISEO. In collaboration with Yole Développement’s team, Thome performs numerous technical and market analyses focusing on LED solutions, in addition to developing innovative optical solutions with PISEO’s RD team. With a master’s degree in mechanical engineering, Thome has worked in the lighting industry for more than 25 years. After beginning his career at Philips Lighting, he has recently held various global business, marketing and RD senior management positions. During this period he developed strong expertise in lighting controls, LED technology and innovation processes including strategic roadmaps and project portfolio management. Today, Thome is also the administrator of the GIL-Syndicat du Luminaire trade union organisation and the Cluster Lumière association. PISEO
  30. 30. ORDER FORM CSP LED Lighting Modules SHIPPING CONTACT First Name: Email: Last Name: Phone: PAYMENT BY CREDIT CARD Visa Mastercard Amex Name of the Card Holder: Credit Card Number: Card Verification Value (3 digits except AMEX: 4 digits): Expiration date: BY BANK TRANSFER BANK INFO: HSBC, 1 place de la Bourse, F-69002 Lyon, France, Bank code: 30056, Branch code: 00170 Account No: 0170 200 1565  87, SWIFT or BIC code: CCFRFRPP, IBAN: FR76 3005 6001 7001 7020 0156 587 RETURN ORDER BY • FAX: +33 (0)472 83 01 83 • MAIL: YOLE DÉVELOPPEMENT, Le Quartz, 75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France SALES CONTACTS • North America - Steve Laferriere: +13106 008 267 laferriere@yole.fr • Europe RoW - Lizzie Levenez: + 49 15 123 544 182 levenez@yole.fr • Japan Rest of Asia - Takashi Onozawa: +81 3 6869 6970 onozawa@yole.fr • Greater China - Mavis Wang: +886 979 336 809 wang@yole.fr • Specific inquiries: +33 472 830 180 – info@yole.fr (1) Our Terms and Conditions of Sale are available at www.yole.fr/Terms_and_Conditions_of_Sale.aspx The present document is valid 24 months after its publishing date: February 23, 2017 / ABOUT YOLE DEVELOPPEMENT BILL TO Name (Mr/Ms/Dr/Pr): Job Title: Company: Address: City: State: Postcode/Zip: Country*: *VAT ID Number for EU members: Tel: Email: Date: PRODUCT ORDER - Ref YDLS17006 Please enter my order for above named report: One user license*: Euro 5,490 Multi user license: Euro 6,490 - The report will be ready for delivery from February 23, 2017 - For price in dollars, please use the day’s exchange rate. All reports are delivered electronically at payment reception. For French customers, add 20% for VAT I hereby accept Yole Développement’s Terms and Conditions of Sale(1) Signature: *One user license means only one person at the company can use the report. Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, the Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Displays, Image Sensors, Optoelectronics, Microfluidics Medical, Advanced Packaging, Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management. The “More than Moore” company Yole and its partners System Plus Consulting, Blumorpho, KnowMade and PISEO support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology trends to develop their business. CONTACTS For more information about : • Consulting Services: Jean-Christophe Eloy (eloy@yole.fr) • Financial Services: Jean-Christophe Eloy (eloy@yole.fr) • Report Business: Fayçal Khamassi (khamassi@yole.fr) • Press relations: Sandrine Leroy (leroy@yole.fr) ABOUT PISEO A unique innovation platform dedicated to smart LED based optical systems. PISEO owns high skilled engineers and cutting edge characterization equipment, all situated in a single location. The team, mainly issued from an industrial global leader, delivers a whole set of services to the industry throughout the entire product life cycle. Therefore, PISEO runs projects from applied research up to product recycling, including market analysis, technology scouting, strategic planning and industrial design. CONTACTS More info on www.piseo.fr Press contact: Joël Thomé, PISEO General Manager (thome.joel@piseo.fr)
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The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot be guaranteed to be free from errors. 4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered. 4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in article 5 below. 4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down payment to the exclusion of any further damages. 4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that any Product will be free from infection. 5. FORCE MAJEURE The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties, equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller. 6. PROTECTION OF THE SELLER’S IPR 6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions. 6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as: • Information storage and retrieval systems; • Recordings and re-transmittals over any network (including any local area network); • Use in any timesharing, service bureau, bulletin board or similar arrangement or public display; • Posting any Product to any other online service (including bulletin boards or the Internet); • Licensing, leasing, selling, offering for sale or assigning the Product. 6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety. 6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the copyrights and will guaranty that the Products are not disseminated out of the company. 6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password. 6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company, the joint venture done with a third party etc..cannot access the report and should pay a full license price. 7. TERMINATION 7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision. 7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation. 8. MISCELLANEOUS All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer. Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party. The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due time. 9. GOVERNING LAW AND JURISDICTION 9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which shall have exclusive jurisdiction upon such issues. 9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions. TERMS AND CONDITIONS OF SALES 
  32. 32. From Technologies to Market Presentation of Yole Développement With Focus on Solid State Lighting (LED, OLED…) and Display Activities Corporate Presentation From Technologies to Market
  33. 33. 28 Yole Développement FromTechnologies to Market ©2017 | www.yole.fr | CSP LED Lighting Module | Sample
  34. 34. 29 Our 30 analysts operate in the following areas. FIELDS OF EXPERTISE Compound Semi. Imaging Photonics Batteries / Energy Management Power Electronics Displays Solid State Lighting (LED, OLED…) Advanced Packaging MEMS Sensors RF (Devices Technologies) Advanced Substrates MedTech Manufacturing ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  35. 35. 30 Consulting and Analysis • Market data research, marketing analysis • Technology analysis • Strategy consulting • Reverse engineering costing • Patent analysis www.yole.fr Reports • Market Technology reports • Patent Investigation and patent infringement risk analysis • Teardowns Reverse Costing Analysis • Cost SimulationTool www.i-Micronews.com/reports Financial services • MA (buying and selling) • Due diligence • Fundraising • Maturation of companies • IP portfolio management optimization www.yolefinance.com / www.bmorpho.com Media • i-Micronews.com website • @Micronews e-newsletter • Technology magazines • Communication webcast services • Events www.i-Micronews.com 4 BUSINESS MODELS ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  36. 36. 31 A GROUP OF COMPANIES Market, technology and strategy consulting www.yole.fr Manufacturing costs analysis Teardown and reverse engineering Cost simulation tools www.systemplus.fr IP analysis Patent assessment www.knowmade.fr Innovation Business maker www.bmorpho.com MA operations Due diligences www.yolefinance.com Test Measurement Expertise Research Innovation www.piseo.fr ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  37. 37. 32 OUR GLOBAL ACTIVITY 30%of our business 40%of our business 30%of our business Yole Inc. Greater China office Yole Japan HQ in Lyon Nantes Paris Nice Vénissieux Europe office Frankfurt Hsinchu Tokyo Phoenix Yole Korea Seoul ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  38. 38. 33 RESEARCH PRODUCTS - CONTENT COMPARISON Custom analysis scope is defined with you to meet your information and budget needs Breadth of the analysis Depthoftheanalysis Custom Analysis Workshops Standard Reports ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  39. 39. 34 Integrators and end-users Device makers Suppliers: material, equipment, OSAT, foundries… Financial investors, RD centers Our analysts provide market analysis, technology evaluation, and business plan along the entire supply chain. SERVING THE ENTIRE SUPPLY CHAIN ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  40. 40. 35 We are working accross multiples industries to understand the impact of More- than-Moore technologies from device to system. SERVING MULTIPLE INDUSTRIAL FIELDS From A to Z… Transportation makers Mobile phone and consumer electronics Automotive Medical systems Industrial and defense Energy ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  41. 41. 36 o Yole Développement publishes a comprehensive collection of market technology reports and patent analysis in: • MEMS Sensors. • RF devices and technologies. • Imaging. • Medical Technologies (MedTech). • Photonics. • Advanced packaging. • Manufacturing. • Power electronics. • Batteries Energy management. • Compound semiconductors. • LED. • Displays. o You are looking for: • An analysis of your product market. • A review of your competitors evolution. • An understanding of your manufacturing and production costs. • An understanding of your industry technology roadmap and related Ips. • A clear view on the evolution of the supply chain. Our team of 50+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting and KnowMade, collect information, identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industry landscape. In the past 18 years, we worked on more than 1?500 projects, interacting with technology professional and high level opinion makers from the main players of the industry. o Every year, Yole Développement, System Plus Consulting and Knowmade publish +120 reports. o Take the full benefit from our Bundle and Annual Subscription offers. REPORTS COLLECTION www.i-Micronews.com ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  42. 42. 37 MARKET ANDTECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Fingerprint Sensor Applications and Technologies - Consumer Market Focus 2017 − MEMS Microphones, Speakers and Audio Solutions 2017 − Status of the MEMS Industry 2017 − MEMS Sensors for Automotive 2017 − High End Inertial Sensors for Defense and Industrial Applications 2017 − Sensor Modules for Smart Building 2017 − Sensing and Display for AR/VR/MR 2017 (Vol 1) − MEMS Packaging 2017 − Magnetic Sensors Market and Technologies 2017** − Microspectrometers Markets and Applications 2017** o RF DEVICES AND TECHNOLOGIES − RF Components and Modules for Cellphones 2017 − Advanced RF SiP for Cellphones 2017 − 5G and Beyond (Vol 1): Impact on RF Industry, from Infrastructure to Terminals 2017 − 5G and Beyond (Vol 2): RF Materials Platform, from Infrastructure to Terminals 2017 − RF Technologies for Automotive Applications 2017 − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 o IMAGING OPTOELECTRONICS − 3D Imaging Sensing 2017 − Status of the CMOS Image Sensor Industry 2017 − Camera Module for Consumer and Automotive Applications 2017 − Uncooled Infrared Imaging Technology Market Trends 2017 − Active Imaging and Lidars 2017 (vol 1) o MEDTECH − Status of the Microfluidics Industry 2017 − Solid State Medical Imaging 2017 − Sensors for HomeCare 2017 − Sensors for Medical Robotics 2017 − Organs-on-a Chip 2017 o ADVANCED PACKAGING − Advanced Substrates Overview 2017 − Status of the Advanced Packaging Industry 2017 − Fan Out Packaging: Market Technology Trends 2017 − 3D Business Update: Market Technology Trends 2017 − Advanced QFN: Market Technology Trends 2017** − Inspection and Metrology for Advanced Packaging Platform 2017** − Advanced Packaging for Memories 2017 − Embedded Die Packaging: Technologies and Markets Trends 2017 o MANUFACTURING − Glass Substrate Manufacturing 2017 − Equipment Materials for Fan Out Technology 2017 − Equipment Materials for 3D T(X)V Technology 2017 − Emerging Non Volatile Memories 2017 ** To be confirmed OUR 2017 REPORTS PLANNING (1/2) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  43. 43. 38 MARKET ANDTECHNOLOGY REPORTS byYole Développement o POWER ELECTRONICS − Status of Power Electronics Industry 2017 − Power Mosfets Market and Technology Trends 2017 − IGBT Market and Technology Trends 2017 − Power Packaging Market and Technology Trends 2017 − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications − Materials Market Opportunities for Cellphone Thermal Management (Battery Cooling, Fast Charging, Data Processing, Battery Cooling, etc.) 2017 − Gate Driver Market and Technology Trends in Power Electronics 2017 − Power Management ICs Market Quarterly Update 2017 − Power Electronics for Electrical Aircraft, Rail and Buses 2017 − Thermal Management for LED and Power 2017 o BATTERY AND ENERGY MANAGEMENT − Status of Battery Industry for Stationary, Automotive and Consumer Applications 2017 o COMPOUND SEMICONDUCTORS − Power SiC 2017: Materials, Devices, and Applications − Power GaN 2017: Materials, Devices, and Applications − GaN and Si LDMOS Market and Technology Trends for RF Power 2017 − Bulk GaN Technology Status and Market Expectations (Power, LED, Lasers) 2017 o DISPLAYS − Microdisplays and MicroLEDs 2017 − Display for Augmented Reality, Virtual Reality and Mixed Reality 2017 − QD for Display Applications 2017 − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − Emerging Display Technologies 2017** o SOLID STATE LIGHTING (LED, OLED…) − UV LEDs 2017 - Technology, Manufacturing and Application Trends − Agricultural Lighting 2017 - Technology, Industry and Market Trends − Automotive Lighting 2017 - Technology, Industry and Market Trends − Active Imaging and Lidar 2017 (Vol 2) - IR Lighting** − LED Lighting Module 2017 - Technology, Industry and Market Trends − IR LEDs 2017 - Technology, Manufacturing and Application Trends − Phosphors Quantum Dots 2017 - LED Downconverters for Lighting Displays − CSP LED Lighting Modules 2017 − LED Packaging 2017 - Market, Technology and Industry Landscape PATENT ANALYSIS by Knowmade − 3D Monolithic Memory: Patent Landscape Analysis − Microfluidic Diagnostic: Patent Landscape Analysis − GaN Technology: Top-100 IP profiles** − Uncooled Infrared Imaging: Patent Landscape Analysis** − MEMS Microphone: Patent Landscape Analysis** − MEMS Microphone: Knowles' Patent Portfolio Analysis** − MicroLEDs: Patent Landscape Analysis** − Microbolometer: Patents used in products** − Micropumps: Patent Landscape Analysis** − Flexible batteries: Patent Landscape Analysis** TEARDOWN REVERSE COSTING by System Plus Consulting More than 60 teardowns and reverse costing analysis and cost simulation tools to be published in 2017. ** To be confirmed OUR 2017 REPORTS PLANNING (2/2) ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  44. 44. 39 MARKET ANDTECHNOLOGY REPORTS byYole Développement o MEMS SENSORS − Gas Sensors Technology and Market 2016 − Status of the MEMs Industry 2016 − Sensors for Cellphones and Tablets 2016 − Market and Technology Trends of Inkjet Printheads 2016 − Sensors for Biometry and Recognition 2016 − Silicon Photonics 2016 o IMAGING OPTOELECTRONICS − Status of the CMOS Image Sensor Industry 2016 − Uncooled Infrared Imaging Technology Market Trends 2016 − Imaging Technologies for Automotive 2016 − Sensors for Drones Robots: Market Opportunities and Technology Evolution 2016 o MEDTECH − BioMEMS 2016 − Point of Care Testing 2016: Application of Microfluidic Technologies o ADVANCED PACKAGING − Embedded Die Packaging: Technology and Market Trends 2017 − 2.5D 3D IC TSV Interconnect for Advanced Packaging: Business Update 2016 − Fan-Out: Technologies and Market Trends 2016 − Fan-In Packaging: Business update 2016 − Status and Prospects for the Advanced Packaging Industry in China 2016 o MANUFACTURING − Thin Wafer Processing and Dicing Equipment Market 2016 − Emerging Non Volatile Memories 2016 o COMPOUND SEMICONDUCTORS − Power GaN 2016: Epitaxy and Devices, Applications and Technology Trends − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 − Sapphire Applications Market 2016: from LED to Consumer Electronics − Power SiC 2016: Materials, Devices, Modules, and Applications o LED − UV LED Technology, Manufacturing and Applications Trends 2016 − OLED for Lighting 2016 – Technology, Industry and Market Trends − Automotive Lighting: Technology, Industry and Market Trends 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − Organic Thin Film Transistor 2016: Flexible Displays and Other Applications − Sapphire Applications Market 2016: from LED to Consumer Electronics o POWER ELECTRONICS − Power Electronics for EV/HEV 2016: Market, Innovations and Trends − Status of Power Electronics Industry 2016 − Passive Components Technologies and Market Trends for Power Electronics 2016 − Power SiC 2016: Materials, Devices, Modules, and Applications − Power GaN 2016: Epitaxy and Devices, Applications, and Technology Trends − Inverter Technologies Trends Market Expectations 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 − Thermal Management Technology and Market Perspectives in Power Electronics and LEDs 2017 − GaN RF Devices Market: Applications, Players, Technology and substrates 2016 o BATTERY AND ENERGY MANAGEMENT − Beyond Li-ion Batteries: Present and Future Li-ion Technology Challengers 2016 − Stationary Storage and Automotive Li-ion Battery Packs 2016 − Opportunities for Power Electronics in Renewable Electricity Generation 2016 OUR 2016 PUBLISHED REPORTS LIST ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  45. 45. 40 • Consulting and Specific Analysis • North America: Steve LAFERRIERE, Director of Northern America Business Development,Yole Inc. Email: laferriere@yole.fr - +1 31 06 008 267 • Greater China: MavisWANG, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • Japan Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • RoW: Jean-Christophe ELOY, President CEO,Yole Développement Email eloy@yole.fr - +33 4 72 83 01 80 • Report business • North America: Steve LAFERRIERE, Director of Northern America Business Development Email: laferriere@yole.fr - +1 31 06 008 267 • Europe: Lizzie LEVENEZ, EMEA Business Development Manager Email: levenez@yole.fr - +49 15 123 544 182 • Rest of Asia:Takashi ONOZAWA, General Manager,Asia Business Development Email: onozawa@yole.fr - +81 3 4405 9204 • Japan Asia: Miho OTHAKE, Account Manager Email: ohtake@yole.fr - +81 3 4405 9204 • Greater China: MavisWANG, Director of Greater China Business Development Email: wang@yole.fr - +886 979 336 809 • Financial services • Jean-Christophe Eloy, CEO President Email eloy@yole.fr - +33 4 72 83 01 80 • General Email: info@yole.fr - +33 4 72 83 01 80 CONTACT INFORMATION Follow us on ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  46. 46. 41 About Solid State Lighting (LED, OLED…) and Display Activities ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  47. 47. 42 We are active throughout the value chain: from substrates to systems! And we interact with industrial / RD players from each level! Yole is active throughout the value chain (Example of LED and Sapphire activities) FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES Substrate SiC / Sapphire / Silicon / Bulk GaN / Engineered substrates LED epi- wafer Mesa LED, Flip Chip LED, Vertical LED structures LED dies- on-wafer LED dies Front-end Level 0 - Epitaxy • Nucleation layer • n-type layer • Active layers (MQW) • p-type layer Back-End Level 0 - Packaging • Substrate separation Bonding • Die singulation • Testing Binning LED systems and applications Front-end Level 1 - Device Production • Inspection • Masking / Lithography • Etching • Metallization / Contacts / Mirrors Back-End level 1 - Packaging • Die Attach Interconnections • Phosphors • Encapsulation Optics • Testing Binning Packaged LEDs Module Packaging • Substrates (PCB) • Encapsulation Optics • Heatsink • Testing Binning LED modules ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  48. 48. 43 “What’s Behind the Crystal Ball?” Only analysts that follow the industry on a daily basis (trough interviews) and developed market modeling tools based on discussions with key players of the industry. Insights on Forecast Methodology (Example of LED and Sapphire activities) FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample APPLICATION Forecast of standard product market volume (unit) Ex.: Smartphone, TVs, lamps (…) Definition of functions using LEDs Ex.: “Flash vs. Keypad” for smartphone (…) Definition of technical requirements Ex.: Efficacy, size (…) Definition of LED penetration rate and competitiveness with alternative technologies Ex.: “OLED vs. LED” in smartphone (…) Forecast of LED market volume (unit) Split by application, power type (low vs. medium vs. high power), package type (single vs. multi-die…) (… ) Definition of LED ASP Per power type, packaged type (…) Forecast of LED market size ($) Split by application, power type, package type (… ) Definition of manufacturing flows for front-end and packaging (process, technologies, materials, yields…) Split by application, power type, package type (…) Forecast of LED manufacturing equipment and material markets (unit and $) Ex.: Phosphors, encapsulant, dicing equipment Definition of LED die surface (mm²) Definition of substrate die surface (mm²) and epiwafer volume (unit) Split by type of substrate (…) Forecast of LED substrate markets (unit and $) Split by type of substrate (…) Definition of sale levels of key manufacturers ($) Ex: LED, packaging materials, epitaxy materials, manufacturing equipment, MOCVD reactor, substrate (…) System Plus Consulting expertise in reverse costing / reverse engineering
  49. 49. 44 A team based on persons having complementary skills and expertise. AboutYole’s AnalystTeam FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES Pars MUKISH - Business Unit Manager - SSL Display Pars MUKISH holds a master degree in Materials Science Polymers (ITECH - France) and a master degree in Innovation Technology Management (EM Lyon - France). Since 2015, Pars MUKISH has taken on responsibility for developing LED, OLED and Sapphire activities as Business Unit Manager at Yole Développement. Previously, he has worked as Marketing Analyst and Techno-Economic Analyst for several years at the CEA (French Research Center). Dr. EricVIREY - Senior Market Technology Analyst - Sapphire Display Eric VIREY holds a Ph-D in Optoelectronics from the National Polytechnic Institute of Grenoble (INPG - France). He works as Market and Technology Analyst in the fields of Sapphire, LED / OLED and Display. In the last 12 years, he has held various RD, engineering, manufacturing and marketing positions with Saint-Gobain. Most recently, he was Market Manager at Saint-Gobain Crystals, in charge of Sapphire and Optoelectronic products. Pierrick BOULAY - Market Technology Analyst - SSL Pierrick BOULAY holds a master degree in Electronics from ESEO (France). He works as Market and Technology Analyst in the fields of LED, OLED and Lighting Systems to carry out technical, economic and marketing analysis. He has experience in both LED lighting (general lighting, automotive lighting…) and OLED lighting. In the past, he has mostly worked in RD department for LED lighting applications. ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample
  50. 50. 45 A collection of more than 15 reports on Solid State Lighting and Display. Report collection FOCUS ON SOLID STATE LIGHTING (LED, OLED…) AND DISPLAY ACTIVITIES Previous Publications: • Status of the LED Industry • LED in Road and Street Lighting • LED Front End • GaN-on-Si Technology and Market • Phosphors QDs - IP Landscape 2016 Publications: • OLED For Lighting - February 2016 • Automotive Lighting - April 2016 • UV LED - August 2016 • Sapphire - September 2016 • OrganicTFT - October 2016 2017 Publications: • Thermal Management for LED and Power Electronic - New • MicroLEDs and MicroDisplays - New • CSP LED Lighting Module - New • Agricultural Lighting - New • IR LED - New • Display for Augmented Reality - New • QD for Display Applications - New • LED Packaging - Update • Phosphors QDs - Update • UV LED - Update • LED Lighting Module - Update • Automotive Lighting - Update Our reports are unmatched in quality and technology depth and typically include: • Technology trends and evolution: costs, barriers, roadmaps (…). • Supply value chain analysis: business models, relationships (…). • In-depth analysis of applications and market drivers: challenges, inflection points (…). • Market data ($, units, wafer starts…). ©2017 | www.yole.fr | CSP LED Lighting Modules 2017 | Sample

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