3D TSV is in MEMS, CMOS Image Sensors and High-End Applications. When will it be used for mainstream consumer applications?
TSV is a business…looking for wider adoption!
Through Silicon Vias (TSV) technology was adopted in production a few years ago for MEMS and CMOS Image Sensors (CIS). Driven by consumer applications such as smartphones and tablets, this market is expected to continue to grow over the next several years. For high-end memories, 2015 will be the turning point for 3D adoption. Standards have now been established, therefore the industry will be ready to enter in high-volume manufacturing. Wide I/Os and logic-on-logic will follow, most probably around 2016-2017. Emerging applications, such as photonics based on interposer, are also being developed for future products. However, their market entrance is most likely not going to happen before 2019-2020. Figure1 illustrates the market adoption and growth for the next 5 years; additional information and details per application are available in the report (revenue, wspy, units 2013-2019, etc.).
Many players, different applications…however, fundamentally only two TSV manufacturing options
3D technology and specifically Through Silicon Via processing offer different options for processing wafers. As a result, different business models have been developed. Today, mainly two TSV approaches are being commonly used: via last and via middle. IDMs and wafer foundries are the main adopters of via middle manufacturing for memories and logic dies. They integrate interconnections between the front and back end of the line structures, offering a full device integration. Most of via middle activities are being done on 300mm wafers, and standard features for these TSVs are being established. In comparison, OSATs and Mid-End fabs, as well as MEMS foundries, are mostly focusing on via last integration approaches. OSATs are capable of performing wafer back side thinning, as well as via reveal processes, prior to bumping and stacking the dies. Figure 2 shows a map with key players coming from different business models using via middle integration. The report provides insights and detailed information on worldwide through-silicon-via activities for both via middle and via last, the companies involved, and comparison of their activities.
More information at http://www.i-micronews.com/reports/3DIC-2-5D-TSV-Interconnect-Packaging-2014-Business-Update/8/450/